Flexible Hybrid Electronics: R2R Production and Applications

Flexible Hybrid Electronics (FHE) seeks to combine the benefits of printed electronics and rigid electronics. The dream is to have high-speed R2R production of flexible circuits boards on PET. The flexible IC can be transferred using novel techniques to overcome the limitations of standard pick-up. Ultrathin ICs or novel natively thin ICs will be used, offering high capability, beyond what printed TFTs can achieve. The IC or die attach will be done using low-cost low-temperature adhesives or solder. Metallization will take place using printing, perhaps with rapid low-sinter low-cost copper pastes.

Crucially, there will be standard design libraries and simulators, enabling engineers to design circuits. At the same time, there will be foundry-like establishment around the world, enabling prototyping as well as volume production. We are still at the start of this transition towards a standard platform, but we will get there. Once there, it will have totally changed the flexible PCB industry towards low-cost R2R and ubiquitous.

This session will focus on examples of key companies developing applications using FHE or furthering the development of R2R processing for FHE.