Innovations Festival:
Printed, Hybrid, 3D, InMold, Textile Electronics
When: 24 June 2022 | 14:00 - 19:00 CET
Speakers at a glance
About the event

This must-attend event showcases exciting and cutting-edge advances from across the world. It brings together more than 400+ participants, 45 speakers and 55+ live exhibitors. The audience is truly global, coming together across many different time zones.

In this innovation festival, the speakers will present the latest advances and innovations in compact technology-focused 5-min speeches. To continue the discussion, the participants can then visit the speakers in their virtual speaker corner or at their virtual booth.

This is a truly unique gathering in our special 'in-person virtual' platform. This environment is called 'in-person virtual' because it makes virtual interaction real, enabling spontaneous discussions, serendipitous meetings, and excellent networking. We promise- in many ways it is more effective and more fun than onsite in-person interactions.

Spaces are limited and will be assigned on a "first come first served" basis. Please secure your spot immediately.

Key Topics

R2R Nanolithography | Nano-Scale Wafer Printing | Smart Skin Patches | 3D Touch Surfaces | Quantum Dots | Stretchable Liquid Metal Inks | Jet Metallization | Laser Induced Forward Transfer | Fuel Cells | Printed Batteries | Organic Photovoltaics | R2R PCB Production | Hybrid Circuits | 3D Electronics | InMold Electronics | Smart Surfaces | Ultra Fine Line Printing | Novel Interconnect Technology | E-Textiles | Printed Displays | Printed Sensors | Printed Sensors | Innovative Paste Technologies | Smart Packaging | Additively Manufactured Electronics | OTFTs | Perovskites

Listen To End-User & Technology Presentations LIVE (online) In addition you can network in our special 'in-person' virtual space and meet 40+ exhibitors live.  View the video below to see how it works.
Guest Registration

Thank you! We look forward to meeting you at the lounge. Please check your e-mail for confirmation and login instructions.​

Enter the Lounge:


Komori Corp

Chisato Oyama



Micro bumps by gravure offset printing method

We examined to utilize the gravure offset printing method to print high-precision micro bumps with various pastes.
For the flux paste, the precision of the printing position was ±5 μm on a 300 mm wafer.
We have also tried to print and reflow the solder paste.
Printing and reflow have been successful with minimum diameter of 6 μm and 15 μm, respectively.
We will report the details on the day.


Zinergy UK

Dilek Ozgit Butler

Co-Founder and Chief Scientific Officer



Printed Batteries: Towards R2R Scale-up


DP Patterning

Tommy Höglund

Sales & Marketing Manager

2:10 PM


R2R FPCB production technology.


Leibniz Institute for New Materials

Sabine Heusing



Flexible transparent conductive coatings by electrospinning

Transparent conductive coatings are widely used as transparent conductive electrodes in displays, touch screens, solar cells, antenna structures etc., and require a low sheet resistance combined with a high transmission. For wearable electronics and bendable displays, a flexibility of the electrode material is also required. Electrospinning was used as a facile method to produce very long and thin fibers, and in combination with silver, conductivity was introduced.
The properties of silver (Ag) nanoparticle-containing inks and coatings thereof, applied by electrospinning on PET and PC foil substrates were studied. The tested Ag nanoparticle-containing inks consisted of a commercial nanoparticulate silver ink and a polymeric binder in a suitable solvent. The electrospun fibers were fabricated using different spinning conditions and were then silver plated in an electroless process. The resulting coatings have been characterized with respect to their sheet resistance, transmission, and haze.
It was observed that with the electrospun polymer silver fibers, fibers with a diameter of about 1 to 3 µm and lengths of several cm could be obtained, ensuring a high percolation. By variation of the number and the diameter of the fibers, the conductivity and the optical properties could be improved, and coatings with a sheet resistance below 5 Ω/sq were obtained, showing a high transmission of up to 92 % and a low haze below 2 %.
The achieved sheet resistances in combination with the relatively high transmission are comparable to those of other transparent conductive coatings that are state of the art and available on the market, such as ITO coatings. In addition, the coatings produced by this electrospinning process are flexible and stretchable, which offers interesting new applications for wearable electronics and 3D-formable displays, for example. Other advantages of these coatings are the low-cost process for their production and the possibility of upscaling by a roll-to-roll process.


Fraunhofer IZM

Malte von Krshiwoblozki

Group Manager



E-Textiles: Adhesive Bonding for electronics integration in textiles

Fraunhofer IZM is an electronic packaging institute providing solutions for new electronics manufacturing. Fraunhofer IZM is focusing on miniaturization, new materials and new form factors for electronics.
Adhesive bonding for electronic textiles was developed and evolved at IZM during several projects. This pitch will introduce the technology that allows the assembly of electronic modules on textiles through creating an electrical and mechanical connection within the same process. Adhesive bonding allows the integration of any kind of PCB, flex PCB or stretchable electronics based module e.g sensor module, light module etc. into a textile circuit. Therefore, Fraunhofer IZM developed a prototype bonding machine with a working area of 1 by 1 m that is able to handle any kind of textile substrate. A hug variety of textile integrated conductors are supported by adhesive bonding, even insulated conductors if the insulation is thermoplastic.


University of Coimbra

Mahmoud Tavakoli

2:25 PM


Stretchable Microchip-Integrated Electronics Based on Liquid Metal

Stretchable electronics have many applications in wearable technology, and health monitoring. But to find their way out of the labratories, fundamental problems had to be solved. In this presentation, I´ll explain how we addressed t hese problems, and how this enables us to move toward scalable fabrication of 3R electronics that are Resilient, Repirable and Recylable. Taking advantage of our novel liquid metal composites, and innovative chip integration processes, i explain direct digital printing of liquid metal based stretchable circuits, and demonstrate examples of microchip integrated soft-matter electronics with record-breaking maximum strain value of >1000% strain. As the whole process is perfomed at the room temperature (even the soldering), 3R electroncis pave an importatn step toward green manufacturing, and sustinable development in electronics.


Fujikura Kasei

David Dewey




Creating Fully Stretchable Medical Devices with Silicone-based AgCl Inks

As stretchable inks improve, the possibility of a fully stretchable medical device is realized with silicone-based stretchable inks utilizing AgCl filler for medical electrodes