ALL PAST & FUTURE EVENTS AS WELL AS MASTERCLASSES WITH A SINGLE ANNUAL PASS
Full Agenda
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11 May 2021
IDENTIVE
NFC & UHF Flexible & Hybrid Sensor Tags
Tuesday
01:10pm
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Thomas Germann
R&D Manager
Bio
Thomas Germann joined Identiv in 2013 in the R&D department of Identiv’s RFID transponder & reader business unit and is now its R&D Manager. He is mainly responsible for development of novel UHF & HF RFID tags, as well as Sensor-enabled NFC products with functionality beyond pure identification. Thomas brings a strong background in RFID label and printed electronics product development, which enable the development of cutting edge flexible RFID & NFC sensor tags and corresponding systems. Thomas holds a Diploma (M.Sc.) in Engineering Physics from the Technische Universität München (TUM).
Flexible Hybrid Electr, R2R, All, Printed Electronics, Flexible Hybrid Electro
NFC & UHF Flexible & Hybrid Sensor Tags
More Details
01:10pm
Bio
Thomas Germann joined Identiv in 2013 in the R&D department of Identiv’s RFID transponder & reader business unit and is now its R&D Manager. He is mainly responsible for development of novel UHF & HF RFID tags, as well as Sensor-enabled NFC products with functionality beyond pure identification. Thomas brings a strong background in RFID label and printed electronics product development, which enable the development of cutting edge flexible RFID & NFC sensor tags and corresponding systems. Thomas holds a Diploma (M.Sc.) in Engineering Physics from the Technische Universität München (TUM).

11 May 2021
Smooth & Sharp Corporation
Printed RFID inlay in Mass Production Scale as basis for further FHE product
Tuesday
01:30pm
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Alan Wu
President
FHE production becomes more and more important role in IOT and wearable devices manufacturing, the mature production solution is needed for the growing market development.
S&S’s DOP, Direct On Paper Solution integrates antenna printing and chip assembling in R2R mass production scale for RFID inlay with paper, serve as basis for realizing further FHE product development with low temperature substrates like paper.
Alan Wu
President @ Smooth & Sharp Corporation
Bio
Alan Wu is founder and President of S&S, Smooth & Sharp Corporation, he dedicates himself in RFID since 2002. Based on decades of RFID inlay manufacturing technology, he starts Flexible Hybrid Electronics production in 2016 in Taiwan.
Alan received his bachelor degree in technical orientated MBA at University Stuttgart, Germany in 1992. After his study in Germany, Alan creates numerous international business projects in RFID and Solar industry, he acts as leading management in local medium size companies before he founds S&S.
R2R, Flexible Hybrid Electro, Printed Electronics, All
Printed RFID inlay in Mass Production Scale as basis for further FHE product
More Details
01:30pm
FHE production becomes more and more important role in IOT and wearable devices manufacturing, the mature production solution is needed for the growing market development.
S&S’s DOP, Direct On Paper Solution integrates antenna printing and chip assembling in R2R mass production scale for RFID inlay with paper, serve as basis for realizing further FHE product development with low temperature substrates like paper.
Alan Wu
President @ Smooth & Sharp Corporation
Bio
Alan Wu is founder and President of S&S, Smooth & Sharp Corporation, he dedicates himself in RFID since 2002. Based on decades of RFID inlay manufacturing technology, he starts Flexible Hybrid Electronics production in 2016 in Taiwan.
Alan received his bachelor degree in technical orientated MBA at University Stuttgart, Germany in 1992. After his study in Germany, Alan creates numerous international business projects in RFID and Solar industry, he acts as leading management in local medium size companies before he founds S&S.

11 May 2021
CPI
Applications Utilising Roll to Roll Fexible Hybrid Electronics
Tuesday
01:50pm
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Steven Bagshaw
Business Development Manager
Bio
Steve is responsible for business development activities across CPI’s printed electronics platform. Steve’s expertise lies in the area of printed electronics, printed sensing and its role in the development of the internet of things and industry 4.0. Steve has delivered on a number of successful private projects at CPI, helping new research ideas develop from prototype and through to commercial deployment. Clients include industries such as automotive, aerospace, defence, packaging and medtech. These projects involve working with companies of all sizes ranging from large corporates to SMEs and academia.
Previously Steve held marketing positions at CPI, where he was responsible for managing the marketing operations of CPI’s printable electronics division. Steve’s role was to provide an end user focus in the scale up and commercialisation of products and processes related to printable electronics. He has extensive knowledge in emerging technology areas such as intelligent print, printed lighting and enabling technologies such as materials integration and barrier encapsulation.
Prior to joining CPI in 2008, Steve graduated from Northumbria University in Business Studies and is currently studying an Executive MBA at Warwick Business School.
Flexible Hybrid Electro, All
Applications Utilising Roll to Roll Fexible Hybrid Electronics
More Details
01:50pm
Bio
Steve is responsible for business development activities across CPI’s printed electronics platform. Steve’s expertise lies in the area of printed electronics, printed sensing and its role in the development of the internet of things and industry 4.0. Steve has delivered on a number of successful private projects at CPI, helping new research ideas develop from prototype and through to commercial deployment. Clients include industries such as automotive, aerospace, defence, packaging and medtech. These projects involve working with companies of all sizes ranging from large corporates to SMEs and academia.
Previously Steve held marketing positions at CPI, where he was responsible for managing the marketing operations of CPI’s printable electronics division. Steve’s role was to provide an end user focus in the scale up and commercialisation of products and processes related to printable electronics. He has extensive knowledge in emerging technology areas such as intelligent print, printed lighting and enabling technologies such as materials integration and barrier encapsulation.
Prior to joining CPI in 2008, Steve graduated from Northumbria University in Business Studies and is currently studying an Executive MBA at Warwick Business School.

11 May 2021
ENJET Inc
High-Resolution Printing from 2D to 3D for Additive Manufacturing of Printed Electronics
Tuesday
01:50pm
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Doyoung Byun
CEO
Bio
Doyoung Byun received the PhD degree in Mechanical and Aerospace Engineering from the Korea Advanced Institute of Science and Technology (KAIST), Korea, in 2000. He has worked in several institutes and academies and founded the Enjet in 2009 in order to commercialize his high resolution printing and coating technologies for the printed electronics. Since 2009, he has served as CEO in the Enjet. He has developed the novel femto-liter droplet dispensing technology, electrostatic spray nozzle for functional coating, micro-fluidic devices, and MEMS devices. Based on these core technologies, he could commercialize ultra-fine printing and spray coating solutions for OLED display, micro-LED display, mobile phone, and bio-medical applications.
The Enjet is a high resolution inkjet printing solution leader and has a vision to provide innovative tools of printed electronics (2D and 3D), replacing conventional vacuum processes in OLED, PCB, Semiconductor, Glass, Bio-medical, and energy industries. The Enjet has further dreams to develop 3D additive manufacturing solutions for printed electronics. The Enjet has been developing a high resolution inkjet head with multi-nozzles, which can dispense higher viscous ink than the conventional ones and form pico-liter or even femto-liter droplets. With this novel inkjet head, we can print and manufacture 3D electronic devices from the provided model data and personal customized products.
Ultraprecision Printing, Printed Electronics, Advanced Displays, All, UltraFineLine Printing, adva
High-Resolution Printing from 2D to 3D for Additive Manufacturing of Printed Electronics
More Details
01:50pm
Bio
Doyoung Byun received the PhD degree in Mechanical and Aerospace Engineering from the Korea Advanced Institute of Science and Technology (KAIST), Korea, in 2000. He has worked in several institutes and academies and founded the Enjet in 2009 in order to commercialize his high resolution printing and coating technologies for the printed electronics. Since 2009, he has served as CEO in the Enjet. He has developed the novel femto-liter droplet dispensing technology, electrostatic spray nozzle for functional coating, micro-fluidic devices, and MEMS devices. Based on these core technologies, he could commercialize ultra-fine printing and spray coating solutions for OLED display, micro-LED display, mobile phone, and bio-medical applications.
The Enjet is a high resolution inkjet printing solution leader and has a vision to provide innovative tools of printed electronics (2D and 3D), replacing conventional vacuum processes in OLED, PCB, Semiconductor, Glass, Bio-medical, and energy industries. The Enjet has further dreams to develop 3D additive manufacturing solutions for printed electronics. The Enjet has been developing a high resolution inkjet head with multi-nozzles, which can dispense higher viscous ink than the conventional ones and form pico-liter or even femto-liter droplets. With this novel inkjet head, we can print and manufacture 3D electronic devices from the provided model data and personal customized products.

11 May 2021
U.S. Army Combat Capabilities Development Command
Hybrid Electronics: Expanding manufacturing options for electronic assembly and packaging
Tuesday
02:10pm
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Eric Forsythe
SAMM-ERP Hybrid Electronics Thrust Lead
Bio
Eric W. Forsythe, Ph.D is the Team Leader for Flexible Electronics at the US Army Research Laboratory, Adelphi, MD. His responsibilities include; the Program Manager for the Flexible Hybrid Electronics Manufacturing Innovation Institute. Recently, Dr Forsythe was the Deputy Program Manager for the U.S. Army’s Flexible Display Center that demonstrated the World’s Largest flexible organic ligtht emitting diode displays and most recently the World’s Largest flexible digital x-ray imagers for DOD Explosive Ordnance Disposal. Additional responsibilities include the co-PI with the human performancde team for the ARL initiaitive “Continuous, Real-Time Assessment of Soldiers:The Foundation for Future Individualized and Adaptive Technologies” and the ARL Directors Initiative entitle “Ultrafast Electron Spectrocopy” for unique materials science exploration. Prior to joining ARL in 2001, Dr Forsythe was a Research Associate at the University of Rochester where he worked on electronic interfaces in organic light emitting diodes (OLEDs) with Eastman Kodak, the inventors of the commercial OLED display technology. In 1996, Dr Forsythe received his Ph.D in Engineering Physics at Stevens Institute of Technology. He has spent time working at small businesses on SBIR-projects in wide range of technologies and at Kearfott Guidance and Navigation on the Trident Missile stellar inertial guidance system, in the mid-1980’s. Dr Forsythe has more than 60 publications (2000 citations, H-index 19), and 5 patents filed or issued.
All, Printed Electronics, Advanced Displays
Hybrid Electronics: Expanding manufacturing options for electronic assembly and packaging
More Details
02:10pm
Bio
Eric W. Forsythe, Ph.D is the Team Leader for Flexible Electronics at the US Army Research Laboratory, Adelphi, MD. His responsibilities include; the Program Manager for the Flexible Hybrid Electronics Manufacturing Innovation Institute. Recently, Dr Forsythe was the Deputy Program Manager for the U.S. Army’s Flexible Display Center that demonstrated the World’s Largest flexible organic ligtht emitting diode displays and most recently the World’s Largest flexible digital x-ray imagers for DOD Explosive Ordnance Disposal. Additional responsibilities include the co-PI with the human performancde team for the ARL initiaitive “Continuous, Real-Time Assessment of Soldiers:The Foundation for Future Individualized and Adaptive Technologies” and the ARL Directors Initiative entitle “Ultrafast Electron Spectrocopy” for unique materials science exploration. Prior to joining ARL in 2001, Dr Forsythe was a Research Associate at the University of Rochester where he worked on electronic interfaces in organic light emitting diodes (OLEDs) with Eastman Kodak, the inventors of the commercial OLED display technology. In 1996, Dr Forsythe received his Ph.D in Engineering Physics at Stevens Institute of Technology. He has spent time working at small businesses on SBIR-projects in wide range of technologies and at Kearfott Guidance and Navigation on the Trident Missile stellar inertial guidance system, in the mid-1980’s. Dr Forsythe has more than 60 publications (2000 citations, H-index 19), and 5 patents filed or issued.

11 May 2021
XTPL
High-Resolution 3D-Printed Conductive Features In Single Micron Scale
Tuesday
02:10pm
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Filip Granek
CEO
We introduce the ultra-precise deposition (UPD) technology for rapid prototyping of microelectronic devices. UPD allows maskless deposition of high-viscosity metallic and non-metallic inks with the printed feature size as small as 1 μm. XTPL technology answers some of the key challenges in the fabrication of high-density microelectronics, including the ability to print on complex 3D substrates and obtain structures with arbitrary shapes, including lines, dots, crosses, and meshes
Ultraprecision Printing, Conducti, All, Printed Electronics, Conductive Ink, Advanced Materials
High-Resolution 3D-Printed Conductive Features In Single Micron Scale
More Details
02:10pm
We introduce the ultra-precise deposition (UPD) technology for rapid prototyping of microelectronic devices. UPD allows maskless deposition of high-viscosity metallic and non-metallic inks with the printed feature size as small as 1 μm. XTPL technology answers some of the key challenges in the fabrication of high-density microelectronics, including the ability to print on complex 3D substrates and obtain structures with arbitrary shapes, including lines, dots, crosses, and meshes

11 May 2021
CEA
Ultrathin Flexible ICs For Flexible Electronics
Tuesday
02:50pm
More Details


Jean-Charles Souriau
Project Leader
ChipInFlex is CEA-Leti's latest development towards the integration of ultra-thin, bare silicon chips within a flexible film. Today, electronic systems are becoming smaller, thinner and, above all, flexible. Flexibility makes possible new functions and hence new usages. With Chip-In-Flex, CEA-Leti is introducing a new paradigm for integrating ultra-thin, bare chips into a flexible label made on a silicon wafer.
Ultrathin IC, Flexible Hybrid Electro, All
Ultrathin Flexible ICs For Flexible Electronics
More Details
02:50pm
ChipInFlex is CEA-Leti's latest development towards the integration of ultra-thin, bare silicon chips within a flexible film. Today, electronic systems are becoming smaller, thinner and, above all, flexible. Flexibility makes possible new functions and hence new usages. With Chip-In-Flex, CEA-Leti is introducing a new paradigm for integrating ultra-thin, bare chips into a flexible label made on a silicon wafer.

11 May 2021
ARM
Towards Natively Flexible ICs
Tuesday
03:10pm
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Jedrzej Kufel
Staff Research Engineer
Conventional silicon technology has embedded at least one integrated circuit into every smart device on Earth. However, it faces key challenges to make everyday objects smarter. Cost is the most important factor but flexibility and conformability are highly desirable.
Our approach is to develop integrated circuits using flexible electronic fabrication techniques, thus paving the way towards natively-flexible LSI and VLSI ICs.
Jedrzej Kufel
Staff Research Engineer @ Arm
Bio
Dr Jedrzej Kufel is a Staff Research Engineer. He joined Arm in 2014, working in the IoT product team before moving to Research in 2016. His current interests are in the area of low-power integrated circuit design using flexible/printed electronics, validation and test methodologies and circular economy. Jedrzej holds a MEng in Mechatronics and Robotic Systems from University of Liverpool and a PhD from University of Southampton.
Flexible Hybrid Electr, Ultrathin IC, Printed Electronics, All
Towards Natively Flexible ICs
More Details
03:10pm
Conventional silicon technology has embedded at least one integrated circuit into every smart device on Earth. However, it faces key challenges to make everyday objects smarter. Cost is the most important factor but flexibility and conformability are highly desirable.
Our approach is to develop integrated circuits using flexible electronic fabrication techniques, thus paving the way towards natively-flexible LSI and VLSI ICs.
Jedrzej Kufel
Staff Research Engineer @ Arm
Bio
Dr Jedrzej Kufel is a Staff Research Engineer. He joined Arm in 2014, working in the IoT product team before moving to Research in 2016. His current interests are in the area of low-power integrated circuit design using flexible/printed electronics, validation and test methodologies and circular economy. Jedrzej holds a MEng in Mechatronics and Robotic Systems from University of Liverpool and a PhD from University of Southampton.

11 May 2021
COATEMA Coating Machinery GmbH
Improvement of yield and performance of OPV by using inline quality control systems and process monitoring
Tuesday
03:10pm
More Details


Thomas Kolbusch
Vice President
Coatema delivered a pilot line in 2012 to the University of Thessaloniki in Greece. (Auth). Since them there had been a continuous scale up of the system with the integration of different quality control systems like inline spectroscopy and others. In a new European project called Real Nano additional quality control systems are being installed.
The talk describes the used systems, the influence of the different parameters like coating, drying, tension control and others.
Thomas Kolbusch
Vice President @ Coatema® Coating Machinery GmbH
Bio
Thomas Kolbusch is Vice President of Coatema Coating Machinery GmbH, an equipment manufacturing company for coating, printing and laminating solutions located in Dormagen, Germany.
He is member of the board of the OE-A (Organic Electronic Association) in Germany, a global association for printed electronics.
He serves in the advisory board of Fraunhofer ITA institute.
He served as member of the board of COPT.NRW, a local association in Germany, as well as exhibition chair of the LOPEC in Munich for five years. Thomas is active in the field of fuel cells, batteries, printed electronics, photovoltaics and medical applications. He organizes the international Coatema Coating Symposium for over 19 years and represents Coatema in a number of public funded German and European projects. Thomas Kolbusch studied Business Economics at the Niederrhein University of Applied Sciences and got his degree as business economist in 1997. He started his career at 3M, Germany. Since 1999 he is working for Coatema Coating Machinery in different positions.
Electronic, Printed Electronics
Improvement of yield and performance of OPV by using inline quality control systems and process monitoring
More Details
03:10pm
Coatema delivered a pilot line in 2012 to the University of Thessaloniki in Greece. (Auth). Since them there had been a continuous scale up of the system with the integration of different quality control systems like inline spectroscopy and others. In a new European project called Real Nano additional quality control systems are being installed.
The talk describes the used systems, the influence of the different parameters like coating, drying, tension control and others.
Thomas Kolbusch
Vice President @ Coatema® Coating Machinery GmbH
Bio
Thomas Kolbusch is Vice President of Coatema Coating Machinery GmbH, an equipment manufacturing company for coating, printing and laminating solutions located in Dormagen, Germany.
He is member of the board of the OE-A (Organic Electronic Association) in Germany, a global association for printed electronics.
He serves in the advisory board of Fraunhofer ITA institute.
He served as member of the board of COPT.NRW, a local association in Germany, as well as exhibition chair of the LOPEC in Munich for five years. Thomas is active in the field of fuel cells, batteries, printed electronics, photovoltaics and medical applications. He organizes the international Coatema Coating Symposium for over 19 years and represents Coatema in a number of public funded German and European projects. Thomas Kolbusch studied Business Economics at the Niederrhein University of Applied Sciences and got his degree as business economist in 1997. He started his career at 3M, Germany. Since 1999 he is working for Coatema Coating Machinery in different positions.

11 May 2021
American Semiconductor
State-of-the-Art and Issues for Bluetooth® Flexible Hybrid Electronics (FHE)
Tuesday
03:30pm
More Details


Doug Hackler
CEO
Bio
Douglas Hackler, Co-founder of American Semiconductor 2001. 30+ years of experience in wafer fabrication, process development, manufacturing and commercialization at M/A-Com, Zilog, Intel, NorTel and General Instrument. Engineering degrees from Boise State University (BSEE) and the University of Idaho (MSEE). Business degree from Texas Tech University (BBA). Doug has multiple patents and patents pending for advanced packaging and flexible technology and has published numerous technical papers. At American Semiconductor Doug maintains overall corporate and operational responsibilities.
Ultrathin IC and TFTs, Printed Electronics, Flexible Hybrid Electr, Flexible Hybrid Electro, All, Semiconductor Packaging
State-of-the-Art and Issues for Bluetooth® Flexible Hybrid Electronics (FHE)
More Details
03:30pm
Bio
Douglas Hackler, Co-founder of American Semiconductor 2001. 30+ years of experience in wafer fabrication, process development, manufacturing and commercialization at M/A-Com, Zilog, Intel, NorTel and General Instrument. Engineering degrees from Boise State University (BSEE) and the University of Idaho (MSEE). Business degree from Texas Tech University (BBA). Doug has multiple patents and patents pending for advanced packaging and flexible technology and has published numerous technical papers. At American Semiconductor Doug maintains overall corporate and operational responsibilities.

11 May 2021
SUNEW
OPV Production Scale-Up & Installation Challenge
Tuesday
03:30pm
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OPV Production Scale-Up & Installation Challenge
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03:30pm

11 May 2021
Texas Instruments
Semiconductor and Printed Electronics Industries: Overview of emerging applications
Tuesday
03:50pm
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Sean Chang
Process Engineer
Traditional semiconductor manufacturing has remained largely unchanged throughout the modern era, and growing efforts to increase throughput and reduce cost provide an ever more compelling case for applications where the flexibility of additive manufacturing can intercept. This talk will explore opportunities, challenges and the road ahead towards adaptation of printed electronics within the semiconductor industry.
All, Printed Electronics
Semiconductor and Printed Electronics Industries: Overview of emerging applications
More Details
03:50pm
Traditional semiconductor manufacturing has remained largely unchanged throughout the modern era, and growing efforts to increase throughput and reduce cost provide an ever more compelling case for applications where the flexibility of additive manufacturing can intercept. This talk will explore opportunities, challenges and the road ahead towards adaptation of printed electronics within the semiconductor industry.

11 May 2021
Parsons
Design and Manufacture of Test Coupons for Risk Reduction Studies of Printed Hybrid Electronics Assemblies
Tuesday
04:10pm
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Alison Kritz
Materials Engineer
We will present an investigation of risks of failure in a prototype printed hybrid electronics (PHE) Arduino-type circuit to be fabricated using a variety of additive manufacturing technologies including aerosol-jet, syringe, and stereolithography (SLA) printing. The interfaces of different components and materials in this design introduce potential sources of failure including thermal expansion mismatches and silver migration resulting from temperature cycling. We will discuss the design rationale, fabrication methods, and testing conditions of three different test coupons, each of which isolates a different area of interest in the PHE assembly and seeks to identify and prevent the greatest risks.
Printed Electronics, Semiconductor Packaging, Flexible Hybrid Electro, Flexible Hybrid Electr
Design and Manufacture of Test Coupons for Risk Reduction Studies of Printed Hybrid Electronics Assemblies
More Details
04:10pm
We will present an investigation of risks of failure in a prototype printed hybrid electronics (PHE) Arduino-type circuit to be fabricated using a variety of additive manufacturing technologies including aerosol-jet, syringe, and stereolithography (SLA) printing. The interfaces of different components and materials in this design introduce potential sources of failure including thermal expansion mismatches and silver migration resulting from temperature cycling. We will discuss the design rationale, fabrication methods, and testing conditions of three different test coupons, each of which isolates a different area of interest in the PHE assembly and seeks to identify and prevent the greatest risks.

11 May 2021
Phillips 66
Photoactive Polymers Tailored to Industrial Printing of High Performing and Stable Organic Photovoltaics
Tuesday
04:10pm
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Photoactive Polymers Tailored to Industrial Printing of High Performing and Stable Organic Photovoltaics
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04:10pm

11 May 2021
ACI Materials
ACI Alchemy Conductive Inks -Enabling Next Generation Flexible & 3D Electronics
Tuesday
05:10pm
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Mike Mastropietro
VP of Engineering
ACI will introduce to the world its Alchemy Conductive Inks. These high-performance printable conductors allow PTF ink like ease of use and processing with fired/sintered thick film electrical performance. The talk will describe some of the overall benefits of using these materials in manufacture of flexible and 3D printed electronics including:
low volume resistivity and sheet resistance
higher current carrying capacity
lower cost per ohm square in use
superior crease ability of narrow traces
formulation latitude from viscous paste to sprayable
Several examples will be presented including
3D circuit structures
high resolution traces
high power density busbars
reflow solder ability
All, Printed Electronics, 3D Printing, InMold Electronics
ACI Alchemy Conductive Inks -Enabling Next Generation Flexible & 3D Electronics
More Details
05:10pm
ACI will introduce to the world its Alchemy Conductive Inks. These high-performance printable conductors allow PTF ink like ease of use and processing with fired/sintered thick film electrical performance. The talk will describe some of the overall benefits of using these materials in manufacture of flexible and 3D printed electronics including:
low volume resistivity and sheet resistance
higher current carrying capacity
lower cost per ohm square in use
superior crease ability of narrow traces
formulation latitude from viscous paste to sprayable
Several examples will be presented including
3D circuit structures
high resolution traces
high power density busbars
reflow solder ability

11 May 2021
CondAlign AS
Advantages With Anisotropic Conductive Adhesive Films Comprising Aligned Particles
Tuesday
05:10pm
More Details


Pål Morten Lindberget
VP Sales and Marketing
CondAlign’s technology represents a novel process for production of anisotropic, conductive films. Using an electric field to structure and align particles, the results in a z-axis conductive film structure. One product type we can produce is anisotropic conductive adhesive (ACA) films with thicknesses from a few µm to some hundreds µm and resistance below 0,01 Ohm/cm^2. With very high chain densities (pitch below 10µm), these films are currently being tested in several bonding processes, like FOB, FOF, COB, COF, as an alternative to traditional ACF. The process is demonstrated in roll-to-roll production, proofing it is scalable and cost effective.
Morten Lindberget
VP Business Development @ CondAlign
Bio
An enabler with 25 years international experience from leadership, sales and business development roles in technology consulting, contract manufacturing, medical device technology and scale up. Morten holds a MSc in Mech. Engineering from TU Delft, the Netherlands, and an Executive Master of Management from BI, Norway.
Flexible Hybrid Electro, Die Attach, All, Advanced Materials, Semiconductor Packaging
Advantages With Anisotropic Conductive Adhesive Films Comprising Aligned Particles
More Details
05:10pm
CondAlign’s technology represents a novel process for production of anisotropic, conductive films. Using an electric field to structure and align particles, the results in a z-axis conductive film structure. One product type we can produce is anisotropic conductive adhesive (ACA) films with thicknesses from a few µm to some hundreds µm and resistance below 0,01 Ohm/cm^2. With very high chain densities (pitch below 10µm), these films are currently being tested in several bonding processes, like FOB, FOF, COB, COF, as an alternative to traditional ACF. The process is demonstrated in roll-to-roll production, proofing it is scalable and cost effective.
Morten Lindberget
VP Business Development @ CondAlign
Bio
An enabler with 25 years international experience from leadership, sales and business development roles in technology consulting, contract manufacturing, medical device technology and scale up. Morten holds a MSc in Mech. Engineering from TU Delft, the Netherlands, and an Executive Master of Management from BI, Norway.

11 May 2021
Agfa
Printed Electronics made with Digital Printing: Materials and Applications in Motor Sport
Tuesday
05:30pm
More Details
true


Frank Louwet
Global Marketing Manager - PE
Digital printing has clearly established itself for graphics printing, thanks to the advantages it offers over traditional processes like screen printing. More recently, digital printing started morphing into digital manufacturing and also Printed Electronics is taking advantage of that evolution. In this talk we will review Agfa's digital conductive inks based on nanomaterials, and highlight some features of newly developed inks. In the second part of the talk, Nanogate Netherlands will discuss the application of additive digital manufacturing in motor sport products.
Peter Willaert
Global Marketing Manager Printed Electronics @ Agfa
Bio
Experienced Product Marketing and Business Development Manager in Printed Electronics with a background in Electronic Engineering. Over the years I have developed a broad knowledge about materials and processes for applications like RFID, iOT, Sensors, Displays etc.
All, Printed Electronics
Printed Electronics made with Digital Printing: Materials and Applications in Motor Sport
More Details
05:30pm
Digital printing has clearly established itself for graphics printing, thanks to the advantages it offers over traditional processes like screen printing. More recently, digital printing started morphing into digital manufacturing and also Printed Electronics is taking advantage of that evolution. In this talk we will review Agfa's digital conductive inks based on nanomaterials, and highlight some features of newly developed inks. In the second part of the talk, Nanogate Netherlands will discuss the application of additive digital manufacturing in motor sport products.
Peter Willaert
Global Marketing Manager Printed Electronics @ Agfa
Bio
Experienced Product Marketing and Business Development Manager in Printed Electronics with a background in Electronic Engineering. Over the years I have developed a broad knowledge about materials and processes for applications like RFID, iOT, Sensors, Displays etc.

11 May 2021
Nanogate
Printed Electronics made with Digital Printing: Materials and Applications in Motor Sport
Tuesday
05:30pm
More Details
true


Jurgen van Peer
Application Manager
Digital printing has clearly established itself for graphics printing, thanks to the advantages it offers over traditional processes like screen printing. More recently, digital printing started morphing into digital manufacturing and also Printed Electronics is taking advantage of that evolution. In this talk we will review Agfa's digital conductive inks based on nanomaterials, and highlight some features of newly developed inks. In the second part of the talk, Nanogate Netherlands will discuss the application of additive digital manufacturing in motor sport products.
All, Printed Electronics
Printed Electronics made with Digital Printing: Materials and Applications in Motor Sport
More Details
05:30pm
Digital printing has clearly established itself for graphics printing, thanks to the advantages it offers over traditional processes like screen printing. More recently, digital printing started morphing into digital manufacturing and also Printed Electronics is taking advantage of that evolution. In this talk we will review Agfa's digital conductive inks based on nanomaterials, and highlight some features of newly developed inks. In the second part of the talk, Nanogate Netherlands will discuss the application of additive digital manufacturing in motor sport products.

11 May 2021
NovaCentrix
PulseForge Soldering-Using flash lamp technology for conventional solder alloy reflow
Tuesday
05:50pm
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