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TECHBLICK PLATFORM: YEAR-ROUND ACCESS TO LIBRARY OF PRESENTATIONS, SLIDES & MASTERCLASSES ON EMERGING TECHNOLOGIES

Growing Library of Cutting-Edge

ON-DEMAND CONTENT

Your Individual or Group Pass gives you access to the whole ever-growing library of hundreds of state-of-the-art presentations and slides, from our past events on exciting emerging technologies and innovations. This is a fantastic tool and resource to learn and train at your own time and speed.

Live Event 2023

* Full Presentations are for Members Only. Contact Us for Access

The Future of Electronics RESHAPED 2023

OCT 2023

Berlin, Germany

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The Future of Electronics RESHAPED | Berlin 2023
16 Virtual Events 2023

NOV 2023

Virtual Event Platform

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Mini- & Micro-LED Displays: Markets, Manufacturing Innovations, Applications, Promising Start-ups

JUL 2023

Virtual Event Platform

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AR, VR, and MR Vision Systems: Innovations, Promising Start-Ups, Future Roadmap

MAY 2023

Virtual Event Platform

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Wearable Technology: Wearable Sensors & Therapeutics, Brain-Computer Interfaces, Continuous Vital Signs Monitoring, E-Textiles, Human-Environment Interaction

MAY 2023

Virtual Event Platform

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CPES | Canadian Printable Electronics Symposium 2023

MAY 2023

Virtual Event Platform

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Printed Electronics:
Speed Networking & Learning

MAY 2023

Virtual Event Platform

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SMART Industry Day 2023

MAR 2023

Virtual Event Platform

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Digital & 3D Additive Manufacturing of Electronics, Sensors, Photovoltaics, Displays, etc

FEB 2023

Virtual Event Platform

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Battery Materials: Next-Generation & Beyond Lithium Ion

NOV 2023

Virtual Event Platform

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Quantum Dots: Material Innovations and Commercial Applications

JUN 2023

Virtual Event Platform

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Innovations Festival:
Printed, Flexible, Hybrid, 3D, Wearable, & Textile Electronics

MAY 2023

Virtual Event Platform

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Electronic Textiles & Skin Patches: Hardware & Software

MAY 2023

Virtual Event Platform

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InMold Structural Electronics Workshop 2023

MAY 2023

Virtual Event Platform

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The Future of Screen Printing for Printed Electronics

APR 2023

Virtual Event Platform

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Learning & Networking: Solid-State Batteries & Frontier Battery Materials

MAR 2023

Virtual Event Platform

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Additive Electronics in Semiconductor Packaging and PCBs

FEB 2023

Virtual Event Platform

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Solid-State Batteries: Innovations, Promising Start-Ups, & Future Roadmap
2023

Novel Electronics

  • Printed Electronics

  • Flexible Electronics

  • Flexible Hybrid Electronics

  • Structural Electronics

  • Electronic Textiles (e-Textiles)

  • Electronic Skin Patches

  • Continuous Health Care Monitoring

  • Roll-to-Roll Electronics

  • Large-Area Electronics

  • OLED Lighting

  • Large-Area LED Lighting

  • Microfluidics

  • HMI and Membrane Switches

  • Printed Logic

  • Thin Flexible IC

  • Organic Photovoltaics

  • RFID and NFC

  • Perovskite Photovoltaics

  • Piezoresistive Sensors 

  • Force/Pressure sensors

  • Peizoelectric Sensors and Actuators

  • Haptics

  • Printed Organic Sensors

  • Hybrid QD or Organic-CMOS Imagers

  • Printed Temperature Sensors

  • Printed OLED

  • Electrochromic Displays

  • Thermochromic Displays

  • Electrophoretic Displays

  • MicroOLEDs

  • MicroLEDs

  • Printed Thin Film Transistors (TFTs)

  • Printed or Flexible Memory

  • Stretchable Strain Sensors

  • Humidity Sensors

  • Gas Sensors

  • Flexible Displays

  • Flexible Polarizers

  • Transparent Heating

  • Transparent Conductive Films 

  • Thin Film Encapsulation

  • Flexible Barriers

  • Solid State Battery

  • Si Anode Battery

  • LiS Battery

Advanced Materials

  • Peroviskites

  • Graphene

  • 2D Materials

  • Carbon Nanotubes

  • Quantum Dots

  • Novel dyes

  • Narrowband Phosphors

  • Si Anode

  • Graphite (Natural, Synthetic, Coated Purified)

  • Solid State Battery Electrolyte (e.g., LiPON, LLZO, LATP, LGPS)

  • Activated Carbon

  • LCO and LFP

  • NMC, NCA and LM

  • OLED

  • TADF (Thermally Activated Delayed Fluorescence)

  • Organic Semiconductors

  • Solution processed IGZO

  • Lithium Metal

  • Metal Sintered Die Attach

  • Low Temperature Solder

  • Anisotropic Conductive Adhesives

  • Isotropic Conductive Adhesives

  • Thermal Interface Materials

  • Vertically Aligned CNTs

  • 3D Printing Metal

  • 3D Printing Materials (Photosensitive Resins, Thermoplastic Powders/Filaments, Ceramic Powders)

  • Thermoelectronics

  • Material Informatics

  • Low-loss PTFE

  • Low-loss modified PI

  • Low-loss LCP

  • Particle-free Inks

  • Nanoparticle Inks

  • Stretchable Inks

  • Copper, Gold,  or Silver-Copper Inks

  • LTPS

  • Aerogels

  • Carbon Inks

  • UV Curable Dielectrics

  • HTL/ETL

  • ALD (Atomic Layer Deposition) Precursors

  • Boron Nitride 

  • SiC

  • clear PI and  Other Flexible Substrates

  • Dispersents

Processes

  • InMold Electronics

  • Inkjet Printing

  • Aerosol Deposition

  • Laser Direct Sturcturing (LDS)

  • Transparent Electronics

  • Spatial ALD

  • Roll-to-Roll Electronics

  • Electrohydrodynamic

  • Spraying

  • Pick-and-place

  • Stamping/Transfer Pritning

  • 3D Printing

  • Nanoprinting

  • Flex printing

  • Gravure Printing

  • Thermal Sintering/Curing

  • Photonic Sintering/Curing

  • SMTs (surface mount technology)

  • Inspection

  • Evaporation 

  • Sputtering

  • Ultrapreicison Printing

  • Wafer Printing

  • Vapor Jetting and Spraying

  • Plating

  • Dispensing

  • Stencil Printing

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