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Printed Interconnects & RF Devices for High Frequency Applications

Speaker: Bryan Germann | Company: Optomec | Date: 10-11 March 2021 | Full Presentation

Microwave & RF devices generally are not small, cheap or lightweight. Printed electronics has an opportunity to change this stigma, enabling the creation of smaller, lower mass, cheaper and in some cases higher performance devices than current manufacturing methodologies. Enabling unique & even mainstream applications in field of defense, automotive and even consumer grade electronic devices to advance. Optomec’s Bryan Germann will share details of device geometries, characterized performance as well as materials information and reliability data in order to showcase the success of using Optomec’s Aerosol Jet printed electronics platform for developing all manner of RF devices and structures for real world applications. Primary applications will include printed 3D RF microwave circuit elements, 3D & 2.5DIC chip interconnect methodologies, even some 3D conformal, multi-layered circuitry over complex surfaces for Optomec customers.

Bryan Germann

Product Manager @ Optomec


Optomec’s Aerosol Jet technology has a unique solution to enable panel front to backside connections without glass vias or vacuum processes. Aerosol Jet’s ability to print at high resolution, down to 10 μm, and at a high aspect ratio, as high as 5mm from the substrate regardless of topology, make it the ideal solution for both manufacturing and repair of metallization on glass edges. Demonstration of high speed, high density printing of connections from the front side of a panel to the backside will be shown along with repair of existing metallization created by other methods.

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