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ALL PAST & FUTURE EVENTS AS WELL AS MASTERCLASSES WITH A SINGLE ANNUAL PASS

The Future of Electronics RESHAPED 2022

12-13 October 2022
Eindhoven, Netherlands

About the Event

Topics Covered

Speakers from the world's leading companies will present on their requirements and research, with many new announcements. You will learn about the needs and case studies from key end-user companies. You will also hear about the latest innovations from companies involved in the fields of: Printed, Flexible, Hybrid Electronics; Structural and InMold Electronics; Wearable Electronics; Electronic Textiles; Smart Skin Patches & Continuous; Vital Signs Monitoring; 3D Printed Electronics; R2R Electronics; Stretchable and Conformal Electronics; Additively Manufactured Electronics; Additive Electronics in Electronic Packaging; Printed, Flexible, Wearable Batteries; Printed Sensors and Actuators; Printed & R2R Photovoltaics (Perovskite, Organic, CIGS, QD); Printing in Displays (OLED, microLED, QD, Electrochromic); Future of HMIs; Large-Area Lighting; Intelligent Packaging

Explore our past & upcoming events on this topic

Leading global speakers include:

Full Agenda

Coming Soon
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12 October 2022

TechBlick

Welcome & Introduction

Wednesday

9.15AM

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Khasha Ghaffarzadeh

CEO

Welcome & Introduction

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9.15AM

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12 October 2022

Holst Centre

Solving Today's Challenges with Flexible Electronics

Wednesday

9.20AM

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Ton van Mol

Managing Director

All, Printed Electronics

Solving Today's Challenges with Flexible Electronics

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9.20AM

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12 October 2022

FaceBook /META

Wearable System Design Challenges toward Human-Centric Computing

Wednesday

9.40AM

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Jim Huang

Research Scientist, Meta Reality Labs

As we move from personal computing to human-centric computing, we see great promises for people to better connect with their family, friend, or colleague around the globe despite of physical distance. All-day wearable devices such as virtual reality (VR) and augmented reality (AR) glasses, wristbands, or gloves equipped with the ubiquitous connectivity can empower people to connect, feel, and interact more intuitively than using today’s mobile phones or personal computers. In my presentation, I will talk about the promises and the technical challenges of wearable systems design using flexible, hybrid, and printed electronics, and how a design-manufacture ecosystem might help.

All, Printed Electronics

Wearable System Design Challenges toward Human-Centric Computing

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9.40AM

As we move from personal computing to human-centric computing, we see great promises for people to better connect with their family, friend, or colleague around the globe despite of physical distance. All-day wearable devices such as virtual reality (VR) and augmented reality (AR) glasses, wristbands, or gloves equipped with the ubiquitous connectivity can empower people to connect, feel, and interact more intuitively than using today’s mobile phones or personal computers. In my presentation, I will talk about the promises and the technical challenges of wearable systems design using flexible, hybrid, and printed electronics, and how a design-manufacture ecosystem might help.

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12 October 2022

Voltera

Print Anything on Everything: Unlocking Additive Electronics for the World

Wednesday

10.00AM

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Alroy Almeida

CEO & Co Founder

Electronics has lived in a subtractive world for a really long time. But the future is additive. Let’s take a look at how the industry — and the world — will evolve with the help of additive manufacturing and prototyping methods. Soft, biocompatible, textile and wearable electronics. In-mold structural electronics. It’s a brave new world and we won’t get there unless we break out of our subtractive box — so let’s take a look at how we do that. Explore the possibilities! Print anything. On everything.

Print Anything on Everything: Unlocking Additive Electronics for the World

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10.00AM

Electronics has lived in a subtractive world for a really long time. But the future is additive. Let’s take a look at how the industry — and the world — will evolve with the help of additive manufacturing and prototyping methods. Soft, biocompatible, textile and wearable electronics. In-mold structural electronics. It’s a brave new world and we won’t get there unless we break out of our subtractive box — so let’s take a look at how we do that. Explore the possibilities! Print anything. On everything.

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12 October 2022

Wuerth Elektronik eiSos

Advanced Electronics – to enable a sustainable future.
How to fuse established processes and disruptive technologies. Insights from an industrial point of view.

Wednesday

10.20AM

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Christoph Voelcker

Team Leader

The presentation will highlight market potentials for advanced electronics and how to use them sensibly. What steps can the industry take to enable and interact with the rapid development to pave the path to a more sustainable future with disruptive technologies.
With a focus on the transfer of innovative projects, the presentation will show examples of how Würth Elektronik eiSos works with start-ups, technology and research projects.

Advanced Electronics – to enable a sustainable future.
How to fuse established processes and disruptive technologies. Insights from an industrial point of view.

More Details

10.20AM

The presentation will highlight market potentials for advanced electronics and how to use them sensibly. What steps can the industry take to enable and interact with the rapid development to pave the path to a more sustainable future with disruptive technologies.
With a focus on the transfer of innovative projects, the presentation will show examples of how Würth Elektronik eiSos works with start-ups, technology and research projects.

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12 October 2022

Networking Break

Coffee & Exhibition/Networking Break

Wednesday

10.45AM

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Coffee & Exhibition/Networking Break

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10.45AM

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12 October 2022

Novo Nordisk

Printed Electronics in Mass-Produced Medical Devices

Wednesday

11.30AM

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Nikolaj Eusebius Jakobsen

Principal Device R&D Engineer

Novo Nordisk A/S supplies nearly 50% of the world’s insulin for treatment of diabetes, and 34 million people are using our diabetes care products. On top of this we are also supplying medicine for growth disorder, haemophilia, and obesity.
In Device and Delivery Solutions, we develop delivery solutions, combining Drug, Data, Diagnostics, digital solutions, and devices to make a meaningful treatment for our end users. Most of our drugs are formulated in a liquid state, so an injection device is needed for administration. To make a link between injection data and digital solution, we need to integrate sensors and communication in our devices. Integrating electronics in the injection devices gives data directly to the user who can use the data together with a health care professional to optimize the treatment.
To get at true mass producible connected device, we have had a couple of projects with printed electronics over the last years. The presentation will take you trough a printed electronics project and share some learnings, opportunities and struggles in making a printed connectivity solution for a mass-produced medical device.

All, Printed Electronics

Printed Electronics in Mass-Produced Medical Devices

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11.30AM

Novo Nordisk A/S supplies nearly 50% of the world’s insulin for treatment of diabetes, and 34 million people are using our diabetes care products. On top of this we are also supplying medicine for growth disorder, haemophilia, and obesity.
In Device and Delivery Solutions, we develop delivery solutions, combining Drug, Data, Diagnostics, digital solutions, and devices to make a meaningful treatment for our end users. Most of our drugs are formulated in a liquid state, so an injection device is needed for administration. To make a link between injection data and digital solution, we need to integrate sensors and communication in our devices. Integrating electronics in the injection devices gives data directly to the user who can use the data together with a health care professional to optimize the treatment.
To get at true mass producible connected device, we have had a couple of projects with printed electronics over the last years. The presentation will take you trough a printed electronics project and share some learnings, opportunities and struggles in making a printed connectivity solution for a mass-produced medical device.

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12 October 2022

Schneider Electric

3D Electronics vs Industrial Mission Profile / Case study From Schneider Electric

Wednesday

11.30AM

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Philippe Prieur

Global, Electronics Industrialization Director

Schneider Electric / Company presentation
Mechatronics physical integration, constraints & compacity
Context and Proof of concept on 3D electronics applications (IME, LDS, Printed 3D)
Industrial mission profile, robustness
Antenna use case / validation plan
Sensor use case / validation plan
Perspectives and next Steps
Questions mark

All, Printed Electronics

3D Electronics vs Industrial Mission Profile / Case study From Schneider Electric

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11.30AM

Schneider Electric / Company presentation
Mechatronics physical integration, constraints & compacity
Context and Proof of concept on 3D electronics applications (IME, LDS, Printed 3D)
Industrial mission profile, robustness
Antenna use case / validation plan
Sensor use case / validation plan
Perspectives and next Steps
Questions mark

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12 October 2022

GE Healthcare

Wearable Ward Monitoring Solution

Wednesday

11.50AM

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Juha Virtanen

Principal Engineer, Wearable Sensors

Continuous ward monitoring is expected to improve patient outcome. Respiration rate has been recognized as a promising early indicator for deterioration of patient status. Department-wide solution is needed to make full benefit of the solution. Data quality and patient comfort are key factors in acceptance of a new monitoring modality. This talk will address the key technical choices behind our newly released wearable ward monitoring solution.

All, Printed Electronics

Wearable Ward Monitoring Solution

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11.50AM

Continuous ward monitoring is expected to improve patient outcome. Respiration rate has been recognized as a promising early indicator for deterioration of patient status. Department-wide solution is needed to make full benefit of the solution. Data quality and patient comfort are key factors in acceptance of a new monitoring modality. This talk will address the key technical choices behind our newly released wearable ward monitoring solution.

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12 October 2022

Sunway Communication

The Latest Development in 2D/3D Microcircuits

Wednesday

11.50AM

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Nouhad Bachnak

Managing Director

The traditional LDS (laser direct structuring) process is fantastic but only works on special plastic substrates containing sub-surface activation particles. This limits the choice and functionality of materials. Firstly, it typically does not work with glass, ceramics, PET or thermosets. Furthermore, the addition of activation particles can render a transparent material opaque or eliminate bio-compatibility. Furthermore, the linewidth resolution is typically around 80-100um (but can be pushed further down) with surface roughness of 20-30um

In this talk, Nouhad Bachnak unveils a new process, which promises to overcome these limitations. Here, the process first involves a special laser structuring process followed by a so-called chemical activation step. After this step, the structured and activated part undergoes typical plating (Cu-NiP-Au)

This is an important development and advancement of the technology, because it greatly lessens the limits on the choice of materials which can be 3D metallized with bulk-like properties and solderable surfaces

Furthermore, it will be shown that this process- when optimized- will achieve 5um linewidths with a surface roughness of just 2-3um (great for antennas, for example). It can also plate within vias with 40um diameter.

This is still not the full production level for all substrates. The most advanced development is for thermoset, which is production ready. The other substrates like glass, PET, and ceramics are still in development. Nonetheless, it is a good space to watch

The Latest Development in 2D/3D Microcircuits

More Details

11.50AM

The traditional LDS (laser direct structuring) process is fantastic but only works on special plastic substrates containing sub-surface activation particles. This limits the choice and functionality of materials. Firstly, it typically does not work with glass, ceramics, PET or thermosets. Furthermore, the addition of activation particles can render a transparent material opaque or eliminate bio-compatibility. Furthermore, the linewidth resolution is typically around 80-100um (but can be pushed further down) with surface roughness of 20-30um

In this talk, Nouhad Bachnak unveils a new process, which promises to overcome these limitations. Here, the process first involves a special laser structuring process followed by a so-called chemical activation step. After this step, the structured and activated part undergoes typical plating (Cu-NiP-Au)

This is an important development and advancement of the technology, because it greatly lessens the limits on the choice of materials which can be 3D metallized with bulk-like properties and solderable surfaces

Furthermore, it will be shown that this process- when optimized- will achieve 5um linewidths with a surface roughness of just 2-3um (great for antennas, for example). It can also plate within vias with 40um diameter.

This is still not the full production level for all substrates. The most advanced development is for thermoset, which is production ready. The other substrates like glass, PET, and ceramics are still in development. Nonetheless, it is a good space to watch

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12 October 2022

Neotech AMT

Scalable 3D Printed Electronics - from “Fully Additive” to High Volume.

Wednesday

12.10PM

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Martin Hedges

MD

All, Printed Electronics

Scalable 3D Printed Electronics - from “Fully Additive” to High Volume.

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12.10PM

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12 October 2022

Quad Industries

Flexible Printed Electronics: A World Of Opportunities

Wednesday

12.10PM

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Wim Christiaens

R&D Director

This talk will provide insights into printed electronics, a platform technology to create electrical devices on various substrates. Printed circuits have been used since more than 20 years for the production of user interfaces, including membrane switches and capacitive touch sensors, but the biggest opportunity in the field of printed electronics is that many new applications are emerging. Quad Industries is a leading innovator in this field, and by means of highly accurate screen-printing techniques, smart functionality is integrated on a wide range of materials such as flexible and stretchable films, textiles and paper. Some of our recent developments and applications include smart electrode patches, PTC film heaters, force sensors and in-mold electronics

Flexible Printed Electronics: A World Of Opportunities

More Details

12.10PM

This talk will provide insights into printed electronics, a platform technology to create electrical devices on various substrates. Printed circuits have been used since more than 20 years for the production of user interfaces, including membrane switches and capacitive touch sensors, but the biggest opportunity in the field of printed electronics is that many new applications are emerging. Quad Industries is a leading innovator in this field, and by means of highly accurate screen-printing techniques, smart functionality is integrated on a wide range of materials such as flexible and stretchable films, textiles and paper. Some of our recent developments and applications include smart electrode patches, PTC film heaters, force sensors and in-mold electronics

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12 October 2022

Nano OPS

A Foundry in a Box: High-throughput Additive Manufacturing
of Nano and Microelectronics and Advanced Packaging for Heterogenous Integration

Wednesday

12.30PM

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Ahmed Busnaina

CTO

Current electronic manufacturing processes have high operating and capital costs. These conventional processes consist of a complex series of steps using hundreds of high-energy deposition steps consuming massive amounts of electricity and water. A new scalable and sustainable technique for additively manufacture nano and microelectronics has been developed. The technique eliminates high-energy, chemically intense processing by utilizing direct assembly of nanoscale particles or other nanomaterials at ambient temperature and pressure onto a substrate, to precisely where the structures are built. Although, many of the nanomaterials-based electronics transistors were made using organic materials and/or nanomaterials that do not need to be sintered such as carbon nanotubes and 2D materials, however, to have a commercial impact, traditional semiconductors nanomaterials such as silicon and III-V and II-VI semiconductors, metals and dielectrics need to be printed to produce high performance electronics. In this presentation we show how this technology can print single crystal structures and make transistors using a purely additive (directed assembly enabled) with no etching or vacuum using inorganic semiconductors, metals and dielectrics. The process demonstrates the manufacturing of transistors with an on/off ratio greater than 106. This new technology will enable the fabrication of nanoelectronics while reducing the cost by 10-100 times and can print 1000 faster and 1000 smaller (down to 20nm) structures than inkjet-based printing. Moreover, the nanoscale printing platform enables the heterogeneous integration of interconnected circuit layers (like CMOS) of printed electronics and active and passive components on rigid or flexible substrates. Printed applications such as transistors, inverters, diodes, logic gates, display at the micro and nanoscale using inorganic and organic materials will be presented.

A Foundry in a Box: High-throughput Additive Manufacturing
of Nano and Microelectronics and Advanced Packaging for Heterogenous Integration

More Details

12.30PM

Current electronic manufacturing processes have high operating and capital costs. These conventional processes consist of a complex series of steps using hundreds of high-energy deposition steps consuming massive amounts of electricity and water. A new scalable and sustainable technique for additively manufacture nano and microelectronics has been developed. The technique eliminates high-energy, chemically intense processing by utilizing direct assembly of nanoscale particles or other nanomaterials at ambient temperature and pressure onto a substrate, to precisely where the structures are built. Although, many of the nanomaterials-based electronics transistors were made using organic materials and/or nanomaterials that do not need to be sintered such as carbon nanotubes and 2D materials, however, to have a commercial impact, traditional semiconductors nanomaterials such as silicon and III-V and II-VI semiconductors, metals and dielectrics need to be printed to produce high performance electronics. In this presentation we show how this technology can print single crystal structures and make transistors using a purely additive (directed assembly enabled) with no etching or vacuum using inorganic semiconductors, metals and dielectrics. The process demonstrates the manufacturing of transistors with an on/off ratio greater than 106. This new technology will enable the fabrication of nanoelectronics while reducing the cost by 10-100 times and can print 1000 faster and 1000 smaller (down to 20nm) structures than inkjet-based printing. Moreover, the nanoscale printing platform enables the heterogeneous integration of interconnected circuit layers (like CMOS) of printed electronics and active and passive components on rigid or flexible substrates. Printed applications such as transistors, inverters, diodes, logic gates, display at the micro and nanoscale using inorganic and organic materials will be presented.

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12 October 2022

Smooth & Sharp

A NFC Biosensor Test Stripe made with Reel-to-Reel Hybrid Electronics on the same Substrate

Wednesday

12.30PM

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Alan Wu

President & Founder

TELETENTO® has innovations in FHE and POCT aspects.

In FHE aspect,
●Integrated Printed Electronics from NFC antenna, MCU socket to Biosensor
All the major parts are printed R2R on same substrate.
●Precise FHE assembling
Up to 10 pads MCU chip assembling in R2R operation.
●Fine Line Printing
Line width/gap < 100um for MCU socket
●Possible with Paper Substrate
Verification of all production conditions with paper substrate.

In POCT aspect,
●Further Decentralization
via NFC smartphone, testers don’t need to come to hospital or clinic for medical specimen collection.
●Risk Reduction
no need medical specimen transportation, avoid latent virus spreading with contaminated medical specimen.
Used test stripe with medical specimen e.g body fluids can be disposed onsite.
●Quick Response
Test result is informed via APP, SaaS or PaaS.
●Cost Saving
No more costly medical specimen required transportation e.g. temperature control, time.

Let contaminated medical specimen stay where it is collected.

A NFC Biosensor Test Stripe made with Reel-to-Reel Hybrid Electronics on the same Substrate

More Details

12.30PM

TELETENTO® has innovations in FHE and POCT aspects.

In FHE aspect,
●Integrated Printed Electronics from NFC antenna, MCU socket to Biosensor
All the major parts are printed R2R on same substrate.
●Precise FHE assembling
Up to 10 pads MCU chip assembling in R2R operation.
●Fine Line Printing
Line width/gap < 100um for MCU socket
●Possible with Paper Substrate
Verification of all production conditions with paper substrate.

In POCT aspect,
●Further Decentralization
via NFC smartphone, testers don’t need to come to hospital or clinic for medical specimen collection.
●Risk Reduction
no need medical specimen transportation, avoid latent virus spreading with contaminated medical specimen.
Used test stripe with medical specimen e.g body fluids can be disposed onsite.
●Quick Response
Test result is informed via APP, SaaS or PaaS.
●Cost Saving
No more costly medical specimen required transportation e.g. temperature control, time.

Let contaminated medical specimen stay where it is collected.

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12 October 2022

Applied Materials

Advanced Screen-Printing: A Study to Entirely Manufacture a Medical Sensor by Screen-Printing

Wednesday

12.50PM

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Marco Galiazzo

R&D manager

Developments in electronics and sensors have demonstrated the ability to manufacture wearable devices to remotely monitor human health in real-time at reasonable cost. A wide variety of smart sensors are now available, both on rigid and flexibRecentle substrates, to monitor the health and well-being of patients suffering from chronic illnesses. We’ve used our advanced screen-printing capabilities to manufacture medical devices: in particular, we studied and developed the realization of medical sensors entirely by screen printing. Thanks also to the constant improvements of the screen-printing ecosystem (paste, screen, equipment), enabling high processing yields and throughput, manufacturing of such devices by screen printing technology was proven to be a cost-efficient solution, compared to conventional microfabrication techniques, for mass manufacturing of healthcare devices.

Advanced Screen-Printing: A Study to Entirely Manufacture a Medical Sensor by Screen-Printing

More Details

12.50PM

Developments in electronics and sensors have demonstrated the ability to manufacture wearable devices to remotely monitor human health in real-time at reasonable cost. A wide variety of smart sensors are now available, both on rigid and flexibRecentle substrates, to monitor the health and well-being of patients suffering from chronic illnesses. We’ve used our advanced screen-printing capabilities to manufacture medical devices: in particular, we studied and developed the realization of medical sensors entirely by screen printing. Thanks also to the constant improvements of the screen-printing ecosystem (paste, screen, equipment), enabling high processing yields and throughput, manufacturing of such devices by screen printing technology was proven to be a cost-efficient solution, compared to conventional microfabrication techniques, for mass manufacturing of healthcare devices.

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12 October 2022

IDS

Significant New Advances in Aerosol Printing

Wednesday

12.50PM

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David Keicher

Vice President

IDS’ novel, patented approach to aerosol printing has found very good acceptance around the world in multiple market segments and applications. The unique method for in-situ aerosol generation, minimizing transport distance and dual focusing lenses is delivering performance that is making aerosol printing ready for production.
Now, IDS will be introducing its next iteration of improvements! IDS will discuss how new standards of daily print performance are being set, accelerated aerosol transport times that exceed conventional standards by multiples, and new novel technology to facilitate rapid cycling of the aerosol stream to serve high speed intermittent applications. These new capabilities will be discussed and data will be presented showing how these improvements affect print performance. Notable measured improvements will be showcased.

Significant New Advances in Aerosol Printing

More Details

12.50PM

IDS’ novel, patented approach to aerosol printing has found very good acceptance around the world in multiple market segments and applications. The unique method for in-situ aerosol generation, minimizing transport distance and dual focusing lenses is delivering performance that is making aerosol printing ready for production.
Now, IDS will be introducing its next iteration of improvements! IDS will discuss how new standards of daily print performance are being set, accelerated aerosol transport times that exceed conventional standards by multiples, and new novel technology to facilitate rapid cycling of the aerosol stream to serve high speed intermittent applications. These new capabilities will be discussed and data will be presented showing how these improvements affect print performance. Notable measured improvements will be showcased.

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12 October 2022

Networking Break

Lunch & Exhibition/Networking Break

Wednesday

1.10PM

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Lunch & Exhibition/Networking Break

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1.10PM

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12 October 2022

BeLink Solutions

Innovative in-mold and hybrid electronics with direct PCB-on-film integration: a cost-effective way to create smart plastics solutions

Wednesday

2.40PM

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Pierre Ball

Sales & Marketing Director

This presentation will highlight the key principles of innovation in printed electronics by BeLink Solutions along 3 axes:
Equipment
Materials
Processes
Replacing incumbent technologies is usually challenging, but hybrid electronics technologies are opening up new solution and design areas that are driving the migration and expansion of the market from conventional electronics to the printed electronics market.
Here we will not only address sensors and traces based on well-known conductive screen-printing techniques, but more importantly how to integrate any variety of SMT components and packages (BGA, fine pitch) with direct PCB-on-film integration.
In other words, how to bridge the gap between both technologies (conventional and printed electronics) to foster new designs in 2D and 3D electronics?

Innovative in-mold and hybrid electronics with direct PCB-on-film integration: a cost-effective way to create smart plastics solutions

More Details

2.40PM

This presentation will highlight the key principles of innovation in printed electronics by BeLink Solutions along 3 axes:
Equipment
Materials
Processes
Replacing incumbent technologies is usually challenging, but hybrid electronics technologies are opening up new solution and design areas that are driving the migration and expansion of the market from conventional electronics to the printed electronics market.
Here we will not only address sensors and traces based on well-known conductive screen-printing techniques, but more importantly how to integrate any variety of SMT components and packages (BGA, fine pitch) with direct PCB-on-film integration.
In other words, how to bridge the gap between both technologies (conventional and printed electronics) to foster new designs in 2D and 3D electronics?

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12 October 2022

Nano Dimension

Roadmap for 3D AME Designs

Wednesday

2.40PM

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Shavi Spinzi

PCB Technologies Director

This presentation will describe the industry drivers for increased electronic devices and circuits performance and packing density and how multi-level and multi-material Additively Manufactured Electronic (AME) technology enables corresponding innovative designs and fabrication from DC to mmWave applications. The presentation will focus on AME devices including design, materials, fabrication, and testing. This technology provides for electronic circuits not only in 2D but also in 3D where connections can be made without vias, but direct wiring between the electronic elements. The wires can be shielded and unshielded. Furthermore, the fabrication technology allows for traces with different thicknesses at the same level. Yielding fully functional boards with smaller size and lower weight, as compared to equivalent PCB fabricated ones. The presentation will include also devices with chip first embedded active ICs. Components such as capacitors, coils, band pass filters, and multilevel Fresnel lenses exhibit superior RF performance as compered Surface Mount Technology (SMT) of components.

All, Printed Electronics

Roadmap for 3D AME Designs

More Details

2.40PM

This presentation will describe the industry drivers for increased electronic devices and circuits performance and packing density and how multi-level and multi-material Additively Manufactured Electronic (AME) technology enables corresponding innovative designs and fabrication from DC to mmWave applications. The presentation will focus on AME devices including design, materials, fabrication, and testing. This technology provides for electronic circuits not only in 2D but also in 3D where connections can be made without vias, but direct wiring between the electronic elements. The wires can be shielded and unshielded. Furthermore, the fabrication technology allows for traces with different thicknesses at the same level. Yielding fully functional boards with smaller size and lower weight, as compared to equivalent PCB fabricated ones. The presentation will include also devices with chip first embedded active ICs. Components such as capacitors, coils, band pass filters, and multilevel Fresnel lenses exhibit superior RF performance as compered Surface Mount Technology (SMT) of components.

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12 October 2022

Novem Car Interior Design

Integrated Products for Integrated Interiors

Wednesday

3.00PM

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Dominique Heilborn

Director Light & Function

Integration of lighting – both, styling and function – is in the center of upcoming interior concepts. This is achieved by merging components visually, applying holistic and scalable concepts and at the same time preserving a high level day time design. Traditional electronics concepts and injection molded electronics are reshaping the future of in vehicle electronics.

All, Printed Electronics

Integrated Products for Integrated Interiors

More Details

3.00PM

Integration of lighting – both, styling and function – is in the center of upcoming interior concepts. This is achieved by merging components visually, applying holistic and scalable concepts and at the same time preserving a high level day time design. Traditional electronics concepts and injection molded electronics are reshaping the future of in vehicle electronics.

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12 October 2022

XTPL

XTPL Ultraprecise Deposition Technology for Advanced Printed µElectronics Applications

Wednesday

3.00PM

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Lukasz Kosior

Business Development Manager

The Ultraprecise Deposition (UPD) technology is a novel additive manufacturing technique for advanced Printed µElectronics applications. UPD can be used for fabricating micrometer-size interconnections in microelectronic systems, as well as for making redistribution layers on chips and filing vias in semiconductor devices.
UPD may be considered as a much-needed intermediary approach between printing of 2D planar structures and free-standing 3D architectures. This technology gives the ability to print metallic structures at micrometer scale on complex substrates, so that the printed features map the topography of the substrate. The UPD approach is based on a direct extrusion of highly-concentrated silver paste using a printing nozzle with the diameter in the range from 0.5 to 10 𝜇m. This defines the unique operating range for the UPD technology, compared to other printed electronics techniques: the combination of high-viscosity pastes and fine printed features. The process itself is governed by pressure, but the possibility to extrude such high-viscosity materials using such narrow nozzles is possible thanks to the simultaneous optimization of the paste, parameters of the process, as well as the printing nozzle (both in terms of the geometry and material properties).
The key advantage of using the high-viscosity pastes is that the printed structures preserve their shape regardless of the wetting properties of the substrates. Therefore, the design of a metallization scheme is not constrained by the surface properties. The printed feature size can be in the range from 1 to 10 𝜇m and the printing resolution (i.e., the distance between the printed structures) can be even below 1 𝜇m.
The structures can be printed on complex substrates, including substrates with pre-existing features (like steps), substrates with different surface properties, as well as flexible substrates. The resulting printed structures can be bent and are uniform regardless of the wetting properties of the substrates. Therefore, it is possible to print on materials like oxides (e.g., SiO2), nitrides (e.g., SiNx), metals, glass, and foils (e.g., PI, Kapton), as well as to print on junctions (metal/semiconductor/insulator).

XTPL Ultraprecise Deposition Technology for Advanced Printed µElectronics Applications

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3.00PM

The Ultraprecise Deposition (UPD) technology is a novel additive manufacturing technique for advanced Printed µElectronics applications. UPD can be used for fabricating micrometer-size interconnections in microelectronic systems, as well as for making redistribution layers on chips and filing vias in semiconductor devices.
UPD may be considered as a much-needed intermediary approach between printing of 2D planar structures and free-standing 3D architectures. This technology gives the ability to print metallic structures at micrometer scale on complex substrates, so that the printed features map the topography of the substrate. The UPD approach is based on a direct extrusion of highly-concentrated silver paste using a printing nozzle with the diameter in the range from 0.5 to 10 𝜇m. This defines the unique operating range for the UPD technology, compared to other printed electronics techniques: the combination of high-viscosity pastes and fine printed features. The process itself is governed by pressure, but the possibility to extrude such high-viscosity materials using such narrow nozzles is possible thanks to the simultaneous optimization of the paste, parameters of the process, as well as the printing nozzle (both in terms of the geometry and material properties).
The key advantage of using the high-viscosity pastes is that the printed structures preserve their shape regardless of the wetting properties of the substrates. Therefore, the design of a metallization scheme is not constrained by the surface properties. The printed feature size can be in the range from 1 to 10 𝜇m and the printing resolution (i.e., the distance between the printed structures) can be even below 1 𝜇m.
The structures can be printed on complex substrates, including substrates with pre-existing features (like steps), substrates with different surface properties, as well as flexible substrates. The resulting printed structures can be bent and are uniform regardless of the wetting properties of the substrates. Therefore, it is possible to print on materials like oxides (e.g., SiO2), nitrides (e.g., SiNx), metals, glass, and foils (e.g., PI, Kapton), as well as to print on junctions (metal/semiconductor/insulator).

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12 October 2022

Agfa


Up your Silver Performance - the USPs of Agfa PRELECT Silver Inks

Wednesday

3.20PM

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Peter Willaert

Product Manager Printed Electronics

Agfa PRELECT Sintering silver inks are developed to offer significant advantages over standard PTF inks, as they will get you more conductivity out of the silver they contain. On top of that, PRELECT screen-, inkjet and spray coating inks offer finer features and thinner layers, and they enable digital workflows in Printed Electronics applications, as we will show in this talk.

All, Printed Electronics


Up your Silver Performance - the USPs of Agfa PRELECT Silver Inks

More Details

3.20PM

Agfa PRELECT Sintering silver inks are developed to offer significant advantages over standard PTF inks, as they will get you more conductivity out of the silver they contain. On top of that, PRELECT screen-, inkjet and spray coating inks offer finer features and thinner layers, and they enable digital workflows in Printed Electronics applications, as we will show in this talk.

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12 October 2022

MacDermid Alpha

Next Generation Assembly and Interconnect Technologies for Smart Structures and Functional Surfaces

Wednesday

3.20PM

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Rahul Raut

Director, Strategy and Technology Acquisition

Emerging electronic structures in consumer, automotive, medical and several other end-applications are rapidly moving towards integrated, interactive, smart interfaces from their current physical and mechanical forms (such as switches, connectors, housings, etc.). Electronics assembly, manufacturing and processing are also evolving to be compatible with the next generation of sleek, lightweight, compact form factors. Additionally, current megatrends such as sustainable and green electronics, and increasingly additive manufacturing approaches and fully automated assemblies will start to become mainstream.
To enable and deploy these next generation smart structures and functional surfaces, a combination of smart materials and compatible processes are needed. In this paper, we present a holistic view from materials, high-volume manufacturing (HVM) approaches and sustainable processes. We discuss/review key building blocks of 3D smart structural platforms that represent an integrated approach, which covers:
- Novel film substrates (for example, multifunctional PC Substrates for In-Mold Electronics),
- Highly conductive and formable Silver Inks
- High performance formable Dielectrics (Thermally curable),
- Formable Structural and Electrically Conducting Adhesives (ECAs), and
- Formable Encapsulants.

We present performance and compatibility of an integrated multi-layer stacks that can be thermoformed and then injection molded to produce smart, interactive 3D structures. Details of several technology demonstrators showcasing these leading-edge technologies will be presented. A key requirement for many of these integrated 3D structures is that they will need to meet or exceed stringent reliability requirements for automotive, medical, military and other demanding applications. Finally, a summary of key reliability testing results will be presented for the 3D IME structures.

Next Generation Assembly and Interconnect Technologies for Smart Structures and Functional Surfaces

More Details

3.20PM

Emerging electronic structures in consumer, automotive, medical and several other end-applications are rapidly moving towards integrated, interactive, smart interfaces from their current physical and mechanical forms (such as switches, connectors, housings, etc.). Electronics assembly, manufacturing and processing are also evolving to be compatible with the next generation of sleek, lightweight, compact form factors. Additionally, current megatrends such as sustainable and green electronics, and increasingly additive manufacturing approaches and fully automated assemblies will start to become mainstream.
To enable and deploy these next generation smart structures and functional surfaces, a combination of smart materials and compatible processes are needed. In this paper, we present a holistic view from materials, high-volume manufacturing (HVM) approaches and sustainable processes. We discuss/review key building blocks of 3D smart structural platforms that represent an integrated approach, which covers:
- Novel film substrates (for example, multifunctional PC Substrates for In-Mold Electronics),
- Highly conductive and formable Silver Inks
- High performance formable Dielectrics (Thermally curable),
- Formable Structural and Electrically Conducting Adhesives (ECAs), and
- Formable Encapsulants.

We present performance and compatibility of an integrated multi-layer stacks that can be thermoformed and then injection molded to produce smart, interactive 3D structures. Details of several technology demonstrators showcasing these leading-edge technologies will be presented. A key requirement for many of these integrated 3D structures is that they will need to meet or exceed stringent reliability requirements for automotive, medical, military and other demanding applications. Finally, a summary of key reliability testing results will be presented for the 3D IME structures.

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12 October 2022

DuPont Teijin Films

Polyester Film Solutions That Are Meeting The Changing Needs in Flexible Electronic Markets

Wednesday

3.40PM

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Valentijn von Morgen

Business Development Manager

Continued advances in the Flexible and Formable Electronics is driving the material suppliers to provide functionality to meet wide ranging demands for applications such as displays, TFT backplanes, energy harvesting and storage, sensors and Human Machine Interfaces.

This talk will give a brief overview of PET and PEN product range meeting wide ranging application needs.

Thereby the focus will be on the recent progress made with the development of Kaladex® PEN substrates for extreme processing requirements, formable PET films for in-mold electronics, films with ultra clean and smooth surfaces for ultra-barrier and high resolution structures and combining UV absorption, weather resistance or fire retardancy whilst also offering more sustainable solutions with the incorporation of recycled materials in the substrates.

DuPont Teijin Films (DTF) has launched many Mylar®, Melinex®, and Kaladex® polyester films through collaborations with partners in the flexible electronic industry as our DTF has proved to be uniquely capable of offering customised and affordable polyester substrate solutions

Polyester Film Solutions That Are Meeting The Changing Needs in Flexible Electronic Markets

More Details

3.40PM

Continued advances in the Flexible and Formable Electronics is driving the material suppliers to provide functionality to meet wide ranging demands for applications such as displays, TFT backplanes, energy harvesting and storage, sensors and Human Machine Interfaces.

This talk will give a brief overview of PET and PEN product range meeting wide ranging application needs.

Thereby the focus will be on the recent progress made with the development of Kaladex® PEN substrates for extreme processing requirements, formable PET films for in-mold electronics, films with ultra clean and smooth surfaces for ultra-barrier and high resolution structures and combining UV absorption, weather resistance or fire retardancy whilst also offering more sustainable solutions with the incorporation of recycled materials in the substrates.

DuPont Teijin Films (DTF) has launched many Mylar®, Melinex®, and Kaladex® polyester films through collaborations with partners in the flexible electronic industry as our DTF has proved to be uniquely capable of offering customised and affordable polyester substrate solutions

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12 October 2022

Fuji Corporation

D​evelopment​ of ​an ​​Electronics 3D ​Printer -​ Full ​Additive PCB ​Manufacturing​ ​Process Plus ​Low ​​Temperature ​Surface​ ​Mount​ ​Technology ​

Wednesday

3.40PM

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Ryojiro Tominaga

Business Development Manager

We’ll introduce a novel electronics 3D printer which integrates resin printing, circuit printing, and low temperature Surface Mount Technology (SMT). Based on these three key functions, we named this machine “FPM-Trinity”.
FPM-Trinity enables the manufacturing of uniquely shaped electrical devices within one day. This can drastically reduce the development time for electronic products, adding value to the process of creating new products. In this presentation, we’ll introduce key process technologies of the machine and its main features. In addition, we’ll show some of the samples which have made using FPM-Trinity.

All, Printed Electronics

D​evelopment​ of ​an ​​Electronics 3D ​Printer -​ Full ​Additive PCB ​Manufacturing​ ​Process Plus ​Low ​​Temperature ​Surface​ ​Mount​ ​Technology ​

More Details

3.40PM

We’ll introduce a novel electronics 3D printer which integrates resin printing, circuit printing, and low temperature Surface Mount Technology (SMT). Based on these three key functions, we named this machine “FPM-Trinity”.
FPM-Trinity enables the manufacturing of uniquely shaped electrical devices within one day. This can drastically reduce the development time for electronic products, adding value to the process of creating new products. In this presentation, we’ll introduce key process technologies of the machine and its main features. In addition, we’ll show some of the samples which have made using FPM-Trinity.

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12 October 2022

Networking Break

Tea & Exhibition/Networking Break

Wednesday

4.00PM

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