top of page

TECHBLICK PLATFORM: YEAR-ROUND ACCESS TO LIBRARY OF PRESENTATIONS, SLIDES & MASTERCLASSES ON EMERGING TECHNOLOGIES

TechBlick Innovations Festival | Free-To-Attend

25 April 2024
Free-To-Attend Online Event
1pm - 8pm

Berlin Time

We invite engineers, researchers, entrepreneurs, inventors, and end users from around the world to join TechBlick Innovations Festival on 25 April 2024 online


#AdditiveElectronics #PrintedElectronics #3DElectronics #WearableTextiles #TextileElectronics  #SoftElectronics 

#SustainableElectronics


This is a carefully curated event weaving together fantastic talks with superb networking and immersive virtual exhibition where you can move around with your own avatar.


The programme will cover all the key application and technology advancements, reflecting the beautiful diversity of this field.


The networking will happen in the immersive virtual platform as well as in round-robin speed networking sessions.


This event makes virtual interaction real and you will feel the buzz of meeting where you can have many spontaneous and serendipitous discussions.


Our last summer Innovations Festival 2023 had 700+ participants [not registrants]! Do not miss this opportunity! 


BONUS: If you register now you will receive a discount code for attending our  onsite Future of Electronics RESHAPED conference and exhibitions in Berlin and Boston!! 

Full Agenda

The times below is Europe Berlin time

LinkZill
joint-presentations.png

LinkZill

Innovating With TFT Technology in Both Optoelectronic and Biological Ways

1:00PM

joint

Read More

Dr. Linrun Feng

Dr. Linrun Feng

Founder & Co-CEO

LinkZill innovatively applies TFT semiconductor technology to various fields of optoelectronics and life sciences such as large-area bio-sensing, novel display, high-throughput DNA synthesis, and in-vitro diagnostics (IVD), based on our core TFT chip capabilities of in-situ signal sensing, pico-liter droplet manipulation, and microarray reaction control.

Innovating With TFT Technology in Both Optoelectronic and Biological Ways

More Details

1:00PM

LinkZill innovatively applies TFT semiconductor technology to various fields of optoelectronics and life sciences such as large-area bio-sensing, novel display, high-throughput DNA synthesis, and in-vitro diagnostics (IVD), based on our core TFT chip capabilities of in-situ signal sensing, pico-liter droplet manipulation, and microarray reaction control.

Watch Demo Video
SmartKem
joint-presentations.png

SmartKem

Organic Thin-Film Transistor Technology – from Lab to Fab

1:15PM

joint

Read More

Simon Ogier

Simon Ogier

CTO

OTFT technology is finding a good fit initially in applications requiring low temperature processing and is suitable for situations where low non-recurring investment (NRE) or capital infrastructure is required. Smartkem OTFT materials are processed with a low thermal budget and produce transistors with current driving capabilities suitable for a range of emissive displays such as AMOLED and micro-LED. This presentation will highlight application demonstrators and show the partnerships that are enabling scale up of the fabrication towards commercial scale production.

Organic Thin-Film Transistor Technology – from Lab to Fab

More Details

1:15PM

OTFT technology is finding a good fit initially in applications requiring low temperature processing and is suitable for situations where low non-recurring investment (NRE) or capital infrastructure is required. Smartkem OTFT materials are processed with a low thermal budget and produce transistors with current driving capabilities suitable for a range of emissive displays such as AMOLED and micro-LED. This presentation will highlight application demonstrators and show the partnerships that are enabling scale up of the fabrication towards commercial scale production.

Watch Demo Video
DoMicro
joint-presentations.png

DoMicro

Insights in Electronic Design and Integration For FHE-Application

1:30PM

joint

Read More

Marcel Grooten

Marcel Grooten

Managing Director

Insights in Electronic Design and Integration For FHE-Application

More Details

1:30PM

Watch Demo Video
Fraunhofer IAP
joint-presentations.png

Fraunhofer IAP

Solid Polymer Electrolytes for Rechargeable Battery Systems

1:45PM

joint

Read More

Benjamin Heyne

Benjamin Heyne

Solid Polymer Electrolytes for Rechargeable Battery Systems

More Details

1:45PM

Watch Demo Video
Networking Break
joint-presentations.png

Networking Break

Networking Break

2.00PM

joint

Read More

Short Demo

Networking Break

More Details

2.00PM

Watch Demo Video
VTT
joint-presentations.png

VTT

Wearable Photonic Sensors in Flexible and Stretchable Form Factor

2:50PM

joint

Read More

Jussi Hiltunen

Jussi Hiltunen

Research Professor

Medical device industry is a rapidly growing opportunity area for photonics technologies, with applications ranging from diagnostics to surgical tools and therapeutics. Real-time monitoring of vital parameters with unobtrusive wearable devices can minimize the time of patients in hospital and ultimately the technologies can enable a paradigm change from treatment-based healthcare towards preventive and participatory medicine. For example, optical monitoring of hearth rate, blood pressure, physical activity and other parameters can minimize risk for post-treatment complications and subsequent treatment costs and enhance the quality of life. Besides healthcare, in wellness applications wearable devices help citizens to better track, for example, the stress levels and thus optimize the amount and level of exercises. A key issue in the production of wearable devices with the maximized user comfortability, is the manufacturing process capable for assembling and integrating devices in flexible and stretchable form factors. At high volumes this can be made using multiple roll-to-roll fabrication processes covering printing of electrical wiring and stop&go component assembly. As an outcome the wearable photonic monitoring devices can be highly sophisticated acquiring multimodal data or low-cost plaster-type devices intended for a short term usage.

Wearable Photonic Sensors in Flexible and Stretchable Form Factor

More Details

2:50PM

Medical device industry is a rapidly growing opportunity area for photonics technologies, with applications ranging from diagnostics to surgical tools and therapeutics. Real-time monitoring of vital parameters with unobtrusive wearable devices can minimize the time of patients in hospital and ultimately the technologies can enable a paradigm change from treatment-based healthcare towards preventive and participatory medicine. For example, optical monitoring of hearth rate, blood pressure, physical activity and other parameters can minimize risk for post-treatment complications and subsequent treatment costs and enhance the quality of life. Besides healthcare, in wellness applications wearable devices help citizens to better track, for example, the stress levels and thus optimize the amount and level of exercises. A key issue in the production of wearable devices with the maximized user comfortability, is the manufacturing process capable for assembling and integrating devices in flexible and stretchable form factors. At high volumes this can be made using multiple roll-to-roll fabrication processes covering printing of electrical wiring and stop&go component assembly. As an outcome the wearable photonic monitoring devices can be highly sophisticated acquiring multimodal data or low-cost plaster-type devices intended for a short term usage.

Watch Demo Video
Linxens
joint-presentations.png

Linxens

Scalable, Customizable, Multimodal Electrode Platform for Biosensors and Sensors

3:05PM

joint

Read More

Christelle Robellin

Christelle Robellin

Healthcare Marketing Director

For over 15 years Linxens has manufactured hundreds of millions of PCB electrode arrays for Point-of-Care Diagnostics. This could be achieved thanks to a cutting-edge and robust reel-to-reel manufacturing process. Recent developments in electrode design, surface coating/functionalization, microfluidics and connectivity open up new fields of application in continuous monitoring of glucose, wound healing, water quality and sport performance etc.

Scalable, Customizable, Multimodal Electrode Platform for Biosensors and Sensors

More Details

3:05PM

For over 15 years Linxens has manufactured hundreds of millions of PCB electrode arrays for Point-of-Care Diagnostics. This could be achieved thanks to a cutting-edge and robust reel-to-reel manufacturing process. Recent developments in electrode design, surface coating/functionalization, microfluidics and connectivity open up new fields of application in continuous monitoring of glucose, wound healing, water quality and sport performance etc.

Watch Demo Video
TNO at Holst Center
joint-presentations.png

TNO at Holst Center

Advancing Medical Technology: Printed Electronics and Hybrid Integration Pave the Way for
Next-Generation Medical Devices

3:20PM

joint

Read More

Natallia E. Uzunbajakava

Natallia E. Uzunbajakava

Chronic diseases became a silent epidemic and are responsible for about 70% of deaths worldwide. Efforts are imperative to shift this distressing trend and make strides towards better health outcomes. Wearable technology holds vast untapped potential across healthcare continuum – from hospital to home.Printed electronics and hybrid integration offers a versatile technological toolbox to create next generation medical devices. Realizing this, however, necessitates navigating several substantial challenges – from further developing printed electronics & hybrid integration modalities to addressing the right user needs. With collaborative efforts among a diverse ecosystem of companies, institutes, and healthcare organizations, each bringing their unique areas of expertise, we are optimistic about overcoming these challenges.

Advancing Medical Technology: Printed Electronics and Hybrid Integration Pave the Way for
Next-Generation Medical Devices

More Details

3:20PM

Chronic diseases became a silent epidemic and are responsible for about 70% of deaths worldwide. Efforts are imperative to shift this distressing trend and make strides towards better health outcomes. Wearable technology holds vast untapped potential across healthcare continuum – from hospital to home.Printed electronics and hybrid integration offers a versatile technological toolbox to create next generation medical devices. Realizing this, however, necessitates navigating several substantial challenges – from further developing printed electronics & hybrid integration modalities to addressing the right user needs. With collaborative efforts among a diverse ecosystem of companies, institutes, and healthcare organizations, each bringing their unique areas of expertise, we are optimistic about overcoming these challenges.

Watch Demo Video
3E Smart Solutions
joint-presentations.png

3E Smart Solutions

Driving Reliability and Scalability in E-Textiles and Wearables via Embroidery Technology

3:35PM

joint

Read More

Steliyan Vasilev

Steliyan Vasilev

Co-Founder & Development Engineer

Embroidery technology, once rooted in historic hand-stitched garment design, has experienced a remarkable resurgence with the advent of computerization. Due to its unparalleled capacity for material optimization, embroidery offers textile engineers the ability to precisely place single fibers,yarns, fiber bundles, or even wires in a pre-designed geometry. This precision makes embroidery an ideal candidate for integrating functionality into textiles through sensors, actuators, or electrodes. By enabling the automatic integration of conductive fibers and electronic components into textiles,embroidery technology facilitates the creation of e-textiles. This capability opens the door to a myriad of applications, ranging from ECG and EMS electrodes to capacitive, strain and pressure sensors, and even illumination systems and heating elements.Despite the longstanding development of e-textiles, the realization of market-ready products has been limited by high production costs and poor reproducibility resulting from manual production processes. The high degree of automations of embroidery technology, combined with the scalability enabled by multi-head machines, has revolutionized e-textile production. This automation not only reduces costs but also ensures consistent quality, paving the way for the widespread adoption of e-textiles in various industries.

Driving Reliability and Scalability in E-Textiles and Wearables via Embroidery Technology

More Details

3:35PM

Embroidery technology, once rooted in historic hand-stitched garment design, has experienced a remarkable resurgence with the advent of computerization. Due to its unparalleled capacity for material optimization, embroidery offers textile engineers the ability to precisely place single fibers,yarns, fiber bundles, or even wires in a pre-designed geometry. This precision makes embroidery an ideal candidate for integrating functionality into textiles through sensors, actuators, or electrodes. By enabling the automatic integration of conductive fibers and electronic components into textiles,embroidery technology facilitates the creation of e-textiles. This capability opens the door to a myriad of applications, ranging from ECG and EMS electrodes to capacitive, strain and pressure sensors, and even illumination systems and heating elements.Despite the longstanding development of e-textiles, the realization of market-ready products has been limited by high production costs and poor reproducibility resulting from manual production processes. The high degree of automations of embroidery technology, combined with the scalability enabled by multi-head machines, has revolutionized e-textile production. This automation not only reduces costs but also ensures consistent quality, paving the way for the widespread adoption of e-textiles in various industries.

Watch Demo Video
Networking Break
joint-presentations.png

Networking Break

Networking Break

4:05 PM

joint

Read More

Short Demo

Networking Break

More Details

4:05 PM

Watch Demo Video
Copprint
joint-presentations.png

Copprint

Conductive Copper Inks Enabling Sustainable PCBs and Printed Electronics

4:55PM

joint

Read More

Ofer Shochet

Ofer Shochet

CEO and Founder

Conductive Copper Inks Enabling Sustainable PCBs and Printed Electronics

More Details

4:55PM

Watch Demo Video
Kimoto
joint-presentations.png

Kimoto

Adhesive Carrier and Protection Films for Advanced Manufacturing

5:10PM

joint

Read More

Menno Bos

Menno Bos

General Manager

Adhesives films play an important role during manufacturing processes, enabling scale-up and defect free production of printed electronics and display systems.
We will take a close look at available adhesive options and their suggested applications.

Adhesive Carrier and Protection Films for Advanced Manufacturing

More Details

5:10PM

Adhesives films play an important role during manufacturing processes, enabling scale-up and defect free production of printed electronics and display systems.
We will take a close look at available adhesive options and their suggested applications.

Watch Demo Video
Sun Chemical
joint-presentations.png

Sun Chemical

Inkjet Printing in Electronics Manufacturing

5:25PM

joint

Read More

Erika Rebrosova

Erika Rebrosova

Global Technology Manager – Electronic Materials

The presentation will discuss current state of materials and inkjet printing in electronics manufacturing.

Inkjet Printing in Electronics Manufacturing

More Details

5:25PM

The presentation will discuss current state of materials and inkjet printing in electronics manufacturing.

Watch Demo Video
CondAlign
joint-presentations.png

CondAlign

Enabling Room Temperature Electronics Bonding In FHE Applications, Addressing Sustainability and Cost

5:40PM

joint

Read More

Salvatore Micali

Salvatore Micali

Introduction
CondAlign is an innovative technology company that has patented and developed a new range of adhesive anisotropic conductive films (ACFs), to enable efficient components bonding for the flexible and hybrid electronics (FHE) industry. This new ACF named E-Align, provides excellent electrical and mechanical bonding performances, in particular to bond electronic components to flexible and rigid substrates.This ACF comes in the form of a double-sided tape, and it doesn’t require any post curing process. Its application process is also very simple, considering that doesn’t require any high pressure (typical bonding pressure is ca 0,1 – 0,3 MPa) or heat (it can be bonded at room temperature).Through these unique characteristics, the E-Align ACF has the ambition of simplifying the entire electronic production and assembly process, increasing efficiency and reducing costs.Presentation content In this presentation, CondAlign will start with an introduction of the technology principles behind the products development, will then provide an overview of the characteristics of the different ACF products already available in the market and the others under qualification, and will finally conclude with different examples of successful end user applications, where the E-Align ACF products enable sustainable and cost-efficient electronic bonding of different products for distinct industries. Examples of applications are the following: bonding printed batteries to printed IOT platforms for logistic and inventory tracking solutions, bonding flexible displays to flex-tails, bonding skin patches to wearable electronic medical devices, etc.

Enabling Room Temperature Electronics Bonding In FHE Applications, Addressing Sustainability and Cost

More Details

5:40PM

Introduction
CondAlign is an innovative technology company that has patented and developed a new range of adhesive anisotropic conductive films (ACFs), to enable efficient components bonding for the flexible and hybrid electronics (FHE) industry. This new ACF named E-Align, provides excellent electrical and mechanical bonding performances, in particular to bond electronic components to flexible and rigid substrates.This ACF comes in the form of a double-sided tape, and it doesn’t require any post curing process. Its application process is also very simple, considering that doesn’t require any high pressure (typical bonding pressure is ca 0,1 – 0,3 MPa) or heat (it can be bonded at room temperature).Through these unique characteristics, the E-Align ACF has the ambition of simplifying the entire electronic production and assembly process, increasing efficiency and reducing costs.Presentation content In this presentation, CondAlign will start with an introduction of the technology principles behind the products development, will then provide an overview of the characteristics of the different ACF products already available in the market and the others under qualification, and will finally conclude with different examples of successful end user applications, where the E-Align ACF products enable sustainable and cost-efficient electronic bonding of different products for distinct industries. Examples of applications are the following: bonding printed batteries to printed IOT platforms for logistic and inventory tracking solutions, bonding flexible displays to flex-tails, bonding skin patches to wearable electronic medical devices, etc.

Watch Demo Video
Nagase ChemteX
joint-presentations.png

Nagase ChemteX

Conductive Ink Wash Testing

5:55 PM

joint

Read More

Alan Brown

Alan Brown

Business Development Manager

There are many challenges that Conductive Inks face when used in wearable applications. Of those challenges, washability is possibly the most challenging. In this presentation Alan Brown from Nagase ChemteX America Corporation (NCU) will discuss those challenges and recent developments in washability testing using conductive inks.

Conductive Ink Wash Testing

More Details

5:55 PM

There are many challenges that Conductive Inks face when used in wearable applications. Of those challenges, washability is possibly the most challenging. In this presentation Alan Brown from Nagase ChemteX America Corporation (NCU) will discuss those challenges and recent developments in washability testing using conductive inks.

Watch Demo Video
Networking Break
joint-presentations.png

Networking Break

Networking Break

6:10 PM

joint

Read More

Short Demo

Networking Break

More Details

6:10 PM

Watch Demo Video
BotFactory
joint-presentations.png

BotFactory

Exploring AM-PCBs for Low-Volume Manufacturing

7:00PM

joint

Read More

Carlos Ospina

Carlos Ospina

Chief Executive Officer

Exploring AM-PCBs for Low-Volume Manufacturing

More Details

7:00PM

Watch Demo Video
Suss MicroTec
joint-presentations.png

Suss MicroTec

Inkjet Printing for Semiconductor Manufacturing

7:15PM

joint

Read More

David Volk

David Volk

Product Manager Coating Systems

Inkjet Printing for Semiconductor Manufacturing

More Details

7:15PM

Watch Demo Video
NanoPrintek
joint-presentations.png

NanoPrintek

Dry Multimaterial Printing: Printed Electronics WITHOUT Inks or Drying

7:30PM

joint

Read More

Masoud Mahjouri-Samani

Masoud Mahjouri-Samani

Founder and President

Dry Multimaterial Printing: Printed Electronics WITHOUT Inks or Drying

More Details

7:30PM

Watch Demo Video
Nano Ops Inc
joint-presentations.png

Nano Ops Inc

High-Throughput Micro & Nanoscale Printing of Electronics and Advanced Packaging

7:45PM

joint

Read More

Ahmed Busnaina

Ahmed Busnaina

Founder and CTO

High-Throughput Micro & Nanoscale Printing of Electronics and Advanced Packaging

More Details

7:45PM

Watch Demo Video
Track 1
Track 2
INO-Žiri
joint-presentations.png

INO-Žiri

Demonstration of Flexible and Printed Electronics Production Using INO PE Line A7

1:00PM

joint

Read More

Nives Vehar

Nives Vehar

INO Sales US

Join us for a demonstration showcasing the production process of flexible and printed electronics utilizing the innovative capabilities of INO PE Line A7.Through screen printing in three colors, we will illustrate the smooth production of flexible electronic components with zero scrap, highlighting the efficiency and precision of this advanced production technology.Following the demonstration, attendees will have the opportunity to engage in a Q&A session to delve deeper into the intricacies of this innovative process. Don't miss this opportunity to witness the future of electronics manufacturing in action.

Demonstration of Flexible and Printed Electronics Production Using INO PE Line A7

More Details

1:00PM

Join us for a demonstration showcasing the production process of flexible and printed electronics utilizing the innovative capabilities of INO PE Line A7.Through screen printing in three colors, we will illustrate the smooth production of flexible electronic components with zero scrap, highlighting the efficiency and precision of this advanced production technology.Following the demonstration, attendees will have the opportunity to engage in a Q&A session to delve deeper into the intricacies of this innovative process. Don't miss this opportunity to witness the future of electronics manufacturing in action.

Watch Demo Video
SPGPrints
joint-presentations.png

SPGPrints

Bridging the Divide: Transitioning from Lab-scale to Industrial-scale Equipment in Printed Electronics Development

1:15PM

joint

Read More

Daan de Kubber

Daan de Kubber

Manager Innovation & Development

Bridging the Divide: Transitioning from Lab-scale to Industrial-scale Equipment in Printed Electronics Development

More Details

1:15PM

Watch Demo Video
Niebling GmbH
joint-presentations.png

Niebling GmbH

High Pressure Forming (HPF) for In-Mold Electronics (IME) Processes

1:30PM

joint

Read More

Udo Weustenhagen

Udo Weustenhagen

Director Sales & Marketing

Precise 3D forming of substrates is the key to success when it comes to In-Mold Electronics. Not only the 3D forming need to be carried out precisely to fit perfectly into the injection tool cavity, but the positioning of the conductor tracks, the electronic components already positioned in 2D or even graphics must also be in the right position with repeat accuracy. The high-pressure forming process, which uses high-pressure air of up to 90 bar and significantly lower forming temperatures than traditional thermoforming, delivers all of these benefits. Clever automation modules can be used to automate the process for series production and link it to subsequent processes, such as trimming the film inserts after forming.

High Pressure Forming (HPF) for In-Mold Electronics (IME) Processes

More Details

1:30PM

Precise 3D forming of substrates is the key to success when it comes to In-Mold Electronics. Not only the 3D forming need to be carried out precisely to fit perfectly into the injection tool cavity, but the positioning of the conductor tracks, the electronic components already positioned in 2D or even graphics must also be in the right position with repeat accuracy. The high-pressure forming process, which uses high-pressure air of up to 90 bar and significantly lower forming temperatures than traditional thermoforming, delivers all of these benefits. Clever automation modules can be used to automate the process for series production and link it to subsequent processes, such as trimming the film inserts after forming.

Watch Demo Video
Notion Systems
joint-presentations.png

Notion Systems

Submicron and High Viscosity Patterning With EHD

1:45PM

joint

Read More

Max Mosberg

Max Mosberg

Submicron and High Viscosity Patterning With EHD

More Details

1:45PM

Watch Demo Video
Networking Break
joint-presentations.png

Networking Break

Networking Break

2.00PM

joint

Read More

Short Demo

Networking Break

More Details

2.00PM

Watch Demo Video
Akoneer
joint-presentations.png

Akoneer

Going maskless for chip packaging with SSAIL

2:50PM

joint

Read More

Tadas Kildusis

Tadas Kildusis

CCO

SSAIL technology enables direct writing of Cu on organic and other dielectric materials. This can be applied for RDL, fanouts and other features in heterogenous integration. High adhesion of the Cu layers increases reliability for demanding applications, like automotive or defense. With maskless process, single part batches and fast iterations are available.

Going maskless for chip packaging with SSAIL

More Details

2:50PM

SSAIL technology enables direct writing of Cu on organic and other dielectric materials. This can be applied for RDL, fanouts and other features in heterogenous integration. High adhesion of the Cu layers increases reliability for demanding applications, like automotive or defense. With maskless process, single part batches and fast iterations are available.

Watch Demo Video
Neotech AMT
joint-presentations.png

Neotech AMT

Additive Manufacturing of Sustainable Mechatronic Systems

3:05PM

joint

Read More

Martin Hedges

Martin Hedges

This presentation will review the current status of the Additive Manufacture (AM) of sustainable mechatronic systems. The use of AM processes, offers significant sustainability advantages in the production of electronic and mechatronic systems by way of simplifying the materials mix, improved materials efficiency and heavily compressed process chains, localising manufacture. The fundamental technology combining free-form, 5 axis 3D printing of mechanical and electronic components, Surface Mount Device (SMD) placement and pre- and post-processing techniques, is described. The State-of-the-Art of the manufacturing process chain is demonstrated by way of a proof-of-concept of a lighting product

Additive Manufacturing of Sustainable Mechatronic Systems

More Details

3:05PM

This presentation will review the current status of the Additive Manufacture (AM) of sustainable mechatronic systems. The use of AM processes, offers significant sustainability advantages in the production of electronic and mechatronic systems by way of simplifying the materials mix, improved materials efficiency and heavily compressed process chains, localising manufacture. The fundamental technology combining free-form, 5 axis 3D printing of mechanical and electronic components, Surface Mount Device (SMD) placement and pre- and post-processing techniques, is described. The State-of-the-Art of the manufacturing process chain is demonstrated by way of a proof-of-concept of a lighting product

Watch Demo Video
Quantica
joint-presentations.png

Quantica

Why 3D printing has failed the electronics industry: A look into the failures & future of 3D inkjet for electronics applications

3:20PM

joint

Read More

Ben Hartkopp

Ben Hartkopp

Founder, IP & Technology Manager

In this talk, Ben Hartkopp, one of the founders at Quantica, will address the fundamental issues at the root of the limited impact that 3D printing has caused in the electronics industry and reveals how upcoming changes in new 3D printing technologies technology are poised to address the industry's critical shortcomings. Despite the significant advancements in technology, the world of printed electronics still faces fundamental challenges and is missing key technological advancements that are essential for its progress. Hartkopp will provide an in-depth analysis of the current printed electronics landscape, highlighting the persistent gaps and limitations that hinder its full potential. Within this context, you will gain a deep understanding of the unique demands of electronics manufacturing and how traditional 3D printing methods have fallen short. These limitations have not only hindered innovation but also contributed to inefficiencies, waste, and economic challenges within the industry. Throughout the talk, you will discover how Quantica's groundbreaking additive manufacturing technology, NovoJet, aims to fill these critical gaps and revolutionize the industry. By focusing on PCB manufacturing as a starting point, Quantica's innovative drop on demand material jetting solution promises to reshape the electronics industry. By enabling the use of novel high viscosity and high particle loaded materials from leading industry partners for the design and generation of substrate and conductive geometries, Quantica's NovoJet represents a transformative leap forward. Learn how NovoJet addresses these technological shortcomings, setting the stage for a digital deposition revolution that promises positive societal, economic, environmental, and climate impacts without the negative consequences that have plagued the industry.

Why 3D printing has failed the electronics industry: A look into the failures & future of 3D inkjet for electronics applications

More Details

3:20PM

In this talk, Ben Hartkopp, one of the founders at Quantica, will address the fundamental issues at the root of the limited impact that 3D printing has caused in the electronics industry and reveals how upcoming changes in new 3D printing technologies technology are poised to address the industry's critical shortcomings. Despite the significant advancements in technology, the world of printed electronics still faces fundamental challenges and is missing key technological advancements that are essential for its progress. Hartkopp will provide an in-depth analysis of the current printed electronics landscape, highlighting the persistent gaps and limitations that hinder its full potential. Within this context, you will gain a deep understanding of the unique demands of electronics manufacturing and how traditional 3D printing methods have fallen short. These limitations have not only hindered innovation but also contributed to inefficiencies, waste, and economic challenges within the industry. Throughout the talk, you will discover how Quantica's groundbreaking additive manufacturing technology, NovoJet, aims to fill these critical gaps and revolutionize the industry. By focusing on PCB manufacturing as a starting point, Quantica's innovative drop on demand material jetting solution promises to reshape the electronics industry. By enabling the use of novel high viscosity and high particle loaded materials from leading industry partners for the design and generation of substrate and conductive geometries, Quantica's NovoJet represents a transformative leap forward. Learn how NovoJet addresses these technological shortcomings, setting the stage for a digital deposition revolution that promises positive societal, economic, environmental, and climate impacts without the negative consequences that have plagued the industry.

Watch Demo Video
Hummink
joint-presentations.png

Hummink

Pushing The Boundaries of Microbump Fabrication: The HPCaP Approach

3:35PM

joint

Read More

Sahar Al Kamand

Sahar Al Kamand

Sales Engineer

High aspect ratio microbumps are vital in packaging applications, yet typical methods lack the control needed for dimension. HPCAP (High Precision Capillary Printing) Technology addresses this, offering high control over microbump fabrication & exceptional versatility in dimensions & materials. Based on Atomic Force Microscopy (AFM) , HPCAP simplifies complex microbump manufacturing into a single-step procedure. During this presentation, we will delve into the workings of HPCAP technology. Our aim is to provide a detailed exploration of how this groundbreaking technology facilitates the creation of microbumps. Furthermore, the presentation will underscore the vital role that HPCAP technology plays in both packaging and semiconductor repair applications.

Pushing The Boundaries of Microbump Fabrication: The HPCaP Approach

More Details

3:35PM

High aspect ratio microbumps are vital in packaging applications, yet typical methods lack the control needed for dimension. HPCAP (High Precision Capillary Printing) Technology addresses this, offering high control over microbump fabrication & exceptional versatility in dimensions & materials. Based on Atomic Force Microscopy (AFM) , HPCAP simplifies complex microbump manufacturing into a single-step procedure. During this presentation, we will delve into the workings of HPCAP technology. Our aim is to provide a detailed exploration of how this groundbreaking technology facilitates the creation of microbumps. Furthermore, the presentation will underscore the vital role that HPCAP technology plays in both packaging and semiconductor repair applications.

Watch Demo Video
ImageXpert
joint-presentations.png

ImageXpert

Print Quality: All That Can go Wrong and How to Identify Them

3:50PM

joint

Read More

Kyle Pucci

Kyle Pucci

Director of Applications Engineering

In this presentation, we’ll dive into print quality for printed electronics and discuss techniques for analyzing it using machine vision. We will identify the most critical aspects of print quality, how to measure them, and what sort of equipment can be used to do this in a robust, repeatable way.

Print Quality: All That Can go Wrong and How to Identify Them

More Details

3:50PM

In this presentation, we’ll dive into print quality for printed electronics and discuss techniques for analyzing it using machine vision. We will identify the most critical aspects of print quality, how to measure them, and what sort of equipment can be used to do this in a robust, repeatable way.

Watch Demo Video
Networking Break
joint-presentations.png

Networking Break

Networking Break

4:05 PM

joint

Read More

Short Demo

Networking Break

More Details

4:05 PM

Watch Demo Video
TracXon
joint-presentations.png

TracXon

Sustainable Mass-production of Hybrid Printed Electronics

5:10PM

joint

Read More

Corne Rentrop

Corne Rentrop

Project Leader

The talk will focus on sustainable advances through implementing printed electronics. Thereto methods are explained to minimise energy consumption and reduce CO2 footprint. Next to that the talk discusses recycling strategies of printed electronics. To complement the talk methods are explained to manufacture complex products and allow a sustainable alternative for PCB

Sustainable Mass-production of Hybrid Printed Electronics

More Details

5:10PM

The talk will focus on sustainable advances through implementing printed electronics. Thereto methods are explained to minimise energy consumption and reduce CO2 footprint. Next to that the talk discusses recycling strategies of printed electronics. To complement the talk methods are explained to manufacture complex products and allow a sustainable alternative for PCB

Watch Demo Video
Danish Technological Institute
joint-presentations.png

Danish Technological Institute

eTextile Sensors and More

5:25PM

joint

Read More