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ALL PAST & FUTURE EVENTS WITH A SINGLE ANNUAL PASS

Boston 2024

12-13 June 2024

The Future of Electronics RESHAPED 2024 USA

Boston Time

9am - 5pm

HTS-Healthtech RESHAPED2024

4-5 December 2024

The Future of Healthtech RESHAPED 2024

Berlin Time

12pm - 7pm

PE & Display Innovation 2024

11 December 2024

Printed Electronics Innovation Day

Berlin Time

2pm - 8pm

AGENDA
Berlin 2024

23-24 October 2024

The Future of Electronics RESHAPED 2024 Berlin

Berlin Time

9am - 5pm

PE & Display Innovation 2024

11 December 2024

Display Innovation Day

Berlin Time

2pm - 8pm

AGENDA
Boston 2025

11-12 June 2025

The Future of Electronics RESHAPED 2025 USA

Boston Time

9am - 5pm

Active Events

microLED Connect Series of Events

microLED

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AGENDA

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A TechBlick Annual Pass gives you 12 months access to our platform from the date you register. 
Through this platform, you can participate in all our LIVE online events, view the on-demand past presentations, join our expert-led masterclasses, and directly network with the entire TechBlick community using the searchable match-making function.
You can also participate in TechBlick LIVE! The Future of Electronics RESHAPED conference and exhibition in Eindhoven on 12 & 13 October, if applicable.

Health Tech
multi-topic
Platform & Networking Demo Videos

The following videos demonstrate what to expect in our upcoming LIVE (online) events. We introduce the event platform and describe the attendee-to-exhibitor as well as the attendee-to-attendee networking opportunities.

Innovations Festival
04:50
Swapcard Demo | 18 July
10:07
Our Focus Areas

We curate our topics to offer the full global picture, covering key innovation trends, enabling or breakthrough technologies, market dynamics, and emerging applications

Diversify-of-conductive-ink-applications.jpg

Electronics, Photovoltaics, Displays, Sensors

Printed, Flexible, Hybrid, Roll-to-Roll, Structural,  InMold, 3D, Conformal, Large-Area, Stretchable, Textile, Wearable, Patches, Transparent

Conductive Inks Trends Particle-Free, Lo

Material Innovations

Energy Storage Materials, Graphene and 2D Materials, Carbon Nanotubes, Perovskites, Quantum Dots, Organic Electronic Materials, 3D Printing Materials, Energy Harvesting,  Novel Functional Inks, Thermal Management Materials, Informatics, Low-loss Materials, Light-weighting

Novel Electronics

  • Printed Electronics

  • Flexible Electronics

  • Flexible Hybrid Electronics

  • Structural Electronics

  • Electronic Textiles (e-Textiles)

  • Electronic Skin Patches

  • Continuous Health Care Monitoring

  • Roll-to-Roll Electronics

  • Large-Area Electronics

  • OLED Lighting

  • Large-Area LED Lighting

  • Microfluidics

  • HMI and Membrane Switches

  • Printed Logic

  • Thin Flexible IC

  • Organic Photovoltaics

  • RFID and NFC

  • Perovskite Photovoltaics

  • Piezoresistive Sensors 

  • Force/Pressure sensors

  • Peizoelectric Sensors and Actuators

  • Haptics

  • Printed Organic Sensors

  • Hybrid QD or Organic-CMOS Imagers

  • Printed Temperature Sensors

  • Printed OLED

  • Electrochromic Displays

  • Thermochromic Displays

  • Electrophoretic Displays

  • MicroOLEDs

  • MicroLEDs

  • Printed Thin Film Transistors (TFTs)

  • Printed or Flexible Memory

  • Stretchable Strain Sensors

  • Humidity Sensors

  • Gas Sensors

  • Flexible Displays

  • Flexible Polarizers

  • Transparent Heating

  • Transparent Conductive Films 

  • Thin Film Encapsulation

  • Flexible Barriers

  • Solid State Battery

  • Si Anode Battery

  • LiS Battery

Advanced Materials

  • Peroviskites

  • Graphene

  • 2D Materials

  • Carbon Nanotubes

  • Quantum Dots

  • Novel dyes

  • Narrowband Phosphors

  • Si Anode

  • Graphite (Natural, Synthetic, Coated Purified)

  • Solid State Battery Electrolyte (e.g., LiPON, LLZO, LATP, LGPS)

  • Activated Carbon

  • LCO and LFP

  • NMC, NCA and LM

  • OLED

  • TADF (Thermally Activated Delayed Fluorescence)

  • Organic Semiconductors

  • Solution processed IGZO

  • Lithium Metal

  • Metal Sintered Die Attach

  • Low Temperature Solder

  • Anisotropic Conductive Adhesives

  • Isotropic Conductive Adhesives

  • Thermal Interface Materials

  • Vertically Aligned CNTs

  • 3D Printing Metal

  • 3D Printing Materials (Photosensitive Resins, Thermoplastic Powders/Filaments, Ceramic Powders)

  • Thermoelectronics

  • Material Informatics

  • Low-loss PTFE

  • Low-loss modified PI

  • Low-loss LCP

  • Particle-free Inks

  • Nanoparticle Inks

  • Stretchable Inks

  • Copper, Gold,  or Silver-Copper Inks

  • LTPS

  • Aerogels

  • Carbon Inks

  • UV Curable Dielectrics

  • HTL/ETL

  • ALD (Atomic Layer Deposition) Precursors

  • Boron Nitride 

  • SiC

  • clear PI and  Other Flexible Substrates

  • Dispersents

Processes

  • InMold Electronics

  • Inkjet Printing

  • Aerosol Deposition

  • Laser Direct Sturcturing (LDS)

  • Transparent Electronics

  • Spatial ALD

  • Roll-to-Roll Electronics

  • Electrohydrodynamic

  • Spraying

  • Pick-and-place

  • Stamping/Transfer Pritning

  • 3D Printing

  • Nanoprinting

  • Flex printing

  • Gravure Printing

  • Thermal Sintering/Curing

  • Photonic Sintering/Curing

  • SMTs (surface mount technology)

  • Inspection

  • Evaporation 

  • Sputtering

  • Ultrapreicison Printing

  • Wafer Printing

  • Vapor Jetting and Spraying

  • Plating

  • Dispensing

  • Stencil Printing

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