Maria Russew | micro resist technology GmbH: Why are traditional polymers failing the optical demands of micro-optics, and how does sol-gel hybridization solve it?
04:48 - 06:31
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Summary of the clip:
How can manufacturers bridge the gap between high-volume screen printing and precise, non-planar direct-write additive dispensing?
Hybrid manufacturing workflows are redefining printed electronics by combining the throughput of conventional flatbed or rotary screen printing with the precision of specialized direct-write systems. Integrating these non-standard ink application methods allows developers to leverage the strengths of both worlds, using screen printing for bulk features and direct-write dispensing to add high-resolution or customized traces. This multi-technology approach provides the process flexibility required to support diverse and complex product lines on a single manufacturing floor.
The integration of advanced materials, such as specialized composite substrates, requires highly compatible material-ink systems to ensure optimal adhesion and electrical performance. When printing complex geometries like Archimedes spirals onto advanced composite substrates, the chemical and physical compatibility of the functional ink is paramount. Utilizing custom-formulated conductive inks engineered specifically for the target composite substrate ensures reliable deposition and long-term interface stability under mechanical stress.
Depositing functional materials onto non-planar or variable-height surfaces demands advanced motion control capable of real-time height adjustment. Incorporating a dynamic Z-axis within the gantry and dispensing head assembly allows the system to track the surface topography of the substrate dynamically during the printing cycle. This capability ensures a constant standoff distance, maintaining consistent line width and wet thickness even when writing directly onto complex, three-dimensional components.
In this short video, you can learn:
* How to integrate direct-write dispensing with conventional flat and rotary screen printing for hybrid manufacturing.
* The importance of matching custom conductive inks to specialized composite substrates for optimized deposition.
* How a dynamic Z-axis gantry system enables precise direct-write printing on variable-height surfaces.
š **Clip Abstract** This video clip demonstrates the integration of MicroPen direct-write dispensing technology with conventional screen printing to print on specialized composite substrates. The speaker highlights a dynamic Z-axis gantry system depositing an Archimedes spiral using a custom creative materials ink onto a WavePro composite substrate.
š¤ Speaker: Maria Russew
š¢ Company: micro resist technology GmbH
š
Event: Printed Electronics Innovation Day 2024
š Location: TechBlick | Online Platform
š Learn more at the next TechBlick event: https://www.techblick.com
#SolGelSynthesis, #HybridPolymers, #MicroOptics, #OrmoClear, #ARWaveguides, #MicroLEDDisplays
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06:34 - 08:32
How can liquid-phase hybrid resins achieve sub-micron 3D optical structures without sticking to lithography masks?
Can advanced PTFE-based nanocomposites finally displace alumina as the industry-standard dielectric for complex, non-conforming high-frequency substrates?
While alumina has long been a staple dielectric in RF and microwave engineering, its high machining costs and mechanical rigidity present severe bottlenecks when designing non-conforming or three-dimensional substrates. Transitioning to a processable, PTFE-based nanocomposite dielectric bypasses these mechanical limitations entirely. This material class leverages the inherent flexibility of polytetrafluoroethylene, allowing manufacturers to easily form complex, conformal, and flat 3D shapes that would be cost-prohibitive or impossible to machine in traditional ceramics.
By precisely engineering the nanocomposite formulation within the PTFE matrix, developers can tailor the dielectric constant to meet specific high-frequency application requirements. This material technology is highly versatile, supporting diverse configurations from custom laminates to copper-clad laminates for build-to-print electronics. The resulting substrate portfolio offers a scalable alternative for integrating high-performance dielectrics directly into complex structural geometries.
These engineered nanocomposites exhibit exceptional electrical and thermal stability across wide temperature and frequency ranges, making them ideal for demanding aerospace, defense, and communication systems. Furthermore, their low outgassing properties qualify them for space-rated applications, such as advanced antennas, lenses, and discrete RF components. This combination of mechanical conformability and environmental resilience positions the technology as a key enabler for next-generation aerospace hardware.
In this short video, you can learn:
* How PTFE-based nanocomposites overcome the high machining costs and structural limitations of alumina dielectrics.
* The role of nanocomposite formulation in tailoring the dielectric constant across various substrate thicknesses.
* The key application spaces for these space-approved, low-outgassing materials in aerospace, defense, and antenna technologies.
š **Clip Abstract** The speaker introduces a PTFE-based nanocomposite dielectric material designed to replace alumina, highlighting its lower machining costs and its ability to be formed into conformal, flat, and 3D shapes. She outlines its key specifications, including stable dielectric constants across different thicknesses, and discusses its target markets in aerospace, defense, and communications due to its temperature stability and low outgassing properties.
š¤ Speaker: Maria Russew
š¢ Company: micro resist technology GmbH
š
Event: Printed Electronics Innovation Day 2024
š Location: TechBlick | Online Platform
š Learn more at the next TechBlick event: https://www.techblick.com
#TwoPhotonPolymerization, #HybridPolymers, #ProximityLithography, #DiffractiveOpticalElements, #MicroLEDDisplays, #ARLightEngines
10:34 - 13:32
Can an acrylic-based micro-optical polymer survive 270Ā°C solder reflow processes and 1,000 hours of damp heat testing without yellowing or cracking?
How can direct-write additive dispensing and advanced PTFE nanocomposites replace machined alumina in high-reliability RF and aerospace applications?
Integrating direct-write printing with advanced dielectric substrates offers a compelling alternative to costly subtractive manufacturing. While alumina is a standard for high-performance electronics, its high machining costs and rigid physical limitations present design barriers. By leveraging versatile, non-contact printing alongside a novel nanocomposite-filled PTFE material, manufacturers can produce conformal, lightweight, and stable electronic structures on three-dimensional and irregular surfaces.
A key enabler is a direct-write platform capable of true non-contact printing across irregular, soft, and fragile 3D substrates. Unlike conventional dispensing systems constrained by narrow viscosity limits, this technology handles materials from water-like fluids to high-viscosity pastes. By linearizing ink upstream of the pen tip and controlling flow through varying orifice sizes, the system achieves precise line widths down to 50 microns with a two-to-one aspect ratio, overcoming geometric barriers on complex form factors.
Complementing this is WavePro, a specialized dielectric composite designed to replace alumina. Formulated with a PTFE base and a nanocomposite filler, this material offers a tailorable dielectric constant and is available in various thicknesses, laminates, and copper-clad configurations. It provides exceptional thermal and frequency stability from -50 Ā°C to 150 Ā°C, is space-approved with low outgassing, and can be thermally cured while remaining stable up to 500 Ā°C. This material synergy opens new possibilities for lightweight, high-reliability components in communications, antennas, and aerospace systems.
In this talk, you can learn:
* The capabilities of a direct-write, non-contact printing platform that handles a wide viscosity range on irregular 3D substrates.
* How WavePro nanocomposite-filled PTFE serves as a lightweight, conformable, and thermally stable alternative to machined alumina.
* Key application areas for these combined technologies, including aerospace, defense, antennas, and medical devices.
š **Talk Abstract** In this talk, the speaker presents a versatile direct-write printing technology capable of depositing conductive and dielectric materials onto highly irregular 3D surfaces. The presentation details a collaborative effort to pair this additive dispensing system with WavePro, a novel PTFE-based nanocomposite dielectric designed to replace alumina in demanding RF, communication, and aerospace applications.
š¤ Speaker: Maria Russew
š¢ Company: micro resist technology GmbH
š
Event: Printed Electronics Innovation Day 2024
š Location: TechBlick | Online Platform
š Learn more at the next TechBlick event: https://www.techblick.com
#OrmoEndure, #SolderReflowStable, #MicroOptics, #LowShrinkagePolymers, #WaferLevelOptics, #OptoelectronicPackaging