Bio

Thomas Germann joined Identiv in 2013 in the R&D department of Identiv’s RFID transponder & reader business unit and is now its R&D Manager. He is mainly responsible for development of novel UHF & HF RFID tags, as well as Sensor-enabled NFC products with functionality beyond pure identification. Thomas brings a strong background in RFID label and printed electronics product development, which enable the development of cutting edge flexible RFID & NFC sensor tags and corresponding systems. Thomas holds a Diploma (M.Sc.) in Engineering Physics from the Technische Universität München (TUM).

FHE production becomes more and more important role in IOT and wearable devices manufacturing, the mature production solution is needed for the growing market development.
S&S’s DOP, Direct On Paper Solution integrates antenna printing and chip assembling in R2R mass production scale for RFID inlay with paper, serve as basis for realizing further FHE product development with low temperature substrates like paper.

Alan Wu
President @ Smooth & Sharp Corporation

Bio

Alan Wu is founder and President of S&S, Smooth & Sharp Corporation, he dedicates himself in RFID since 2002. Based on decades of RFID inlay manufacturing technology, he starts Flexible Hybrid Electronics production in 2016 in Taiwan.

Alan received his bachelor degree in technical orientated MBA at University Stuttgart, Germany in 1992. After his study in Germany, Alan creates numerous international business projects in RFID and Solar industry, he acts as leading management in local medium size companies before he founds S&S.

Bio

Steve is responsible for business development activities across CPI’s printed electronics platform. Steve’s expertise lies in the area of printed electronics, printed sensing and its role in the development of the internet of things and industry 4.0. Steve has delivered on a number of successful private projects at CPI, helping new research ideas develop from prototype and through to commercial deployment. Clients include industries such as automotive, aerospace, defence, packaging and medtech. These projects involve working with companies of all sizes ranging from large corporates to SMEs and academia.

Previously Steve held marketing positions at CPI, where he was responsible for managing the marketing operations of CPI’s printable electronics division. Steve’s role was to provide an end user focus in the scale up and commercialisation of products and processes related to printable electronics. He has extensive knowledge in emerging technology areas such as intelligent print, printed lighting and enabling technologies such as materials integration and barrier encapsulation.

Prior to joining CPI in 2008, Steve graduated from Northumbria University in Business Studies and is currently studying an Executive MBA at Warwick Business School.

Bio

Doyoung Byun received the PhD degree in Mechanical and Aerospace Engineering from the Korea Advanced Institute of Science and Technology (KAIST), Korea, in 2000. He has worked in several institutes and academies and founded the Enjet in 2009 in order to commercialize his high resolution printing and coating technologies for the printed electronics. Since 2009, he has served as CEO in the Enjet. He has developed the novel femto-liter droplet dispensing technology, electrostatic spray nozzle for functional coating, micro-fluidic devices, and MEMS devices. Based on these core technologies, he could commercialize ultra-fine printing and spray coating solutions for OLED display, micro-LED display, mobile phone, and bio-medical applications.

The Enjet is a high resolution inkjet printing solution leader and has a vision to provide innovative tools of printed electronics (2D and 3D), replacing conventional vacuum processes in OLED, PCB, Semiconductor, Glass, Bio-medical, and energy industries. The Enjet has further dreams to develop 3D additive manufacturing solutions for printed electronics. The Enjet has been developing a high resolution inkjet head with multi-nozzles, which can dispense higher viscous ink than the conventional ones and form pico-liter or even femto-liter droplets. With this novel inkjet head, we can print and manufacture 3D electronic devices from the provided model data and personal customized products.

Bio

Eric W. Forsythe, Ph.D is the Team Leader for Flexible Electronics at the US Army Research Laboratory, Adelphi, MD. His responsibilities include; the Program Manager for the Flexible Hybrid Electronics Manufacturing Innovation Institute. Recently, Dr Forsythe was the Deputy Program Manager for the U.S. Army’s Flexible Display Center that demonstrated the World’s Largest flexible organic ligtht emitting diode displays and most recently the World’s Largest flexible digital x-ray imagers for DOD Explosive Ordnance Disposal. Additional responsibilities include the co-PI with the human performancde team for the ARL initiaitive “Continuous, Real-Time Assessment of Soldiers:The Foundation for Future Individualized and Adaptive Technologies” and the ARL Directors Initiative entitle “Ultrafast Electron Spectrocopy” for unique materials science exploration. Prior to joining ARL in 2001, Dr Forsythe was a Research Associate at the University of Rochester where he worked on electronic interfaces in organic light emitting diodes (OLEDs) with Eastman Kodak, the inventors of the commercial OLED display technology. In 1996, Dr Forsythe received his Ph.D in Engineering Physics at Stevens Institute of Technology. He has spent time working at small businesses on SBIR-projects in wide range of technologies and at Kearfott Guidance and Navigation on the Trident Missile stellar inertial guidance system, in the mid-1980’s. Dr Forsythe has more than 60 publications (2000 citations, H-index 19), and 5 patents filed or issued.

We introduce the ultra-precise deposition (UPD) technology for rapid prototyping of microelectronic devices. UPD allows maskless deposition of high-viscosity metallic and non-metallic inks with the printed feature size as small as 1 μm. XTPL technology answers some of the key challenges in the fabrication of high-density microelectronics, including the ability to print on complex 3D substrates and obtain structures with arbitrary shapes, including lines, dots, crosses, and meshes

ChipInFlex is CEA-Leti's latest development towards the integration of ultra-thin, bare silicon chips within a flexible film. Today, electronic systems are becoming smaller, thinner and, above all, flexible. Flexibility makes possible new functions and hence new usages. With Chip-In-Flex, CEA-Leti is introducing a new paradigm for integrating ultra-thin, bare chips into a flexible label made on a silicon wafer.

Conventional silicon technology has embedded at least one integrated circuit into every smart device on Earth. However, it faces key challenges to make everyday objects smarter. Cost is the most important factor but flexibility and conformability are highly desirable.
Our approach is to develop integrated circuits using flexible electronic fabrication techniques, thus paving the way towards natively-flexible LSI and VLSI ICs.

Jedrzej Kufel
Staff Research Engineer @ Arm
Bio

Dr Jedrzej Kufel is a Staff Research Engineer. He joined Arm in 2014, working in the IoT product team before moving to Research in 2016. His current interests are in the area of low-power integrated circuit design using flexible/printed electronics, validation and test methodologies and circular economy. Jedrzej holds a MEng in Mechatronics and Robotic Systems from University of Liverpool and a PhD from University of Southampton.

Coatema delivered a pilot line in 2012 to the University of Thessaloniki in Greece. (Auth). Since them there had been a continuous scale up of the system with the integration of different quality control systems like inline spectroscopy and others. In a new European project called Real Nano additional quality control systems are being installed.
The talk describes the used systems, the influence of the different parameters like coating, drying, tension control and others.

Thomas Kolbusch
Vice President @ Coatema® Coating Machinery GmbH
Bio

Thomas Kolbusch is Vice President of Coatema Coating Machinery GmbH, an equipment manufacturing company for coating, printing and laminating solutions located in Dormagen, Germany.
He is member of the board of the OE-A (Organic Electronic Association) in Germany, a global association for printed electronics.
He serves in the advisory board of Fraunhofer ITA institute.
He served as member of the board of COPT.NRW, a local association in Germany, as well as exhibition chair of the LOPEC in Munich for five years. Thomas is active in the field of fuel cells, batteries, printed electronics, photovoltaics and medical applications. He organizes the international Coatema Coating Symposium for over 19 years and represents Coatema in a number of public funded German and European projects. Thomas Kolbusch studied Business Economics at the Niederrhein University of Applied Sciences and got his degree as business economist in 1997. He started his career at 3M, Germany. Since 1999 he is working for Coatema Coating Machinery in different positions.

Bio

Douglas Hackler, Co-founder of American Semiconductor 2001. 30+ years of experience in wafer fabrication, process development, manufacturing and commercialization at M/A-Com, Zilog, Intel, NorTel and General Instrument. Engineering degrees from Boise State University (BSEE) and the University of Idaho (MSEE). Business degree from Texas Tech University (BBA). Doug has multiple patents and patents pending for advanced packaging and flexible technology and has published numerous technical papers. At American Semiconductor Doug maintains overall corporate and operational responsibilities.

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Traditional semiconductor manufacturing has remained largely unchanged throughout the modern era, and growing efforts to increase throughput and reduce cost provide an ever more compelling case for applications where the flexibility of additive manufacturing can intercept. This talk will explore opportunities, challenges and the road ahead towards adaptation of printed electronics within the semiconductor industry.

We will present an investigation of risks of failure in a prototype printed hybrid electronics (PHE) Arduino-type circuit to be fabricated using a variety of additive manufacturing technologies including aerosol-jet, syringe, and stereolithography (SLA) printing. The interfaces of different components and materials in this design introduce potential sources of failure including thermal expansion mismatches and silver migration resulting from temperature cycling. We will discuss the design rationale, fabrication methods, and testing conditions of three different test coupons, each of which isolates a different area of interest in the PHE assembly and seeks to identify and prevent the greatest risks.

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ACI will introduce to the world its Alchemy Conductive Inks. These high-performance printable conductors allow PTF ink like ease of use and processing with fired/sintered thick film electrical performance. The talk will describe some of the overall benefits of using these materials in manufacture of flexible and 3D printed electronics including:
low volume resistivity and sheet resistance
higher current carrying capacity
lower cost per ohm square in use
superior crease ability of narrow traces
formulation latitude from viscous paste to sprayable
Several examples will be presented including
3D circuit structures
high resolution traces
high power density busbars
reflow solder ability

CondAlign’s technology represents a novel process for production of anisotropic, conductive films. Using an electric field to structure and align particles, the results in a z-axis conductive film structure. One product type we can produce is anisotropic conductive adhesive (ACA) films with thicknesses from a few µm to some hundreds µm and resistance below 0,01 Ohm/cm^2. With very high chain densities (pitch below 10µm), these films are currently being tested in several bonding processes, like FOB, FOF, COB, COF, as an alternative to traditional ACF. The process is demonstrated in roll-to-roll production, proofing it is scalable and cost effective.

Morten Lindberget
VP Business Development @ CondAlign
Bio

An enabler with 25 years international experience from leadership, sales and business development roles in technology consulting, contract manufacturing, medical device technology and scale up. Morten holds a MSc in Mech. Engineering from TU Delft, the Netherlands, and an Executive Master of Management from BI, Norway.

Digital printing has clearly established itself for graphics printing, thanks to the advantages it offers over traditional processes like screen printing. More recently, digital printing started morphing into digital manufacturing and also Printed Electronics is taking advantage of that evolution. In this talk we will review Agfa's digital conductive inks based on nanomaterials, and highlight some features of newly developed inks. In the second part of the talk, Nanogate Netherlands will discuss the application of additive digital manufacturing in motor sport products.

Peter Willaert
Global Marketing Manager Printed Electronics @ Agfa
Bio

Experienced Product Marketing and Business Development Manager in Printed Electronics with a background in Electronic Engineering. Over the years I have developed a broad knowledge about materials and processes for applications like RFID, iOT, Sensors, Displays etc.

Digital printing has clearly established itself for graphics printing, thanks to the advantages it offers over traditional processes like screen printing. More recently, digital printing started morphing into digital manufacturing and also Printed Electronics is taking advantage of that evolution. In this talk we will review Agfa's digital conductive inks based on nanomaterials, and highlight some features of newly developed inks. In the second part of the talk, Nanogate Netherlands will discuss the application of additive digital manufacturing in motor sport products.

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