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ALL PAST & FUTURE EVENTS AS WELL AS MASTERCLASSES WITH A SINGLE ANNUAL PASS

Innovations Festival: Printed, Hybrid, 3D, InMold, Textile Electronics

24 June 2022
2pm - 7pm

CET:

Virtual Festival

This must-attend event showcases exciting and cutting-edge advances from across the world. It brings together more than 400+ participants, 45 speakers and 55+ live exhibitors. The audience is truly global, coming together across many different time zones. 


In this innovation festival, the speakers will present the latest advances and innovations in compact technology-focused 5-min speeches.  To continue the discussion, the participants can then visit the speakers in their virtual speaker corner or at their virtual booth.


This is a truly unique gathering in our special 'in-person virtual' platform. This environment is called 'in-person virtual' because it makes virtual interaction real, enabling spontaneous discussions, serendipitous meetings, and excellent networking. We promise- in many ways it is more effective and more fun than onsite in-person interactions.


Do not miss our Innovations Festival on 25 April 2024

R2R Nanolithography | Nano-Scale Wafer Printing | Smart Skin Patches | 3D Touch Surfaces | Quantum Dots | Stretchable Liquid Metal Inks | Jet Metallization | Laser Induced Forward Transfer | Fuel Cells | Printed Batteries | Organic Photovoltaics | R2R PCB Production | Hybrid Circuits | 3D Electronics | InMold Electronics | Smart Surfaces | Ultra Fine Line Printing | Novel Interconnect Technology | E-Textiles | Printed Displays | Printed Sensors | Printed Sensors | Innovative Paste Technologies | Smart Packaging | Additively Manufactured Electronics | OTFTs | Perovskites

Leading global speakers include:
Boeing
KIMOTO
Coatema
DP Patterning
Seristampa
Joanneum Research
Fujikura Kasei
PulseForge
Danish Technological Institute
SmartKem
Kent Displays
Voltera
Panacol-Elosol GmbH
Fraunhofer IAP
Panasonic Electronic Materials
Leibniz Institute for New Materials
Ynvisible
Sun Chemical
ACI Materials
DoMicro
DuPont Teijin Films UK Ltd
LiquidWire
University of Coimbra
DuPont Microcircuit & Component Materials.
Zinergy UK
Nano-Ops
The University of Texas at El Paso
IDS
Fraunhofer ILT
Quad Industries
META (Metamaterial)
Brilliant Matters
Keiron Printing Technologies
CondAlign AS
Fraunhofer IZM
Henkel AG & Co. KGaA
Komori Corp
InnovationLab GmbH
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Explore our past & upcoming events

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Full Agenda

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24 June 2022

Komori Corp

Friday

Micro bumps by gravure offset printing method

More Details

2.00PM

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Chisato Oyama

We examined to utilize the gravure offset printing method to print high-precision micro bumps with various pastes.
For the flux paste, the precision of the printing position was ±5 μm on a 300 mm wafer.
We have also tried to print and reflow the solder paste.
Printing and reflow have been successful with minimum diameter of 6 μm and 15 μm, respectively.
We will report the details on the day.

All, Printed Electronics

Micro bumps by gravure offset printing method

2.00PM

We examined to utilize the gravure offset printing method to print high-precision micro bumps with various pastes.
For the flux paste, the precision of the printing position was ±5 μm on a 300 mm wafer.
We have also tried to print and reflow the solder paste.
Printing and reflow have been successful with minimum diameter of 6 μm and 15 μm, respectively.
We will report the details on the day.

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24 June 2022

Zinergy UK

Friday

Printed Batteries: Towards R2R Scale-up

More Details

2:05PM

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Dilek Ozgit Butler

Co-Founder and Chief Scientific Officer

All, Printed Electronics

Printed Batteries: Towards R2R Scale-up

2:05PM

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24 June 2022

DP Patterning

Friday

R2R FPCB production technology.

More Details

2:10 PM

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Talk Demo

Tommy Höglund

Sales & Marketing Manager

All, Printed Electronics

R2R FPCB production technology.

2:10 PM

Watch Demo Video
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24 June 2022

Leibniz Institute for New Materials

Friday

Flexible transparent conductive coatings by electrospinning

More Details

2:15PM

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Sabine Heusing

Transparent conductive coatings are widely used as transparent conductive electrodes in displays, touch screens, solar cells, antenna structures etc., and require a low sheet resistance combined with a high transmission. For wearable electronics and bendable displays, a flexibility of the electrode material is also required. Electrospinning was used as a facile method to produce very long and thin fibers, and in combination with silver, conductivity was introduced.
The properties of silver (Ag) nanoparticle-containing inks and coatings thereof, applied by electrospinning on PET and PC foil substrates were studied. The tested Ag nanoparticle-containing inks consisted of a commercial nanoparticulate silver ink and a polymeric binder in a suitable solvent. The electrospun fibers were fabricated using different spinning conditions and were then silver plated in an electroless process. The resulting coatings have been characterized with respect to their sheet resistance, transmission, and haze.
It was observed that with the electrospun polymer silver fibers, fibers with a diameter of about 1 to 3 µm and lengths of several cm could be obtained, ensuring a high percolation. By variation of the number and the diameter of the fibers, the conductivity and the optical properties could be improved, and coatings with a sheet resistance below 5 Ω/sq were obtained, showing a high transmission of up to 92 % and a low haze below 2 %.
The achieved sheet resistances in combination with the relatively high transmission are comparable to those of other transparent conductive coatings that are state of the art and available on the market, such as ITO coatings. In addition, the coatings produced by this electrospinning process are flexible and stretchable, which offers interesting new applications for wearable electronics and 3D-formable displays, for example. Other advantages of these coatings are the low-cost process for their production and the possibility of upscaling by a roll-to-roll process.

All, Printed Electronics

Flexible transparent conductive coatings by electrospinning

2:15PM

Transparent conductive coatings are widely used as transparent conductive electrodes in displays, touch screens, solar cells, antenna structures etc., and require a low sheet resistance combined with a high transmission. For wearable electronics and bendable displays, a flexibility of the electrode material is also required. Electrospinning was used as a facile method to produce very long and thin fibers, and in combination with silver, conductivity was introduced.
The properties of silver (Ag) nanoparticle-containing inks and coatings thereof, applied by electrospinning on PET and PC foil substrates were studied. The tested Ag nanoparticle-containing inks consisted of a commercial nanoparticulate silver ink and a polymeric binder in a suitable solvent. The electrospun fibers were fabricated using different spinning conditions and were then silver plated in an electroless process. The resulting coatings have been characterized with respect to their sheet resistance, transmission, and haze.
It was observed that with the electrospun polymer silver fibers, fibers with a diameter of about 1 to 3 µm and lengths of several cm could be obtained, ensuring a high percolation. By variation of the number and the diameter of the fibers, the conductivity and the optical properties could be improved, and coatings with a sheet resistance below 5 Ω/sq were obtained, showing a high transmission of up to 92 % and a low haze below 2 %.
The achieved sheet resistances in combination with the relatively high transmission are comparable to those of other transparent conductive coatings that are state of the art and available on the market, such as ITO coatings. In addition, the coatings produced by this electrospinning process are flexible and stretchable, which offers interesting new applications for wearable electronics and 3D-formable displays, for example. Other advantages of these coatings are the low-cost process for their production and the possibility of upscaling by a roll-to-roll process.

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24 June 2022

Fraunhofer IZM

Friday

E-Textiles: Adhesive Bonding for electronics integration in textiles

More Details

2:20PM

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Talk Demo

Malte von Krshiwoblozki

Group Manager

Fraunhofer IZM is an electronic packaging institute providing solutions for new electronics manufacturing. Fraunhofer IZM is focusing on miniaturization, new materials and new form factors for electronics.
Adhesive bonding for electronic textiles was developed and evolved at IZM during several projects. This pitch will introduce the technology that allows the assembly of electronic modules on textiles through creating an electrical and mechanical connection within the same process. Adhesive bonding allows the integration of any kind of PCB, flex PCB or stretchable electronics based module e.g sensor module, light module etc. into a textile circuit. Therefore, Fraunhofer IZM developed a prototype bonding machine with a working area of 1 by 1 m that is able to handle any kind of textile substrate. A hug variety of textile integrated conductors are supported by adhesive bonding, even insulated conductors if the insulation is thermoplastic.

All, Printed Electronics

E-Textiles: Adhesive Bonding for electronics integration in textiles

2:20PM

Fraunhofer IZM is an electronic packaging institute providing solutions for new electronics manufacturing. Fraunhofer IZM is focusing on miniaturization, new materials and new form factors for electronics.
Adhesive bonding for electronic textiles was developed and evolved at IZM during several projects. This pitch will introduce the technology that allows the assembly of electronic modules on textiles through creating an electrical and mechanical connection within the same process. Adhesive bonding allows the integration of any kind of PCB, flex PCB or stretchable electronics based module e.g sensor module, light module etc. into a textile circuit. Therefore, Fraunhofer IZM developed a prototype bonding machine with a working area of 1 by 1 m that is able to handle any kind of textile substrate. A hug variety of textile integrated conductors are supported by adhesive bonding, even insulated conductors if the insulation is thermoplastic.

Watch Demo Video
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24 June 2022

University of Coimbra

Friday

Stretchable Microchip-Integrated Electronics Based on Liquid Metal

More Details

2:25 PM

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Talk Demo

Mahmoud Tavakoli

Stretchable electronics have many applications in wearable technology, and health monitoring. But to find their way out of the labratories, fundamental problems had to be solved. In this presentation, I´ll explain how we addressed t hese problems, and how this enables us to move toward scalable fabrication of 3R electronics that are Resilient, Repirable and Recylable. Taking advantage of our novel liquid metal composites, and innovative chip integration processes, i explain direct digital printing of liquid metal based stretchable circuits, and demonstrate examples of microchip integrated soft-matter electronics with record-breaking maximum strain value of >1000% strain. As the whole process is perfomed at the room temperature (even the soldering), 3R electroncis pave an importatn step toward green manufacturing, and sustinable development in electronics.

All, Printed Electronics

Stretchable Microchip-Integrated Electronics Based on Liquid Metal

2:25 PM

Stretchable electronics have many applications in wearable technology, and health monitoring. But to find their way out of the labratories, fundamental problems had to be solved. In this presentation, I´ll explain how we addressed t hese problems, and how this enables us to move toward scalable fabrication of 3R electronics that are Resilient, Repirable and Recylable. Taking advantage of our novel liquid metal composites, and innovative chip integration processes, i explain direct digital printing of liquid metal based stretchable circuits, and demonstrate examples of microchip integrated soft-matter electronics with record-breaking maximum strain value of >1000% strain. As the whole process is perfomed at the room temperature (even the soldering), 3R electroncis pave an importatn step toward green manufacturing, and sustinable development in electronics.

Watch Demo Video
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24 June 2022

Fujikura Kasei

Friday

Creating Fully Stretchable Medical Devices with Silicone-based AgCl Inks

More Details

2:30PM

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David Dewey

Sales

As stretchable inks improve, the possibility of a fully stretchable medical device is realized with silicone-based stretchable inks utilizing AgCl filler for medical electrodes

All, Printed Electronics

Creating Fully Stretchable Medical Devices with Silicone-based AgCl Inks

2:30PM

As stretchable inks improve, the possibility of a fully stretchable medical device is realized with silicone-based stretchable inks utilizing AgCl filler for medical electrodes

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24 June 2022

Networking Break

Friday

Networking and Meet-the-Speaker

More Details

2.35PM

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Talk Demo

The 'in-person virtual' networking space will open. You can mingle with the others and meet the speakers at 'speaker corners'

All, Printed Electronics

Networking and Meet-the-Speaker

2.35PM

The 'in-person virtual' networking space will open. You can mingle with the others and meet the speakers at 'speaker corners'

Watch Demo Video
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24 June 2022

Fraunhofer IAP

Friday

Ultra precise EHD-Jet printing of quantum dots.

More Details

3.00PM

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Talk Demo

Armin Wedel

Division Director Functional Polymers

All, Printed Electronics

Ultra precise EHD-Jet printing of quantum dots.

3.00PM

Watch Demo Video
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24 June 2022

DoMicro

Friday

Perspectives For Electrohydrodynamic Printing On Nanoscale

More Details

3.05PM

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Talk Demo

Aart-Jan Hoeven

Business Development Manager

DoMicro has developed a printer (the DM50-ENP) with a novel technology for printing wires with nanoscale dimensions. The technology is based on the electrohydrodynamic effect. This effect enables a submicron additive technology, in which an electric field is used for pulling an inkjet into a very narrow shape. The effect can reduce the line width from about 30 microns, as can be obtained with industrial inkjet technology, down to 1 micron or less.
Applications are in various fields, such as displays, micro fluidics, batteries and photo voltaics. The presentation highlights the opportunities in these application areas, as well as results from trials with the DoMicro printer.

All, Printed Electronics

Perspectives For Electrohydrodynamic Printing On Nanoscale

3.05PM

DoMicro has developed a printer (the DM50-ENP) with a novel technology for printing wires with nanoscale dimensions. The technology is based on the electrohydrodynamic effect. This effect enables a submicron additive technology, in which an electric field is used for pulling an inkjet into a very narrow shape. The effect can reduce the line width from about 30 microns, as can be obtained with industrial inkjet technology, down to 1 micron or less.
Applications are in various fields, such as displays, micro fluidics, batteries and photo voltaics. The presentation highlights the opportunities in these application areas, as well as results from trials with the DoMicro printer.

Watch Demo Video
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24 June 2022

Coatema

Friday

The pathway to digital fabrication of printed electronic products

More Details

3:10PM

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Talk Demo

Thomas Kolbusch

Director

All, Printed Electronics

The pathway to digital fabrication of printed electronic products

3:10PM

Watch Demo Video
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24 June 2022

Keiron Printing Technologies

Friday

Digitally Printing Highly Viscous Contents with Laser-Induced Forward Transfer

More Details

3:15 PM

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Talk Demo

Shahzad Khan

Senior Business Developer

Laser-Induced Forward Transfer could replace traditional digital printing methods such as Inkjet for printed electronics applications. Whereas materials must be tailored to Inkjet’s limited range of functionality, LIFT can work with commercially available inks typically known for screen printing. This feature reduces the cost of production and waste for a more sustainable and flexible electronics manufacturing plant.

All, Printed Electronics

Digitally Printing Highly Viscous Contents with Laser-Induced Forward Transfer

3:15 PM

Laser-Induced Forward Transfer could replace traditional digital printing methods such as Inkjet for printed electronics applications. Whereas materials must be tailored to Inkjet’s limited range of functionality, LIFT can work with commercially available inks typically known for screen printing. This feature reduces the cost of production and waste for a more sustainable and flexible electronics manufacturing plant.

Watch Demo Video
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24 June 2022

Nano-Ops

Friday

The Future of Printed Electronics is Here; Print Electronic Components and ICs Using a Single Platform

More Details

3.20PM

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Talk Demo

Ahmed Busnaina

CTO

Imagine if you can input your design and materials on one end and have your chips come out the other end using one machine? And do this on the same day as you finish the design? What if this machine could be installed in your, lab, or another secure location? We present a new purely additive manufacturing technique for nano and microscale integrated electronics systems manufacturing. This fully automated foundry-in-a-box tool takes less than 10 square meters of space and can be installed and used anywhere to ensure a secure operation independent of any semiconductor fab. The electronic development cycle would be in days instead of six to nine months, with prototyping taking a day or less. The technique eliminates high-energy, chemically intense processing by utilizing direct assembly of nanoparticles at room temperature and atmospheric pressure. This technology can be used to make transistors, diodes, or logic gates using a purely additive (directed assembly enabled) process utilizing semiconductors, metals, and dielectric nanoparticles suspended in a liquid. The nanoscale printing platform enables the heterogeneous integration of interconnected circuit layers (like CMOS) of electronics and sensors at ambient temperature and pressure on rigid or flexible substrates. The technique has been used to make transistors, inverters, diodes, logic gates, displays, all carbon electronics, and sensors at the micro and nanoscale using inorganic and organic materials.

All, Printed Electronics

The Future of Printed Electronics is Here; Print Electronic Components and ICs Using a Single Platform

3.20PM

Imagine if you can input your design and materials on one end and have your chips come out the other end using one machine? And do this on the same day as you finish the design? What if this machine could be installed in your, lab, or another secure location? We present a new purely additive manufacturing technique for nano and microscale integrated electronics systems manufacturing. This fully automated foundry-in-a-box tool takes less than 10 square meters of space and can be installed and used anywhere to ensure a secure operation independent of any semiconductor fab. The electronic development cycle would be in days instead of six to nine months, with prototyping taking a day or less. The technique eliminates high-energy, chemically intense processing by utilizing direct assembly of nanoparticles at room temperature and atmospheric pressure. This technology can be used to make transistors, diodes, or logic gates using a purely additive (directed assembly enabled) process utilizing semiconductors, metals, and dielectric nanoparticles suspended in a liquid. The nanoscale printing platform enables the heterogeneous integration of interconnected circuit layers (like CMOS) of electronics and sensors at ambient temperature and pressure on rigid or flexible substrates. The technique has been used to make transistors, inverters, diodes, logic gates, displays, all carbon electronics, and sensors at the micro and nanoscale using inorganic and organic materials.

Watch Demo Video
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24 June 2022

Networking Break

Friday

LIVE Exhibition OPENS

More Details

3.25PM

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Talk Demo

LIVE exhibition space opens. You can visit the exhibiting companies live to mingle with them
Exhibiting companies will come from TechBlick exhibitors and sponsorsMeta | NovaCentrix | Panasonic | Agfa | Brewer Science | Brilliant Matters | Coatema | DuPoint Teijin Films | DuPont | Binder ITZ | IDS | McDermid Alpha | Neotech AMT | Nippin Kayaku | Quad Industries | Sunray Scientific | Holst Centre | VTT | XTPL | ACTI Materials | Asada Mesh | Applied Materials | Asahi Kasei | BeLink Solutions | Chasm | CPI | Cond Align | Copprint | Danish Technological Institute | DoMicro | e2IP | Elantas | Kodak | East Print | Electroninks | Epishine | Fraunhofer IAP | Front Edge | Fujifilm | Fujikura Kasei | GIS | Hamamatsu | Henkel | InnovationLab | Jet Metal | Joanneum Research | Kimoto | Keiron | Liquid Wire | Nagase Chemtex  Nani Ops | Rise | Panacol | Noctiluca | Raymore | Safi-Tech | Sateco XT | Sefar | Seriestampa | Sheldahl | Smartkem | Versarien | Ynvisible

All, Printed Electronics

LIVE Exhibition OPENS

3.25PM

LIVE exhibition space opens. You can visit the exhibiting companies live to mingle with them
Exhibiting companies will come from TechBlick exhibitors and sponsorsMeta | NovaCentrix | Panasonic | Agfa | Brewer Science | Brilliant Matters | Coatema | DuPoint Teijin Films | DuPont | Binder ITZ | IDS | McDermid Alpha | Neotech AMT | Nippin Kayaku | Quad Industries | Sunray Scientific | Holst Centre | VTT | XTPL | ACTI Materials | Asada Mesh | Applied Materials | Asahi Kasei | BeLink Solutions | Chasm | CPI | Cond Align | Copprint | Danish Technological Institute | DoMicro | e2IP | Elantas | Kodak | East Print | Electroninks | Epishine | Fraunhofer IAP | Front Edge | Fujifilm | Fujikura Kasei | GIS | Hamamatsu | Henkel | InnovationLab | Jet Metal | Joanneum Research | Kimoto | Keiron | Liquid Wire | Nagase Chemtex  Nani Ops | Rise | Panacol | Noctiluca | Raymore | Safi-Tech | Sateco XT | Sefar | Seriestampa | Sheldahl | Smartkem | Versarien | Ynvisible

Watch Demo Video
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24 June 2022

Joanneum Research

Friday

R2R-NIL for realizing highly innovative use cases – from bionics to medical diagnostics

More Details

3:45PM

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Gregor Scheipl

Marketing Business Development Executive

Imprint lithography is a versatile technology for the replication of micro- and nanostructures. It is widely used in high-tech areas such as optics, electronics, photovoltaics, sensor technology, in the medical field ("lab-on-chip") or in surface finishing.
As a European pioneer, JOANNEUM RESEARCH Forschungsgesellschaft mbH operates a roll2roll (R2R) UV coating and imprinting system since 2010 and is developing and using resins that are biodegradable and thus sustainable. Required structures can be produced on a meter-per-minute scale, similar to newspaper printing. With a strong focus on the product, processes are developed and optimized for:
(i) Environmentally friendly production of high-resolution conductive structural elements for organic electronics (fine conductor paths, nanoscale electrodes for organic transistors)
(ii) Precise production of optical 2.5D structures for the management of light in films (coupling and decoupling, light conduction) for applications in photonics
(iii) Large-scale realization of 3D-structured bionic surfaces and complex nanostructures that make effects from nature technically usable (shark skin, lotus effect, gecko effect, structural colors)
(iv) Cost-effective production of complex microfluidic elements in foil as the basis of biosensors for lab-on-foil analysis systems
(v) Continuous production of refined high-tech film surfaces for packaging, decoration, security and labelling, which have improved optical, mechanical and chemical properties due to micro- and nanostructure

All, Printed Electronics

R2R-NIL for realizing highly innovative use cases – from bionics to medical diagnostics

3:45PM

Imprint lithography is a versatile technology for the replication of micro- and nanostructures. It is widely used in high-tech areas such as optics, electronics, photovoltaics, sensor technology, in the medical field ("lab-on-chip") or in surface finishing.
As a European pioneer, JOANNEUM RESEARCH Forschungsgesellschaft mbH operates a roll2roll (R2R) UV coating and imprinting system since 2010 and is developing and using resins that are biodegradable and thus sustainable. Required structures can be produced on a meter-per-minute scale, similar to newspaper printing. With a strong focus on the product, processes are developed and optimized for:
(i) Environmentally friendly production of high-resolution conductive structural elements for organic electronics (fine conductor paths, nanoscale electrodes for organic transistors)
(ii) Precise production of optical 2.5D structures for the management of light in films (coupling and decoupling, light conduction) for applications in photonics
(iii) Large-scale realization of 3D-structured bionic surfaces and complex nanostructures that make effects from nature technically usable (shark skin, lotus effect, gecko effect, structural colors)
(iv) Cost-effective production of complex microfluidic elements in foil as the basis of biosensors for lab-on-foil analysis systems
(v) Continuous production of refined high-tech film surfaces for packaging, decoration, security and labelling, which have improved optical, mechanical and chemical properties due to micro- and nanostructure

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24 June 2022

META (Metamaterial)

Friday

Multifunctional metasurfaces for everyday printed electronic functional films

More Details

3:50PM

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Jonathan Waldern

Chief Technology Officer

Meta Materials Inc. is developing discrete platform specific proprietary technologies for large-surface-area lithography, allowing the manufacture of nanostructures to be carried out in a cost-effective manner. Each platform employs a massively parallel patterning scheme, designed to be scalable to large areas of either rigid substrate materials and rolls of flexible films. In certain cases we use a phase-shift mask approach and in others, cast plasmonic printing – all allowing the creation of structures with feature sizes down to 50 nm.

All, Printed Electronics

Multifunctional metasurfaces for everyday printed electronic functional films

3:50PM

Meta Materials Inc. is developing discrete platform specific proprietary technologies for large-surface-area lithography, allowing the manufacture of nanostructures to be carried out in a cost-effective manner. Each platform employs a massively parallel patterning scheme, designed to be scalable to large areas of either rigid substrate materials and rolls of flexible films. In certain cases we use a phase-shift mask approach and in others, cast plasmonic printing – all allowing the creation of structures with feature sizes down to 50 nm.

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24 June 2022

PulseForge

Friday

Use of Photonic Soldering to Enable High Quality Connections on Temperature Sensitive Substrates

More Details

3:55PM

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Vahid Akhavan

Global Application Engineering Lead

Many prototypes have been developed in the flexible hybrid electronic space that do not go to production due to poor longevity of the final design. One of the big challenges remains how to connect conventional component to a flexible architecture, while maintaining the expected longevity in the circuit. Anisotropic conductors are the current benchmarks for these devices, but their performance is lacking as compared to standard soldering processes. PulseForge has devised a new photonic soldering process that enables attachment using standard solder pastes onto components and substrates that cannot withstand the oven reflow temperatures.
Photonic soldering utilizes high intensity flashes of visible light to achieve wide area heating with exceptional uniformity. Solder paste is heated to its liquidous temperature using radiative energy transfer, and light is converted to heat through optical absorption. This process is selective by exploiting selective absorptivity of active regions or with the aid of shadow masks. The optical flash can be modulated digitally, with high temporal resolution, to enable highly customizable temperature profiles, ranging from traditional to highly innovative.
Photonic soldering is compatible with standard high temperature lead free solder alloys (e.g. SAC305) in combination with temperature-sensitive substrates (e.g. PET). The nonequilibrium nature of the heating process enables thermal isolation of active regions from temperature sensitive regions. The resulting flexibility in material selection gives designers significant freedom and unconventional options in device architectures. The innovative approach enables a production flow that better lines up with the next generation of electronics. This presentation highlights the advantages of the new technology and discusses the application space for the photonic soldering technology.

All, Printed Electronics

Use of Photonic Soldering to Enable High Quality Connections on Temperature Sensitive Substrates

3:55PM

Many prototypes have been developed in the flexible hybrid electronic space that do not go to production due to poor longevity of the final design. One of the big challenges remains how to connect conventional component to a flexible architecture, while maintaining the expected longevity in the circuit. Anisotropic conductors are the current benchmarks for these devices, but their performance is lacking as compared to standard soldering processes. PulseForge has devised a new photonic soldering process that enables attachment using standard solder pastes onto components and substrates that cannot withstand the oven reflow temperatures.
Photonic soldering utilizes high intensity flashes of visible light to achieve wide area heating with exceptional uniformity. Solder paste is heated to its liquidous temperature using radiative energy transfer, and light is converted to heat through optical absorption. This process is selective by exploiting selective absorptivity of active regions or with the aid of shadow masks. The optical flash can be modulated digitally, with high temporal resolution, to enable highly customizable temperature profiles, ranging from traditional to highly innovative.
Photonic soldering is compatible with standard high temperature lead free solder alloys (e.g. SAC305) in combination with temperature-sensitive substrates (e.g. PET). The nonequilibrium nature of the heating process enables thermal isolation of active regions from temperature sensitive regions. The resulting flexibility in material selection gives designers significant freedom and unconventional options in device architectures. The innovative approach enables a production flow that better lines up with the next generation of electronics. This presentation highlights the advantages of the new technology and discusses the application space for the photonic soldering technology.

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24 June 2022

DuPont Teijin Films UK Ltd

Friday

Polyester film solutions from DTF meeting changing needs in flexible electronic markets.

More Details

4:00 PM

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Valentijn von Morgen

Business Development Manager

Continued advances in the Flexible and Formable Electronics is driving the material suppliers such as DuPont Teijin Films to provide functionality to meet wide ranging demands for applications such as displays, TFT backplanes, energy harvesting and storage, sensors and Human Machine Interfaces.

This talk will give a brief overview of DTF’s PET and PEN product range meeting wide ranging application needs.

Thereby the focus will be on the recent progress made with the development of PEN substrates for extreme processing requirements, formable PETfilms for in-mold electronics, films with ultra clean and smooth surfaces for ultra barrier and high resolution structures and combining UV absorption, weather resistance or fire retardancy whilst also offering more sustainable solutions with the incorporation of recycled materials in the substrates.

DTF has launched many films through collaborations with partners in the flexible electronic industry as our organisation is proving to be uniquely capable of offering customised and affordable polyester substrate solutions.

All, Printed Electronics

Polyester film solutions from DTF meeting changing needs in flexible electronic markets.

4:00 PM

Continued advances in the Flexible and Formable Electronics is driving the material suppliers such as DuPont Teijin Films to provide functionality to meet wide ranging demands for applications such as displays, TFT backplanes, energy harvesting and storage, sensors and Human Machine Interfaces.

This talk will give a brief overview of DTF’s PET and PEN product range meeting wide ranging application needs.

Thereby the focus will be on the recent progress made with the development of PEN substrates for extreme processing requirements, formable PETfilms for in-mold electronics, films with ultra clean and smooth surfaces for ultra barrier and high resolution structures and combining UV absorption, weather resistance or fire retardancy whilst also offering more sustainable solutions with the incorporation of recycled materials in the substrates.

DTF has launched many films through collaborations with partners in the flexible electronic industry as our organisation is proving to be uniquely capable of offering customised and affordable polyester substrate solutions.

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24 June 2022

Ynvisible

Friday

Established and new applications of printed e-paper displays

More Details

4:05PM

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Keith Morton

VP Sales & Marketing

Keith Morton, Ynvisible's VP of Sales & Marketing, will speak about established and new applications that are benefiting from their printed, ultra-low-power, and cost-effective e-paper technology.

All, Printed Electronics

Established and new applications of printed e-paper displays

4:05PM

Keith Morton, Ynvisible's VP of Sales & Marketing, will speak about established and new applications that are benefiting from their printed, ultra-low-power, and cost-effective e-paper technology.

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24 June 2022

InnovationLab GmbH

Friday

Current R&D at InnovationLab: Towards reflow-solderable hybrid electronics

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4:10 PM

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Meike Baumgarten

Business Developer

What happens currently at InnovationLab? Insights into what iL’s R&D department researches on regarding hybrid and flexible electronics, along with interim results and next steps. This will be accompanied by the one or other novel development

All, Printed Electronics

Current R&D at InnovationLab: Towards reflow-solderable hybrid electronics

4:10 PM

What happens currently at InnovationLab? Insights into what iL’s R&D department researches on regarding hybrid and flexible electronics, along with interim results and next steps. This will be accompanied by the one or other novel development

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24 June 2022

Networking Break

Friday

LIVE Exhibition

More Details

4.15PM

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Talk Demo

LIVE exhibition space opens. You can visit the exhibiting companies live to mingle with them

Exhibiting companies will come from TechBlick exhibitors and sponsors Meta | NovaCentrix | Panasonic | Agfa | Brewer Science | Brilliant Matters | Coatema | DuPoint Teijin Films | DuPont | Binder ITZ | IDS | McDermid Alpha | Neotech AMT | Nippin Kayaku | Quad Industries | Sunray Scientific | Holst Centre | VTT | XTPL | ACTI Materials | Asada Mesh | Applied Materials | Asahi Kasei | BeLink Solutions | Chasm | CPI | Cond Align | Copprint | Danish Technological Institute | DoMicro | e2IP | Elantas | Kodak | East Print | Electroninks | Epishine | Fraunhofer IAP | Front Edge | Fujifilm | Fujikura Kasei | GIS | Hamamatsu | Henkel | InnovationLab | Jet Metal | Joanneum Research | Kimoto | Keiron | Liquid Wire | Nagase Chemtex  Nani Ops | Rise | Panacol | Noctiluca | Raymore | Safi-Tech | Sateco XT | Sefar | Seriestampa | Sheldahl | Smartkem | Versarien | Ynvisible

All, Printed Electronics

LIVE Exhibition

4.15PM

LIVE exhibition space opens. You can visit the exhibiting companies live to mingle with them

Exhibiting companies will come from TechBlick exhibitors and sponsors Meta | NovaCentrix | Panasonic | Agfa | Brewer Science | Brilliant Matters | Coatema | DuPoint Teijin Films | DuPont | Binder ITZ | IDS | McDermid Alpha | Neotech AMT | Nippin Kayaku | Quad Industries | Sunray Scientific | Holst Centre | VTT | XTPL | ACTI Materials | Asada Mesh | Applied Materials | Asahi Kasei | BeLink Solutions | Chasm | CPI | Cond Align | Copprint | Danish Technological Institute | DoMicro | e2IP | Elantas | Kodak | East Print | Electroninks | Epishine | Fraunhofer IAP | Front Edge | Fujifilm | Fujikura Kasei | GIS | Hamamatsu | Henkel | InnovationLab | Jet Metal | Joanneum Research | Kimoto | Keiron | Liquid Wire | Nagase Chemtex  Nani Ops | Rise | Panacol | Noctiluca | Raymore | Safi-Tech | Sateco XT | Sefar | Seriestampa | Sheldahl | Smartkem | Versarien | Ynvisible

Watch Demo Video
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24 June 2022

Henkel AG & Co. KGaA

Friday

Pad-printing Silver Inks – Example of 5G Antenna Applications

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4:35PM

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Thibaut Soulestin

Application Engineer EIMEA

Henkel is an industry-leading supplier of printed electronics materials and services. The broad Loctite portfolio of functional inks includes silver inks, carbon inks, silver/ silver chloride inks, dielectric inks, and other non-conductive inks as well. Due to Henkel’s extensive partnership network, we are uniquely situated to provide high-quality materials for a variety of printed electronics applications. Combining the trend of 3D electronics and increased connectivity, we recently developed a range of silver inks for pad-printing. This ink range enables the direct 3D-printing of 5G antenna on the smartphone frame.

All, Printed Electronics

Pad-printing Silver Inks – Example of 5G Antenna Applications

4:35PM

Henkel is an industry-leading supplier of printed electronics materials and services. The broad Loctite portfolio of functional inks includes silver inks, carbon inks, silver/ silver chloride inks, dielectric inks, and other non-conductive inks as well. Due to Henkel’s extensive partnership network, we are uniquely situated to provide high-quality materials for a variety of printed electronics applications. Combining the trend of 3D electronics and increased connectivity, we recently developed a range of silver inks for pad-printing. This ink range enables the direct 3D-printing of 5G antenna on the smartphone frame.

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24 June 2022

Danish Technological Institute

Friday

Your copper nanoparticle production scale up

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4:40 PM

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Zachary J. Davis

Team Manager, PhD

Finding sustainable alternative conductive materials to silver is growing in demand. Copper is the next best conductive material, extremely abundant and much cheaper compared to silver and thus is a prime candidate moving forward. DTI has developed several micro and nano copper particles and has demonstrated industrial production of up to 10 kg per day. This talk will showcase the reactor technology DTI has developed, consisting of both a material synthesis reactor as well as filtration system, for automated production of