Join us for a demonstration showcasing the production process of flexible and printed electronics utilizing the innovative capabilities of INO PE Line A7.Through screen printing in three colors, we will illustrate the smooth production of flexible electronic components with zero scrap, highlighting the efficiency and precision of this advanced production technology.Following the demonstration, attendees will have the opportunity to engage in a Q&A session to delve deeper into the intricacies of this innovative process. Don't miss this opportunity to witness the future of electronics manufacturing in action.

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Precise 3D forming of substrates is the key to success when it comes to In-Mold Electronics. Not only the 3D forming need to be carried out precisely to fit perfectly into the injection tool cavity, but the positioning of the conductor tracks, the electronic components already positioned in 2D or even graphics must also be in the right position with repeat accuracy. The high-pressure forming process, which uses high-pressure air of up to 90 bar and significantly lower forming temperatures than traditional thermoforming, delivers all of these benefits. Clever automation modules can be used to automate the process for series production and link it to subsequent processes, such as trimming the film inserts after forming.

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SSAIL technology enables direct writing of Cu on organic and other dielectric materials. This can be applied for RDL, fanouts and other features in heterogenous integration. High adhesion of the Cu layers increases reliability for demanding applications, like automotive or defense. With maskless process, single part batches and fast iterations are available.

This presentation will review the current status of the Additive Manufacture (AM) of sustainable mechatronic systems. The use of AM processes, offers significant sustainability advantages in the production of electronic and mechatronic systems by way of simplifying the materials mix, improved materials efficiency and heavily compressed process chains, localising manufacture. The fundamental technology combining free-form, 5 axis 3D printing of mechanical and electronic components, Surface Mount Device (SMD) placement and pre- and post-processing techniques, is described. The State-of-the-Art of the manufacturing process chain is demonstrated by way of a proof-of-concept of a lighting product

In this talk, Ben Hartkopp, one of the founders at Quantica, will address the fundamental issues at the root of the limited impact that 3D printing has caused in the electronics industry and reveals how upcoming changes in new 3D printing technologies technology are poised to address the industry's critical shortcomings. Despite the significant advancements in technology, the world of printed electronics still faces fundamental challenges and is missing key technological advancements that are essential for its progress. Hartkopp will provide an in-depth analysis of the current printed electronics landscape, highlighting the persistent gaps and limitations that hinder its full potential. Within this context, you will gain a deep understanding of the unique demands of electronics manufacturing and how traditional 3D printing methods have fallen short. These limitations have not only hindered innovation but also contributed to inefficiencies, waste, and economic challenges within the industry. Throughout the talk, you will discover how Quantica's groundbreaking additive manufacturing technology, NovoJet, aims to fill these critical gaps and revolutionize the industry. By focusing on PCB manufacturing as a starting point, Quantica's innovative drop on demand material jetting solution promises to reshape the electronics industry. By enabling the use of novel high viscosity and high particle loaded materials from leading industry partners for the design and generation of substrate and conductive geometries, Quantica's NovoJet represents a transformative leap forward. Learn how NovoJet addresses these technological shortcomings, setting the stage for a digital deposition revolution that promises positive societal, economic, environmental, and climate impacts without the negative consequences that have plagued the industry.

High aspect ratio microbumps are vital in packaging applications, yet typical methods lack the control needed for dimension. HPCAP (High Precision Capillary Printing) Technology addresses this, offering high control over microbump fabrication & exceptional versatility in dimensions & materials. Based on Atomic Force Microscopy (AFM) , HPCAP simplifies complex microbump manufacturing into a single-step procedure. During this presentation, we will delve into the workings of HPCAP technology. Our aim is to provide a detailed exploration of how this groundbreaking technology facilitates the creation of microbumps. Furthermore, the presentation will underscore the vital role that HPCAP technology plays in both packaging and semiconductor repair applications.

In this presentation, we’ll dive into print quality for printed electronics and discuss techniques for analyzing it using machine vision. We will identify the most critical aspects of print quality, how to measure them, and what sort of equipment can be used to do this in a robust, repeatable way.

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The talk will focus on sustainable advances through implementing printed electronics. Thereto methods are explained to minimise energy consumption and reduce CO2 footprint. Next to that the talk discusses recycling strategies of printed electronics. To complement the talk methods are explained to manufacture complex products and allow a sustainable alternative for PCB

This talk will provide an overview of Danish Technological Institute's capabilities within eTextile development. Dr. Davis will showcase prototypes within on-skin sensors and integrated heating elements. This presentation aims to give a comprehensive understanding of our advancements and innovations in the field of eTextiles.

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The demand for high-volume flexible devices across various industries necessitates advanced roll-to-roll (R2R) solutions utilizing vacuum coatings that are laser patterned. Various process and product controls are optimized to fulfill the specific requirements needed for different flexible devices. Modularity and scalability are critical for high volume production, these techniques can encompass these requirements along with ease of development.

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For university spin-outs and startup companies, especially in the growing medical sector, it can be challenging to find a responsive production partner to scale up your idea from bench-scale to the small/mid volume production needed to gain investment and customers. PEL is an established manufacturing company with over 18 years’ experience in printable electronics. Here in the UK, we have an extremely well-equipped production facility that gives access to a multitude of printing methods including: high resolution screen printing, inkjet deposition, aerosol jet and viscous jet piezo jet deposition. Whilst some customers prefer to outsource their production entirely to us, we also engage with users who are keen to become manufacturers in the longer term – where they can be trained on the systems we sell and “try before they buy”. In this presentation we explain the capabilities and the training and support packages that PEL can offer.

In the dynamic landscape of New Product Development (NPD) at OEMs, engineers have long pursued the solution for fully additive processes (FAP) circuit board manufacturing. Traditional methods have been hampered by challenges such as subpar electrical performance of conductive inks, limited interconnect density, and the environmental instability of joints formed between isotropic conductive adhesives (ICAs) and surface mount devices (SMDs). These hurdles have confined FAP applications primarily to low-complexity devices, such as sensors and membrane touch switches. Enter ACI Materials and our groundbreaking Alchemy Conductive Inks. Our proprietary inks are set to transcend these longstanding barriers, heralding a new era of efficiency, sustainability, and versatility in the manufacture of Flexible Hybrid Electronics (FHE) compared to conventional PCB/FPC processes. Our presentation will explore the transformative features of Alchemy Conductive Inks that empower engineers and designers at OEMs to innovate with less constraints:

Innovation doesn't just relate to the product itself; but the method in which it is manufactured. As your trusted contract manufacturing partner, CTI is always investigating new types of equipment, technologies, raw materials, etc to best suit the needs of our customers.

This presentation will review the most common screen-printed heaters in Printed Electronics; Printed Resistive heaters and Printed Wire heaters. An explanation will follow on how each type of heater is designed, and a comparison between a Printed Resistive heater (PTC) and a Printed Wire heater will be shared. There will be a review of the technology limits and challenges.Finally, a quick review of the latest technological advancements in Transparent heaters.