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ALL PAST & FUTURE EVENTS AS WELL AS MASTERCLASSES WITH A SINGLE ANNUAL PASS

The Future of Electronics RESHAPED 2022

12-13 October 2022
Eindhoven, Netherlands

About the Event

Topics Covered

Speakers from the world's leading companies will present on their requirements and research, with many new announcements. You will learn about the needs and case studies from key end-user companies. You will also hear about the latest innovations from companies involved in the fields of: Printed, Flexible, Hybrid Electronics; Structural and InMold Electronics; Wearable Electronics; Electronic Textiles; Smart Skin Patches & Continuous; Vital Signs Monitoring; 3D Printed Electronics; R2R Electronics; Stretchable and Conformal Electronics; Additively Manufactured Electronics; Additive Electronics in Electronic Packaging; Printed, Flexible, Wearable Batteries; Printed Sensors and Actuators; Printed & R2R Photovoltaics (Perovskite, Organic, CIGS, QD); Printing in Displays (OLED, microLED, QD, Electrochromic); Future of HMIs; Large-Area Lighting; Intelligent Packaging

Explore our past & upcoming events on this topic

Leading global speakers include:

Full Agenda

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12 October 2022

TechBlick

Welcome & Introduction

Wednesday

9.15AM

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Khasha Ghaffarzadeh

CEO

Welcome & Introduction

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9.15AM

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12 October 2022

TNO at Holst Centre

Solving Today's Challenges with Flexible Electronics

Wednesday

9.20AM

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Ton van Mol

Managing Director

All, Printed Electronics

Solving Today's Challenges with Flexible Electronics

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9.20AM

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12 October 2022

FaceBook /META

Wearable System Design Challenges toward Human-Centric Computing

Wednesday

9.40AM

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Jim Huang

Research Scientist, Meta Reality Labs

As we move from personal computing to human-centric computing, we see great promises for people to better connect with their family, friend, or colleague around the globe despite of physical distance. All-day wearable devices such as virtual reality (VR) and augmented reality (AR) glasses, wristbands, or gloves equipped with the ubiquitous connectivity can empower people to connect, feel, and interact more intuitively than using today’s mobile phones or personal computers. In my presentation, I will talk about the promises and the technical challenges of wearable systems design using flexible, hybrid, and printed electronics, and how a design-manufacture ecosystem might help.

All, Printed Electronics

Wearable System Design Challenges toward Human-Centric Computing

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9.40AM

As we move from personal computing to human-centric computing, we see great promises for people to better connect with their family, friend, or colleague around the globe despite of physical distance. All-day wearable devices such as virtual reality (VR) and augmented reality (AR) glasses, wristbands, or gloves equipped with the ubiquitous connectivity can empower people to connect, feel, and interact more intuitively than using today’s mobile phones or personal computers. In my presentation, I will talk about the promises and the technical challenges of wearable systems design using flexible, hybrid, and printed electronics, and how a design-manufacture ecosystem might help.

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12 October 2022

Voltera

Print Anything on Everything: Unlocking Additive Electronics for the World

Wednesday

10.00AM

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Alroy Almeida

CEO & Co Founder

Electronics has lived in a subtractive world for a really long time. But the future is additive. Let’s take a look at how the industry — and the world — will evolve with the help of additive manufacturing and prototyping methods. Soft, biocompatible, textile and wearable electronics. In-mold structural electronics. It’s a brave new world and we won’t get there unless we break out of our subtractive box — so let’s take a look at how we do that. Explore the possibilities! Print anything. On everything.

Print Anything on Everything: Unlocking Additive Electronics for the World

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10.00AM

Electronics has lived in a subtractive world for a really long time. But the future is additive. Let’s take a look at how the industry — and the world — will evolve with the help of additive manufacturing and prototyping methods. Soft, biocompatible, textile and wearable electronics. In-mold structural electronics. It’s a brave new world and we won’t get there unless we break out of our subtractive box — so let’s take a look at how we do that. Explore the possibilities! Print anything. On everything.

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12 October 2022

Wuerth Elektronik eiSos

Advanced Electronics – to enable a sustainable future.
How to fuse established processes and disruptive technologies. Insights from an industrial point of view.

Wednesday

10.20AM

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Christoph Voelcker

Team Leader

The presentation will highlight market potentials for advanced electronics and how to use them sensibly. What steps can the industry take to enable and interact with the rapid development to pave the path to a more sustainable future with disruptive technologies.
With a focus on the transfer of innovative projects, the presentation will show examples of how Würth Elektronik eiSos works with start-ups, technology and research projects.

Advanced Electronics – to enable a sustainable future.
How to fuse established processes and disruptive technologies. Insights from an industrial point of view.

More Details

10.20AM

The presentation will highlight market potentials for advanced electronics and how to use them sensibly. What steps can the industry take to enable and interact with the rapid development to pave the path to a more sustainable future with disruptive technologies.
With a focus on the transfer of innovative projects, the presentation will show examples of how Würth Elektronik eiSos works with start-ups, technology and research projects.

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12 October 2022

Networking Break

Coffee & Exhibition/Networking Break

Wednesday

10.45AM

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Coffee & Exhibition/Networking Break

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10.45AM

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12 October 2022

Novo Nordisk

Printed Electronics in Mass-Produced Medical Devices

Wednesday

11.30AM

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Nikolaj Eusebius Jakobsen

Principal Device R&D Engineer

Novo Nordisk A/S supplies nearly 50% of the world’s insulin for treatment of diabetes, and 34 million people are using our diabetes care products. On top of this we are also supplying medicine for growth disorder, haemophilia, and obesity.
In Device and Delivery Solutions, we develop delivery solutions, combining Drug, Data, Diagnostics, digital solutions, and devices to make a meaningful treatment for our end users. Most of our drugs are formulated in a liquid state, so an injection device is needed for administration. To make a link between injection data and digital solution, we need to integrate sensors and communication in our devices. Integrating electronics in the injection devices gives data directly to the user who can use the data together with a health care professional to optimize the treatment.
To get at true mass producible connected device, we have had a couple of projects with printed electronics over the last years. The presentation will take you trough a printed electronics project and share some learnings, opportunities and struggles in making a printed connectivity solution for a mass-produced medical device.

All, Printed Electronics

Printed Electronics in Mass-Produced Medical Devices

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11.30AM

Novo Nordisk A/S supplies nearly 50% of the world’s insulin for treatment of diabetes, and 34 million people are using our diabetes care products. On top of this we are also supplying medicine for growth disorder, haemophilia, and obesity.
In Device and Delivery Solutions, we develop delivery solutions, combining Drug, Data, Diagnostics, digital solutions, and devices to make a meaningful treatment for our end users. Most of our drugs are formulated in a liquid state, so an injection device is needed for administration. To make a link between injection data and digital solution, we need to integrate sensors and communication in our devices. Integrating electronics in the injection devices gives data directly to the user who can use the data together with a health care professional to optimize the treatment.
To get at true mass producible connected device, we have had a couple of projects with printed electronics over the last years. The presentation will take you trough a printed electronics project and share some learnings, opportunities and struggles in making a printed connectivity solution for a mass-produced medical device.

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12 October 2022

Schneider Electric

3D Electronics vs Industrial Mission Profile / Case study From Schneider Electric

Wednesday

11.30AM

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Philippe Prieur

Global, Electronics Industrialization Director

Schneider Electric / Company presentation
Mechatronics physical integration, constraints & compacity
Context and Proof of concept on 3D electronics applications (IME, LDS, Printed 3D)
Industrial mission profile, robustness
Antenna use case / validation plan
Sensor use case / validation plan
Perspectives and next Steps
Questions mark

All, Printed Electronics

3D Electronics vs Industrial Mission Profile / Case study From Schneider Electric

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11.30AM

Schneider Electric / Company presentation
Mechatronics physical integration, constraints & compacity
Context and Proof of concept on 3D electronics applications (IME, LDS, Printed 3D)
Industrial mission profile, robustness
Antenna use case / validation plan
Sensor use case / validation plan
Perspectives and next Steps
Questions mark

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12 October 2022

GE Healthcare

Wearable Ward Monitoring Solution

Wednesday

11.50AM

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Juha Virtanen

Principal Engineer, Wearable Sensors

Continuous ward monitoring is expected to improve patient outcome. Respiration rate has been recognized as a promising early indicator for deterioration of patient status. Department-wide solution is needed to make full benefit of the solution. Data quality and patient comfort are key factors in acceptance of a new monitoring modality. This talk will address the key technical choices behind our newly released wearable ward monitoring solution.

All, Printed Electronics

Wearable Ward Monitoring Solution

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11.50AM

Continuous ward monitoring is expected to improve patient outcome. Respiration rate has been recognized as a promising early indicator for deterioration of patient status. Department-wide solution is needed to make full benefit of the solution. Data quality and patient comfort are key factors in acceptance of a new monitoring modality. This talk will address the key technical choices behind our newly released wearable ward monitoring solution.

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12 October 2022

Sunway Communication

The Latest Development in 2D/3D Microcircuits

Wednesday

11.50AM

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Nouhad Bachnak

Managing Director

The traditional LDS (laser direct structuring) process is fantastic but only works on special plastic substrates containing sub-surface activation particles. This limits the choice and functionality of materials. Firstly, it typically does not work with glass, ceramics, PET or thermosets. Furthermore, the addition of activation particles can render a transparent material opaque or eliminate bio-compatibility. Furthermore, the linewidth resolution is typically around 80-100um (but can be pushed further down) with surface roughness of 20-30um

In this talk, Nouhad Bachnak unveils a new process, which promises to overcome these limitations. Here, the process first involves a special laser structuring process followed by a so-called chemical activation step. After this step, the structured and activated part undergoes typical plating (Cu-NiP-Au)

This is an important development and advancement of the technology, because it greatly lessens the limits on the choice of materials which can be 3D metallized with bulk-like properties and solderable surfaces

Furthermore, it will be shown that this process- when optimized- will achieve 5um linewidths with a surface roughness of just 2-3um (great for antennas, for example). It can also plate within vias with 40um diameter.

This is still not the full production level for all substrates. The most advanced development is for thermoset, which is production ready. The other substrates like glass, PET, and ceramics are still in development. Nonetheless, it is a good space to watch

The Latest Development in 2D/3D Microcircuits

More Details

11.50AM

The traditional LDS (laser direct structuring) process is fantastic but only works on special plastic substrates containing sub-surface activation particles. This limits the choice and functionality of materials. Firstly, it typically does not work with glass, ceramics, PET or thermosets. Furthermore, the addition of activation particles can render a transparent material opaque or eliminate bio-compatibility. Furthermore, the linewidth resolution is typically around 80-100um (but can be pushed further down) with surface roughness of 20-30um

In this talk, Nouhad Bachnak unveils a new process, which promises to overcome these limitations. Here, the process first involves a special laser structuring process followed by a so-called chemical activation step. After this step, the structured and activated part undergoes typical plating (Cu-NiP-Au)

This is an important development and advancement of the technology, because it greatly lessens the limits on the choice of materials which can be 3D metallized with bulk-like properties and solderable surfaces

Furthermore, it will be shown that this process- when optimized- will achieve 5um linewidths with a surface roughness of just 2-3um (great for antennas, for example). It can also plate within vias with 40um diameter.

This is still not the full production level for all substrates. The most advanced development is for thermoset, which is production ready. The other substrates like glass, PET, and ceramics are still in development. Nonetheless, it is a good space to watch

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12 October 2022

Neotech AMT

Scalable 3D Printed Electronics - from “Fully Additive” to High Volume.

Wednesday

12.10PM

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Martin Hedges

MD

All, Printed Electronics

Scalable 3D Printed Electronics - from “Fully Additive” to High Volume.

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12.10PM

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12 October 2022

Quad Industries

Flexible Printed Electronics: A World Of Opportunities

Wednesday

12.10PM

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Wim Christiaens

R&D Director

This talk will provide insights into printed electronics, a platform technology to create electrical devices on various substrates. Printed circuits have been used since more than 20 years for the production of user interfaces, including membrane switches and capacitive touch sensors, but the biggest opportunity in the field of printed electronics is that many new applications are emerging. Quad Industries is a leading innovator in this field, and by means of highly accurate screen-printing techniques, smart functionality is integrated on a wide range of materials such as flexible and stretchable films, textiles and paper. Some of our recent developments and applications include smart electrode patches, PTC film heaters, force sensors and in-mold electronics

Flexible Printed Electronics: A World Of Opportunities

More Details

12.10PM

This talk will provide insights into printed electronics, a platform technology to create electrical devices on various substrates. Printed circuits have been used since more than 20 years for the production of user interfaces, including membrane switches and capacitive touch sensors, but the biggest opportunity in the field of printed electronics is that many new applications are emerging. Quad Industries is a leading innovator in this field, and by means of highly accurate screen-printing techniques, smart functionality is integrated on a wide range of materials such as flexible and stretchable films, textiles and paper. Some of our recent developments and applications include smart electrode patches, PTC film heaters, force sensors and in-mold electronics

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12 October 2022

Nano OPS

A Foundry in a Box: High-throughput Additive Manufacturing
of Nano and Microelectronics and Advanced Packaging for Heterogenous Integration

Wednesday

12.30PM

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Ahmed Busnaina

CTO

Current electronic manufacturing processes have high operating and capital costs. These conventional processes consist of a complex series of steps using hundreds of high-energy deposition steps consuming massive amounts of electricity and water. A new scalable and sustainable technique for additively manufacture nano and microelectronics has been developed. The technique eliminates high-energy, chemically intense processing by utilizing direct assembly of nanoscale particles or other nanomaterials at ambient temperature and pressure onto a substrate, to precisely where the structures are built. Although, many of the nanomaterials-based electronics transistors were made using organic materials and/or nanomaterials that do not need to be sintered such as carbon nanotubes and 2D materials, however, to have a commercial impact, traditional semiconductors nanomaterials such as silicon and III-V and II-VI semiconductors, metals and dielectrics need to be printed to produce high performance electronics. In this presentation we show how this technology can print single crystal structures and make transistors using a purely additive (directed assembly enabled) with no etching or vacuum using inorganic semiconductors, metals and dielectrics. The process demonstrates the manufacturing of transistors with an on/off ratio greater than 106. This new technology will enable the fabrication of nanoelectronics while reducing the cost by 10-100 times and can print 1000 faster and 1000 smaller (down to 20nm) structures than inkjet-based printing. Moreover, the nanoscale printing platform enables the heterogeneous integration of interconnected circuit layers (like CMOS) of printed electronics and active and passive components on rigid or flexible substrates. Printed applications such as transistors, inverters, diodes, logic gates, display at the micro and nanoscale using inorganic and organic materials will be presented.

A Foundry in a Box: High-throughput Additive Manufacturing
of Nano and Microelectronics and Advanced Packaging for Heterogenous Integration

More Details

12.30PM

Current electronic manufacturing processes have high operating and capital costs. These conventional processes consist of a complex series of steps using hundreds of high-energy deposition steps consuming massive amounts of electricity and water. A new scalable and sustainable technique for additively manufacture nano and microelectronics has been developed. The technique eliminates high-energy, chemically intense processing by utilizing direct assembly of nanoscale particles or other nanomaterials at ambient temperature and pressure onto a substrate, to precisely where the structures are built. Although, many of the nanomaterials-based electronics transistors were made using organic materials and/or nanomaterials that do not need to be sintered such as carbon nanotubes and 2D materials, however, to have a commercial impact, traditional semiconductors nanomaterials such as silicon and III-V and II-VI semiconductors, metals and dielectrics need to be printed to produce high performance electronics. In this presentation we show how this technology can print single crystal structures and make transistors using a purely additive (directed assembly enabled) with no etching or vacuum using inorganic semiconductors, metals and dielectrics. The process demonstrates the manufacturing of transistors with an on/off ratio greater than 106. This new technology will enable the fabrication of nanoelectronics while reducing the cost by 10-100 times and can print 1000 faster and 1000 smaller (down to 20nm) structures than inkjet-based printing. Moreover, the nanoscale printing platform enables the heterogeneous integration of interconnected circuit layers (like CMOS) of printed electronics and active and passive components on rigid or flexible substrates. Printed applications such as transistors, inverters, diodes, logic gates, display at the micro and nanoscale using inorganic and organic materials will be presented.

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12 October 2022

Smooth & Sharp

A NFC Biosensor Test Stripe made with Reel-to-Reel Hybrid Electronics on the same Substrate

Wednesday

12.30PM

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Alan Wu

President & Founder

TELETENTO® has innovations in FHE and POCT aspects.

In FHE aspect,
●Integrated Printed Electronics from NFC antenna, MCU socket to Biosensor
All the major parts are printed R2R on same substrate.
●Precise FHE assembling
Up to 10 pads MCU chip assembling in R2R operation.
●Fine Line Printing
Line width/gap < 100um for MCU socket
●Possible with Paper Substrate
Verification of all production conditions with paper substrate.

In POCT aspect,
●Further Decentralization
via NFC smartphone, testers don’t need to come to hospital or clinic for medical specimen collection.
●Risk Reduction
no need medical specimen transportation, avoid latent virus spreading with contaminated medical specimen.
Used test stripe with medical specimen e.g body fluids can be disposed onsite.
●Quick Response
Test result is informed via APP, SaaS or PaaS.
●Cost Saving
No more costly medical specimen required transportation e.g. temperature control, time.

Let contaminated medical specimen stay where it is collected.