ALL PAST & FUTURE EVENTS AS WELL AS MASTERCLASSES WITH A SINGLE ANNUAL PASS

Electronics Packaging Symposium: AI Chips, 5G Packaging, Chiplets. Heterogeneous Integration, High Density Fan-Out Packages, Scaling, Future of Semiconductors

4-5 November 2021
Virtual Symposium

Topics Covered

This event will be available as on-demand talks only. This was originally organized by the Integrated Electronics Engineering Center (IEEC) of Binghamton University. Topics covered include Future of Semiconductor Technology | Heterogeneous Integration | AI Hardware | Supercomputers | Quantum Computing | On-Package Integration | Panel Level Packaging | Chiplets and Die Block Assembly | 5G Architectures and Packaging| Materials for Neuromorphic Computing | Photonic Packaging | Printed Microwave Packaging | Future of Semiconductors | High Density Fan-Out Packages | Chiplets and SiP | Liquid Metal | 3D Printed Electronics | Printed Electronics | Energy Storage E-Textiles | Interconnects and Die Attach Technologies | Scaling in interconnects | E-Textiles | Wearable Sensors

Leading global speakers include:

Full Agenda

The times below is Central European Times (CET).

On the platform the times will automatically be changed to your time zone

Coming Soon
4 November 2021
TechBlick-favicon.png

Binghamton University

Thursday

Opening Remarks

More Details

10:00am

joint-presentations.png
TechBlick-favicon_edited.png

Bahgat Sammakla

Vice President for Research

Opening Remarks

More Details

10:00am

4 November 2021
TechBlick-favicon.png

GE Research

Thursday

Opening Remarks

More Details

10:10am

joint-presentations.png
TechBlick-favicon_edited.png

James LeBlanc

Executive Technology Director

Opening Remarks

More Details

10:10am

4 November 2021
TechBlick-favicon.png

IBM Research

Thursday

Opening Remarks

More Details

10:10am

joint-presentations.png
TechBlick-favicon_edited.png

Mukesh V. Khare

Vice President

Semiconductor advances have powered nearly every aspect of technology for over 50 years and continue to push the limits of computing performance. This talk will discuss the most recent advances and what’s next in semiconductor technology. IBM Research has maintained leadership in logic technology, and recently announced a breakthrough that will push scaling to the 2nm node and beyond. The trend will continue, with more innovations in microelectronics increasing functionality, advances in packaging and heterogeneous integration, AI hardware, supercomputers (HPC), and quantum computing. Mukesh will share some of the advances in AI cores for both digital and analog compute, which are expected to deliver huge improvements in performance and efficiency without sacrificing accuracy. The talk will also include a journey through IBM’s Quantum ecosystem, including both the hardware and the community which supports its rapid development The combination of quantum computing and semiconductor technology advances for HPC will be the creation of unseen compute power, dramatically accelerating the rate of scientific discovery, with a profound impact on science and industry.

Bio: Dr. Mukesh V. Khare is Vice President at IBM Research, driving IBM’s Hybrid Cloud research agenda. His team of more than 1000 researchers worldwide is re-defining the future of computing for the next generation workloads such as AI, Machine Learning, High-Performance Computing and their delivery through Hybrid Cloud. Dr. Khare’s areas of responsibilities at IBM range from fundamental materials and device research for semiconductors, novel chip architecture and design, cloud and enterprise systems and software for hybrid cloud.

Throughout his career, Dr. Khare helped build and drive collaborative research alliances with leading companies to create what is next in computing. He championed the formation of the AI Hardware Center in 2019 to drive innovations in AI hardware technologies through public-private partnership. Dr. Khare is also the executive sponsor of IBM’s recently launched Cloud Innovation Lab that helps clients and ecosystem partners advance state-of-the-art in cloud technologies. Over the last decade he established IBM Research site at Albany, NY as the world-wide hub for collaborative research in semiconductor technology and built a platform for advanced logic and packaging technology innovation.

Dr. Khare is a recipient of IBM Corporate Award for his technical accomplishments and is also an IBM Distinguished Engineer. He serves on the Board of Directors for the Semiconductor Research Corporation (SRC) and is an active board member of several research-focused entities. Dr. Khare served as the General Chair of the 2018 Symposia on VLSI Technology, has co-authored more than 100 research papers and holds many U.S. and international patents.

Dr. Khare began his career at IBM in 1998 after finishing his M.S, M. Phil. and Ph.D. degrees from Yale University. He is a strong advocate of diversity and inclusion in the workplace through sponsoring initiatives such as PowerUp for women engineers. A proud father of two and the husband of an architect, Dr. Khare lives in Niskayuna, New York.