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Innovative in-mold and hybrid electronics with direct PCB-on-film integration:

a cost-effective way to create smart plastics solutions

Speaker: Pierre Ball | Company: BeLink Solutions | Date: 12-13 October 2022 | Full Presentation

This presentation will highlight the key principles of innovation in printed electronics by BeLink Solutions along 3 axes:




Replacing incumbent technologies is usually challenging, but hybrid electronics technologies are opening up new solution and design areas that are driving the migration and expansion of the market from conventional electronics to the printed electronics market.

Here we will not only address sensors and traces based on well-known conductive screen-printing techniques, but more importantly how to integrate any variety of SMT components and packages (BGA, fine pitch) with direct PCB-on-film integration.

In other words, how to bridge the gap between both technologies (conventional and printed electronics) to foster new designs in 2D and 3D electronics?

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