Full Program Highlight | The Future of Electronics RESHAPED ECC, Berlin, 22 & 23 OCT 2025
- khashayar Ghaffarzadeh
- Oct 2
- 5 min read
TechBlick’s The Future of Electronics RESHAPED conference and exhibition (22 & 23 OCT 2025, Berlin) is just three weeks away! This year’s agenda once again covers the state-of-the-art across the full innovation spectrum of additive, sustainable, printed, hybrid, R2R, 3D and wearable electronics.
In this article, we introduce the conference agenda, summarising the innovations that will be showcased as part of the conference program. The list below does not correspond to actual agenda timings.
Fuji Corporation
Inkjet-printed silver nano-inks on UV-curable substrates for multilayer circuits with embedded components.
GE Aerospace
Additive RF sensors and packaging for aerospace applications rated up to 1000 °C.
Lockheed Martin
Case study on flexible hybrid electronics adoption, incl. copper additive manufacturing and flexible RF circuits.
Valeo
Printed and in-mold electronics integration into vehicles, addressing automotive specs and quality demands.
Akoneer
Laser-processed multilayer glass PCBs for semi-additive semiconductor packaging, demonstrating high-density interconnections on glass substrates.
AMAREA Technology
Multi-material 3D printing of ceramic components with integrated electronics.
CEA-Leti
Additive PCB fabrication replacing subtractive methods to enable sustainable electronics.
NanoPrintek
Inkless nanoparticle-based dry printing without sintering via laser particle generation and in-situ sintering.
DR Utilight
Laser pattern transfer printing enabling 10 μm PV lines or 20 μm solder bumps.
Eastman Kodak
Roll-to-roll flexography for high-resolution, high-volume printed circuits, surpassing screen printing.
ELANTAS Europe
Functional pastes for flexible, durable in-mold automotive electronics.
Enjet
EHD multi-nozzle printing for high-throughput deposition of viscous functional inks.
Fraunhofer EMFT
Roll-to-roll UV digital lithography enabling seamless, high-resolution flexible circuits.
Ceradrop (MGI Digital Technology)
Agile PCB and etching production using digital additive manufacturing.
Coatema
Slot-die coating fundamentals and live demos showing how rheology, tension, and process control define scalable coating windows for R2R production.
Hahn-Schickard
Multi-material additive manufacturing combines molten metal StarJet printing with polymer processes for 3D embedded circuitry and conformal devices.
HighLine Technologies
Scalable microextrusion of metals (<20 µm lines at >500 mm/s) for metallization.
Hummink
Capillary printing enabling nanoscale (100 nm–50 µm) interconnects, bumps, and biosensors.
iGii
3D carbon nanomaterials via scalable R2R processes for point-of-care diagnostics.
Lithoz
Co-printing dielectric ceramics with Cu/Ag for functional multi-material electronic components.
Mesoline
Microchannel particle deposition (MPD) for wafer-scale micron-precision material placement.
Wiliot
Battery-free Bluetooth IoT tags produced roll-to-roll with printed multi-sensors.
Toyota
Cross-industry innovations incl. SMA wire actuators, NIR pigments for hidden data transfer, and metamaterial vibration damping.
XTPL
Ultra-precise dispensing for bonding and defect repair.
Würth Elektronik
PCB sustainability via selective solder masks and recyclable base materials.
X-Fab
Micro-transfer printing of ultra-thin chiplets for heterogeneous integration.
Myrias Optics & UMass Amherst
Wafer-scale metaoptics via nanoimprint lithography and nanoparticle inks.
NRCC Canada
Volumetric additive electronics manufacturing enabling rapid 3D overprinting of conductors.
Prio Optics
Anti-reflective and optical coatings via additive inkjet printing.
Printed Electronics Limited
Viscous-jet deposition for highly loaded functional inks (>5k cP), expanding drop-on-demand printing.
Q5D
5-axis laser-assisted processes enabling 3D metallization.
RISE
Stretchable circuits via screen-printed liquid metal inks.
Perovskia Solar
Digitally printed perovskite PV scaled to 1M units for IoT and consumer devices.
Sonojet
SAW-based aerosol printing enabling clog-free, tunable deposition
GraphEnergyTech
Carbon inks for scalable, low-resistance printed electronics.
Gunter Erfurt
Outlook on EU/US solar manufacturing under Chinese overcapacity; advocates industrial policy and innovation ecosystems.
Hamamatsu
NIR laser sintering for greener, energy-efficient printed electronics.
Hareraus Electronics
Polymer thick-film conductors with improved solderability and thermal stability.
Heliatek
Lightweight flexible PV modules, IEC 61215-certified, produced via R2R multilayer deposition.
Helmholtz-Zentrum Berlin
Scaling solution-processed perovskite PV with standardized metrology and data handling.
Henkel
Silver/copper inks for hybrid integration and 3D functional electronics.
Heraeus Electronics
Printable thick-film heaters using polymer and cermet pastes (incl. PTC) enable reliable, scalable thermal management for automotive and consumer systems.
Holst Centre
Closed-loop recyclability for in-mold electronics via recovery of plastics and metals.
Hoenle Adhesives
Solder-free adhesives enabling durable encapsulation for flexible devices.
ImageXpert
Structured printhead evaluation to optimize inkjet adoption.
INO
Modular screen printing lines enabling smooth R&D-to-production scaling.
Intellivation
Flexible PV via R2R sputtering of barrier and conductor films.
IPVF (Institut Photovoltaïque d’Île-de-France)
Paris-Saclay pilot line supports lab-to-fab perovskite manufacturing with qualification across substrates, encapsulants, and precursors.
Karlsruhe Institute of Technology
Sustainable interconnections using copper busbars and low-Ag metallization pastes.
Nagase ChemteX
Property-driven conductive ink selection optimizes resistivity, rheology, adhesion, curing, and stability for reliable printed electronics.
NextFlex
Commercialization of additive manufacturing of electronics through a 200+ partner ecosystem.
NGK Europe
Ultra-thin semi-solid Li-ion batteries with ceramic electrodes for safe wearables and IoT.
Notion Systems
Advancing EHD printing for high-viscosity deposition beyond inkjet.
OET Energy / Coatema
Flex2Energy Giga Fab integrates R2R printing, assembly, metrology, and AI for industrial-scale OPV/PV.
Panasonic
Self-healing Toughtelon films for slimmer, tougher electronic devices.
SATO Global
RFID-driven digital twins enabling real-time manufacturing intelligence and predictive maintenance.
Signify Research
Printed LEDs on flexible foils for novel lighting form factors and sustainable devices.
Silicon Austria Labs
Life cycle assessment-driven design strategies for sustainable printed electronics.
Sofab Inks
Soluble, cost-efficient formulations for scalable perovskite PV.
Solaires Entreprises
Slot-die and blade-coated perovskite modules for scalable photovoltaics.
SOLRA-PV
Printed encapsulated perovskite solar modules for battery-free IoT and consumer devices.
SparkNano
R2R spatial ALD for SnO₂ ETLs, enabling gigawatt-scale perovskite PV production.
Sunray Scientific
UV-cured anisotropic conductive epoxy for fine-pitch, pressure-less interconnects with underfill.
Swansea University
Transitioning perovskite PV from sheet-to-sheet to R2R slot-die printing tackles uniformity, interconnection, defect mitigation, and stability at scale.
Swift Solar
Scaling perovskite–silicon tandems with wafer-level processes, reliability testing, and high-throughput manufacturing.
TracXon
Patented R2R VIA fabrication enabling high-density double-sided printed circuits.
Trusscore
Electrochromic PVC enabling color-changing wall panels.
TU Dresden
Leaf-based lignocellulose substrates with metallized electrodes for eco-friendly flexible electronics.
University of Coimbra
Liquid metal composites enabling recyclable, repairable electronics.
University of Glasgow
Battery-free, chip-free RF sensors for sustainable monitoring and supply-chain applications.
University of Manchester
Graphene inks for multifunctional printed devices and heaters.
University of Rome Tor Vergata
Fully printed perovskite PV with ambient processing and >1000 h lifetimes.
Voltera
Direct ink write (DIW) prototyping of multilayer flexible circuits accelerates design iteration using screen-print-compatible conductive inks.
3E Smart Solutions / ZSK
Enabling scalable, washable, and multifunctional e-textiles via embroidery technology that integrates PCBs, sensors, and electrodes directly into textiles.
AeroSolar
Enhancing perovskite film uniformity with Aerosol CVD recrystallization. AntolinDynamic automotive interiors using E Ink Prism™ trim surfaces.
Armor Smart Films
Piezoelectric coatings for sensors, haptics, heating, and medical devices.
Auburn University
Thermoformed IME circuits replacing wire harnesses and enabling driver-monitoring sensors.
Blackleaf
Graphene heating inks for efficient, uniform thermal control in flexible foils and coatings.
Caelux
High-density solar architecture maximizing module output, reducing land use and costs while improving resilience under market volatility.
CEA
Low-T printing, interface advances, and long-term encapsulation for scaling Si–perovskite tandems.
CondAlign
Particle alignment for anisotropic films that cut filler use and cost.
Conductive Technologies
Screen printing high-performance sensors via optimized material stack-ups.
CubicPV
Decoupled tandem design for durable perovskite–silicon modules, NREL-certified ~22% top cells and ~30% tandems validated by accelerated aging.
CurveSYS Sensors
Flexible pressure arrays for security sensing, differentiating impacts in real time.
DELO
High-barrier encapsulants extending perovskite PV lifetimes and efficiency.
Fraunhofer IFAM
Screen printing of conductive paths, sensors, and actuators enables high-throughput functional integration into industrial components.
Fraunhofer ILT
Selective laser sintering to optimize conductivity and stability in printed sensors.
Fraunhofer ISE
Sustainable perovskite PV fabrication addressing toxic solvents and critical materials.
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