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Explore how printable piezoelectric polymers are changing the field of sensors. With their ability to convert forces, pressures and mechanical waves into electricity, these advanced materials offer more efficient, precise and durable solutions for a wide range of industrial and technological applications, including human-machine interfaces, sensors for sport and health, and structural control. Join us to explore the competitive advantages they bring to your products.

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At JOANNEUM RESEARCH, we have built-up comprehensive know-how over the years that enables us to design, develop, and manufacture highly complex sensor systems based on electro-active polymers. Due to our end-to-end system expertise, which covers the entire value chain from device fabrication, bonding, and signal processing to system integration as well as software development, we are offering tailor-made solutions for your specific application. By means of our pilot-line, these highly complex systems can now be realized in a customer-friendly and efficient manner. Our technology can be applied to most versatile surfaces and covers a wide range of applications, including monitoring of industrial production processes (precise pressure distribution measurements; vibration measurements for condition monitoring), surveillance of material conditions in the field of structural health monitoring, as well as recording of vital parameters in healthcare (pulse, respiratory rate, balistocaridogram), amongst others. Furthermore, the system can be used as an innovative energy harvester that autonomously supplies energy to sensor nodes. Together with our partners who specialize in upscaling and mass production, we offer this technology as tailored product solutions across various market segments.

New 3D uLED-structures based on a novel bottom-up approach based on InGaN/GaN pyramidal quantum well structures. The pyramidal uLEDs are fabricated by means of a re-growth process on lithographically patterned SiN-masked GaN templates. Quantum wells on the facets of the um-sized pyramids act as the active emitters. The emission from pyramidal uLEDs have recently demonstrated with a high brightness and external quantum efficiency (EQE) in a wide spectral range. The high quality of homogeneous pyramidal uLED structures combined with a flexible design paves a promising route for uLEDs

MicroLED displays are a promising technology for very small and large displays. The market adoption strongly depends on costs of the display. Shrinking microLED sizes with additional high throughput and yield are the key to success. The use of pulsed UV laser systems to manipulate microLEDs is enabling the development and production of microLED displays.

In aviation industry, there exists an increasing demand for structural health monitoring (SHM) of carbon fiber reinforced composite materials (CFRP), which are needed for aerospace structures because of their unique stiffness to weight ratio. The challenge in such a context is to integrate smart systems in composites for lightweight constructions using different sensors without mechanically changing the structural behavior of the host structures (low weight addition and as small as possible stiffness modification). Innovative printing technologies allow the integration of printed sensors in composite parts and components by satisfying these criteria. For this purpose, manufacturing and integration process of sensors in composite parts using printing technologies was investigated. Piezoelectric sensors as well as temperature sensors were deposited directly on composite aeronautics parts representative of the aeronautic industry using screen printing and Aerosol Jet printing technologies. As an architecture network, printed individual sensors can be connected to an overall system.
The great advantage of printing technologies is the possibility to deposit customized sensor structures directly on planar and non-planar surfaces. The usage of printing technologies results in a great accuracy, reliability, and cost reduction also in a later production process. The development of electrical conductive composites allows the deposition of conductive paths between the sensor structures on the part and finally a connection to the power supply unit. This allows for the realization of a complete sensor structure with low added weight and low intrusivity with respect to the host structure. The sensor technology platform itself offers a broad range of variations of piezoelectric sensor candidate architectures into manufacturing process. The printed sensor network consists of several connected piezoelectric sensors, which build a dynamical load and displacement sensitive element. To detect, localize, classify and quantify damage to CFRP parts, composite aeronautic structural elements may be monitored using data from such printed sensors. This innovative sensor technology can thus be used for SHM by providing a complete and continuous observation of the whole system in the aircraft, but also in any other application area having similar requirements.
Printed piezoelectric sensors can be used to detect and monitor structural deformation, damage, or fatigue in aircrafts, helping to ensure the safety and reliability of the aircraft. Furthermore, it can be used to monitor the vibration of aircraft engines, providing early warning of potential issues and helping to prevent costly engine failures. Printed temperature sensors are able to monitor temperature changes even in inaccessible places in engines. Overall, the use of printed piezoelectric sensors in aeronautics can help to improve the safety, efficiency, and performance of aircrafts.

The global trend for smarter devices has led to a surge in the use of electronic functions often represented by printed circuit boards (PCBs), which contribute to about 7% of global electronic waste (E-waste). Printed electronics technology, utilizing low-impact additive manufacturing techniques, offer a promising alternative to conventional PCB processes as presented by multiple life cycle assessments (LCA) studies. These techniques, thanks to their low thermal budget and reduced chemical use, allows the fabrication of PCB on a variety of lower environmental impact substrates such as cellulose based materials. In CEA-Liten, we address the challenges of high-density multilayer printed PCBs by developing a four-metal layer flexible printed PCB with over 100 thru-hole vias and components assembly on both sides. This approach broadens the applications of printed PCBs to consumer electronics markets, promoting more sustainability in electronics manufacturing and addressing its end of life.

Achieving high efficiency MicroLED based micro- and pico-displays still has many challenges. With desired pixel sizes below 5 micron this leads to significant challenges in re-combination to RGB display chips and low LED efficiency due to the large surface ratio of the LED chip edges to the LED emission area. It is possible to produce / grow an all nitride RGB LED chips by nano-patterned templated growth on a single wafer, e.g. nano-wire LEDs. This would eliminate the re-combination steps and increase LED efficiency due to damage free LED edges. To do so, there is a need to accurately pattern sub-50nm patterns with less than 1nm size variation and overlay alignment of ~ 500nm, preferably sub-100nm, on a wafer that is bowed and not flat anymore due to topology from previous LED growth runs. Accurate placement of the sub-pixels on the epi-wafer is also required when the LED chips are bonded to the driver IC’s. Any pattern distortions will add to potential losses due to bad connections. Conventional (deep) UV lithography uses light to define patterns and is therefore limited by the diffraction limit and related critical depth of focus issue. Nanoimprint lithography, or NIL, uses a physical process of a stamp that has the pattern information coded into it in height / depth. On stamp contact with the wafer, liquid resist will flow into the nano-features before hardening into a 3D inverse shape of the stamp. NIL therefore is not limited by the diffraction limit and can faithfully replicate complex shapes and features with sub-10nm resolution. The disadvantage with NIL is that intimate physical contact needs to be made over the whole wafer. To allow this, the industry has moved to stamps that are flexible in order to accommodate for wafer bow, thickness variations and topology. However, the flexibility of the stamp hinders the overlay alignment accuracy. We’ll demonstrate that by using the proper processes for stamp fabrication, the NIL step, stamp release and resist material systems, we are able to achieve sub-500nm overlay alignment over full 300mm wafers and show the potential to reach sub-100nm overlay alignment.

Technologically advanced problems demand technically advanced solutions. This session will highlight the capabilities in contract manufacturing and R&D services within the field of printed electronics. Emphasis will be placed on providing customer-tailored solutions, from monitoring temperature in battery stacks to 12m high bioreactors. Leveraging a state-of-the-art technology park, innovative concepts can be transformed into practical, real-world applications. Attendees will gain insights into how cutting-edge capabilities are employed to turn ideas into reality.

The application of augmented and virtual reality (AR/VR) devices is growing rapidly in industries as diverse as gaming, military, education, transportation, and medicine. The increasing importance of AR/VR technology demands control solutions that ensure visual performance. However, achieving a quality, seamless visual experience poses a challenge for device designers and manufacturers due to the limitations of measurement systems. Measuring the display characteristics of AR/VR headsets involves evaluating various parameters to ensure they meet the required standards for clarity, accuracy, and user comfort. To help manufacturers ensure display quality, various optical solutions comprised of AR/VR and XRE lenses paired with an Imaging Photometer or Colorimeter provide unique optics engineered for measuring near-eye displays, such as those integrated into virtual, mixed, and augmented reality headsets. The innovative new geometry of the lens design simulates the size, position, and binocular field of view of the human eye. Unlike traditional lenses where the aperture is located inside the lens, the aperture of the AR/VR and XRE lens is located on the front of the lens to enable the connected imaging system to replicate the location of the human eye in an AR/VR device headset and capture the entire FOV available to the user. The optical solution can be paired with a powerful software, which would enable analysing accurately different optical characteristics namely. 1. Resolution (The number of pixels per eye). 2. Field of View (FOV: The extent of the observable environment, measured in degrees). 3. Pixel Density (Pixels Per Inch – PPI - The number of pixels per inch on the display. Calculated using the resolution and the diagonal size of the display. 4. Optical Distortion: Distortion of the image caused by the lenses. 5. Colour Accuracy: The accuracy of the colours displayed compared to the real world. 6. Brightness and Contrast- The luminance of the display, measured in nits (cd/m²). 7. Image Clarity and Sharpness - Detail and clarity of the displayed to measure Modulation Transfer Function (MTF), which quantifies the display’s ability to reproduce fine details. By systematically measuring these characteristics, the manufacturers can evaluate the performance and quality of AR/VR displays accurately. AR/VR display test solution is an unique measurement system with unique optical components that replicate the human pupil size and position within AR/VR goggles and headsets to capture a display FOV to 120° horizontal. The system offers the high resolution and efficiency AR/VR device makers require, employing a compact camera/lens solution to capture all details visible across the near-eye display in a single image to quickly evaluate the human visual experience. Therefore, by leveraging advanced optical components and replicating human vision, AR/VR headsets can achieve high standards in display measurement, ensuring immersive and realistic user experiences.

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The increasing standardization of AR devices based on waveguides has brought attention to the importance of designing and ensuring the durability of waveguides. While ultrashort pulsed lasers hold promise for achieving precise and strong free-form cutting at scale, optimizing the laser process parameters and material compositions of high-index glasses remains a challenge in achieving optimal glass strength. To address this challenge, we have partnered with a reputable producer of specialized glasses to develop a separation process that prioritizes high and predictable bending strength. This process has been integrated into a modular machine concept, allowing for scalability from lab to mass production. Our presentation offers an overview of this fully automated machine solution designed for cost-effective free-form cutting of high-index glass used in AR waveguides. It highlights the thoughtful considerations behind the development and demonstrates how our various process, handling, and quality inspection modules offer high flexibility and scalability.

Silver based conductive ink is the backbone of the Printed Electronics. However, volatile silver prices necessitate the development of conductive inks with lower cost underlying Materials. Such an alternative must provide comparable conductivity while ensuring stable conductivity levels over time, and easy processability using conventional printing technologies (i.e.screen printing). Introducing a novel low-cost Saral Copper Ink, this presentation guides you through the high-demand application areas, discusses the benefits and addresses how to overcome challenges.

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Focal Plane Array (FPA) imaging and detector devices, such as infrared (IR) thermal imaging sensors, Quantum computing processors and micro LED displays are seeing higher demand as more practical applications requiring these components are coming into research and development, military, industrial and consumer markets. This paired with higher pixel and Qubit count and interconnect density on larger and larger chips is driving hybridization and monolithic integration in these technologies. This is showing a marked increase in demand for fine pitch micro Indium Bump Interconnect (IBI) flip chip die bonding. However, some critical challenges facing these technologies are: larger component sizes mean higher density interconnections over increasing surface area. Sub-micron accuracy is required to align fine pitch micro interconnect arrays. This together with the challenges facing the materials that are becoming the industry standard for these applications, such as the requirement for the assembled components to remain stable in extreme conditions such as cryogenic application environments, combined with low loss high strength mechanical / electrical interconnect requirements on components containing sensitive materials, structures and unmatched coefficient of thermal expansion (CTE) means that processing gases such as formic acid or high temperature reflow bonding can no longer be used to bond these devices. These challenges mean that the industry is fast approaching the limitations of even state-of-the-art die bonders and die bonding methods on the market today. This paper is going to highlight these challenges and the methods used to address them to produce large format, high density Infrared (IR) thermal imaging devices, Quantum processors and micro LED displays using fine pitch micro Indium Bump Interconnections (IBI) that meet today's industry requirements.

Nowadays adhesives are more than just simple fasteners and enable the implementation of new technological concepts. Various industries and a variety of applications are thus offered great growth potential. In the field of sustainable energy generation there are numerous tasks that can be addressed with the help of adhesives. In particular, the potential of novel photovoltaic technologies remains large in view of the increasing demand for alternative energy sources and has a direct influence on the success of the energy transition.Flexible photovoltaic technologies present a significant advancement in the solar energy sector, offering lightweight, adaptable and potentially lower-cost solutions in comparison to traditional rigid solar panels. A critical component of those OPV or perovskite-based systems is the adhesive material, which helps to ensure integrity, efficiency and longevity of the cells. In this talk we will focus on adhesives for encapsulation and electrically conductive adhesives, discussing their respective advantages and limitations in regard of the key requirements as mechanical support, electrical properties and environmental protection.

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