Connecting flexible circuits to traditional printed circuit boards (PCBs) is commonly called flexible-to-rigid interconnections. They enable flexible sensors, displays, wearables, and other flexible electronics to communicate with microcontrollers, power management systems, and external devices. MATERIALS USED NovaCentrix HPS-U11 silver nanoparticle ink ACI FS0142 flexible silver ink ACI SS1109 stretchable silver ink ACI SC1502 stretchable carbon ink ACI FC3203 flexible carbon ink VFP ECV003 UV-curable dielectric ink T4 Solder paste SUBSTRATES USED Polyethylene terephthalate (PET) Thermoplastic polyurethane (TPU) Polyimide (Kapton) 3" × 4" FR1 board TOOLS AND ACCESSORIES V-One PCB printer NOVA materials dispensing system Würth Elektronik 687140149022 FFC connector TE Connectivity AMP Connectors 487923-1 contact crimp pin connector Amphenol ICC (FCI) 66226-004LF 4 position FFC connector header CW Industries CWR-142-10-0203 IDC connector 3M electrically conductive adhesive transfer tape 9703 TLKKUE B0B1B33TZJ 10 mm snap connectors Guangshunle B0CXLL458K 15 mm snap connectors Arduino Micro controller We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend Project overview Purpose The goal of this project was to validate five different ways of making reliable, accessible interconnections between flexible and rigid circuits — a common use case for a lot of our customers and essentia...

Author: Kyle Pucci, kyle@imagexpert.com , ImageXpert The ImageXpert Perspective Inkjet printing has been around for decades, but in the world of printed electronics it is still an emerging technology — one that is opening doors to applications that traditional coating and deposition methods cannot reach. At ImageXpert, we have had a front row seat to this evolution. For more than 30 years, we’ve helped engineers and researchers understand, test, and optimize inkjet systems. Our equipment is found in hundreds of labs worldwide, giving us the chance to see firsthand what works, what doesn’t, and what separates a laboratory experiment from a production-ready process. Unlike print shops or graphic arts applications where speed and cost are the primary drivers, printed electronics demand precision and adaptability. The fluids are often unconventional: nanoparticle dispersions, high-viscosity coatings, or conductive inks. The layers can be extremely thin, sometimes just a few hundred nanometers, or conversely quite thick, exceeding one hundred microns. In every case, the choice of printhead determines whether the process succeeds or fails. We are Exhibiting! Visit our booth at the MicroLED Connect & AR/VR Connect in Eindhoven on 24-25 September 2025 Over the years, we’ve worked with companies who are brand new to inkjet, guiding them through early ink trials, waveform optimization, and eventually into pilot production. We’ve also partnered with seasoned electronics manufacturers wh...

Why Should You Join TechBlick's The Future of Electronics RESHAPED? The Future of Electronics RESHAPED conference and exhibition (22 & 23 OCT 2025, Berlin) is set to be the most important event of the year focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics.  This year the program features a world-class agenda with over 100 superb invited talks from around the world, 12 industry- or expert-led masterclasses, 4 tours, and over 90 onsite exhibitors.  In this article, we discuss and highlight various innovative talks at the event around the theme of smart surfaces and sensors. In future articles, we will cover further technologies including smart surfaces, sustainable electronics, printed medical electronics, novel materials and beyond. Explore the  full agenda now and join the global industry in Berlin on 22 & 23 OCT 2025. Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable.  🚨Register before 12 September to save 200 Euros on top of early bird discounts. This is a one-time offer. The coupon can be obtained here🚨 Toyota – Michael Rowe  presents technology opportunities beyond automotive , showcasing cross-industry applications of actuator, sensor, and material innovations. Highlights include shape memory alloy (SMA) wire actuators delivering lightweight, translational motion with integrated feedback; near-IR reflective pigments enabling hidden data transfer fo...

22 & 24 October 2025 | ECC, Berlin | Conference & Exhibition This is the must-attend event of the year , focusing on additive, printed, 3D sustainable, wearable, flexible, hybrid, soft, stretchable, textile, structural and R2R electronics.    This year the event will feature:

✅ 100+ speakers 
✅ 90+ exhibitors showcasing all the key innovations
✅ 12 expert- and industry-led masterclasses 
✅ 3 guided tours
✅ Networking with 600+ global participants 
✅ Annual access to all TechBlick online events, on-demand version of all onsite events, as well as an on-demand library featuring over 1500 talks and  masterclasses.
🚨Register before 12 September to save 200 Euros on top of early bird discounts. This is a one-time offer. The coupon can be obtained here🚨
Explore The Agenda See the most up-to-date conference agenda here 22 October | Conference Day 1 Track 1 09:00 | TechBlick  | Welcome & Introduction 09:10 | Toyota  | Technology Opportunities That Go Beyond Automotive 09:30 | Fuji Corporation  | Additively manufactured multi-layer and stacked circuits with embedded electronics components 09:50 | Lockheed Martin  | Flexible Hybrid Electronics in the Wild: How Copper Printing and Flexible RF Circuits Made it Out of the Lab and Into the Field 10:10 | NanoPrintek  | Inkless Multimaterial Printing Directly from Raw Materials - Breaking the Barriers in Cost, Time, Pollution, and Supply Chain   Networking Break 11:15 | University of Rome Tor Vergata  | Scalable and Ambien...

Author: Tobias Steinel , Steinel@instrumentsystems.com , Instrument Systems GmbH, Munich, Germany Background MicroLED (µLED) displays promise high contrast, fast response, wide color gamut, and long lifetime. However, production faces critical challenges: Massive parallelization of testing:  Millions of tiny µLEDs must be characterized quickly. Metrology limitations:  Narrow emission bandwidth and strong wavelength variability (≈5 nm) demand both speed and spectral accuracy. Hardware requirements : In order to rapidly test and measure millions of µm sized µLEDs high resolution optics and cameras as well as precise detection algorithms are needed to avoid image artefacts due to low oversampling ratios (Rs).  Fig. 1 : Detail of a highly resolved image of a microLED microdisplay, white test pattern Traditional LIV measurements with integrating sphere methods are too slow (hours per wafer). To address this, the authors developed a spectrally enhanced imaging light measurement device (ILMD)  – the LumiTop system  – which combines a high-resolution camera with a traceable spectroradiometer. Fig. 2 : Comparison of LIV and imaging photoluminescence measurement setup Methodology ·        Color Calibration:  Live calibration is performed for every image, using the spectroradiometer to adapt to spectral variations from manufacturing tolerances or drive conditions. [1,2] Experimental Setup: [3] Photoluminescence (wafer test):  µLED 6”wafer with 17M µLEDs; 165 stitched images captured ≈10...

Deividas Andriukaitis (Main Author) [1], Paulius Gečys[2], Tadas Kildušis[3] [1] Ekspla, Vilnius, Lithuania | [2] Center for Physical Sciences and Technology, Vilnius, Lithuania | [3] Akoneer, Vilnius, Lithuania Contact: d.andriukaitis@ekspla.com , Deividas Andriukaitis The consumer electronics field continues to evolve rapidly, driven by tighter tolerances, higher quality, faster processing speeds, and novel functionalities. As manufacturing demands increase, femtosecond lasers have become an essential technology, playing a critical role in enabling these advancements. In this article, we explore how femtosecond lasers are shaping the development of consumer electronics and powering emerging manufacturing technologies. Figure 1. Fan-out circuit on PI. Courtesy of Akoneer Lasers have long contributed to technological progress across various domains - from telecommunications and metrology to automotive, semiconductor, and medical sectors. Among the different laser types, femtosecond lasers stand out due to their extremely short pulse duration (on the order of 10⁻¹⁵ seconds). When tightly focused, they enable highly localized energy delivery in both time and space, vaporizing material with minimal thermal effects - a process known as „cold“ ablation. Figure 2. Schematic of material processing with long and ultrashort pulse lasers. Courtesy of Amada Miyachi America Inc. To learn more about  MicroLED and AR/VR displays please join the show in Eindhoven on 24 and 25 Sept 2025. Lea...

📍 2025年10月22日・24日 | ECC ベルリン | 国際会議 & 展示会 本イベントは、Additive, Printed, 3D, Sustainable, Wearable, Flexible, Hybrid, Soft, Stretchable, Textile, Structural, そして Roll-to-Roll (R2R) エレクトロニクスに焦点を当てた、今年必見のグローバル会議・展示会です。 開催内容 ✅ 世界をリードする 100名以上のスピーカー ✅ 90社以上の出展者による最新技術紹介 ✅ 12 の専門家・業界リードによるマスタークラス ✅ 3つのガイド付き研究所見学ツアー ✅ 600名以上の国際参加者とのネットワーキング ✅ TechBlickオンラインイベント、オンデマンド配信、1,500件以上の講演・マスタークラスライブラリに年間アクセス可能 🚨 2025年9月12日までの登録で早期割引に加え200ユーロ節約できます 。一度限りの特典です 🚨 🔹 10月22日 | カンファレンス 1日目 Track 1 09:00 | TechBlick | 開会 & 挨拶
09:10 | Toyota | 自動車産業を超える技術的機会
09:30 | Fuji Corporation | 多層・積層構造のAdditive製造による回路形成
09:50 | Lockheed Martin | 柔軟なハイブリッドエレクトロニクスの実用事例（銅配線と柔軟RF回路）10:10 | NanoPrintek | 原材料から直接行うインクレス多材料プリンティング Networking Break 11:15 | University of Rome Tor Vergata | 大気中での印刷プロセスによる大面積ペロブスカイトPVモジュール
11:35 | CubicPV | 耐久性のあるタンデム構造とスケーラブル製造法
11:55 | Solaires Entreprises Inc | 研究室から量産へ：ペロブスカイトPVスケールアップの課題と教訓12:15 | Institut Photovoltaïque d'Île-de-France (IPVF) | ペロブスカイトPV量産化の課題と戦略 Lunch & Exhibition Break 14:05 | SATO Global | デジタルツインによるIndustry 4.0の進化とRFIDの将来
14:25 | Wiliot | バッテリーフリーBluetoothとプリンテッドセンサーによるAmbient IoTの拡張
14:45 | Sunray Scientific Inc | 紫外線硬化型異方性導電性エポキシによる低コスト高速実装
15:05 | University of Glasgow | サステナブルな無線バッテリーレス・チップレスセンサー Exhibition & Refreshment Break 16:10 | Essemtec | Jetting & SMT実装技術によるフレキシブル基板向け電子回路
16:30 | VTT | フレキシブル・ハイブリッド多層複合システムの試作とプロセス開発
16:50 | Fraunhofer ENAS | 超薄型パリレン基板による次世代フレキシブルPCB
17:10 | TracXon | PCB代替に向けたプリントエレクトロニクスの量産化拡大 Drinks Recep...

We cover these points by sharing short (1min or so) handpicked snippets from their live recent talks at TechBlick and MicroLED Connect conferences and exhibitions In this newsletter we cover the following MicroLED Wafer Metrology and Calibration Strategies Assessing the Practicality of MicroLED Displays for Mass Production Stamp-Based Imprinting for AR Waveguide Manufacturing Advances in Mass Transfer Processes for MicroLED Chip Integration VR vs. AR: Market Outlook and Growth Limitations Perovskite Quantum Dots for High-Density Color Conversion Challenges and Advances in Native Red MicroLED Efficiency Etching and Deposition Solutions for MicroLED Materials Progress Toward Emissive Quantum Dot–EL Displays Cubic GaN as a Novel Platform for Scalable MicroLEDs Wafer-to-Wafer Integration for MicroLED Microdisplays MicroLED Smart Glasses and Market Update for AR Applications Integrated Production Platforms for Scalable MicroLED Manufacturing Join the MicroLED Connect + AR/VR Connect 2025 on 24 & 25 Sept 2025 at the High Tech Campus in Eindhoven (Netherlands). Explore full agenda here and register before 12 Sept when the FINAL early bird rates expire   https://www.microledconnect.com/ https://www.microledconnect.com Manufacturing Processes & Integration Advances in Mass Transfer Processes for MicroLED Chip Integration Mass transfer remains one of the biggest hurdles for cost-effective microLED displays. At MicroLED-Connect 2024, Toray Engineering presented a new transfer method com...