top of page

ALL PAST & FUTURE EVENTS AS WELL AS MASTERCLASSES WITH A SINGLE ANNUAL PASS

The Future of Electronics RESHAPED 2024 USA

12-13 June 2024
9am - 5pm

Boston Time

Live Event

Leading global speakers include:
FLEXOO
Copprium
Suss MicroTec
Notion Systems
GE HealthCare
Raytheon | An RTX Business
INTELLIVATION LLC
Advanced Printed Electronic Solutions
Parc/SRI International
Integrated Deposition Systems Inc
Quantica
Ligna Energy
XTPL
Brewer Science
Electroninks Incorporated
Heraeus Electronics
 Holst Centre
GE Aerospace
SunRay Scientific
Panasonic
ImageXpert
East West Manufacturing
INO
Nano3dprint
SmartKem
Coatema
Carnegie Mellon University
Boeing
Loomia Technologies
AFFOA
Nano OPS, Inc.
Inteva Products
Kateeva
Komori America Corporation
VTT
MAASS
Linxens
Sefar Inc
CondAlign AS
NanoPrintek
Eaton
Spark Biomedical
Eastman Kodak
Hummink
Lockheed Martin
Pragmatic Semiconductor
Asahi Kasei
TracXon
Northrop Grumman
Antenna Research Associates
Energy Materials Corporation
Voltera
Akoneer
Gradient_edited_edited.jpg

Full Agenda

The times below is USA Boston time

TechBlick
joint-presentations.png

TechBlick

Welcome & Introduction

9:00 AM

joint

Read More

Khasha Ghaffarzadeh
Short Demo

Khasha Ghaffarzadeh

CEO & Founder

Welcome & Introduction

9:00 AM

Abstract

Watch Demo Video
Asahi Kasei
joint-presentations.png

Asahi Kasei

Development of Smart Logistic Solution Using Flexible Sensor with R2R Submicron Electrode Formation Technology

9:05 AM

joint

Read More

Masayuki Abe
Short Demo

Masayuki Abe

New business development manager

The supply chain that delivers products and services to end consumers is constantly changing and is exposed to various risks such as diseases, counterfeit crimes, geopolitics, natural disasters, and economics. In order to solve these issues, it is important to visualize the end-to-end status of individual products from upstream to downstream, and to upgrade and optimize the SC based on the visualized data. One of the solutions is the realization of smart logistics and flexible sensors for understanding the status of individual products. Asahi Kasei has developed RFID labels with submicron resolution R2R electrode printing technology and a data platform using blockchain. In this presentation, we will introduce the submicron resolution R2R electrode printing technology and RFID labels, as well as the roadmap toward smart logistics and the data platform. 2. R2R electrode printing technology with submicron resolution The line width that can be achieved with existing printing processes are generally several tens of microns, and the most advanced ones are about 10 microns, but the line width of the process we have developed has an ultra-high resolution of about 250 nm. To achieve this, we developed in- house the three elements, those are conductive nano ink, submicron-resolution cylindrical mold (SRM), and the R2R high-definition printing process. The key element is the SRM, which is fabricated using a proprietary electron beam lithography process for cylindrical rollers. Furthermore, the unique R2R printing process incorporating this SRM achieves low-cost production through continuous printing. 3. RFID labels with guaranteed authenticity By using our technology, we develop an "authenticity-assured" RFID label. The label consists of submicron to several microns wide metal wires embedded with a special pattern to detect counterfeiters. The label is therefore designed to ensure the authenticity of the product to which it is affixed, while enabling RFID-based product identification and communication. In addition, the label can be attached to various products because it is transparent in appearance and does not interfere with the design. The RFID has a general dipole antenna shape, and the communication distance can be designed according to the required specifications, with a maximum distance of several meters. When read by the IoT edge device developed at the same time, it determines whether the label is manufactured by Asahi Kasei or not, and generates digitalized information with the product ID. 4. Roadmap We develop a platform configuration for digitizing label information attached to individual products and preventing tampering. Currently, only RFID labels with guaranteed authenticity are available, but in the future, flexible sensors with measurement functions for various physical quantities will be developed to create an infrastructure for the realization of smart logistics.

Development of Smart Logistic Solution Using Flexible Sensor with R2R Submicron Electrode Formation Technology

9:05 AM

Abstract

Watch Demo Video
Energy Materials Corporation
joint-presentations.png

Energy Materials Corporation

Commercializing High-speed Production of Perovskite Solar Panels

9:25 AM

joint

Read More

Thomas Tombs
Short Demo

Thomas Tombs

Chief Technology Officer

Energy Materials Corporation (EMC) is scaling up to manufacture Perovskite solar panels for multi-GW/year production volumes using high speed roll-to-roll equipment. The methodology of EMC’s commercialization approach is described, including the steps to go from lab scale inks and methods to high-speed prototype demonstrations and culminating with full scale production of finished panels. The challenges and equipment for all stages of the commercialization process are reviewed. EMC’s projected cost per Watt for manufacturing perovskite solar cells at the GW-scale is shown to be a fraction of the best-case projections for Silicon solar cells, which enables local manufacturing in regions with high energy and labor costs.

Commercializing High-speed Production of Perovskite Solar Panels

9:25 AM

Abstract

Watch Demo Video
Voltera
joint-presentations.png

Voltera

Multi-layer Flexible Displays using Electroluminescent Ink

9:45 AM

joint

Read More

Jesus Zozaya
Short Demo

Jesus Zozaya

CEO | Co-founder

This research unveils a cutting-edge technique for prototyping multi-layer flexible displays using electroluminescent ink. Additively deposited using a direct ink writing dispensing system, this ink opens up new use cases for functional information display and aesthetic appeal. These inks can be printed on diverse substrates, such as glass, paper, and plastic, enabling a new dimension in creative and interactive packaging solutions across various industries.

Multi-layer Flexible Displays using Electroluminescent Ink

9:45 AM

Abstract

Watch Demo Video
FLEXOO
joint-presentations.png

FLEXOO

Mass customization & mass production of Smart Sensors

10:05 AM

joint

Read More

Jean-Charles Flores
Short Demo

Jean-Charles Flores

Team Leader, photonics, integrated circuits

Mass customization & mass production of Smart Sensors
As we specialize in delivering end-to-end solutions for smart sensors and electronics, from initial development to final manufacturing, we will highlight in this presentation how it is possible to enable the mass production of smart sensing elements in record time. We will present our strategy to go toward mass customization and give examples for e-mobility & renewable energy storage, military, automotive and logistic applications.

About the author
Jean-Charles Flores is a creative technologist with passion for innovation and a gift for connecting people, ideas and technologies. He started his industrial carrier at Ciba and then BASF where he worked as scientist, technologist and program manager for more than a decade. In 2019, he founded anthos iD_ and in 2023, co-founded Flexoo where his mission is to stir the tremendous creative power of Flexoo’s team into developing always smarter sensors that seamlessly integrate into our daily life. Jean-Charles holds a PhD in Material Sciences and an Engineering degree from the National Chemistry School of Montpellier.

About the company
Flexoo, based in Heidelberg, Germany, is a leading provider of printed electronics and sensors, dedicated to driving innovation and delivering high value to its customers. A unique manufacturing setup, characterized by flexibility, quality, and unparalleled productivity, sets the company apart as the ideal partner for mass production of smart sensors and electronics.

Mass customization & mass production of Smart Sensors

10:05 AM

Abstract

Watch Demo Video
GE Aerospace
joint-presentations.png

GE Aerospace

Printed Electronics for Embedded RF Die Packaging

11:15 AM

joint

Read More

Felippe J Pavinatto
Short Demo

Felippe J Pavinatto

Senior Engineer - Printed Electronics

Additive Electronics manufacturing is employed at GE Aerospace as an enabler for
devices and systems in the areas of harsh environment sensing, electronics packaging, power electronics, and structural health monitoring (SHM), as well as telecommunication systems and soft robotics. The possibility of using direct-write printing to fabricate conformal devices on non-planar aerospace surfaces using innovative materials and inks is the focus of our printed electronics team. In this talk, we will present the latest developments on the use of high-resolution 3D printed ceramics and micro-dispensing and aerosol jet printing for the fabrication of embedded electronics packaging for radiofrequency (RF) devices. The manufacturing of a multilayer circuit with a 4 x 4 array of low-noise amplifier (LNA) RF chips embedded in alumina will be described. This will include details on material selection and process development for conductive via, dielectric moat ramp and printed RF interconnects fabrication. In conclusion,the performance of a unit cell in the array will be presented to demonstrate the viability of using printed materials and methods for 3D packaging RF devices.

Printed Electronics for Embedded RF Die Packaging

11:15 AM

Abstract

Watch Demo Video
Akoneer
joint-presentations.png

Akoneer

High density Cu traces for novel methods of PCB/FPC and semiconductor packaging production using SSAIL technology.

11:35 AM

joint

Read More

Tadas Kildusis
Short Demo

Tadas Kildusis

CCO

Selective Surface Activation Induced by Laser (SSAIL) technology allows creating Cu traces on any dielectric material (organic, glass, ceramic, etc.). In first part of this talk we are presenting our results for high throughput 10-25 µm trace formation on FR4 and PET for PCB/FPC production. In the second part we discuss 1-25 µm traces on PI, EMC and glass for semiconductor packaging. This enables novel methods for PCB/FPC and semiconductor packaging avoiding chemical etching, masks and reducing power consumption and waste.

High density Cu traces for novel methods of PCB/FPC and semiconductor packaging production using SSAIL technology.

11:35 AM

Abstract

Watch Demo Video
 Holst Centre
joint-presentations.png

Holst Centre

Additive manufacturing for 3D structural microelectronics

11:55 AM

joint

Read More

Hylke Akkerman
Short Demo

Hylke Akkerman

Program Manager

Over the years, electronics and its components have continuously developed towards a higher density, but largely in the same rigid flat form factor of PCBs. To achieve higher density electronics in complex 3D arrangements, TNO at Holst Centre has developed a multi-material additive manufacturing process named “3D additive lithography for electronics” (3D-ALE). With this fabrication process a scanning DMD-based light engine is used to pattern photopolymers down to 10 um structures. Within the patterned photopolymer cavities are designed for component placement (particularly suitable for bare-die components) and tracks for metal paste filling to fabricate the circuitry. Continuous successive layer-by-layer build-up allows for complex high-density electronics in 3D structural embodiments.

Additive manufacturing for 3D structural microelectronics

11:55 AM

Abstract

Watch Demo Video
NanoPrintek
joint-presentations.png

NanoPrintek

Dry Multimaterial Printing Technology: Efficient, Clean, Cost-Effective, and Supply-Chain Resilient

12:15 PM

joint

Read More

Masoud Mahjouri-Samani
Short Demo

Masoud Mahjouri-Samani

Founder and President

NanoPrintek presents its disruptive “dry multimaterial printing” technology that transforms the current printing ecosystem. This presentation highlights the unparalleled capability of this technology and shows how it can print directly from metals and semiconductors to insulators and composites (even from scraps and rocks!) and on various substrates. The current printing ecosystem is liquid-based, which heavily suffers from major drawbacks, including i) the need for a complex and pollutive supply chain, ii) expensive and extensive ink formulation processes, iii) surfactants and contaminants, iv) limited printing inks, and v) the need for high-temperature post-processing. This talk presents NanoPrintek’s disruptive inkless multimaterial printing technology, where various materials can be printed seamlessly from solid sources. The key technology advantages include 1) on-demand and in-situ generation of various pure nanoparticles without contaminations, 2) in-situ and real-time laser sintering of nanoparticles on various substrates with no post-processing, 3) multimaterial printing of hybrid and tunable nanocomposite materials and structures. This supply-chain resilient, clean, and highly cost-effective technology transforms the electronics printing ecosystem to a new realm where pure, multimaterial, multifunctional, and hybrid materials are printed on demand, enabling various applications in the electronics, healthcare, automotive, aerospace, defense, and energy industries.

Dry Multimaterial Printing Technology: Efficient, Clean, Cost-Effective, and Supply-Chain Resilient

12:15 PM

Abstract

Watch Demo Video
Lunch & Exhibition Break
joint-presentations.png

Lunch & Exhibition Break

Lunch & Exhibition Break

12:35 PM

joint

Read More

Short Demo

Lunch & Exhibition Break

12:35 PM

Abstract

Watch Demo Video
Kateeva
joint-presentations.png

Kateeva

Billions of drops per second, where do you want them?

2:05 PM

joint

Read More

Kent Ubellacker
Short Demo

Kent Ubellacker

Electronics and display industry applications push the limits of inkjet printing in terms of accuracy and volume control. It’s one thing to meet these objectives in a laboratory environment, but an entirely different experience to scale to production. Materials in use such as optical light emitting diodes, quantum dots, and numerous encapsulants create a challenging environment for inkjet nozzle reliability and performance.Drop placement correction is one core technology to maintain high quality printing. Used in tandem with highly reliable printing equipment and world class printing algorithms, high accuracy can be achieved in applications ranging from multi thickness layer printing to discrete pixel printing.

Billions of drops per second, where do you want them?

2:05 PM

Abstract

Watch Demo Video
Komori America Corporation
joint-presentations.png

Komori America Corporation

Minimum Solder Paste Bump Size using Gravure Offset Printing for Micro LEDs

2:25 PM

joint

Read More

Doug Schardt
Short Demo

Doug Schardt

Director Of Product Managment

Application of micro-LEDs in a wide range of products is expected and with the ever-increasing trend towards miniaturization, very small and precisely placed print is a requirement. This presentation will examine the smallest diameter bump that can be accurately produced with gravure offset.Current bonding techniques using ACF can be improved by moving to solder paste bonding which is expected. Solder paste itself works very well with gravure offset with the main requirement of small, precise solder bumps.Within the process of gravure offset printing creating and maintaining the minimum possible bump size is determined by two main variables and the presentation examines those variables and reveals the smallest possible bump diameter that can be created using gravure offset and solder paste.

Minimum Solder Paste Bump Size using Gravure Offset Printing for Micro LEDs

2:25 PM

Abstract

Watch Demo Video
Quantica
joint-presentations.png

Quantica

Beyond Thin Layers: High Viscosity Solutions for Printed Electronics

2:45 PM

joint

Read More

Marcel Strobel
Short Demo

Marcel Strobel

Business Developer & Electronics Application Specialist

In the world of printed electronics, challenges in technology and material limitations have remained a barrier to more widespread adoption. This talk will explore the transformative potential of leveraging high viscosity materials for inkjet printing. Marcel will dive into Quantica’s NovoJet inkjet printing technology, showcasing its capability to expand the repertoire of printable materials. Additionally, the presentation will delve into new avenues for applications in printed electronics, shedding light on the exciting possibilities ahead.

Beyond Thin Layers: High Viscosity Solutions for Printed Electronics

2:45 PM

Abstract

Watch Demo Video
Notion Systems
joint-presentations.png

Notion Systems

Advanced Patterning with EHD and Inkjet

3:05 PM

joint

Read More

Maximilian Mosberg
Short Demo

Maximilian Mosberg

Business Development and Sales

One of the founding ideas of Notion Systems was to replace the current subtractive process chains with additive process steps in electronics manufacturing. The n.jet inkjet platform is used to produce electronic displays, printed circuit boards, semiconductor components, as well as high precision optical 3D parts, covering the full range of solutions from lab to fab. Main inkjet applications are coating, dispensing or patterning. Patterning can easily be done with inkjet printing, as it is a digital printing process with drop-on-demand functionalities. Depending on the print head and the material used, resolutions of 20 µm are possible. Despite the fact that this is an interesting technology for any industries, there are limitations with this technology for certain display or semiconductor applications. For this reason, Notion Systems has invested in a collaboration with Scrona AG of Switzerland, which has developed an EHD printing technology.Electrohydrodynamic (EHD) printing is a new high-resolution printing technology that enables maskless, direct-write, non-contact, conformal and additive patterning at the micron scale with a variety of ink systems and materials. Print resolution exceeds that of conventional inkjet printing by two to three orders of magnitude, it paves the way for additive printing in applications dominated by photolithographic microfabrication and enables entirely new devices made from micro-scale building blocks.MEMS multi-nozzle printheads with ultra-high print resolution, enabling applications with resolution greater than 1 μm. This Research and development tool is targeted to advanced development labs in various fields of micro-fabrication and digital additive manufacturing.

Advanced Patterning with EHD and Inkjet

3:05 PM

Abstract

Watch Demo Video
VTT
joint-presentations.png

VTT

Advancing printed and hybrid electronics from concepts to pilot factory manufacturing

4:10 PM

joint

Read More

Antti Kemppainen
Short Demo

Antti Kemppainen

Key Account Manager

Printed and hybrid electronics technologies are currently being developed for elastic wearable smart patches for health and medical applications. Also thin flexible smart labels are highly interesting for several industries to improve transparency, efficiency and security of the logistics throughout their product life cycle. Today with printed and flexible electronics solutions for practically any function required can be developed, but the bottleneck is often in upscaling. In this presentation the speeding up the upscaling utilizing VTT’s Printocent Pilot Factory is discussed. Development of printing, component assembly, postprocessing and testing is described.

Advancing printed and hybrid electronics from concepts to pilot factory manufacturing

4:10 PM

Abstract

Watch Demo Video
Raytheon | An RTX Business
joint-presentations.png

Raytheon | An RTX Business

Printed Hybrid Electronics (PHE) Manufacturing: Pathways to Next-Gen Electronics

4:30 PM

joint

Read More

Daniel Hines
Short Demo

Daniel Hines

Director/RTX

Additive manufacturing (AM) methods are coming of age and being used to not only fabricate structural and prototype parts but also to fabricate high-quality electronic components and circuits. Direct-write (DW) printing is emerging as one of the more promising AM methods for the fabrication of printed circuitization, printed interconnects, and other printed passive circuit components. These printed hybrid electronics (PHE) fabrication methods provide specific advantages for heterogeneous integration at both the package and board levels, for RF electronics, and for conformal electronics. Examples include: i) rapid prototyping, ii) printed interconnects, and iii) new form factors for integrating electronics directly into structural parts. Such PHE fabrication capabilities will be highlighted primarily in terms of manufacturing methods for next-gen electronics.

Printed Hybrid Electronics (PHE) Manufacturing: Pathways to Next-Gen Electronics

4:30 PM

Abstract

Watch Demo Video
CondAlign AS
joint-presentations.png

CondAlign AS

Room temperature electronics bonding in FHE applications, addressing sustainability and cost.

4:50 PM

joint

Read More

Morten Lindberget
Short Demo

Morten Lindberget

VP Business Development


CondAlign’s range of adhesive ACFs for low-temperature, low-pressure bonding of electronics components is well suited for the Flexible and Hybrid Electronics (FHE) area. These products offer electrical and mechanical bonding of components to flexible (and rigid) substrates at room temperature with no heat or other post curing required. With a typical bonding pressure of ca 0,1 – 0,3 MPa, instant functionality is immediately achieved.These adhesive ACFs contain a pressure sensitive adhesive material comprising conductive particles. The particles are aligned in z-direction with the patented technology, creating an anisotropic conductive film. The process is well suited for continuous roll-to-roll production and is implemented in CondAlign’s coating line. The alignment allows for significantly reduced use of particles (while still maintaining good electrical conductivity in Z-direction), which again leads to a) reduced material cost compared to traditional ECAs, b) retaining the initial polymer properties very well (adhesiveness, softness, flexibility, transparency etc),and c) reduced environmental impact through reduced particle content, as well as reduced energy consumption in the bonding process. The reduced environmental impact is documented by an independent part (CEMAsys), which shows a considerable reduction in CO2 emission, compared to two traditional processes: Reflow soldering, and bonding with silver filled epoxy. Extensive in-house and customer tests have been performed, regarding temperature cycling and humidity stability, in-plane and through-plane resistance, mechanical stress, capacity to lead current, adhesiveness etc.

Room temperature electronics bonding in FHE applications, addressing sustainability and cost.

4:50 PM

Abstract

Watch Demo Video
Northrop Grumman
joint-presentations.png

Northrop Grumman

Advanced Electronics for Space Systems of the Future

5:10 PM

joint

Read More

Anthony  DeCicco
Short Demo

Anthony DeCicco

Sr. Engineer

Modern day advanced technology for electronics are on track for major use cases and applications for terrestrial purposes. But the environments of space and getting there, lead to a set of new challenges that may force us to reinvent how we will produce systems that will reside in space. This talk will discuss those challenges and offer some suggestions on where the technology needs to go. It will also investigate which are candidates for actually producing these articles, not just for space, but in space which could include on orbit, or on planetary or lunar surfaces. The need is there. The technology is not. Come see why.

Advanced Electronics for Space Systems of the Future

5:10 PM

Abstract

Watch Demo Video
Lockheed Martin
joint-presentations.png

Lockheed Martin

Flex Integration for Edge Computing

9:00AM

joint

Read More

Isaac Leffler
Short Demo

Isaac Leffler

Research Engineer Sr

To achieve the advanced electronics requirements of many defense applications and systems there is a demand for the use of heterogenous solutions that can integrate a variety of semiconductor chiplets onto conformal surfaces. The leading representative examples include missiles and Group 1 unmanned platforms. An increasing number of platforms are similarly moving toward these requirements, particularly with the migration to converged sensing architectures in which the electronics are located very near the RF and EOIR sensors.

Examples of the type of Flexible Hybrid Electronics (FHE) that is needed for edge sensing and computing in defense applications include the following types of advanced electronics:

· RF mixed signal sensor front end electronics (antenna, RF, filters, channelizer)

· Small Signal Power (SSP) Point-of-Load (PoL) power management

· Sensor signal processing including AI/ML algorithms.

· Computation for backend processing (data fusion, object detection/recognition)

· Optical interconnects to transport RF sensor data more efficiently.

While the long-term solution requires many heterogenous chiplets integrated into a common system-in-package (SiP), current efforts focus on a discriminating subset of the key challenges by integrating a single mixed-bump, high-performance data converter die onto an FHE substrate. By doing so, it will demonstrate the FHE advanced electronics manufacturing, assembly, and packaging build, with process steps for 1) assembly and alignment of high-density die at 55um and 150um bump pitch devices, 2) high-speed RF and digital signal handling, 3) electrical connectivity via flip-chip, and 4) reliability testing of the packaged solution.

Past efforts have also targeted optical RF interconnects for more efficient transport of sensor data by building an RFoF PIC system for long distance fiber backhaul to replace existing RF cabling systems. These systems improve and normalize sensor data across larger aperture antenna arrays bringing life back to edge array elements previously experiencing exceptionally high RF losses.

Flex Integration for Edge Computing

9:00AM

Abstract

Watch Demo Video
Antenna Research Associates
joint-presentations.png

Antenna Research Associates

Additive Large Area Conformal Electronics Manufacturing

9:20 AM

joint

Read More

Denise Radkowski
Short Demo

Denise Radkowski

Director of Signature Management Systems

Additive Large Area Conformal Electronics Manufacturing

9:20 AM

Abstract

Watch Demo Video
Eastman Kodak
joint-presentations.png

Eastman Kodak

Flexible Heaters Manufactured Using High-Resolution Flexography

9:40 AM

joint

Read More

Carolyn Ellinger
Short Demo

Carolyn Ellinger

General Manager

Many flexible heater products are produced using printing techniques. In all cases, each mass-produced heater is a replicate of the last, making their manufacture well suited for “analog” print manufacturing, such as flexography. The use of high-resolution printing enables the additive manufacturing of custom heater designs – whether they be transparent or have other unique design features. These heaters can be built from “all-ink” materials or from copper micro-wires for additional transparency and function. This talk will provide an overview of the requirements for different heater applications and how these requirements can be achieved with high-resolution flexographic processes. Examples and data will be shared from lab-scale and production scale evaluations.

Flexible Heaters Manufactured Using High-Resolution Flexography

9:40 AM

Abstract

Watch Demo Video
INTELLIVATION LLC
joint-presentations.png

INTELLIVATION LLC

Integrated R2R Platform for Development and Production of High-Tech Flexible Electronics

10:00 AM

joint

Read More

Mike Simmons
Short Demo

Mike Simmons

President & CEO

The need for high volume flexible, functional devices for sensor, energy, optical, biomedical, and aerospace applications requires the ability to integrate new product and process controls into roll-to-roll solutions for vacuum coating. Key factors in equipment selection include powerful automation, modular equipment design, deposition source technology, power supply selection, substrate handling e.g. transport, temperature, surface treatment and in-situ monitoring, are all critical for providing solutions for the production of flexible devices. Modern flexible electronic sensors can be manufactured from coated thin films using laser patterning of the vacuum deposited layers. This technique can also be used to control surface morphology of individual layers to provide functionalities catered to the end use. The ability to provide unique comprehensive solutions for all these requirements in a single R2R vacuum web coating system is driving production of the next generation of light-weight flexible devices with high yield and the best performance for high volume production.

Integrated R2R Platform for Development and Production of High-Tech Flexible Electronics

10:00 AM

Abstract

Watch Demo Video
Sefar Inc
joint-presentations.png

Sefar Inc

Screens for printing ultra-fine line printed electronics

11:10 AM

joint

Read More

Daniel Gilsdorf
Short Demo

Daniel Gilsdorf

Vice President Sales

In this presentation, we will talk about the screens used for ultra-fine line screen printing of conductive materials in printed electronics. The limits of the finest screen printable graphic elements continue to get smaller and smaller. We will talk about what questions to ask to make sure you are internally prepared to run ultra-fine line screen printing and some of the common challenges screen printers face when pushing the technology to its limits… at least today’s limits. We will also show some of the latest results.

Screens for printing ultra-fine line printed electronics

11:10 AM

Abstract

Watch Demo Video
INO
joint-presentations.png

INO

Revolutionizing Small Batch Printing: High Productivity with Innovative Screen Printing Technology

11:30 AM

joint

Read More

Nives Vehar
Short Demo

Nives Vehar

Sales US

As the printed electronics industry evolves towards customization and rapid prototyping, the demand for high productivity in small series printing becomes crucial. This presentation delves into the key capabilities and technical solutions of the most advanced screen printing equipment, exploring their contribution to elevated efficiency in screen printing for smaller production runs. Discover innovative approaches to traditional screen printing, optimized workflows, and the integration of the latest technologies, collectively contributing to a significant transformation in the field of flexible electronics manufacturing.

Revolutionizing Small Batch Printing: High Productivity with Innovative Screen Printing Technology

11:30 AM

Abstract

Watch Demo Video
Brewer Science
joint-presentations.png

Brewer Science

Implementation of New Materials and Printed Electronics for Monitoring the Environment

11:50 AM

joint

Read More

Adam Scotch
Short Demo

Adam Scotch

Director of R&D, Smart Devices

Brewer Science's vision is to design, build, and deploy connected gas and water sensors that monitor environmental contaminants quantitatively on a large scale. For the last 10 years, Brewer Science has developed the materials and technology to print cost-effective sensors that can measure contaminants in water, such as heavy metals (lead, cadmium), copper, calcium, magnesium, nitrate, pH, and ORP, as well as sensors that assess air quality by measuring gases like carbon monoxide, carbon dioxide, hydrogen, VOCs, and oxygen. Brewer Science fabricates a variety of printable sensor materials and deposits them onto a substrate utilizing processes such as physical vapor deposition (PVD) sputtering, screen printing, stencil printing, ink-jet printing, spray coating, and high-speed jet dispensing. Producing low-cost sensors with low-power electronics and wireless communication will enable the deployment of sensors over vast areas for real-time monitoring of environmental conditions.

To enable this vision of building and distributing cost-effective environmental sensors, the electronics industry must accelerate the advancement of additively manufactured electronics (AME). Some of the biggest challenges in implementing AME technologies is the development of printable functional inks, especially electrically non-conductive materials. There have been decades of progress in conductive inks, driven by applications such as membrane switches, resistive heaters, RFID tags, photovoltaics, and RF antennas. The next wave of development will be in the creation of new printable materials such as low-loss dielectrics, porous membranes, ion selective membranes, optical materials, and environmental protection layers (encapsulants). Brewer Science is excited to be part of this future by leaning on its core strength as an innovative materials development and manufacturing company.

Implementation of New Materials and Printed Electronics for Monitoring the Environment

11:50 AM

Abstract

Watch Demo Video
Eaton
joint-presentations.png

Eaton

Printed Power Module

12:10 PM

joint

Read More

Sai Avuthu
Short Demo

Sai Avuthu

Specialist Engineer

Direct printing of power modules using advanced 3D metal printing and screen printing

Printed Power Module

12:10 PM

Abstract

Watch Demo Video
Ligna Energy
joint-presentations.png

Ligna Energy

R2R manufactured supercapacitors for self-powered electronics

2:00 PM

joint

Read More

Peter Ringstad
Short Demo

Peter Ringstad

CEO

The need for wireless electronics is continuously increasing. But the potential market growth of wireless electronics is limited by their need for power. We believe in a clear movement towards cost efficient, extremely thin and self-powered systems - as the combination of digitalization and ESG legislations pushes the limits away from conventional solutions. To relate to this path a roll-to-roll manufactured supercapacitor have been developed, fully based on sustainable materials and now available on the market for integration to a wide range of wireless customer applications. Manufacturing methods including continuous coating of electrode material on Al foil from water-based slurries and assembly of Ligna supercapacitors in our conversion line enables high-volume manufacturing of cells in a R2R format. Upscaling is about balancing cell design and product properties with production speed and process control.

R2R manufactured supercapacitors for self-powered electronics

2:00 PM

Abstract

Watch Demo Video
Coatema
joint-presentations.png

Coatema

Tech Pillars of the green hydrogen economy – how to scale the production methods for PEM Fuel cells from lab2fab.

2:20 PM

joint

Read More

Thomas Kolbusch
Short Demo

Thomas Kolbusch

Director Sales, Marketing, Technology, VP