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Digitally print ultrafine micropads and bumps for microLEDs?

As microLED’s inevitably shrink in size, the question of how to bond and contact them to the substrate becomes ever more important. This need will drive innovation both in terms of material development and deposition technology.

An interesting additive approach is based on electrohydrodynamic printing (EHD), which can digitally print inks with few-micron resolution and over a spectrum of viscosities (can handle far more viscous than inkjet can). The image below by Enjet presented at a previous TechBlick conference, shows how conductive bond pads and adhesives in the scale of 15-20um were digitally (EDH) printed. Currently, the EHD is generally somewhat slow, but the recent development of multi-head printers may change this. This is an important technology area to watch.

To learn more join TechBlick’s specialist microLED event. Check out the confirmed speaker list here. It is truly a world-class agenda . See full agenda here


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