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ALL PAST & FUTURE EVENTS AS WELL AS MASTERCLASSES WITH A SINGLE ANNUAL PASS

The Future of Electronics RESHAPED 2024 USA

12-13 June 2024
9am - 5pm

Boston Time

Live Event

Leading global speakers include:
FLEXOO
Copprium
Suss MicroTec
Notion Systems
GE HealthCare
Raytheon | An RTX Business
INTELLIVATION LLC
Advanced Printed Electronic Solutions
Parc/SRI International
Integrated Deposition Systems Inc
Quantica
Ligna Energy
XTPL
Brewer Science
C3Nano
Heraeus Electronics
 Holst Centre
GE Aerospace
SunRay Scientific
Panasonic
ImageXpert
East West Manufacturing
INO
Nano3dprint
SmartKem
Coatema
Carnegie Mellon University
Boeing
Loomia Technologies
AFFOA
Nano OPS, Inc.
Inteva Products
Kateeva
Komori America Corporation
VTT
MAASS
Linxens
Sefar Inc
CondAlign AS
NanoPrintek
Eaton
Spark Biomedical
Eastman Kodak
Hummink
Lockheed Martin
Pragmatic Semiconductor
Asahi Kasei
TracXon
Northrop Grumman
Antenna Research Associates
Energy Materials Corporation
Voltera
Akoneer
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Explore our past & upcoming events

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The times below are Berlin/Paris/Amsterdam time

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12 June 2024

TechBlick

Wednesday

Welcome & Introduction

More Details

9:00 AM

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Talk Demo

Khasha Ghaffarzadeh

CEO & Founder

Welcome & Introduction

9:00 AM

Watch Demo Video
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12 June 2024

Asahi Kasei

Wednesday

Development of Smart Logistic Solution Using Flexible Sensor with R2R Submicron Electrode Formation Technology

More Details

9:05 AM

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Talk Demo

Masayuki Abe

New business development manager

The supply chain that delivers products and services to end consumers is constantly changing and is exposed to various risks such as diseases, counterfeit crimes, geopolitics, natural disasters, and economics. In order to solve these issues, it is important to visualize the end-to-end status of individual products from upstream to downstream, and to upgrade and optimize the SC based on the visualized data. One of the solutions is the realization of smart logistics and flexible sensors for understanding the status of individual products. Asahi Kasei has developed RFID labels with submicron resolution R2R electrode printing technology and a data platform using blockchain. In this presentation, we will introduce the submicron resolution R2R electrode printing technology and RFID labels, as well as the roadmap toward smart logistics and the data platform. 2. R2R electrode printing technology with submicron resolution The line width that can be achieved with existing printing processes are generally several tens of microns, and the most advanced ones are about 10 microns, but the line width of the process we have developed has an ultra-high resolution of about 250 nm. To achieve this, we developed in- house the three elements, those are conductive nano ink, submicron-resolution cylindrical mold (SRM), and the R2R high-definition printing process. The key element is the SRM, which is fabricated using a proprietary electron beam lithography process for cylindrical rollers. Furthermore, the unique R2R printing process incorporating this SRM achieves low-cost production through continuous printing. 3. RFID labels with guaranteed authenticity By using our technology, we develop an "authenticity-assured" RFID label. The label consists of submicron to several microns wide metal wires embedded with a special pattern to detect counterfeiters. The label is therefore designed to ensure the authenticity of the product to which it is affixed, while enabling RFID-based product identification and communication. In addition, the label can be attached to various products because it is transparent in appearance and does not interfere with the design. The RFID has a general dipole antenna shape, and the communication distance can be designed according to the required specifications, with a maximum distance of several meters. When read by the IoT edge device developed at the same time, it determines whether the label is manufactured by Asahi Kasei or not, and generates digitalized information with the product ID. 4. Roadmap We develop a platform configuration for digitizing label information attached to individual products and preventing tampering. Currently, only RFID labels with guaranteed authenticity are available, but in the future, flexible sensors with measurement functions for various physical quantities will be developed to create an infrastructure for the realization of smart logistics.

Development of Smart Logistic Solution Using Flexible Sensor with R2R Submicron Electrode Formation Technology

9:05 AM

The supply chain that delivers products and services to end consumers is constantly changing and is exposed to various risks such as diseases, counterfeit crimes, geopolitics, natural disasters, and economics. In order to solve these issues, it is important to visualize the end-to-end status of individual products from upstream to downstream, and to upgrade and optimize the SC based on the visualized data. One of the solutions is the realization of smart logistics and flexible sensors for understanding the status of individual products. Asahi Kasei has developed RFID labels with submicron resolution R2R electrode printing technology and a data platform using blockchain. In this presentation, we will introduce the submicron resolution R2R electrode printing technology and RFID labels, as well as the roadmap toward smart logistics and the data platform. 2. R2R electrode printing technology with submicron resolution The line width that can be achieved with existing printing processes are generally several tens of microns, and the most advanced ones are about 10 microns, but the line width of the process we have developed has an ultra-high resolution of about 250 nm. To achieve this, we developed in- house the three elements, those are conductive nano ink, submicron-resolution cylindrical mold (SRM), and the R2R high-definition printing process. The key element is the SRM, which is fabricated using a proprietary electron beam lithography process for cylindrical rollers. Furthermore, the unique R2R printing process incorporating this SRM achieves low-cost production through continuous printing. 3. RFID labels with guaranteed authenticity By using our technology, we develop an "authenticity-assured" RFID label. The label consists of submicron to several microns wide metal wires embedded with a special pattern to detect counterfeiters. The label is therefore designed to ensure the authenticity of the product to which it is affixed, while enabling RFID-based product identification and communication. In addition, the label can be attached to various products because it is transparent in appearance and does not interfere with the design. The RFID has a general dipole antenna shape, and the communication distance can be designed according to the required specifications, with a maximum distance of several meters. When read by the IoT edge device developed at the same time, it determines whether the label is manufactured by Asahi Kasei or not, and generates digitalized information with the product ID. 4. Roadmap We develop a platform configuration for digitizing label information attached to individual products and preventing tampering. Currently, only RFID labels with guaranteed authenticity are available, but in the future, flexible sensors with measurement functions for various physical quantities will be developed to create an infrastructure for the realization of smart logistics.

Watch Demo Video
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12 June 2024

Energy Materials Corporation

Wednesday

Commercializing High-speed Production of Perovskite Solar Panels

More Details

9:25 AM

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Talk Demo

Thomas Tombs

Chief Technology Officer

Energy Materials Corporation (EMC) is scaling up to manufacture Perovskite solar panels for multi-GW/year production volumes using high speed roll-to-roll equipment. The methodology of EMC’s commercialization approach is described, including the steps to go from lab scale inks and methods to high-speed prototype demonstrations and culminating with full scale production of finished panels. The challenges and equipment for all stages of the commercialization process are reviewed. EMC’s projected cost per Watt for manufacturing perovskite solar cells at the GW-scale is shown to be a fraction of the best-case projections for Silicon solar cells, which enables local manufacturing in regions with high energy and labor costs.

Commercializing High-speed Production of Perovskite Solar Panels

9:25 AM

Energy Materials Corporation (EMC) is scaling up to manufacture Perovskite solar panels for multi-GW/year production volumes using high speed roll-to-roll equipment. The methodology of EMC’s commercialization approach is described, including the steps to go from lab scale inks and methods to high-speed prototype demonstrations and culminating with full scale production of finished panels. The challenges and equipment for all stages of the commercialization process are reviewed. EMC’s projected cost per Watt for manufacturing perovskite solar cells at the GW-scale is shown to be a fraction of the best-case projections for Silicon solar cells, which enables local manufacturing in regions with high energy and labor costs.

Watch Demo Video
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12 June 2024

Voltera

Wednesday

Multi-layer Flexible Displays using Electroluminescent Ink

More Details

9:45 AM

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Talk Demo

Jesus Zozaya

CEO | Co-founder

This research unveils a cutting-edge technique for prototyping multi-layer flexible displays using electroluminescent ink. Additively deposited using a direct ink writing dispensing system, this ink opens up new use cases for functional information display and aesthetic appeal. These inks can be printed on diverse substrates, such as glass, paper, and plastic, enabling a new dimension in creative and interactive packaging solutions across various industries.

Multi-layer Flexible Displays using Electroluminescent Ink

9:45 AM

This research unveils a cutting-edge technique for prototyping multi-layer flexible displays using electroluminescent ink. Additively deposited using a direct ink writing dispensing system, this ink opens up new use cases for functional information display and aesthetic appeal. These inks can be printed on diverse substrates, such as glass, paper, and plastic, enabling a new dimension in creative and interactive packaging solutions across various industries.

Watch Demo Video
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12 June 2024

FLEXOO

Wednesday

Mass customization & mass production of Smart Sensors

More Details

10:05 AM

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Talk Demo

Jean-Charles Flores

Team Leader, photonics, integrated circuits

Mass customization & mass production of Smart Sensors
As we specialize in delivering end-to-end solutions for smart sensors and electronics, from initial development to final manufacturing, we will highlight in this presentation how it is possible to enable the mass production of smart sensing elements in record time. We will present our strategy to go toward mass customization and give examples for e-mobility & renewable energy storage, military, automotive and logistic applications.

About the author
Jean-Charles Flores is a creative technologist with passion for innovation and a gift for connecting people, ideas and technologies. He started his industrial carrier at Ciba and then BASF where he worked as scientist, technologist and program manager for more than a decade. In 2019, he founded anthos iD_ and in 2023, co-founded Flexoo where his mission is to stir the tremendous creative power of Flexoo’s team into developing always smarter sensors that seamlessly integrate into our daily life. Jean-Charles holds a PhD in Material Sciences and an Engineering degree from the National Chemistry School of Montpellier.

About the company
Flexoo, based in Heidelberg, Germany, is a leading provider of printed electronics and sensors, dedicated to driving innovation and delivering high value to its customers. A unique manufacturing setup, characterized by flexibility, quality, and unparalleled productivity, sets the company apart as the ideal partner for mass production of smart sensors and electronics.

Mass customization & mass production of Smart Sensors

10:05 AM

Mass customization & mass production of Smart Sensors
As we specialize in delivering end-to-end solutions for smart sensors and electronics, from initial development to final manufacturing, we will highlight in this presentation how it is possible to enable the mass production of smart sensing elements in record time. We will present our strategy to go toward mass customization and give examples for e-mobility & renewable energy storage, military, automotive and logistic applications.

About the author
Jean-Charles Flores is a creative technologist with passion for innovation and a gift for connecting people, ideas and technologies. He started his industrial carrier at Ciba and then BASF where he worked as scientist, technologist and program manager for more than a decade. In 2019, he founded anthos iD_ and in 2023, co-founded Flexoo where his mission is to stir the tremendous creative power of Flexoo’s team into developing always smarter sensors that seamlessly integrate into our daily life. Jean-Charles holds a PhD in Material Sciences and an Engineering degree from the National Chemistry School of Montpellier.

About the company
Flexoo, based in Heidelberg, Germany, is a leading provider of printed electronics and sensors, dedicated to driving innovation and delivering high value to its customers. A unique manufacturing setup, characterized by flexibility, quality, and unparalleled productivity, sets the company apart as the ideal partner for mass production of smart sensors and electronics.

Watch Demo Video
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12 June 2024

GE Aerospace

Wednesday

Printed Electronics for Embedded RF Die Packaging

More Details

11:15 AM

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Talk Demo

Felippe J Pavinatto

Senior Engineer - Printed Electronics

Additive Electronics manufacturing is employed at GE Aerospace as an enabler for
devices and systems in the areas of harsh environment sensing, electronics packaging, power electronics, and structural health monitoring (SHM), as well as telecommunication systems and soft robotics. The possibility of using direct-write printing to fabricate conformal devices on non-planar aerospace surfaces using innovative materials and inks is the focus of our printed electronics team. In this talk, we will present the latest developments on the use of high-resolution 3D printed ceramics and micro-dispensing and aerosol jet printing for the fabrication of embedded electronics packaging for radiofrequency (RF) devices. The manufacturing of a multilayer circuit with a 4 x 4 array of low-noise amplifier (LNA) RF chips embedded in alumina will be described. This will include details on material selection and process development for conductive via, dielectric moat ramp and printed RF interconnects fabrication. In conclusion,the performance of a unit cell in the array will be presented to demonstrate the viability of using printed materials and methods for 3D packaging RF devices.

Printed Electronics for Embedded RF Die Packaging

11:15 AM

Additive Electronics manufacturing is employed at GE Aerospace as an enabler for
devices and systems in the areas of harsh environment sensing, electronics packaging, power electronics, and structural health monitoring (SHM), as well as telecommunication systems and soft robotics. The possibility of using direct-write printing to fabricate conformal devices on non-planar aerospace surfaces using innovative materials and inks is the focus of our printed electronics team. In this talk, we will present the latest developments on the use of high-resolution 3D printed ceramics and micro-dispensing and aerosol jet printing for the fabrication of embedded electronics packaging for radiofrequency (RF) devices. The manufacturing of a multilayer circuit with a 4 x 4 array of low-noise amplifier (LNA) RF chips embedded in alumina will be described. This will include details on material selection and process development for conductive via, dielectric moat ramp and printed RF interconnects fabrication. In conclusion,the performance of a unit cell in the array will be presented to demonstrate the viability of using printed materials and methods for 3D packaging RF devices.

Watch Demo Video
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12 June 2024

Linxens

Wednesday

Merging technologies for tomorrow’s medical wearables

More Details

11:15 AM

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Talk Demo

Alix Joseph

Medical wearables are rapidly transforming the healthcare landscape, holding immense potential to revolutionize preventive care, disease management, and patient engagement. As the demand increases, the construction of such device require to merge very diverse technologies and to make them work together. The expansion of biosensors, their integration into wearable sensors together with skin adhesive and flexible materials, and the continuous growth of communication technologies such as NFC and Bluetooth lead to infinite combination for another level of medical monitoring.

Merging technologies for tomorrow’s medical wearables

11:15 AM

Medical wearables are rapidly transforming the healthcare landscape, holding immense potential to revolutionize preventive care, disease management, and patient engagement. As the demand increases, the construction of such device require to merge very diverse technologies and to make them work together. The expansion of biosensors, their integration into wearable sensors together with skin adhesive and flexible materials, and the continuous growth of communication technologies such as NFC and Bluetooth lead to infinite combination for another level of medical monitoring.

Watch Demo Video
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12 June 2024

Akoneer

Wednesday

High density Cu traces for novel methods of PCB/FPC and semiconductor packaging production using SSAIL technology.

More Details

11:35 AM

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Talk Demo

Tadas Kildusis

CCO

Selective Surface Activation Induced by Laser (SSAIL) technology allows creating Cu traces on any dielectric material (organic, glass, ceramic, etc.). In first part of this talk we are presenting our results for high throughput 10-25 µm trace formation on FR4 and PET for PCB/FPC production. In the second part we discuss 1-25 µm traces on PI, EMC and glass for semiconductor packaging. This enables novel methods for PCB/FPC and semiconductor packaging avoiding chemical etching, masks and reducing power consumption and waste.

High density Cu traces for novel methods of PCB/FPC and semiconductor packaging production using SSAIL technology.

11:35 AM

Selective Surface Activation Induced by Laser (SSAIL) technology allows creating Cu traces on any dielectric material (organic, glass, ceramic, etc.). In first part of this talk we are presenting our results for high throughput 10-25 µm trace formation on FR4 and PET for PCB/FPC production. In the second part we discuss 1-25 µm traces on PI, EMC and glass for semiconductor packaging. This enables novel methods for PCB/FPC and semiconductor packaging avoiding chemical etching, masks and reducing power consumption and waste.

Watch Demo Video
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12 June 2024

TracXon

Wednesday

Trillion-Sensor Economy Enabled by Printed Electronics.

More Details

11:35 AM

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Talk Demo

Ashok Sridhar

The "trillion-sensor economy" metatrend prophecy is coming true. To realize its full potential in an effective and responsible manner, a re-think in the way sensing systems are manufactured, exploited and recycled, is necessary. Printed Electronics is emerging as a key-enabler for large-scale and sustainable manufacturing of sensing systems. TracXon, a fully-integrated foundry for Printed Electronics, is helping several B2B customers in realizing their ambition to be part of this trillion-sensor economy. In this talk, some application examples are presented.

Trillion-Sensor Economy Enabled by Printed Electronics.

11:35 AM

The "trillion-sensor economy" metatrend prophecy is coming true. To realize its full potential in an effective and responsible manner, a re-think in the way sensing systems are manufactured, exploited and recycled, is necessary. Printed Electronics is emerging as a key-enabler for large-scale and sustainable manufacturing of sensing systems. TracXon, a fully-integrated foundry for Printed Electronics, is helping several B2B customers in realizing their ambition to be part of this trillion-sensor economy. In this talk, some application examples are presented.

Watch Demo Video
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12 June 2024

Holst Centre

Wednesday

Additive manufacturing for 3D structural microelectronics

More Details

11:55 AM

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Talk Demo

Hylke Akkerman

Program Manager

Over the years, electronics and its components have continuously developed towards a higher density, but largely in the same rigid flat form factor of PCBs. To achieve higher density electronics in complex 3D arrangements, TNO at Holst Centre has developed a multi-material additive manufacturing process named “3D additive lithography for electronics” (3D-ALE). With this fabrication process a scanning DMD-based light engine is used to pattern photopolymers down to 10 um structures. Within the patterned photopolymer cavities are designed for component placement (particularly suitable for bare-die components) and tracks for metal paste filling to fabricate the circuitry. Continuous successive layer-by-layer build-up allows for complex high-density electronics in 3D structural embodiments.

Additive manufacturing for 3D structural microelectronics

11:55 AM

Over the years, electronics and its components have continuously developed towards a higher density, but largely in the same rigid flat form factor of PCBs. To achieve higher density electronics in complex 3D arrangements, TNO at Holst Centre has developed a multi-material additive manufacturing process named “3D additive lithography for electronics” (3D-ALE). With this fabrication process a scanning DMD-based light engine is used to pattern photopolymers down to 10 um structures. Within the patterned photopolymer cavities are designed for component placement (particularly suitable for bare-die components) and tracks for metal paste filling to fabricate the circuitry. Continuous successive layer-by-layer build-up allows for complex high-density electronics in 3D structural embodiments.

Watch Demo Video
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12 June 2024

Spark Biomedical

Wednesday

Printing 3D In-Ear Sensors: Technological Innovations*

More Details

11:55 AM

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Talk Demo

Alejandro Covalin

CTO

Printing 3D In-Ear Sensors: Technological Innovations*

11:55 AM

Watch Demo Video
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12 June 2024

GE HealthCare

Wednesday

Sustainability in single use medical sensors/devices

More Details

12:15 PM

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Talk Demo

Gurvinder Singh Khinda

Lead Scientist

Sustainability has become one of essential part of a product life cycle and biomedical industry is not an exception rather it is one of major industry using wide ranges of single use medical products. Addressing sustainability of these products is important especially due to their biohazard nature and sanitation issues. This presentation will cover ongoing effort to address cost and sustainability issues of single use devices through use of Flexible Hybrid Electronics (FHE) manufacturing, evaluation of novel materials usage, introduction of environmentally conscious design practices, and life cycle assessment methodologies. Examples of two additively manufactured demonstrators: single-use vital sign monitor system (SUVSM) and single-use ECG leads (SUEL) will be discussed showing feasibility and benefits of FHE manufacturing approach.

Sustainability in single use medical sensors/devices

12:15 PM

Sustainability has become one of essential part of a product life cycle and biomedical industry is not an exception rather it is one of major industry using wide ranges of single use medical products. Addressing sustainability of these products is important especially due to their biohazard nature and sanitation issues. This presentation will cover ongoing effort to address cost and sustainability issues of single use devices through use of Flexible Hybrid Electronics (FHE) manufacturing, evaluation of novel materials usage, introduction of environmentally conscious design practices, and life cycle assessment methodologies. Examples of two additively manufactured demonstrators: single-use vital sign monitor system (SUVSM) and single-use ECG leads (SUEL) will be discussed showing feasibility and benefits of FHE manufacturing approach.

Watch Demo Video
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12 June 2024

NanoPrintek

Wednesday

Dry Multimaterial Printing Technology: Efficient, Clean, Cost-Effective, and Supply-Chain Resilient

More Details

12:15 PM

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Talk Demo

Masoud Mahjouri-Samani

Founder and President

NanoPrintek presents its disruptive “dry multimaterial printing” technology that transforms the current printing ecosystem. This presentation highlights the unparalleled capability of this technology and shows how it can print directly from metals and semiconductors to insulators and composites (even from scraps and rocks!) and on various substrates. The current printing ecosystem is liquid-based, which heavily suffers from major drawbacks, including i) the need for a complex and pollutive supply chain, ii) expensive and extensive ink formulation processes, iii) surfactants and contaminants, iv) limited printing inks, and v) the need for high-temperature post-processing. This talk presents NanoPrintek’s disruptive inkless multimaterial printing technology, where various materials can be printed seamlessly from solid sources. The key technology advantages include 1) on-demand and in-situ generation of various pure nanoparticles without contaminations, 2) in-situ and real-time laser sintering of nanoparticles on various substrates with no post-processing, 3) multimaterial printing of hybrid and tunable nanocomposite materials and structures. This supply-chain resilient, clean, and highly cost-effective technology transforms the electronics printing ecosystem to a new realm where pure, multimaterial, multifunctional, and hybrid materials are printed on demand, enabling various applications in the electronics, healthcare, automotive, aerospace, defense, and energy industries.

Dry Multimaterial Printing Technology: Efficient, Clean, Cost-Effective, and Supply-Chain Resilient

12:15 PM

NanoPrintek presents its disruptive “dry multimaterial printing” technology that transforms the current printing ecosystem. This presentation highlights the unparalleled capability of this technology and shows how it can print directly from metals and semiconductors to insulators and composites (even from scraps and rocks!) and on various substrates. The current printing ecosystem is liquid-based, which heavily suffers from major drawbacks, including i) the need for a complex and pollutive supply chain, ii) expensive and extensive ink formulation processes, iii) surfactants and contaminants, iv) limited printing inks, and v) the need for high-temperature post-processing. This talk presents NanoPrintek’s disruptive inkless multimaterial printing technology, where various materials can be printed seamlessly from solid sources. The key technology advantages include 1) on-demand and in-situ generation of various pure nanoparticles without contaminations, 2) in-situ and real-time laser sintering of nanoparticles on various substrates with no post-processing, 3) multimaterial printing of hybrid and tunable nanocomposite materials and structures. This supply-chain resilient, clean, and highly cost-effective technology transforms the electronics printing ecosystem to a new realm where pure, multimaterial, multifunctional, and hybrid materials are printed on demand, enabling various applications in the electronics, healthcare, automotive, aerospace, defense, and energy industries.

Watch Demo Video
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12 June 2024

Lunch & Exhibition Break

Wednesday

Lunch & Exhibition Break

More Details

12:35 PM

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Talk Demo

Lunch & Exhibition Break

12:35 PM

Watch Demo Video
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12 June 2024

Copprium

Wednesday

Copper Conductive Inks: Meeting the conductivity, cost, and scale challenges*

More Details

2:05 PM

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Talk Demo

Edward Tierney


EIR & Strategy Advisor

Copper Conductive Inks: Meeting the conductivity, cost, and scale challenges*

2:05 PM

Watch Demo Video
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12 June 2024

Kateeva

Wednesday

Billions of drops per second, where do you want them?

More Details

2:05 PM

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Talk Demo

Kent Ubellacker

Electronics and display industry applications push the limits of inkjet printing in terms of accuracy and volume control. It’s one thing to meet these objectives in a laboratory environment, but an entirely different experience to scale to production. Materials in use such as optical light emitting diodes, quantum dots, and numerous encapsulants create a challenging environment for inkjet nozzle reliability and performance.Drop placement correction is one core technology to maintain high quality printing. Used in tandem with highly reliable printing equipment and world class printing algorithms, high accuracy can be achieved in applications ranging from multi thickness layer printing to discrete pixel printing.

Billions of drops per second, where do you want them?

2:05 PM

Electronics and display industry applications push the limits of inkjet printing in terms of accuracy and volume control. It’s one thing to meet these objectives in a laboratory environment, but an entirely different experience to scale to production. Materials in use such as optical light emitting diodes, quantum dots, and numerous encapsulants create a challenging environment for inkjet nozzle reliability and performance.Drop placement correction is one core technology to maintain high quality printing. Used in tandem with highly reliable printing equipment and world class printing algorithms, high accuracy can be achieved in applications ranging from multi thickness layer printing to discrete pixel printing.

Watch Demo Video
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12 June 2024

Carnegie Mellon University

Wednesday

Soft & Stretchable Electronics with Liquid Metal

More Details

2:25 PM

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Talk Demo

Carmel Majidi

Assistant Professor

Over the past decade, there’s been tremendous advancements in soft and highly stretchable circuitry for use in epidermal electronics for health monitoring, wearable computing, and soft robotics. As these technologies continue to improve, there is increasing interest in new material architectures that allow for manufacturing scale-up, printability over large areas, and robust interfacing with surface-mounted microelectronics. One promising approach is to use metal alloys like eutectic gallium-indium (EGaIn) that are liquid at room temperature and which can be incorporated as microfluidic inclusions within a soft elastomer substrate. As the surrounding elastomers stretches, the fluidic inclusions can elongate and maintain electrical connectivity. Moreover because of their high electrical conductivity, EGaIn can support digital circuit functionality and potentially replace the rigid metallic interconnects that are used in current circuit boards. In this talk, I will present several approaches for using EGaIn as electrical interconnects and conductive inks for stretchable electronics. This includes efforts to create circuits composed of microfluidic channels of liquid metal that directly interface with the pins of packaged microelectronic chips. I will also present recent efforts to combine EGaIn and soft elastomers to create composite materials composed of percolating networks of microscale EGaIn droplets (along with other metallic particles) within a soft elastomer matrix. Soft polymers blended with liquid metal exhibit unique combinations of high electrical or thermal conductivity, high stretchability, and low elastic stiffness. In particular, I will show how these composites can be formulated to function as printable conductive inks and thermal interface materials. Applications include soft printed circuits that maintain stable electrical resistance under strain, elastic transducers capable of sensing and actuation, and thermal interface materials for high performance computing.

Bio: Carmel Majidi is the Clarence H. Adamson Professor of Mechanical Engineering at Carnegie Mellon University, where he leads the Soft Machines Lab. His research group develops novel material architectures that allow machines and electronics to be soft, elastically deformable, and biomechanically compatible. This includes research with liquid metal and shape memory materials for creating “artificial” skin, nervous tissue, and muscle for applications in soft robotics and wearable computing. Prof. Majidi has received Young Investigator awards from DARPA, ONR, AFOSR, and NASA, is an author on >200 journal publications, has 28 issued patents, and is co-founder of several spin-off companies.

Soft & Stretchable Electronics with Liquid Metal

2:25 PM

Over the past decade, there’s been tremendous advancements in soft and highly stretchable circuitry for use in epidermal electronics for health monitoring, wearable computing, and soft robotics. As these technologies continue to improve, there is increasing interest in new material architectures that allow for manufacturing scale-up, printability over large areas, and robust interfacing with surface-mounted microelectronics. One promising approach is to use metal alloys like eutectic gallium-indium (EGaIn) that are liquid at room temperature and which can be incorporated as microfluidic inclusions within a soft elastomer substrate. As the surrounding elastomers stretches, the fluidic inclusions can elongate and maintain electrical connectivity. Moreover because of their high electrical conductivity, EGaIn can support digital circuit functionality and potentially replace the rigid metallic interconnects that are used in current circuit boards. In this talk, I will present several approaches for using EGaIn as electrical interconnects and conductive inks for stretchable electronics. This includes efforts to create circuits composed of microfluidic channels of liquid metal that directly interface with the pins of packaged microelectronic chips. I will also present recent efforts to combine EGaIn and soft elastomers to create composite materials composed of percolating networks of microscale EGaIn droplets (along with other metallic particles) within a soft elastomer matrix. Soft polymers blended with liquid metal exhibit unique combinations of high electrical or thermal conductivity, high stretchability, and low elastic stiffness. In particular, I will show how these composites can be formulated to function as printable conductive inks and thermal interface materials. Applications include soft printed circuits that maintain stable electrical resistance under strain, elastic transducers capable of sensing and actuation, and thermal interface materials for high performance computing.

Bio: Carmel Majidi is the Clarence H. Adamson Professor of Mechanical Engineering at Carnegie Mellon University, where he leads the Soft Machines Lab. His research group develops novel material architectures that allow machines and electronics to be soft, elastically deformable, and biomechanically compatible. This includes research with liquid metal and shape memory materials for creating “artificial” skin, nervous tissue, and muscle for applications in soft robotics and wearable computing. Prof. Majidi has received Young Investigator awards from DARPA, ONR, AFOSR, and NASA, is an author on >200 journal publications, has 28 issued patents, and is co-founder of several spin-off companies.

Watch Demo Video
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12 June 2024

Komori America Corporation

Wednesday

Minimum Solder Paste Bump Size using Gravure Offset Printing for Micro LEDs

More Details

2:25 PM

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Talk Demo

Doug Schardt

Director Of Product Managment

Application of micro-LEDs in a wide range of products is expected and with the ever-increasing trend towards miniaturization, very small and precisely placed print is a requirement. This presentation will examine the smallest diameter bump that can be accurately produced with gravure offset.Current bonding techniques using ACF can be improved by moving to solder paste bonding which is expected. Solder paste itself works very well with gravure offset with the main requirement of small, precise solder bumps.Within the process of gravure offset printing creating and maintaining the minimum possible bump size is determined by two main variables and the presentation examines those variables and reveals the smallest possible bump diameter that can be created using gravure offset and solder paste.

Minimum Solder Paste Bump Size using Gravure Offset Printing for Micro LEDs

2:25 PM

Application of micro-LEDs in a wide range of products is expected and with the ever-increasing trend towards miniaturization, very small and precisely placed print is a requirement. This presentation will examine the smallest diameter bump that can be accurately produced with gravure offset.Current bonding techniques using ACF can be improved by moving to solder paste bonding which is expected. Solder paste itself works very well with gravure offset with the main requirement of small, precise solder bumps.Within the process of gravure offset printing creating and maintaining the minimum possible bump size is determined by two main variables and the presentation examines those variables and reveals the smallest possible bump diameter that can be created using gravure offset and solder paste.

Watch Demo Video
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12 June 2024

C3Nano

Wednesday

A Silver Bullet: Nanowires and Nanoglue™ Advancing Engineered Composites, Transparent Heating, Printed Electronics, & Thermal Management

More Details

2:45 PM

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Talk Demo

Ajay Virkar

Co-Founder and CTO

C3Nano’s technology is currently being utilized in tens of millions of flagship smartphones and has enabled some of the earliest commercial foldable devices. Recently, C3Nano extended its Activegrid™ transparent conducting ink and film product lines to address fundamental issues in transparent heating and thermal management for the automotive and cleantech sectors. In the first part of this presentation, we will discuss how Activegrid™ is being developed and adopted for a variety of transparent heating and thermal management solutions due to several important value propositions, including excellent optical clarity in the visible (camera) and LiDAR regions, direct coating and deposition on 3D substrates like PC, and outstanding formability. Additionally, major proprietary breakthroughs by C3Nano have led to the development of new classes of highly concentrated silver nanowire-based dispersions with exceptional properties. In the second part of the talk, we will describe the advantages of nanowires as conductive fillers in inks and composites over conventional fillers like silver nanoparticles, flakes, and carbon black/nanotubes. Record low loadings < 5% and less than 10 wt.% total Silver (i.e., more than 90% resin in the final cured composite) can yield composites with remarkably low resistivities (10-3 to 10-4 ohm-cm, 1000 S/cm to 10,000 S/cm range). This allows our customers and partners to develop the next generation of inks and ECAs to address fundamental problems in consumer electronics, semiconductors packaging, and the automotive and life science sectors.

A Silver Bullet: Nanowires and Nanoglue™ Advancing Engineered Composites, Transparent Heating, Printed Electronics, & Thermal Management

2:45 PM

C3Nano’s technology is currently being utilized in tens of millions of flagship smartphones and has enabled some of the earliest commercial foldable devices. Recently, C3Nano extended its Activegrid™ transparent conducting ink and film product lines to address fundamental issues in transparent heating and thermal management for the automotive and cleantech sectors. In the first part of this presentation, we will discuss how Activegrid™ is being developed and adopted for a variety of transparent heating and thermal management solutions due to several important value propositions, including excellent optical clarity in the visible (camera) and LiDAR regions, direct coating and deposition on 3D substrates like PC, and outstanding formability. Additionally, major proprietary breakthroughs by C3Nano have led to the development of new classes of highly concentrated silver nanowire-based dispersions with exceptional properties. In the second part of the talk, we will describe the advantages of nanowires as conductive fillers in inks and composites over conventional fillers like silver nanoparticles, flakes, and carbon black/nanotubes. Record low loadings < 5% and less than 10 wt.% total Silver (i.e., more than 90% resin in the final cured composite) can yield composites with remarkably low resistivities (10-3 to 10-4 ohm-cm, 1000 S/cm to 10,000 S/cm range). This allows our customers and partners to develop the next generation of inks and ECAs to address fundamental problems in consumer electronics, semiconductors packaging, and the automotive and life science sectors.

Watch Demo Video
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12 June 2024

Quantica

Wednesday

Beyond Thin Layers: High Viscosity Solutions for Printed Electronics

More Details

2:45 PM

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Talk Demo

Marcel Strobel

Business Developer & Electronics Application Specialist

In the world of printed electronics, challenges in technology and material limitations have remained a barrier to more widespread adoption. This talk will explore the transformative potential of leveraging high viscosity materials for inkjet printing. Shahzad will dive into Quantica’s NovoJet inkjet printing technology, showcasing its capability to expand the repertoire of printable materials. Additionally, the presentation will delve into new avenues for applications in printed electronics, shedding light on the exciting possibilities ahead.

Beyond Thin Layers: High Viscosity Solutions for Printed Electronics

2:45 PM

In the world of printed electronics, challenges in technology and material limitations have remained a barrier to more widespread adoption. This talk will explore the transformative potential of leveraging high viscosity materials for inkjet printing. Shahzad will dive into Quantica’s NovoJet inkjet printing technology, showcasing its capability to expand the repertoire of printable materials. Additionally, the presentation will delve into new avenues for applications in printed electronics, shedding light on the exciting possibilities ahead.

Watch Demo Video
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12 June 2024

Heraeus Electronics

Wednesday

Functional electronic inks as an enabler for the latest advancements in healthcare

More Details

3:05 PM

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Talk Demo

Gregory Berube

2022 healthcare spending in the U.S. alone was $4.5 trillion and grew at an annual rate of 5.3% between 2017 and 2022. The sheer size of the market provides a major opportunity for suppliers at all points of the value chain, especially if they have enabling technology that facilitates the megatrends surrounding healthcare. These drivers include: A rapidly growing elderly population due to increased life expectancy. Technology advancement is growing at the rate of Moore’s law, driven by device miniaturization. The availability of huge data, driving the use of artificial intelligence and data analytics. An increasing focus on cost reduction. A tightening labor market, which has led to staff shortages, especially for nurses. A stringent regulatory environment, which slows approval of new products. An increased awareness of health and fitness by consumers, leading to wider adoption of wearables. These drivers have resulted in a rapid shift in point of care from the provider to ambulatory, home, and virtual care options. Also, the increasing availability of low-cost portable and wearable sensors facilitates the shift to remote points of care.For decades, functional electronic inks have proven to be a dependable, cost-efficient and energy efficient technology for highly reliable electronic circuitry and components, especially for medical devices. One of the main advantages over other processes is that functional electronic inks use an additive process, whereas the various conductor, resistor, and dielectric pastes are screen-printed or deposited by other means, then cured or fired in succession to form the circuit or electrode. This reduces waste. Also, most functional electronic inks have been developed without toxic substances subject and are RoHS and REACH compliant. Screens are relatively easy to manufacture and allow for flexibility in circuit design. Screen printing technology is capable of feature sizes from hundreds of microns down to 30 microns or less. The continuing drive to print smaller and thinner features enables device miniaturization. Functional electronic inks may be tailored for new form factors such as 3D, flexible, and stretchable substrates. These unique advantages make functional electronic inks the technology of choice for medical device electronics and medical sensors.In this presentation, we will summarize how functional electronic inks enable current and future devices that directly address the trends in the healthcare industry. Heraeus Electronics, with its extensive portfolio of functional electronic inks and pastes and matched systems is in a prime position to support these advancements.

Functional electronic inks as an enabler for the latest advancements in healthcare

3:05 PM

2022 healthcare spending in the U.S. alone was $4.5 trillion and grew at an annual rate of 5.3% between 2017 and 2022. The sheer size of the market provides a major opportunity for suppliers at all points of the value chain, especially if they have enabling technology that facilitates the megatrends surrounding healthcare. These drivers include: A rapidly growing elderly population due to increased life expectancy. Technology advancement is growing at the rate of Moore’s law, driven by device miniaturization. The availability of huge data, driving the use of artificial intelligence and data analytics. An increasing focus on cost reduction. A tightening labor market, which has led to staff shortages, especially for nurses. A stringent regulatory environment, which slows approval of new products. An increased awareness of health and fitness by consumers, leading to wider adoption of wearables. These drivers have resulted in a rapid shift in point of care from the provider to ambulatory, home, and virtual care options. Also, the increasing availability of low-cost portable and wearable sensors facilitates the shift to remote points of care.For decades, functional electronic inks have proven to be a dependable, cost-efficient and energy efficient technology for highly reliable electronic circuitry and components, especially for medical devices. One of the main advantages over other processes is that functional electronic inks use an additive process, whereas the various conductor, resistor, and dielectric pastes are screen-printed or deposited by other means, then cured or fired in succession to form the circuit or electrode. This reduces waste. Also, most functional electronic inks have been developed without toxic substances subject and are RoHS and REACH compliant. Screens are relatively easy to manufacture and allow for flexibility in circuit design. Screen printing technology is capable of feature sizes from hundreds of microns down to 30 microns or less. The continuing drive to print smaller and thinner features enables device miniaturization. Functional electronic inks may be tailored for new form factors such as 3D, flexible, and stretchable substrates. These unique advantages make functional electronic inks the technology of choice for medical device electronics and medical sensors.In this presentation, we will summarize how functional electronic inks enable current and future devices that directly address the trends in the healthcare industry. Heraeus Electronics, with its extensive portfolio of functional electronic inks and pastes and matched systems is in a prime position to support these advancements.

Watch Demo Video
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12 June 2024

Notion Systems

Wednesday

Advanced Patterning with EHD and Inkjet

More Details

3:05 PM

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Talk Demo

Maximilian Mosberg

Business Development and Sales

One of the founding ideas of Notion Systems was to replace the current subtractive process chains with additive process steps in electronics manufacturing. The n.jet inkjet platform is used to produce electronic displays, printed circuit boards, semiconductor components, as well as high precision optical 3D parts, covering the full range of solutions from lab to fab. Main inkjet applications are coating, dispensing or patterning. Patterning can easily be done with inkjet printing, as it is a digital printing process with drop-on-demand functionalities. Depending on the print head and the material used, resolutions of 20 µm are possible. Despite the fact that this is an interesting technology for any industries, there are limitations with this technology for certain display or semiconductor applications. For this reason, Notion Systems has invested in a collaboration with Scrona AG of Switzerland, which has developed an EHD printing technology.Electrohydrodynamic (EHD) printing is a new high-resolution printing technology that enables maskless, direct-write, non-contact, conformal and additive patterning at the micron scale with a variety of ink systems and materials. Print resolution exceeds that of conventional inkjet printing by two to three orders of magnitude, it paves the way for additive printing in applications dominated by photolithographic microfabrication and enables entirely new devices made from micro-scale building blocks.MEMS multi-nozzle printheads with ultra-high print resolution, enabling applications with resolution greater than 1 μm. This Research and development tool is targeted to advanced development labs in various fields of micro-fabrication and digital additive manufacturing.

Advanced Patterning with EHD and Inkjet

3:05 PM

One of the founding ideas of Notion Systems was to replace the current subtractive process chains with additive process steps in electronics manufacturing. The n.jet inkjet platform is used to produce electronic displays, printed circuit boards, semiconductor components, as well as high precision optical 3D parts, covering the full range of solutions from lab to fab. Main inkjet applications are coating, dispensing or patterning. Patterning can easily be done with inkjet printing, as it is a digital printing process with drop-on-demand functionalities. Depending on the print head and the material used, resolutions of 20 µm are possible. Despite the fact that this is an interesting technology for any industries, there are limitations with this technology for certain display or semiconductor applications. For this reason, Notion Systems has invested in a collaboration with Scrona AG of Switzerland, which has developed an EHD printing technology.Electrohydrodynamic (EHD) printing is a new high-resolution printing technology that enables maskless, direct-write, non-contact, conformal and additive patterning at the micron scale with a variety of ink systems and materials. Print resolution exceeds that of conventional inkjet printing by two to three orders of magnitude, it paves the way for additive printing in applications dominated by photolithographic microfabrication and enables entirely new devices made from micro-scale building blocks.MEMS multi-nozzle printheads with ultra-high print resolution, enabling applications with resolution greater than 1 μm. This Research and development tool is targeted to advanced development labs in various fields of micro-fabrication and digital additive manufacturing.

Watch Demo Video
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12 June 2024

Loomia Technologies

Wednesday

Integration Techniques for Electronic Textiles: Bridging Hard and Soft Materials

More Details

4:10 PM

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Talk Demo

Madison Maxey

Founder & CEO

Explore practical integration strategies for seamlessly incorporating the Loomia Electronic Layer - a type of E-textile- into various fabrics, trims, and plastics. Delve into the nuanced considerations of each method, with a focus on understanding their advantages, limitations, and ideal applications. This session aims to equip attendees with the knowledge needed to effectively scale electronic integration within trims, providing valuable insights for product developers working at the intersection of rigid and flexible materials. From automotive PU leathers to performance fabrics for AR/VR, this discussion offers practical guidance for navigating the challenges of integrating electronics into textiles and sheet materials.

Integration Techniques for Electronic Textiles: Bridging Hard and Soft Materials

4:10 PM

Explore practical integration strategies for seamlessly incorporating the Loomia Electronic Layer - a type of E-textile- into various fabrics, trims, and plastics. Delve into the nuanced considerations of each method, with a focus on understanding their advantages, limitations, and ideal applications. This session aims to equip attendees with the knowledge needed to effectively scale electronic integration within trims, providing valuable insights for product developers working at the intersection of rigid and flexible materials. From automotive PU leathers to performance fabrics for AR/VR, this discussion offers practical guidance for navigating the challenges of integrating electronics into textiles and sheet materials.

Watch Demo Video
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12 June 2024

VTT

Wednesday

Advancing printed and hybrid electronics from concepts to pilot factory manufacturing

More Details

4:10 PM

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Talk Demo

Antti Kemppainen

Key Account Manager