TECHBLICK PLATFORM: YEAR-ROUND ACCESS TO LIBRARY OF PRESENTATIONS, SLIDES & MASTERCLASSES ON EMERGING TECHNOLOGIES
Growing Library of Cutting-Edge
ON-DEMAND CONTENT
Your Individual or Group Pass gives you access to the whole ever-growing library of hundreds of state-of-the-art presentations and slides, from our past events on exciting emerging technologies and innovations. This is a fantastic tool and resource to learn and train at your own time and speed.
Live Event 2023
* Full Presentations are for Members Only. Contact Us for Access
16 Virtual Events 2023
Novel Electronics
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Printed Electronics
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Flexible Electronics
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Flexible Hybrid Electronics
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Structural Electronics
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Electronic Textiles (e-Textiles)
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Electronic Skin Patches
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Continuous Health Care Monitoring
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Roll-to-Roll Electronics
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Large-Area Electronics
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OLED Lighting
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Large-Area LED Lighting
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Microfluidics
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HMI and Membrane Switches
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Printed Logic
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Thin Flexible IC
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Organic Photovoltaics
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RFID and NFC
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Perovskite Photovoltaics
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Piezoresistive Sensors
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Force/Pressure sensors
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Peizoelectric Sensors and Actuators
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Haptics
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Printed Organic Sensors
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Hybrid QD or Organic-CMOS Imagers
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Printed Temperature Sensors
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Printed OLED
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Electrochromic Displays
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Thermochromic Displays
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Electrophoretic Displays
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MicroOLEDs
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MicroLEDs
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Printed Thin Film Transistors (TFTs)
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Printed or Flexible Memory
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Stretchable Strain Sensors
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Humidity Sensors
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Gas Sensors
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Flexible Displays
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Flexible Polarizers
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Transparent Heating
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Transparent Conductive Films
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Thin Film Encapsulation
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Flexible Barriers
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Solid State Battery
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Si Anode Battery
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LiS Battery
Advanced Materials
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Peroviskites
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Graphene
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2D Materials
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Carbon Nanotubes
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Quantum Dots
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Novel dyes
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Narrowband Phosphors
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Si Anode
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Graphite (Natural, Synthetic, Coated Purified)
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Solid State Battery Electrolyte (e.g., LiPON, LLZO, LATP, LGPS)
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Activated Carbon
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LCO and LFP
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NMC, NCA and LM
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OLED
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TADF (Thermally Activated Delayed Fluorescence)
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Organic Semiconductors
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Solution processed IGZO
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Lithium Metal
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Metal Sintered Die Attach
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Low Temperature Solder
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Anisotropic Conductive Adhesives
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Isotropic Conductive Adhesives
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Thermal Interface Materials
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Vertically Aligned CNTs
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3D Printing Metal
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3D Printing Materials (Photosensitive Resins, Thermoplastic Powders/Filaments, Ceramic Powders)
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Thermoelectronics
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Material Informatics
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Low-loss PTFE
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Low-loss modified PI
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Low-loss LCP
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Particle-free Inks
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Nanoparticle Inks
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Stretchable Inks
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Copper, Gold, or Silver-Copper Inks
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LTPS
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Aerogels
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Carbon Inks
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UV Curable Dielectrics
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HTL/ETL
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ALD (Atomic Layer Deposition) Precursors
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Boron Nitride
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SiC
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clear PI and Other Flexible Substrates
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Dispersents
Processes
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InMold Electronics
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Inkjet Printing
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Aerosol Deposition
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Laser Direct Sturcturing (LDS)
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Transparent Electronics
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Spatial ALD
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Roll-to-Roll Electronics
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Electrohydrodynamic
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Spraying
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Pick-and-place
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Stamping/Transfer Pritning
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3D Printing
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Nanoprinting
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Flex printing
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Gravure Printing
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Thermal Sintering/Curing
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Photonic Sintering/Curing
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SMTs (surface mount technology)
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Inspection
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Evaporation
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Sputtering
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Ultrapreicison Printing
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Wafer Printing
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Vapor Jetting and Spraying
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Plating
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Dispensing
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Stencil Printing