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The Future of Electronics RESHAPED USA   conference and exhibition ( 10 & 11 JUNE 2026, Mountain View ) is set to be the most important event of the year in Silicon Valley focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics. Hosted at the iconic  Computer History Museum , this event serves as the global hub for the next generation of electronics. This year the program features a world-class agenda with  over 75 superb invited talks  from around the world,  8 industry- or expert-led masterclasses ,  2 tours , and  over 75 onsite exhibitors . In this article, we discuss and highlight various innovative talks at the event around the theme of  Additive, Digital and/or 3D Electronics: Process Innovation .  In other articles we cover themes like materials innovation, additive electronics in packaging and PCBs, wearables and sensors, soft robotics, additive electronics in packaging and PCB production, sustainable electronics, and more. Explore the  full agenda  now and join the global industry in  Mountain View on 10 & 11 JUNE 2026 . Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable. 🚨 Explore the   Full Agenda  and   Register  before 3 May when early bird rates expire Lockheed Martin – Paul Gaylo  discusses  enabling high-temperature antennas with additive manufacturing . Paul explores why material availability alone fails to solve high-temperature design, as traditional fabrication cannot accommodate the tight tolerances and robust joints required for 1,000°C environments. The talk demonstrates how AM creates complex geometries and embedded multi-material interfaces impossible to achieve by traditional means. This work offers a production path for high-performance antennas that thrive in extreme heat. Fabric8Labs – Michael Matthews  highlights  Electrochemical Additive Manufacturing (ECAM)  for AI thermal management. Michael explores the physical limits of traditional liquid cooling as AI accelerators push heat flux densities beyond 4 W/mm². ECAM deposits pure copper atom-by-atom at room temperature with micron-scale precision, creating pixelated micro-electrode arrays. This technology offers a sustainable pathway to solve the AI thermal bottleneck with a 90% lower GHG footprint than traditional 3D printing. NASA Marshall Space Flight Center – Cadre Francis  explores  in-space manufacturing of functional electronic components . Cadre explores the major challenges of fine-feature printing without gravity-assisted flow and maintaining device reliability across diverse space environments. The work investigates how material formulation and deposition behavior evolve 🚨 Explore the   Full Agenda  and   Register  before 3 May when early bird rates expire 👉  Universal Display Corporation – Mike Hack  introduces  Universal Vapor Jet Printing (UVJP)  as a transformative dry deposition technology. Mike explores the sustainability and efficiency drain caused by manufacturing workflows that depend heavily on solvents and complex lithography. UVJP enables the digital, solvent-free deposition of high-value functional materials at low temperatures. This solution unlocks the fabrication of devices previously unattainable, facilitating cleaner and more intelligent manufacturing. 👉  Sakuu – Robert Bagheri  discusses  reinventing battery manufacturing with high-speed additive manufacturing . Robert explores the energy-intensive and toxic nature of "wet coating" electrode processes, which suffer from low reliability and high carbon footprints. By combining material preprocessing with dry electrode printing, Sakuu eliminates "forever chemicals" and toxic solvents. This work offers a revolutionary step for solid-state battery production, allowing for arbitrary shapes and integrated safety features at high volume. 👉  Inuru – Marcin Ratajczak  discusses  affordable surface lighting through printed OLED technology . Marcin explores the "hard economical reality" where OLEDs remain expensive due to vacuum evaporation processes and complex driving electronics. Inuru has simplified OLED manufacturing by utilizing inkjet technology to print molecules on-demand like color. This additive solution saves material, reduces costs, and opens the printed electronics industry to a wider audience through nano-meter precision lighting. 🚨 Explore the   Full Agenda  and   Register  before 3 May when early bird rates expire Space Foundry – Ram Prasad Gandhiraman  explores  plasma jet printing of conformal electronics . Ram explores the difficulty of embedding electronics onto non-planar surfaces like UAV wing panels and nose cones using conventional planar manufacturing. Plasma jet printing is a gravity-independent direct-write technology that uses electromagnetic fields to deliver fluid and reduce metal ions in-situ. This solution provides a fastest-method for addressing evolving electronic warfare environments by printing directly onto complex airborne structures. Altium  discusses a  new vision for agile electronics development via the cloud . Altium explores how traditional hardware development workflows are too rigid and slow to keep up with global supply chain chaos and rising demand for embedded tech. By leveraging AI for requirements and a shared cloud platform, cross-functional teams can work in sync. This solution offers an agile hardware development framework that tames requirement chaos and accelerates the path from concept to manufacture. Hummink – Pascal Boncenne  introduces  High Precision Capillary Printing (HPCaP)  for advanced packaging. Pascal explores the resolution barriers of conventional printing, which often requires external energy sources like UV or lasers that can damage sensitive materials. HPCaP leverages capillary forces and resonance to deposit materials with resolutions down to 100 nanometers. This solution offers a versatile and sustainable method for printing high-viscosity materials on complex substrate topographies in real-time. 🚨 Explore the   Full Agenda  and   Register  before 3 May when early bird rates expire Scrona – Patrick Galliker  presents a masterclass on  Electrohydrodynamic (EHD) inkjet printing . Patrick explores the physics behind EHD and why traditional inkjet struggles with the high-efficiency printing of complex 3D structures. The session details the control of characteristic variables that influence the EHD process at a fundamental level. This work offers an outlook on the commercialization of EHD printheads, showcasing their influence on next-generation high-resolution 3D applications. Rice University – Yong Lin Kong  explores  near-field microwave 3D printing of electronics . Yong Lin explores a critical limitation in 3D printing: the inability to selectively anneal printed materials without damaging temperature-sensitive substrates. By focusing microwaves using a metamaterial-inspired near-field structure (Meta-NFS), rapid volumetric heating is achieved in situ. This solution enables the local programming of electronic properties even within optically opaque materials, broadening the compatible material palette. Oregon State University – Harish Subbaraman  highlights  plasma-assisted processing for surface property tuning . Harish explores the inefficiency of current three-step printing processes (pretreat, print, sinter), which increase material waste and overall costs. Plasma-jet printing (PJP) reduces these steps into a single on-demand process capable of patterning sub-micron features. This hybrid method offers a transformative pathway for flexible electronics, improving scalability and reliability while reducing costs. 🚨 Explore the   Full Agenda  and   Register  before 3 May when early bird rates expire New Mexico State University – Chaitanya Mahajan  discusses  single-step aerosol printing via in-flight plasma reduction . Chaitanya explores why direct printing of metallic inks rarely achieves functional conductivity without post-processing, which restricts use on heat-sensitive substrates. This work integrates deposition and post-processing into a single step, yielding copper resistivities of just 17 µΩ·cm at low temperatures. This solution provides a framework for rapid metallization in space manufacturing and biocompatible coatings. NanoPrintek – Masoud Mahjouri-Samani  highlights  ink-free multimaterial dry printing . Masoud explores the polluting supply chain and contaminant issues inherent in traditional ink-based formulation and high-temperature processing. This disruptive technology prints directly from raw materials—including pure rock or semiconductors—generating pure nanoparticles in-situ. This work offers a supply-chain-agnostic, clean ecosystem for printing multifunctional nanocomposite structures on demand. Akoneer – Tadas Kildusis  presents  Selective Surface Activation Induced by Laser (SSAIL)  for high-density Cu traces. Tadas explores the environmental impact of traditional PCB/FPC production which relies on masks, chemical etching, and high power consumption. SSAIL technology creates 10-25 µm traces on dielectric materials like FR4, PET, and glass. This solution enables novel, sustainable manufacturing methods that eliminate chemical waste while supporting high-throughput semiconductor packaging. Notion Systems – Simon Rihm  concludes with  shaping the future of R&D with the n.jet evo inkjet system . Simon explores the technological challenges of replacing current subtractive process chains with additive steps in a way that is simple and efficient. The presentation demonstrates how industrial-standard desktop inkjet systems support R&D on new functional inks and substrates. This work offers a bridge for research teams to move from laboratory experimentation to industrial-scale additive processes. 🚨 Explore the   Full Agenda  and   Register  before 3 May when early bird rates expire

The Future of Electronics RESHAPED USA  conference and exhibition ( 10 & 11 JUNE 2026, Mountain View ) is set to be the most important event of the year focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics. Hosted at the iconic Computer History Museum , this event serves as the global hub for the next generation of electronics. This year the program features a world-class agenda with over 75 superb invited talks  from around the world, 8 industry- or expert-led masterclasses , 2 tours , and over 75 onsite exhibitors . In this article, we discuss and highlight various innovative talks at the event around the theme of Additive Electronics in Packaging and PCB Manufacturing . In other articles we cover themes like materials innovation, hybrid electronic manufacturing and scale-up, wearables and sensors, soft robotics, additive and 3D electronics, sustainable electronics, and more. Explore the   full agenda  now and join the global industry in Mountain View on 10 & 11 JUNE 2026 . Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable. 🚨 Explore the   Full Agenda  and   Register  before 3 May when early bird rates expire GE Aerospace Research – David Lin  discusses 3D MEMS IMU enabled by additive packaging . In this session, David explores how traditional 3D assembly is highly susceptible to long-term drift driven by package-induced stress. By utilizing an additively printed Aluminum Nitride (AlN) ceramic frame, GE achieves a 70% reduction in CTE mismatch compared to alumina. This work offers a compact, single-component IMU that provides ultra-low SWaP-C and excellent stability in harsh environments. Raytheon | An RTX Business – Daniel Hines  discusses hybrid electronics for sustainable board-level manufacturing . Here, Daniel explores the environmental bottleneck of traditional PCB manufacturing, which relies on eco-unfriendly materials and generates significant hazardous waste. The talk focuses on printing passive insulator materials for solder masks and next-gen RF filters. This solution enables the tighter integration of digital and RF electronics while significantly reducing the carbon footprint of board-level fabrication. NASA Marshall Space Flight Center – Cadre Francis  explores in-space manufacturing of electronics . Cadre explores the critical challenge of maintaining patterning fidelity and device reliability in microgravity where gravity-assisted flow is absent. This work investigates how material formulation and deposition behavior evolve under reduced gravity and variable thermal conditions. The research offers a resource-efficient pathway to create sensors and power elements critical for long-duration space missions. 🚨 Explore the   Full Agenda  and   Register  before 3 May when early bird rates expire Fabric8Labs – Michael Matthews  highlights Electrochemical Additive Manufacturing (ECAM)  for next-gen AI cooling. In this talk, Michael explores how traditional liquid cooling is reaching its physical limits as AI accelerators push heat flux densities beyond 4 W/mm². ECAM utilizes a backplane with 33-micron pixels to deposit copper atom-by-atom at room temperature. This technology offers a 90% lower GHG footprint and provides a high-resolution cooling structure that eliminates the thermal stresses of traditional 3D printing. Komori America – Reza Kazemi  introduces as part of his masterclass high-precision gravure offset printing  for next-generation electronics. Reza explores the limitations of current plating processes, which are often eco-polluting and struggle with high-density alignment. Capable of ±5 µm positional accuracy, this process enables micro-solder and copper paste deposition for micro-LED assembly. This solution offers an eco-friendly alternative that ensures high reliability and strong resistance to migration in advanced packaging. Air Force Research Laboratory – Christopher Tabor  presents resilient packaging for stretchable electronics . Christopher explores the difficulty of maintaining electrical performance in wearable electronics under extreme mechanical loads and reactive environments. Utilizing liquid metal inks and conformable substrates like spider silk, the AFRL creates breathable, biocompatible electrodes. This strategy offers a pathway to reconfigurable, self-healing electronic systems that can maintain performance at strains up to 300%. 🚨 Explore the   Full Agenda  and   Register  before 3 May when early bird rates expire TracXon – Ashok Sridhar  unveils a patented, high-speed R2R-compatible VIA production process . Ashok explores the industry-wide bottleneck where the lack of printed VIAs forces expensive "stack printing" that increases material consumption and cost. By addressing this lack of robust vertical interconnects, TracXon enables double-sided, high-density circuitry. This concept offers the ability to close the gap with traditional subtractive PCBs in terms of circuitry complexity and scalability. Sunray Scientific – John Yundt  discusses fine-pitch direct die attach  using magnetically aligned anisotropic conductive adhesives (ZTACH® ACE). In this presentation, John explores how traditional bonding methods like solder or ECAs struggle with fine-pitch requirements, often leading to brittle joints or slow processing times. This pressure-less, low-temperature process enables 100-micron pitch bonding with 5-10x the strength of solder. The solution offers a single-step adhesive application that provides both electrical interconnection and mechanical reinforcement without the need for underfill. Hummink – Pascal Boncenne  introduces High Precision Capillary Printing (HPCaP)  for advanced packaging. Pascal explores the resolution limits of conventional inkjet printing, which often fails at the micron scale and requires external energy sources like UV. Leveraging capillary forces, this AFM-inspired technology achieves sub-micron accuracy down to 100nm. It offers a versatile and sustainable solution for high-viscosity materials and fine interconnects in semiconductor packaging and biosensors. 🚨 Explore the   Full Agenda  and   Register  before 3 May when early bird rates expire Holst Centre – Hylke Akkerman  explores 3D microelectronics via foil laminated stereolithography (f-SLA) . Hylke explores the constraints of planar electronics which limit design freedom and lead to complex value chains. This approach integrates bare dies at the 10–20 µm scale and forms vertical interconnects directly during the print process. This platform offers a route toward fully spatial, ultra-miniaturized systems with significantly shorter lead times. Akoneer – Tadas Kildusis  presents Selective Surface Activation Induced by Laser (SSAIL)  for high-density Cu traces. Tadas explores the waste-heavy nature of traditional PCB production, which relies on chemical etching and expensive masks. The technology creates 1-25 µm traces on organic, glass, and ceramic substrates for both FPC and semiconductor packaging. This solution enables a novel manufacturing method that drastically reduces power consumption and chemical waste. NanoPrintek – Masoud Mahjouri-Samani  highlights ink-free multimaterial dry printing . Masoud explores the polluting supply chain and high-temperature post-processing requirements inherent in current ink-based printed electronics. This disruptive technology prints directly from raw materials, generating pure nanoparticles in-situ via laser sintering. It offers a supply-chain-agnostic, clean technology that enables multifunctional hybrid materials to be printed on demand across multiple industries. 🚨 Explore the   Full Agenda  and   Register  before 3 May when early bird rates expire Notion Systems – Simon Rihm  discusses shaping R&D with the n.jet evo inkjet system . Simon explores the challenges of replacing subtractive process chains with additive steps in a way that remains industrially relevant. The talk demonstrates how industrial-standard desktop inkjet tools enable rapid research into functional inks and substrates. This work offers a bridge for R&D labs to overcome traditional manufacturing barriers efficiently and simply. UMass Lowell – Guinevere Strack  presents printed resistors for low-cost, sustainable, semi-additive PCBs . Guinevere explores the need for eco-friendly alternatives to conventional subtractive manufacturing that often result in excessive material waste and high production costs. The talk outlines how additive resistor printing can be integrated into sustainable PCB workflows. This solution provides a low-cost pathway for fabricating passive components directly on-board, enhancing the viability of semi-additive manufacturing. VTT – Tuomas Happonen  explores elastic multilayer printed circuits  manufactured via sheet-based processing. Tuomas explores the difficulty of creating sensitive, interference-tolerant elastic circuits that can withstand the mechanical rigors of wearable applications. The method involves stacking pre-perforated TPU films and curing conductive circuits with filled vias. This work offers a robust architecture for mixed-signal systems and RF applications that require high flexibility without sacrificing electrical performance. NoiseFigure Research – Dr. Manish Ojha  showcases high-resolution printed copper antennas  for flexible mmWave electronics. Manish explores the lack of flexible mmWave antennas capable of high resolution and speed for 24 GHz applications. Using screen printing with copper conductive inks on polyimide and alumina ribbon ceramics, a resolution of 50 µm was achieved. This work offers a proven method for integrating bare die chipsets with flexible antennas, showing strong agreement between simulation and measured performance. 🚨 Explore the   Full Agenda  and   Register  before 3 May when early bird rates expire

Andrew Stemmermann & John Yundt SunRay Scientific Inc. Wall Township, NJ USA andrew@sunrayscientific.com   johny@sunrayscientific.com SunRay Scientific Inc of Wall Township, NJ, USA continues to develop new and innovative technologies for electronic component assembly with their portfolio of novel ZTACH® ACE anisotropic conductive adhesives, printed conductive inks and dielectric and encapsulation materials. Introduction Today’s electronics manufacturers are confronted with a growing need for higher performance, lightweight, cost competitive, printed flexible hybrid electronics. This often requires the bonding of fine pitch components in high density and volumes. Factors for success include the capability of the conductive bonding technology to manage the pitch, bond strength requirements, cost constraints, and manufacturing throughput needs. Most available technologies employed in today’s FHE environment have limitations that can either hamper one or more of these important factors. Traditional component bonding technologies can struggle with the requirements for printed FHE applications. Solder, while very low cost and highly conductive, has limitations due to the required processing temperatures, brittle properties, and low bond strength. As a result, it will always require secondary encapsulation of the bonded component to ensure structural integrity. Silver-filled conductive adhesives (ECA) require patterning, which drastically limit component size and pitch, are heavily filled with silver powder or flake, which is detrimental to cost, and have very poor structural bond strength. As a result, they will also require a secondary process like underfill and/or edge encapsulant to provide additional mechanical strength and stress reduction. The result is a complex assembly process flow. When moving to high density or high volumes of fine pitch components, which require micro-dot dispensing of the ECA to properly pattern to limit potential shorting, results in very slow processing times for the material to be deposited, which dramatically reduces manufacturing throughput. Finally, Anisotropic Conductive Adhesive (ACA) or Anisotropic Conductive Film (ACF) can manage fine pitch very well, but typically involves the use of thermocompression bonding, an additional process step that could also be damaging to thin silicon chips or printed conductive traces. The equipment to do this can be very costly. The number of thermal compression heads on typical equipment will often limit the number of interconnections that can be bonded to 2-6 components per bond step, which can also drastically limit production throughput. We are exhibiting at The Future of Electronics RESHAPED in California, USA  on 10-11 June 2026  and in  Berlin  on 21-22 October 2026 . Please register to meet us in person and see our technology in action.  ZTACH® ACE, a patented anisotropic conductive adhesive system capable of bonding fine pitch components down to 100 microns at high density, can typically be over 1,000 components per sheet at one time, using a pressure-less, low temperature process which eliminates most of these constraints. Using the ZMAG® Magnetic Pallet to create magnetically aligned columns of unique ferromagnetic and highly conductive particles during the cure process, ZTACH® ACE creates a low contact resistance (.007 - .020 Ωcm), fine-pitch, anisotropic electrical interconnection, anywhere from 5-10x the bond strength of either solder or ECA. An illustration of this novel technology approach is shown in Figure 1 below: Figure 1:  Flip Chip assembly comparisons: traditional solder balls & underfill attachment (Left); Die attach with z-axis magnetically aligned conductive epoxy (Right) This technology utilizes a platform approach which gives SunRay the ability to utilize the most appropriate adhesive resin system for the requirements of the application. The patented, noble metal-plated, ferromagnetic particles are dispersed into the adhesive resin system; this includes a 2-part catalyzed epoxy for the thermally cured formulation, and a 1-part modified acrylate for the UV cured formula. Once the printed circuits are ready for component placement, either manually, or in an SMT process, ZTACH® ACE is deposited onto the component landing pads using an automated syringe dispensing system or printed with a conventional stainless steel open aperture stencil with no patterning for anode and cathode separation required. Next, as in any conventional SMT process, components are placed on top of ZTACH in a pick and place process and then placed directly onto the ZMAG® Magnetic Pallet where the ferromagnetic particles form z-axis magnetically aligned columns within seconds. The particles are held into fine pitch; tightly formed columns as the resin system is cured and fixed in place during the die-to-substrate cure process without any pressure applied. The formation of the columns during the curing process is illustrated in Figure 2. Because this technology uses such fine, precise particles to create these z-axis columns to form the conductive pathways, the formulations require dramatically less conductive particles (typically between 15-25%) to achieve low contact resistance interconnection. This results in a far higher percentage of adhesive resin, thus drastically higher bond strength than most conventionally used technologies in use today. This technology simplifies the assembly process to a single adhesive application, which provides both electrical interconnection and mechanical reinforcement. No additional underfill material is needed. Fine patterning is not required as the entire area of the component target location is deposited with epoxy. The device alignment process is more forgiving relative to solder ball-to-solder pad alignment. Z-axis columns align after component placement; magnetic pallet placement and cure are achieved. Thermal or UV curing methods complete the component attachment without any thermocompression (cure method is epoxy formulation dependent). Thermal curing occurs within the 80°C to 160°C temperature range. Figure 2:  X-Ray photos of Z-axis magnetically aligned particles in an Anisotropic Conductive Epoxy (ACE) The remainder of this article will outline recent project-based findings for high density LED and related component placement for backlighting on flexible films. Case Study 1 Printed Electronics contract manufacturers want to produce more complex, Flexible Hybrid Electronics devices, which need to meet both high-volume production speeds, while achieving strict mechanical and electrical requirements. The initial capabilities of ZTACH® ACE to successfully run product in a high-speed contract manufacturing SMT process for a wide range of printed FHE applications were initially validated on the production lines at a major global printed electronics contract manufacturer. Taking an existing product being run with a low-temperature solder process to bond 8 x 0402 LEDs onto a multi-layer silver ink printed flex circuit, the SunRay High-Throughput thermally cured formulation of ZTACH® ACE was put into the validation process. The incumbent low-temperature solder process was run at production speeds equating to 60 sheets per hour, 4 parts up per sheet, for a total of 32 LEDs per sheet. This required a reflow oven profile of 160°C, which equated to a tunnel transition time of 7 minutes. Once bonded, the parts would then be encapsulated with a standard UV cured glob-top encapsulant and put through a series of electrical and mechanical testing. Once the placement, stencil, and reflow processes were optimized for ZTACH® ACE, the final reflow profile was determined to be 135°C, for the same dwell time and production rate of 60 sheets per hour: a significant reduction in processing temperature required. We are Speaking at The Future of Electronics RESHAPED in California, USA  on 10-11 June 2026 . Please register to meet us in person, hear our talk and see our technology in action.  Testing included component voltage sweep to confirm electrical interconnections are meeting specifications: 100% of the LED’s lit with =/< 12% in voltage shift. An initial mechanical test was then conducted which included rolling a completed part under power, over a ¼ inch steel mandrel with a 1 kg weight attached at one end for 10 cycles. The specification was 100% of all LEDs remained illuminated throughout and after mandrel testing, with zero interruption to the fully illuminated state of all LEDs. Next, a comprehensive set of environmental and mechanical testing was conducted by a third-party testing lab on all parts built. These tests included salt fog (MIL STD-202F, 101D), heat and humidity (MIL-STD-202F, 103B), Thermal shock (MIL-STD-202F, 107G, and thermal aging (MIL-STD-202F, 108A), Mechanical vibration (MIL-STD-202F, 201A) and mechanical shock (MIL STD-202F, 107G). For all tests, the specification was zero failures of the bonded LEDs on each part. ZTACH® ACE passed all testing criteria and was qualified for manufacturing production at scale. But what was most compelling about these results where what ZTACH® ACE showed it could accomplish outside the specification. The existing requirements for this CM’s current production process called for all components to be encapsulated, because they reported unencapsulated parts built with their current process would typically FAIL nearly all the above testing anywhere from 50% to 100%. The decision was made to produce half the total parts built with ZTACH® ACE without the required encapsulation. Of those parts, 94% passed ¼ inch mandrel bend testing, 100% passed 85/85 testing, 100% passed mechanical shock, and 80% passed mechanical vibration, thermal aging, and salt-fog testing. This would be virtually impossible with unencapsulated solder or ECA as a bonding method. Table 1:  Shows additional highlights from this process Case Study 2 As the automobile industry increasingly shifts to hybrid and fully electrified vehicles, the need to conserve space and weight becomes more critical for manufacturers and drivers. According to a recent article in Semiconductor Engineering titled “Shedding Pounds in Automotive Electronics”, the traditional wire harnessing takes up a lot of space and weight even in compact cars. “The wiring harness is one of three heaviest subsystems in many vehicles—as much as 150 lbs. in highly contented vehicles—and it’s very typical for the average vehicle to have 100–120 lbs. of wire harness in the vehicle. These vehicles weigh on average around 3,500 lbs,” said Mentor’s Burcicki. “Today’s luxury cars contain some 1,500–2000 copper wires—totaling over 1 mile in length. To put that into perspective, in 1948, the average family car contained only about 55 wires, amounting to total length of 150 feet.” [1] With the growth in e-vehicle adoption and the weight those battery systems can reach, the need to trim weight to maintain or increase vehicle efficiency becomes even more focused. Like the traditional commercial aerospace concern…every ounce and inch cost money. The more automotive designers and manufacturers can leverage lighter weight, smaller, and lower current draw printed electronics into their vehicles, the more cost efficient they can be without sacrificing performance and design. Recent demand for printed flexible hybrid electronics in areas like Automotive interiors for Human Machine Interface (HMI) like capacitive touch controls, flexible, light weight heating, or flexible, light weight ambient lighting, is creating new and exciting opportunities for the printed electronics industry. Notable advances have been made with printed and in-mold electronics to be adapted into the vehicle compartment for these applications. However, the ability to make high reliability component attachments in a manner that can meet manufacturing throughput requirements remains an obstacle. Solder is cost effective and very conductive. It’s heavy, not environmentally friendly, requires higher temps to process which limits substrate options, and lacks structural integrity. Traditional silver filled conductive epoxies (ECAs) require precise patterning that cannot support placement of smaller fine-pitch components, or requires very precise, micro-dot dispensing that requires exceptionally long dispensing times, and the cure times can be too long for high throughput mfg. Additionally, due to the high percentage of conductive particles needed in ECAs, they also tend to be very low bond strength materials which require secondary encapsulation processes to ensure the structural integrity of bond. There is a cost issue with ECAs. The high loading percentage of silver used in most ECAs can lead to costs that exceed $2 or $3 per gram. This was prior to silver going from a 10-year average of ~$25 per ounce, to its current price of $67 per ounce, and the record high of $118 hit earlier in January of this year. The need for a more cost stable, lighter weight, higher bond strength adhesive system that can easily manage finer pitch, smaller components and be processed at the high-volume throughput rates is required by the automotive world. ZTACH® ACE, a pressure-less, anisotropic conductive adhesive system, can solve each of these issues. With a bond strength ranging from 5-10x that of solder or ECA, ZTACH® ACE is an exceptionally reliable electrical interconnect solution. It does not require patterning for small components with fine pitch, so standard screen depositing with a stainless-steel stencil makes very high-density, high-volume deposition in a matter of seconds a reality. SunRay has repeatedly demonstrated that this technology can handle over 1000 component placements per sheet in a typically configured production SMT process. The high throughput formulation can manage production rates of 60 sheets per hour at low process parameters of 135°C for 7 minutes. The conductive particle make up of ZTACH is in the range of 25-35% and of that, only 5-7% is silver, the cost of the material is not dependent on the fluctuation of silver cost. The density is so low that even when underfilling the entire component, the weight of ZTACH is dramatically less. This case study conducted by SunRay compared a typical ECA used for bonding a total of 100 Automotive LEDs (8 electrical pads each) - 100 × 0603 capacitors (2 terminations each) - Total interconnect locations: ~1,000 electrical joints onto a silver ink printed circuit part with a configuration of 400 mm x 500 mm for flexible ambient LED lighting. This resulted in considerable materials cost savings over traditional ECA materials, with lower contact resistance, greater throughput, and higher component bond integrity as illustrated in Table 2. Table 2 Conclusions The ability to deposit a novel anisotropic conductive adhesive via high-speed stencil printing for the bonding of fine pitch components in high density for increasingly complex FHE applications manufactured at high throughput is more feasible than ever before. ZTACH® ACE helps to enable the easier, low-cost adoption of this approach for the next generation of printed electronics. SunRay Scientific can provide technical and application support for new projects or applications with their experienced Engineering Team and full-scale SMT line capabilities. SunRay can also sell ZTACH® ACE Developer Kits that put this technology and the in-person training to deploy into your product development in your facility. These are being utilized now, enabling their customers to design and validate the processes and design rules allowing them to integrate ZTACH® ACE into their products for improvements in: Finer pitch interconnections that enable more functionality in smaller space Higher throughput for complex assemblies Higher density component placement Increased environmental and mechanical durability of electrical interconnections Ability to make complex bare die attach a reality for printed FHE New technology integration into your existing portfolio of capabilities [1] Semiconductor Engineering, March 12, 2019, Shedding Pounds in Automotive Electronics – SE Staff Join us at the flagship TechBlick events in California on 10-11 June 2026  + in Berlin on 21-22 October 2026 This event is the global hub for Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year, the event in California will also feature. The Future of Wearables Reshaped       The event in Berlin will also feature: Perovskite Connect , Sustainable Electronics RESHAPED , Electronic Textiles RESHAPED

21 & 22 OCT 2026 | Berlin Co-located with the  Electronics RESHAPED  conference and exhibition  Winter early bird rates expire end of this week (3 April 2026) Preliminary list of confirmed speakers Perovskite Connect 2026 is the most important conference and tradeshow dedicated to all aspects of the perovskite industry, bringing together the entire community from around the world in Berlin on 21 and 22 OCT 2026. Explore and Book This Week When Winter Early Birds Expire (3 April) Preliminary speaker list includes Oxford PV, Microquanta, Qcells, Caelux, Kunshan GCL Optoelectronic Material Co.,Ltd, Hust/WonderSolar, CubicPV,  Energy Material Corp, Power Roll, Bergfeld Lasertech, Homerun Energy, HB Fuller, imec, Helmholtz-Zentrum Berlin, Nano-C, Inc., PINA CREATION, Solar and Renewable Industry Leader, Tandem PV, Kalpana, Zentrum für Sonnenenergie-und Wasserstoff-Forschung Baden-Württemberg ZSW, Eternal Sun, Everlight, Nanyang Technological University, Unijet, etc. Learn more here Winter early bird rates expire end of this week (3 April 2026) Explore and Book This Week When Winter Early Birds Expire (3 April) The 2026 edition is building on the great success of Perovskite Connect 2025 which was a sell-out event with packed conference tracks and buzzing exhibition stands. This event is already established as the most important event of the year dedicated to perovskite technology.  The Perovskite Connect exhibition area is part of the  Eectronics RESHAPED  show in Berlin. There are only 4 available slots with 7 months to go to the event, demonstrating the strong demand for exhibition space. Learn more here about exhibition opportunities. Winter early bird rates expire end of this week (3 April 2026) Explore and Book This Week When Winter Early Birds Expire (3 April ) Testimonials (Perovskite Connect 2025) Swift Solar The turnout at Perovskite Connect was remarkable. Running the event alongside their “Future of Electronics” show, TechBlink brought two complementary industries together inside packed auditoriums that had lines reaching out through the doors. Microquanta 2025 is Microquanta’s first year entering international markets, and Perovskite-Connect has been a tremendous support along the way. The platform does a wonderful job connecting the perovskite community worldwide.  PINA Creation As exhibitors, Berlin Perovskite Connect 2025 delivered everything we hoped for and more. The quality of buyers, the depth of discussions, and the tremendous interest in our Nano Inks made it a truly rewarding experience. We’ve already booked our spots for next year. Perovskia Solar Perovskite-Connect 2025 was an excellent event, providing unparalleled access to key industry players and fostering invaluable discussions about the future of perovskite technology Nano-C It was great to see the industry enthusiasm at Perovskite Connect last week in Berlin. Inspiring presentations and great meetings with large-scale roll-outs of next-generation solar getting closer! Sofab Inks Perovskite Connect 2025 was a genuinely productive week in Berlin. The density of experts, manufacturers, and suppliers made it an excellent snapshot of where the industry is heading Solaires The Perovskite-Connect event was exceptional, successfully bringing together key perovskite and related materials companies to focus on the essential topic of industrial scaling.. Alpha Precision Systems   It was energizing to engage with leading researchers and industry innovators who are shaping the future of perovskite technologies.  ... and many more...

Polymer Thick Film (PTF) technology has played a significant role in printed electronics for more than forty years . By combining additive printing methods with advanced material innovation, PTF has enabled a wide range of electronic designs across industries. Although the underlying process is straightforward, effective use of PTF materials requires both technical understanding and practical experience.    To support continued learning  in this field, Heraeus Electronics is hosting a two‑day, on‑site workshop  at the Thick Film Application Center in Conshohocken, Pennsylvania. The workshop is open to participants across various roles and experience levels. Sessions will primarily focus on technical topics , including materials, processing, and application‑specific considerations.   The program includes small‑group seminars led by engineering experts, designed to strengthen participants’ understanding of PTF pastes and associated process steps. The workshop emphasizes practical   knowledge that can be applied directly to manufacturing and development activities.   Workshop components include: Technical Sessions:  where we share knowledge, practical insight, and innovative approaches to understanding the extensive world of thick film.  Hands-On Demonstrations:  that allow you to grasp the intricacies of the process and gain practical insights. In-Lab Activities:  guided hands-on exercises using our state-of-the-art equipment. Facility Tour:  highlighting our manufacturing process as well as our R&D capabilities. Networking Activity:  Group outing on the evening of April 21st to connect and engage in meaningful discussions with fellow participants.    To learn more about the workshop, visit: Printed Electronics Workshop 2026 . *Space is limited; submitting the interest form does not guarantee your placement We are exhibiting at The Future of Electronics RESHAPED in California, USA  on 10-11 June 2026  and in  Berlin  on 21-22 October 2026 . Please register to meet us in person and see our technology in action.   Join us at the flagship TechBlick events in California on 10-11 June 2026 + in Berlin on 21-22 October 2026 This event is the global hub for Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year, the event in California will also feature. The Future of Wearables Reshaped     The event in Berlin will also feature: Perovskite Connect , Sustainable Electronics RESHAPED , Electronic Textiles RESHAPED

In this newsletter you will find short highlights given at various editions of TechBlick's Future of Electronics RESHAPED conference and exhibitions. In particular you can learn about the following: Join us in Mountain View, Silicon Valley, in June at the latest edition of the Future of Electronics RESHARED event. This is the most important event of the year dedicated to Additive, Printed, Hybrid and Sustainable Electronic. Explore Agenda here https://www.techblick.com/electronicsreshapedusa Frederic Güth | Fraunhofer ENAS: How does the substitution of the structural unit in Parylene polymers affect their properties and application-specific fine-tuning? Ryojiro Tominaga | Fuji Corporation: How does the low-temperature sintering process impact the choice of conductive inks and substrate materials? Ryan Banfield | Heraeus Electronics: Why is a solderable polymer necessary when high-temperature fired materials have been available for decades? Paul Gaylo | Lockheed Martin: How does the miniaturization of electronic warfare systems impact mission capabilities? Alejandro Covalin | Spark Biomedical: How can 3D printing and printed electronics overcome the limitations of traditional manufacturing in wearable devices? Eric Wolf | Essemtec: How does Essemtec manage the complexities of dispensing non-Newtonian fluids with varying rheological properties? Allan Neville | Human Systems Integration, Inc.: How does the manufacturing process for integrating electronics into garments differ from traditional electronics manufacturing, and what are the key challenges in bridging these two worlds? Daniel Lacorte | Ames Goldsmith: How can manipulating precipitation process parameters affect the final particle morphology? Jonathan Chang | Panasonic: How does Panasonic's Fine Cross technology differ from conventional copper mesh processes? Ryota Shimizu | Satosen Co.,Ltd: How does repeated stretching lead to electrical failure in conventional stretchable PCBs? Dr. Shenqiang Ren | University of Maryland: How does the performance of this novel copper ink compare to commercially available alternatives under ambient sintering conditions? Denis Cormier | Rochester Institute of Technology: How does molten metal droplet jetting compare to traditional nanoparticle-based conductive inks? Dresden Integrated Center for Applied Physics and Photonic Materials - TU Dresden: What specific etching process is used to remove the basophil from the leaf, and how does this process affect the structural integrity of the remaining lignocellulose? Book before 15 March 2026 when winter early bird rates expire https://www.techblick.com/electronicsreshapedusa How can 3D printing and printed electronics overcome the limitations of traditional manufacturing in wearable devices? The speaker asserts that 3D printing, 3D electronics, and 3D manufacturing offer a distinct advantage in producing wearables. This stems from several key factors that address limitations inherent in traditional manufacturing processes. The ability to create inexpensive, ultra-thin, and flexible devices is paramount. The capacity of 3D-printed wearables to conform seamlessly to the body's contours is highlighted as a significant benefit. This adaptability enhances user comfort and device efficacy, particularly in medical applications where precise sensor placement and consistent contact are crucial. The speaker emphasizes that this approach is the optimal path forward for wearable technology. The convergence of 3D printing, advanced manufacturing techniques, and printed electronics is presented as the future of wearable device production. This synergy enables the creation of devices that are not only functional and cost-effective but also highly personalized and comfortable for the user. This is especially important in the context of women's health, where tailored solutions can address specific physiological needs. In this short video, you can learn: * The advantages of 3D printing and printed electronics in wearable manufacturing. * How these technologies enable the creation of inexpensive, flexible, and body-conforming devices. * The potential of this approach to revolutionize wearable technology, particularly in women's health. 📋 **Clip Abstract** The speaker advocates for 3D printing and printed electronics as the superior method for producing wearables due to their cost-effectiveness, flexibility, and ability to conform to the body. This approach is particularly relevant for women's health applications, where personalized and comfortable devices are essential. #3DPrinting, #PrintedElectronics, #WearableElectronics, #FlexibleElectronics, #DigitalHealth, #Bioelectronics This presentation was given by Alejandro Covalin from Spark Biomedical at The Future of Electronics RESHAPED USA | Boston 2025 conference and exhibition Join us next at the Computer History Museum in California at the largest and most important show in the USA dedicated to Additive, Hybrid, Wearable, Soft, Stretchable, InMold Electronics. Learn more here https://www.techblick.com/electronicsreshapedusa How does Essemtec manage the complexities of dispensing non-Newtonian fluids with varying rheological properties? Essemtec emphasizes the importance of understanding the rheology of dispensed materials, particularly the concept of shear thinning in thixotropic pastes. These materials, classified as non-Newtonian fluids, exhibit reduced viscosity under higher pressure. This behavior is critical in dispensing applications where pistons force material through an aperture. The system accounts for variables such as dispensing speed and temperature to determine the optimal open time for achieving desired dot sizes from small apertures. Essemtec collaborates with material companies to qualify specific parameters, acknowledging that these relationships are often non-linear and can result in complex rheological behaviors at different pressure levels. The shape of the particles within the paste also influences dispensing characteristics. Solder paste typically contains spherical particles, while conductive epoxies often feature silver in flake form, and structural glues may contain colloidal silica. Understanding these particle morphologies is crucial for achieving consistent and reliable dispensing results. In this short video, you can learn: * How shear thinning affects dispensing of non-Newtonian fluids. * The importance of material rheology in dispensing applications. * How particle shape influences dispensing characteristics. 📋 **Clip Abstract** This segment highlights Essemtec's approach to understanding and managing the rheological complexities of dispensing various materials, including the impact of shear thinning and particle morphology. It emphasizes the importance of qualifying material parameters for consistent dispensing results. #NonNewtonianFluids, #ShearThinning, #ParticleMorphology, #PrecisionDispensing, #SemiconductorManufacturing, #AdvancedPackaging This presentation was given by Eric Wolf from Essemtec at The Future of Electronics RESHAPED USA | Boston 2025 conference and exhibition Join us next at the Computer History Museum in California at the largest and most important show in the USA dedicated to Additive, Hybrid, Wearable, Soft, Stretchable, InMold Electronics. Learn more here https://www.techblick.com/electronicsreshapedusa How does the manufacturing process for integrating electronics into garments differ from traditional electronics manufacturing, and what are the key challenges in bridging these two worlds? The speaker highlights a significant challenge in the field: the integration of electronics into garments, specifically addressing the cultural and technological gap between the garment industry and the electronics industry. Garment manufacturing floors are not typically equipped or accustomed to handling electronics, which require different processes and expertise compared to traditional textile work. This disconnect poses a major hurdle in the seamless production of smart garments. The speaker emphasizes that the textile world lags behind the electronics industry by approximately 30 to 40 years in terms of technological advancement. However, there's a growing recognition and desire for collaboration between these two sectors. Organizations like NextFlex and AFFOA (Advanced Functional Fabrics of America) are actively promoting this integration, aiming to bridge the gap and foster innovation in the wearable technology space. The concept of Soft Electronics Assembly is introduced as a solution to streamline the integration process. This approach involves pre-assembling sensors and electronics into a single, manageable component before it reaches the garment manufacturing floor. This simplifies the manufacturing process and reduces the need for garment workers to handle individual electronic components, thereby mitigating potential errors and improving overall efficiency. In this short video, you can learn: * The challenges of integrating electronics into traditional garment manufacturing. * The technological gap between the textile and electronics industries. * The role of organizations like NextFlex and AFFOA in promoting collaboration. 📋 **Clip Abstract** This segment discusses the challenges of merging electronics manufacturing with garment production, highlighting the cultural and technological differences between the two industries and the efforts to bridge this gap through initiatives like Soft Electronics Assembly. It emphasizes the need for collaboration and innovation to advance the field of wearable technology. #SmartGarments, #WearableElectronics, #SoftElectronicsAssembly, #FunctionalFabrics, #WearableTech, #SemiconductorIntegration This presentation was given by Allan Neville from Human Systems Integration, Inc. at The Future of Electronics RESHAPED USA | Boston 2025 conference and exhibition Join us next at the Computer History Museum in California at the largest and most important show in the USA dedicated to Additive, Hybrid, Wearable, Soft, Stretchable, InMold Electronics. Learn more here https://www.techblick.com/electronicsreshapedusa How can manipulating precipitation process parameters affect the final particle morphology? The process begins with aqueous silver, typically silver nitrate, which is then reduced to form brown-based silver atoms. This reduction is generally achieved through a wet-based precipitation process, where nuclei are initially formed. These nuclei then develop into primary crystallites, which can be further grown using different surfactants or reducing agents. The manipulation of these surfactants and reducing agents allows for the creation of various morphologies and particle size distributions. By carefully controlling these parameters, the characteristics of the resulting silver particles can be tailored to specific application requirements. This level of control is crucial for optimizing the performance of the silver particles in printed electronics. The presenter highlights the ability to influence whether the resulting material is crystalline or polycrystalline in nature. This control is achieved by precisely manipulating the precipitation process parameters. This level of control is crucial for optimizing the performance of the silver particles in printed electronics. In this short video, you can learn: * The role of silver nitrate reduction in particle formation. * How surfactants and reducing agents influence particle morphology. * The impact of precipitation parameters on crystalline structure. 📋 **Clip Abstract** This segment details the wet-based precipitation process used to manufacture silver particles, emphasizing the control over particle morphology through manipulation of surfactants, reducing agents, and process parameters. It highlights the ability to create both crystalline and polycrystalline materials tailored for specific applications. #SilverNitrateReduction, #WetPrecipitationSynthesis, #ParticleMorphologyControl, #CrystallineStructureTuning, #PrintedElectronics, #SemiconductorMaterials This presentation was given by Daniel Lacorte from Ames Goldsmith at The Future of Electronics RESHAPED USA | Boston 2025 conference and exhibition Join us next at the Computer History Museum in California at the largest and most important show in the USA dedicated to Additive, Hybrid, Wearable, Soft, Stretchable, InMold Electronics. Learn more here https://www.techblick.com/electronicsreshapedusa How does Panasonic's Fine Cross technology differ from conventional copper mesh processes? Panasonic's Fine Cross technology involves a unique process of creating grooves on PET or PC materials. Copper is then deposited within these grooves. This is achieved through a roll-to-roll manufacturing process, enabling the production of very long rolls of the material. The process also supports the creation of two-layer structures, with patterns on both the top and bottom layers. The key differentiator of this technology is the embedding of the copper within the substrate, as opposed to conventional copper mesh processes where the copper sits on top. This embedding results in a smoother surface. Furthermore, the technology allows for the creation of very narrow, two-micron width lines, contributing to higher transparency compared to conventional solutions. The roll-to-roll nature of the process allows for scalability and cost-effectiveness in manufacturing. The ability to create customizable patterns and multi-layer structures expands the range of potential applications for the technology. This approach offers a balance between conductivity, transparency, and surface smoothness, making it suitable for various applications. In this short video, you can learn: * The core manufacturing process of Fine Cross technology. * How Fine Cross differs from traditional copper mesh. * The advantages of Fine Cross in terms of surface smoothness and transparency. 📋 **Clip Abstract** This segment details Panasonic's Fine Cross technology, highlighting its unique groove-based copper embedding process and its advantages over conventional copper mesh. The roll-to-roll manufacturing and customizable patterns are also discussed. #FineCrossTechnology, #CopperEmbedding, #RollToRollManufacturing, #MicronLineWidth, #TransparentConductors, #FlexibleElectronics This presentation was given by Jonathan Chang from Panasonic at The Future of Electronics RESHAPED USA | Boston 2025 conference and exhibition Join us next at the Computer History Museum in California at the largest and most important show in the USA dedicated to Additive, Hybrid, Wearable, Soft, Stretchable, InMold Electronics. Learn more here https://www.techblick.com/electronicsreshapedusa How does repeated stretching lead to electrical failure in conventional stretchable PCBs? Conventional stretchable PCBs, whether utilizing meandering copper traces or printed silver paste, face durability challenges under repeated stretching. While silver paste allows for straight patterns and higher design density compared to the complex shapes required for copper, both materials exhibit a common failure mode. This failure manifests as an increase in resistance after repeated stretching cycles, ultimately leading to electrical discontinuity. The root cause of this resistance increase lies in the formation and propagation of cracks within the conductive material. As the PCB undergoes repeated stretching, micro-cracks initiate and grow, disrupting the conductive pathways. This crack formation is exacerbated by the inherent limitations of copper and silver paste in withstanding tensile stress, leading to a gradual degradation of electrical performance. The presenter highlights that while the resistance fluctuates with each stretch and release cycle, the critical issue is the continuous upward trend in resistance over time. This trend signifies irreversible damage accumulation, eventually resulting in an open circuit and rendering the PCB unusable. This limitation restricts the lifespan and warranty potential of current stretchable PCB technologies. In this short video, you can learn: * The limitations of copper and silver paste in stretchable PCBs. * How repeated stretching leads to crack formation and increased resistance. * Why current stretchable PCBs have limited durability and short lifespans. 📋 **Clip Abstract:** This segment explains the failure mechanisms in conventional stretchable PCBs due to repeated stretching, focusing on crack formation and resistance increase in conductive materials. It highlights the limitations of current technologies and sets the stage for introducing liquid metal as a solution. #StretchablePCBs, #CopperTraces, #SilverPaste, #ElectricalFailureMode, #FlexibleElectronics, #WearableTech This presentation was given by Ryota Shimizu from Satosen Co.,Ltd at The Future of Electronics RESHAPED USA | Boston 2025 conference and exhibition Join us next at the Computer History Museum in California at the largest and most important show in the USA dedicated to Additive, Hybrid, Wearable, Soft, Stretchable, InMold Electronics. Learn more here https://www.techblick.com/electronicsreshapedusa How does the performance of this novel copper ink compare to commercially available alternatives under ambient sintering conditions? The speaker presents a comparison between their copper ink and a commercially available copper ink. Both inks were screen-printed onto paper substrates and sintered in open air using lamps. The speaker emphasizes the simplicity of their copper ink's processing, highlighting that it can be cured and dried in less than 30 seconds in ambient conditions. The speaker's copper ink achieved a sheet resistance of approximately 35 milliohms per square after open-air sintering. While acknowledging that this is not yet comparable to silver inks, the speaker notes that there is still room for improvement. In contrast, the commercial copper ink, when subjected to the same printing and sintering conditions, exhibited sheet resistance values in the megaohm range, significantly higher than the speaker's ink. The speaker highlights the visible difference in color between their ink and the commercial ink after sintering, suggesting a difference in the resulting copper film's properties. The speaker also mentions a live demonstration at the exhibits, inviting attendees to observe the printing process firsthand. In this short video, you can learn: * The speaker's copper ink can be sintered in open air in less than 30 seconds. * The speaker's copper ink achieves a sheet resistance of approximately 35 milliohms per square after open-air sintering. * The commercial copper ink exhibited sheet resistance values in the megaohm range under the same conditions. 📋 **Clip Abstract:** This segment showcases a direct comparison between the speaker's copper ink and a commercial alternative, highlighting the superior performance of the speaker's ink in terms of sheet resistance after open-air sintering. The speaker emphasizes the simplicity and effectiveness of their ink's processing. #CopperInk, #AmbientSintering, #SheetResistance, #PrintedElectronics, #FlexibleElectronics, #IoTDevices This presentation was given by Dr. Shenqiang Ren from University of Maryland at The Future of Electronics RESHAPED USA | Boston 2025 conference and exhibition Join us next at the Computer History Museum in California at the largest and most important show in the USA dedicated to Additive, Hybrid, Wearable, Soft, Stretchable, InMold Electronics. Learn more here https://www.techblick.com/electronicsreshapedusa How does molten metal droplet jetting compare to traditional nanoparticle-based conductive inks? The speaker describes a metal droplet jetting process where metal wire or rod is fed into a micro-crucible, melted, and then ejected as molten metal droplets onto a moving substrate. This process differs significantly from traditional printed electronics methods that rely on nanoparticle-based conductive inks. The key distinction lies in the material state upon deposition; molten metal solidifies directly, eliminating the need for post-processing steps like drying or curing, which are essential for nanoparticle inks to achieve conductivity. The initial application of this technology was for metal additive manufacturing, specifically aluminum parts, rather than printed electronics. However, the speaker's team began exploring the possibility of using it for printing aluminum traces and subsequently transitioning to copper and silver. This shift required modifications to the system, including software adjustments for path planning based on Gerber files instead of STL files used in 3D printing. The transition to copper and silver also necessitated optimizing print parameters to achieve desired line quality and conductivity. A significant advantage of this method is the potential to achieve conductivity levels comparable to bulk copper, which is crucial for applications requiring high current carrying capacity. This is attributed to the formation of solid core metal lines, contrasting with the often porous and less conductive structures formed by sintered nanoparticle inks. In this short video, you can learn: * The fundamental difference between molten metal jetting and nanoparticle ink printing. * The adaptations required to repurpose a metal AM system for printed electronics. * The potential for achieving bulk-like conductivity in printed traces using this method. 📋 **Clip Abstract** This segment introduces molten metal droplet jetting as an alternative to nanoparticle inks, highlighting its potential for high conductivity and the modifications needed to adapt a metal AM system for printed electronics applications. #MoltenMetalJetting, #DirectMetalPrinting, #BulkConductivity, #NanoparticleInks, #PrintedElectronics, #CircuitFabrication This presentation was given by Denis Cormier from Rochester Institute of Technology at The Future of Electronics RESHAPED USA | Boston 2025 conference and exhibition Join us next at the Computer History Museum in California at the largest and most important show in the USA dedicated to Additive, Hybrid, Wearable, Soft, Stretchable, InMold Electronics. Learn more here https://www.techblick.com/electronicsreshapedusa What specific etching process is used to remove the basophil from the leaf, and how does this process affect the structural integrity of the remaining lignocellulose? The speaker introduces the motivation behind using leaves as a substrate for printed electronics, driven by concerns about electronic waste. A PhD student's research highlighted the vast amount of untracked e-waste, leading to the exploration of alternative, more sustainable substrates. The initial focus was on finding alternatives for printing processes, eventually leading to the investigation of leaves as a potential source material. The complex structure of a leaf, including the basophil, skin, and vascular structure, presents challenges for direct printing. However, the stable vascular structure, composed of lignin and cellulose, remains after removing the green material (basophil) through etching. This resulting lignocellulose structure exhibits quasi-fractal properties, making it suitable for substrate technology. In this short video, you can learn: * The environmental motivation for exploring leaves as a substrate. * The structural components of a leaf and the process of removing the basophil. * The composition and properties of the remaining lignocellulose structure. 📋 **Clip Abstract** This segment highlights the initial motivation for using leaves as a substrate for printed electronics, focusing on the environmental concerns related to e-waste and the structural properties of leaves that make them a viable alternative. #LeafEtching, #BasophilRemoval, #LignocelluloseSubstrate, #BiomaterialProcessing, #PrintedElectronics, #SustainableSubstrates This presentation was given by Dresden Integrated Center for Applied Physics and Photonic Materials - TU Dresden at The Future of Electronics RESHAPED 2025 conference and exhibition Join us next at the Computer History Museum in California at the largest and most important show in the USA dedicated to Additive, Hybrid, Wearable, Soft, Stretchable, InMold Electronics. Learn more here https://www.techblick.com/electronicsreshapedusa How does the substitution of the structural unit in Parylene polymers affect their properties and application-specific fine-tuning? Parylene is a group of polymers with interesting properties, including being a dielectric, chemically inert, and biocompatible. The material is based on the same structural unit, but different variants of Parylene can be achieved through substitution. This allows for fine-tuning the material's properties to suit specific applications. The deposition of Parylene is always the same, involving a three-phase gas phase deposition process, specifically chemical vapor deposition (CVD). This process occurs in a chamber at low pressures and room temperature, enabling the coating of temperature-sensitive materials. The result is a thin layer with a thickness that can be varied by adjusting the duration of the process. Due to its gas phase deposition, the coating is highly conformal, allowing for coating of complex 3D structures. These properties, combined with the pinhole-free nature of the thin Parylene layers, make it suitable for various applications. The material can also be structured through laser ablation or oxygen plasma etching to remove Parylene where needed. In this short video, you can learn: * The fundamental properties of Parylene polymers. * How chemical substitution enables property fine-tuning. * The specifics of the Parylene deposition process. 📋 **Clip Abstract:** This segment introduces Parylene, highlighting its tunable properties through chemical substitution and the specifics of its gas-phase deposition process, emphasizing its conformality and suitability for coating temperature-sensitive materials. #ParylenePolymers, #ChemicalVaporDeposition, #PropertyTuning, #ConformalCoating, #SemiconductorManufacturing, #AdvancedPackaging This presentation was given by Frederic Güth from Fraunhofer ENAS at The Future of Electronics RESHAPED 2025 conference and exhibition Join us next at the Computer History Museum in California at the largest and most important show in the USA dedicated to Additive, Hybrid, Wearable, Soft, Stretchable, InMold Electronics. Learn more here https://www.techblick.com/electronicsreshapedusa How does the low-temperature sintering process impact the choice of conductive inks and substrate materials? The HPM-300DI system utilizes a two-module approach, integrating pick-and-place functionality with a printing module. The printing module initially deposits a UV-curable dielectric material using a 600 DPI inkjet system, followed by UV exposure for hardening. Subsequently, the same inkjet system prints a silver conductive ink onto the dielectric surface. The printed silver ink undergoes a drying and sintering process at a relatively low temperature. This low-temperature sintering is a critical aspect of the process, enabling the creation of conductive circuits on the substrate. The process is repeated to build up multi-layer circuits. This additive manufacturing approach allows for the creation of material circuits through a fully digital process. The system's capabilities are being evaluated with partners to explore various applications, including 2D substrate prototyping and the fabrication of novel 3D geometry devices. In this short video, you can learn: * The two-module architecture of the HPM-300DI system. * The process of printing dielectric and conductive layers. * The importance of low-temperature sintering for circuit formation. 📋 **Clip Abstract** The clip details the core printing and curing process of the HPM-300DI, highlighting the use of UV-curable dielectrics and low-temperature sintered silver conductive inks. It emphasizes the system's ability to create multi-layer circuits through a fully additive digital manufacturing process. #LowTempSintering, #ConductiveInk, #UVCurableDielectric, #AdditiveManufacturing, #PrintedElectronics, #SemiconductorManufacturing This presentation was given by Ryojiro Tominaga from Fuji Corporation at The Future of Electronics RESHAPED 2025 conference and exhibition Join us next at the Computer History Museum in California at the largest and most important show in the USA dedicated to Additive, Hybrid, Wearable, Soft, Stretchable, InMold Electronics. Learn more here https://www.techblick.com/electronicsreshapedusa Why is a solderable polymer necessary when high-temperature fired materials have been available for decades? The speaker introduces the concept of a solderable polymer material and poses the question of its necessity, given the existing high-temperature fired materials. He highlights his extensive experience in the printed electronics industry, spanning approximately 25 years. He notes that since the advent of the membrane switch in the mid-1970s, the industry has been aiming to replace traditional subtractive technology. However, the speaker argues that the focus should shift from replacement to augmentation and support. He suggests leveraging the knowledge and advancements from the traditional technology industry and integrating them into the printed electronics sector. The core limitation of the polymer thick film industry, according to the speaker, lies in solderability. The ability to attach components directly to the substrate has been restricted to two-part or one-part epoxy-based materials, which present challenges such as long pot life, viscosity changes over time, evolving processing parameters, extended cure cycles, and low attachment rates. The speaker asserts that solder, in every aspect, is superior to epoxy-based materials due to its snap cure, higher conductivity, enhanced mechanical strength, and improved reliability in demanding applications. In this short video, you can learn: * The historical context of printed electronics and its relationship with subtractive technologies. * The limitations of epoxy-based materials in printed electronics applications. * The advantages of solder over epoxy in terms of performance and reliability. 📋 **Clip Abstract:** This segment introduces the need for solderable polymers by contrasting them with existing solutions like epoxies and high-temperature materials, highlighting the limitations of current approaches in printed electronics. It sets the stage for understanding the benefits of the new material. #SolderablePolymer, #PolymerThickFilm, #ComponentAttachment, #EpoxyAdhesives, #PrintedElectronics, #ElectronicPackaging This presentation was given by Ryan Banfield from Heraeus Electronics at The Future of Electronics RESHAPED 2025 conference and exhibition Join us next at the Computer History Museum in California at the largest and most important show in the USA dedicated to Additive, Hybrid, Wearable, Soft, Stretchable, InMold Electronics. Learn more here https://www.techblick.com/electronicsreshapedusa How does the miniaturization of electronic warfare systems impact mission capabilities? The core enabler of the mission described is the dramatic reduction of size, weight, and power (SWaP) of electronic warfare systems. This involves scaling down systems that once occupied the space of a refrigerator to the size of a hockey puck. This miniaturization is achieved through the integration of state-of-the-art, US-built microelectronics. This advancement allows for the delivery of 21st-century digital technologies, ensuring service members remain ahead of emerging threats. The technology focuses not only on efficiency but also on enhancing the effectiveness of defense systems. This includes faster threat detection, higher accuracy, and advanced electronic defense capabilities. The reduction in SWaP enables the deployment of advanced electronic warfare capabilities on platforms with limited space and power resources. This enhances the overall effectiveness of defense systems by providing faster threat detection, higher accuracy, and advanced electronic defense capabilities. The miniaturized systems act as force multipliers, significantly enhancing the capabilities of service members. In this short video, you can learn: * The impact of SWaP reduction on electronic warfare systems. * The role of advanced microelectronics in achieving miniaturization. * How miniaturization enhances threat detection and defense capabilities. 📋 **Clip Abstract** This segment highlights the significance of miniaturizing electronic warfare systems through advanced microelectronics, enabling enhanced capabilities in smaller, lighter, and more power-efficient packages. The result is faster threat detection, higher accuracy, and improved electronic defense. #ElectronicWarfareMiniaturization, #SWaPReduction, #MicroelectronicsIntegration, #DigitalDefense, #DefenseTech, #MilitaryApplications This presentation was given by Paul Gaylo from Lockheed Martin at The Future of Electronics RESHAPED 2025 conference and exhibition Join us next at the Computer History Museum in California at the largest and most important show in the USA dedicated to Additive, Hybrid, Wearable, Soft, Stretchable, InMold Electronics. Learn more here https://www.techblick.com/electronicsreshapedusa

MicroLED Connect and AR/VR Connect 16 & 17 September 2026 | High Tech Campus, Eindhoven, Netherlands   MicroLED Connect and AR/VR Connect are the most important dedicated conferences and exhibitions in these fields still taking place this year, bringing together the entire industry and applied research community from around the globe.   👉Organised by TechBlick and MicroLED Association 👉Supported by Optica, EPIC Photonics, and Karl Guttag 👉375+ Participants 👉25+ Exhibitors 👉50+ Talks 👉8 Masterclasses 👉3 Tours 👉And a year-round program of curated online events A Look Back to 2025. Significant Growth in MicroLED Connect and AR/VR Connect  MicroLED Connect and AR/VR Connect 2025 was a huge success registrating over 30% YoY growth.   The program was world-class, featuring the likes of Google, Jade Bird Display, Lynx, Avegant, ASML, Swave Photonics, Brilliance RGB, Aledia, Mojo Vision and many more.   The participation was excellent too, including Apple, Meta, GoogleSamsung, Samsung Displays, Tianma, Sony, ASML, Huawei, Applied Materials, Bosch, Sensortec, GlobalFoundries, Lam Research, Thales, BAE Systems, Anduril Industries, Nokia, EssilorLuxotticaValeo, Garmin, ams-OSRAM, Haylo Ventures, ITEC B.V., Jabil Optics,  Fielmann Ventures GmbH, Sioux Technologies, and more A Look Back to 2024. The First Ever MicroLED Onsite Conference & Exhibition  MicroLED Connect 2024 was a huge success with superb participation and fantastic customer feedback - despite the ups and downs of the industry.   The program was world-class, featuring the likes of Google, Continental, Meta, TCL CSOT, Globalfoundries, and others.   The participation was excellent too, including Google, Mercedes-Benz, AUO, Samsung Electronics, Tianma, Swatch Group, Continental Corporation, GlobalFoundries, Huawei Technologies, Kulicke & Soffa, Infineon Technologies, Sony,  TCL CSOT, Konica Minolta, Toray Engineering, Coherent, Aixtron, Jabil Optics, ITEC B.V., ams Osram,  imec.xpand, Omdia, CEA-Leti,  Carux (Innolux),  Samsung Display, Snap Inc, Lam Research, Samsung Venture Investment,  Collins Aerospace, Garmin, Lumileds, and many more 2026: Growth of MicroLED Connect + Launch of AR/VR Connect  In 2026 we expect further growth at both MicroLED Connect and AR/VR Connect. We will also launch Optical I/O Connect! Stay Tuned! This show is now an established high-quality event and a firm fixture of the calender for the industry. Confirmed speakers already include Meta, Google, Sony, Applied Materials, EssilorLuxottica, Avicena, UC Santa Barbara, University of Rochester, Hongshi Intelligence and others. See here . Book Your Exhibition Packages It is time to book your spot to exhibit at MicroLED Connect and AR/VR Connect. The booth spaces are assigned on a first come first served basis. The spaces are very limited.  Our unique packages offer 👉Onsite exhibition 👉Conference attendance 👉Onsite talk (depending on package) 👉Online talk 👉Email marketing 👉Virtual booth 👉Annual passes 👉and moreThe floorplan below shows the available spaces (white). All others are already booked or reserved If interested please contact khasha@techblick.com

Mention droplet dispensing and you may immediately think of lab-on-a-chip (LoC) devices. Indeed, LoC devices rely on droplet dispensing systems or pipettes to distribute liquids for disease diagnostics. However, the application of droplet dispensing extends beyond life sciences. It finds various applications in consumer electronics (home inkjet printers), optics (lens arrays for fiber optics), life sciences (LoC systems, medical inhalers) as well as electronics manufacturing (dispensing solder droplets for flip chip bonding — attaching semiconductor chips to a substrate by flipping them onto tiny solder bumps) [1]. How does droplet dispensing work? Dispensing droplets manually involves using a syringe or micropipette to release individual droplets, and is common in laboratories for liquid handling. Micropipettes are engineered to deliver highly reproducible volumes and can reduce human variability, but achieving this precision requires proper technique and therefore subject to inter‑individual imprecision [2]. Automated droplet dispensing systems, in contrast, offer superior reliability by accurately jetting (drop-on-demand jetting systems ) or extruding ( direct ink writing  systems) single discrete volumes of materials from a nozzle to a precise location. The target volume of each drop can range widely, from picoliters in microelectronics to microliters in lab applications. Achieving consistent volume is crucial in droplet dispensing for accuracy and reproducibility [3]. Droplet dispensing applications Electronics manufacturing Potting electronics Molten lead-free solder droplets dispensed with 100 µm spacing © Wang, C.-H. et al. , CC BY 4.0 Droplet dispensing plays a critical role in electronic packaging. For example, advanced micro droplet dispensers use piezoelectric or magnetostrictive actuation to jet precise adhesive or encapsulant droplets [4]. This has significantly improved the consistency and placement of the smaller droplets, increasing assembly speed and supporting higher-density, miniaturized devices [5]. Another key application in electronics manufacturing is solder droplet printing for circuit assembly. One demonstrated system [6] uses a heated pneumatic printhead to directly jet molten solder droplets onto PCB pads, where they solidify to form electrical interconnects. Such droplet-based metallization methods (including solder jetting and nanoparticle ink printing) avoid the steps of reflow ovens or wire bonding, potentially streamlining electronics assembly [6]. Optics Printed thermally activated delayed fluorescence droplets in 4 × 4 mm 2  square patterns with 200 DPI, adapted from © Kant, C., et al . , CC BY 4.0 In the optics and display industry, droplet dispensing technologies are used to fabricate fine optical structures and deposit light-emitting materials with great control. Inkjet printing of display layers has emerged as a promising alternative to vapor deposition in OLED and quantum-dot displays. Solutions of organic light-emitting or quantum dot materials are dispensed as microliter droplets into millions of pixel wells, then cured to form uniform thin films [7]. Another optical application is making microlens arrays (MLAs), used to enhance light extraction or sensing in miniaturized cameras, 3D displays, and sensors. By jetting or printing UV-curable polymer droplets to form a smooth micro-lens, droplet dispensing bypasses molding steps and allows high fill-factors over large areas, enabling rapid prototyping of optics on flat or flexible substrates [8]. In-vitro diagnostics (IVD) The construction of an immunodiagnostic chip supporting the movement of reagent droplets, adapted from © Hu, X., el al ., CC BY 4.0 In lab-on-a-chip assembly and operation, droplet-based systems precisely manipulate microliter and nanoliter droplets of fluids for assays. For example, a recent platform [9] demonstrated fully automated immunoassays by using magnetic beads to shuttle droplets between processing steps, running multiple tests in parallel on a disposable chip, and achieved sensitivities comparable to conventional lab methods.  Unlike continuous-flow microchannels, droplet-based approaches in point-of-care testing minimize sample volume, cut assay time, and allow in situ integration of functions (mixing, incubation, detection) that would otherwise require bulky instruments. They also provide a controlled, contamination-limited environment for biochemical reactions [10]. We are exhibiting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026 and in Berlin  on 21-22 October 2026 . Please register to meet us in person and see our technology in action. Bioprinting Bioprinting process © Ng, W. L., & Shkolnikov, V ., CC BY 4.0 Beyond diagnostics, droplet dispensing has a broad spectrum of expansive applications in the life sciences. In bioprinting, for example, droplet dispensing systems deposit bioink droplets containing living cells, growth factors, or other biomaterials to fabricate tissues and organoids (lab-grown miniature organs/tissues), achieving precise placement of cells at high speed [11]. This precise spatial control supports the recreation of cellular microenvironments, which is essential for studying cell-to-cell interactions, disease progression, and tissue regeneration [11]. Key considerations of droplet dispensing As seen in the applications above, a wide variety of materials can be dispensed as droplets, from metals and functional nanomaterials to polymers and bioinks. However, dispensing materials at micro to nanoliter scales comes with several important considerations. Clogging: Dried residue from volatile solvents or particulate matter in the fluid can block nozzles. In addition to frequent cleaning, it may be necessary to adjust material viscosity using additives or by changing the temperature. Inconsistency in placement and volume: Droplet volume can drift due to changes in printing parameters (e.g., drawback force) [12]. Air currents, static charge on the substrate, or inconsistent drop velocities can also affect placement. Choosing a high-precision droplet dispenser and implementing environmental controls, such as using an enclosure, are critical for consistent results. To learn more about dispensing best practices, check out How to Dispense Adhesives . Conclusion Droplet dispensing is increasingly important in electronics manufacturing and the life sciences, enabling precise miniaturization. Recent work [13] suggests that adaptive intelligent control will be key to maintaining consistent droplet formation and ejection characteristics, and future advances may allow dispensers to self-tune to different liquids for optimal performance. Ready to learn more about materials dispensing? Explore these resources: Blog: What Is Dot Dispensing? Blog: What Are Precision Fluid Dispensing Systems? Application overview: Solder Paste Printing Looking for proof-of-concept of your droplet dispensing applications? Book a meeting  to speak with one of Voltera’s technical representatives. References [1] Lindemann, T., & Zengerle, R. (2008). Droplet Dispensing. Encyclopedia of Microfluidics and Nanofluidics , 402–411. https://doi.org/10.1007/978-0-387-48998-8_361 .  [2] Lippi, G., Lima-Oliveira, G., Brocco, G., Bassi, A., & Salvagno, G. L. (2017). Estimating the intra- and inter-individual imprecision of manual pipetting. Clinical Chemistry and Laboratory Medicine (CCLM) , 55(7). https://doi.org/10.1515/cclm-2016-0810 .  [3] Nikapitiya, N. Y. J. B., Nahar, M. M., & Moon, H. (2017). Accurate, consistent, and fast droplet splitting and dispensing in electrowetting on dielectric digital microfluidics. Micro and Nano Systems Letters , 5(1). https://doi.org/10.1186/s40486-017-0058-6 .    [4] Zhou, C., Li, J. H., Duan, J. A., & Deng, G. L. (2015). The principle and physical models of novel jetting dispenser with giant magnetostrictive and a magnifier. Scientific Reports , 5(1). https://doi.org/10.1038/srep18294 .  [5] Nature Research Intelligence. (n.d.). Fluid Dispensing and Microelectronics Packaging . https://www.nature.com/research-intelligence/nri-topic-summaries/fluid-dispensing-and-microelectronics-packaging-micro-82301 .  [6] Shu, Z., Fechtig, M., Florian Lombeck, Breitwieser, M., Zengerle, R., & Koltay, P. (2020). Direct Drop-on-Demand Printing of Molten Solder Bumps on ENIG Finishing at Ambient Conditions Through StarJet Technology. IEEE Access , 8, 210225–210233. https://doi.org/10.1109/access.2020.3040035 .  [7] Xiong, J., Chen, J., Li, Y., Yue, X., Fu, Y., & Yin, Z. (2025). Large-area OLED substrate printing path planning method based on multi-head GAT imitation learning to solve partitioned integer programming. Scientific Reports , 15(1). https://doi.org/10.1038/s41598-025-08355-x . [8] Zhong, L., Liu, W., Gong, H., Li, Y., Zhao, X., Kong, D., Du, Q., Xu, B., Zhang, X., & Liu, Y. J. (2025). Electrohydrodynamically Printed Microlens Arrays with the High Filling Factor Near 90%. Photonics , 12(5), 446–446. https://doi.org/10.3390/photonics12050446 .  [9] Hu, X., Gao, X., Chen, S., Guo, J., & Zhang, Y. (2023). DropLab: an automated magnetic digital microfluidic platform for sample-to-answer point-of-care testing—development and application to quantitative immunodiagnostics. Microsystems & Nanoengineering , 9(1), 1–12. https://doi.org/10.1038/s41378-022-00475-y .  [10] Trinh, T. N. D., Do, H. D. K., Nam, N. N., Dan, T. T., Trinh, K. T. L., & Lee, N. Y. (2023). Droplet-Based Microfluidics: Applications in Pharmaceuticals. Pharmaceuticals , 16(7), 937. https://doi.org/10.3390/ph16070937 . [11] Ng, W. L., & Shkolnikov, V. (2024). Jetting-based bioprinting: process, dispense physics, and applications. Bio-Design and Manufacturing , 7(5), 771–799. https://doi.org/10.1007/s42242-024-00285-3 . [12] Wang, W., Chen, J., & Zhou, J. (2016). An electrode design for droplet dispensing with accurate volume in electro-wetting-based microfluidics. Applied Physics Letters , 108(24). https://doi.org/10.1063/1.4954195 .  [13] Jiang, J., Chen, X., Mei, Z., Chen, H., Chen, J., Wang, X., Li, S., Zhang, R., Zheng, G., & Li, W. (2024). Review of Droplet Printing Technologies for Flexible Electronic Devices: Materials, Control, and Applications. Micromachines , 15(3), 333. https://doi.org/10.3390/mi15030333 . Join the flagship TechBlick events in California on 10-11 June 2026 , and in Berlin on 21-22 October 2026 This event is the global home of the Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year, the events will also feature. In California: The Future of Wearables Reshaped    In Berlin: Perovskite Connect , Sustainable Electronics RESHAPED , Electronic Textiles RESHAPED

When: 10 & 11 June 2026 Where: Computer History Museum, Mountain View, California Register before 15 March 2026 for early bird rates  The Largest and Most Important Additive Electronics Show in North America! This is the most  important and the largest conference and exhibition  in North America dedicated to additive, printed, flexible, hybrid, wearable, stretchable, soft electronics. Exhibition floor : Almost sold out.  Agenda:  Shaping up to be our strongest yet. Featuring:  NextFlex Innovation Days  Co-locating:  Wearables RESHAPED Exhibition Floor Almost Sold Out ­ The exhibition floor is almost sold out with over 90% of the available spots booked. Act now and book your place! Visit here to download the info package including detailed pricing and benefits descriptions. Tom Keenan will also be your primary point of contact (tom@techblick.com) The Only Truly Global Package Worldwide Our packages are the only truly global option, combining the opportunity to exhibit in the USA and Europe with year-round global digital marketing and engagement. The key benefits include: Onsite exhibition (California  and/or  Berlin shows) 2 or more full onsite conference & exhibition passes 6 or more annual online passes Onsite talk (silver and gold packages only) Online talk Email marketing Social media support Virtual booth

Printed electronics often involve touch applications on flexible transparent films, which creates a demand for transparent conductive materials. Integration of ICs enables the control of capacitive touch functionality, combined with serial communication protocols such as I2C or USB. This allows for much smaller and more efficient connections than traditional solutions using bulky cables. DoMicro is capable of making Flexible Hybrid Electronic touch applications with screen-printed transparent PEDOT electrodes, inkjet printed silver circuitry and Anisotropic Conductive Adhesive ( ACA) bonded components. This paper focusses on the integration processes of printed transparent conductive polymer polyethylene dioxythiophene (PEDOT:PSS).   Human machine interfaces and control displays should be easy to understand for the operator. Highlighting essential information depending on mode or status of the equipment creates a focussed and minimal atmosphere without distraction. Visual appearance and coloured feedback of touch icons by RGB controlled backlight LED’s is featured by transparent capacitive touch technology in Flexible Hybrid Electronics (FHE) circuitry. A FHE-Touch foil integrated with a FPCA-LED assembly enables a fully flat, flexible interface system that can be integrated in curve products and surfaces. Touch icon buttons can be completely hidden or made invisible when backlight is switched off. Figure 1 - User interface by Metafas Application demonstrator Figure 1 shows a user interface with capacitive touch buttons to use with backlighting. The FHE module is placed on top of a flexible FPC with RGB-LEDs that will respond to the touch actuation. The product is made by a combination of screen-printed PEDOT touch electrodes and inkjet printed silver traces. The transparency of PEDOT electrodes allows for the backlighting and lightguide. Figure 2 shows this transparency of the blueish PEDOT electrodes printed on a PEN film. Figure 2 The transparency and conductivity of the PEDOT electrodes depends on the layer thickness. This sample has a PEDOT layer of only 350 nm thickness. This results in a sheet resistance  of 320 Ω/sq. The PEDOT screen-printing paste is commercially available. DoMicro is capable to screen print on films up to 150x150 mm on the Aurel C1010 screen-p rinter. Metafas screen prints series up to 1,000 pieces on 1,000x700 mm.   Around the PEDOT electrodes the electrical circuit is printed with a silver nanoparticle (NP) ink. This circuit is shown in figure 3. The inkjet printing technology allows for small contact pads to interconnect the QFN packaged driver IC. This IC has pad sizes of 250 µm at a pitch of 500 µm. Using this inkjet printing technology, DoMicro is capable of printing at a pitch down to 100 µm. The inkjet printed circuit is a 2-layer circuit with inkjet printed insulator to separate crossing top and bottom silver traces. For this inkjet printing process the SUSS MicroTec PiXDRO LP-50 inkjet printer is used. Both the UV curable insulator ink and silver ink are commercially available. Sintering of the NP is performed in a box oven at 150°C for 30 min. Figure 3 The PEN substrate and silver circuit do not allow for a standard soldering process for integration of components. An ACA is used to make a thermocompression bond between the IC and passive components and the printed circuit. Figure 4 shows an FHE touch module after assembly of the components. The Pick&Place process is performed with a Fineplacer Pico having an alignment accuracy of 5µm. Figure 4 The FHE touch module can, for example, be connected to a flexible LED FPC, such as shown in Figure 1. This interconnection is achieved using ACA through a thermocompression bonding process. The process, carried out with the Fineplacer PICO, enables strong and reliable interconnections at relatively low bonding temperatures of around 160 °C. These bonds ensure high reliability without short circuits, while preserving the flexibility of the transparent printed electronics touch circuit in combination with the LED FPC. We are exhibiting at the Future of Electronics RESHAPED. The event will take place in Berlin  on 21-22 October 2026. Please register for the event, meet us in person and see our technology in action.   Conclusions and outlook Screen-printed electrodes with transparent conductive polymer PEDOT are useful for touch applications in combination with backlight. The presented process steps show how such FHE touch modules could be made. Many designs of these touch button circuits are possible. Besides FHE modules with touch buttons, this printing process also allows for other transparent touch applications, e.g. trackpads or touch screens. DoMicro can support the technology for manufacturing as well as the hardware and system integration . Metafas complements this by bridging the gap towards industrial scalability and manufacturability.   Strong collaboration DoMicro and Metafas have collaborated for many years, supported by their close geographical proximity. DoMicro develops advanced inkjet printing processes and technology for micro assembly and 3D packaging of FHE and micro devices. While DoMicro focuses on R&D and prototyping with transparent PEDOT electrodes, inkjet-printed circuitry, and micro-assembly, Metafas transforms these innovations into reliable products. With expertise in membrane switches, printed electronics, and advanced foil-based HMI applications, Metafas develops and produces small and medium series using advanced techniques.   By combining the capabilities of DoMicro and Metafas, high-performance devices can be made, pushing the boundaries of flexible hybrid and printed electronics. Cleanroom Imagine, create, ACCOMPLISH   DoMicro provides R&D services, small series production, system architecture and project management. Typically for customers exploring new technologies for circuitry on flexible substrates like transparent conductive films, OPV electrodes, OLED, Lab-on-chip, wearables, in-mould electronics, IC and MEMS integrations.   Metafas operates a fully automated INO screen printing line for advanced printed electronics, using in-house screen fabrication and product finishing. A structured product and process launch system enables FHE technologies – such as transparent PEDOT-based HMI foils – to evolve into volume production for industrial, medical, and consumer applications.   If you are challenged by the market and looking for a partner to move your ideas into realization, contact us. We really do IMAGINE, CREATE AND ACCOMPLISH. Let's meet! DoMicro is an exhibitor at several inspiring events this year. We start at Nanotech Tokyo, 26 to 30 January, at the Netherlands Pavilion, booth number AT-L02. From 24 to 26 February, you can find us at LOPEC in Munich, Germany, at Booth B0 514. And through various activities from TechBlick including exhibition at the Future of Electronics RESHAPED Berlin (21 and 22 OCT 2026) we can connect as well and share our mutual passion for innovation. If you are looking for a partner to move your ideas into realization, let’s cross boundaries together! Join the flagship TechBlick event in California on 10-11 June 2026 , and in Berlin on 21-22 October 2026 This event is the global home of the Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year, the events will also feature the Future of Wearables Reshaped  (in California) and  Perovskite Connect  (in Berlin) .

When: 10 & 11 June 2026 Where: Computer History Museum, Mountain View, California https://www.techblick.com/electronicsreshapedusa Join us and 600+ others from around the world next June at the heart of the  Silicon Valley  to RESHAPE the Future of Electronics together, one layer at a time, making it Additive, Printed, Sustainable, Flexible, Hybrid, Stretchable, Wearable, Textile, Structural, 3D... This event stands as the largest show in the USA dedicated specifically to Additive, Printed, Hybrid and 3D Electronics. It unites the entire global community—connecting end-users and manufacturers with equipment providers, material developers, and applied researchers. The 2026 edition is expected to welcome more than  600 attendees  and  80 exhibitors , supported by  three parallel conference tracks , alongside  masterclasses and technical tours  designed to bridge innovation with real-world deployment. A major highlight for 2026 is the partnership with  NextFlex , the US-based consortium at the centre of the Printed and Hybrid Electronics ecosystem. The inclusion of the NextFlex Innovation Day further strengthens the event’s position as the definitive North American meeting point for the community. “Electronics RESHAPED USA has firmly established itself as the premier event for our industry in North America, consistently selling out year after year. This is now the home of Printed, Additive, and Hybrid Electronics. By bringing the show to the heart of Silicon Valley for the first time, we expect record-breaking growth. If you are active in, using, or exploring these technologies, this is the definitive place to be.” Dr Khasha Ghaffarzadeh, CEO

To watch this presentation in full, please purchase TechBlick Annual Pass at https://www.techblick.com/registration  and login to TechBlick platform https://app.swapcard.com/event/techblick Engineering Functionality: Sensors Sensors are at the heart of modern technology - integrated into devices we use every day to enhance healthcare, fitness, safety, and comfort. From monitoring vital signs to enabling smart industrial systems, sensors are transforming the way we interact with the world. Depending on the application, sensors come in many forms, each with its own materials, requirements, and performance considerations. Below are a few examples of sensors that are key to next-generation sensor innovation. Biosensors & Electrochemical Sensors:  Measure biological and chemical reactions by generating signals proportional to analyte concentration. PTC Heaters:  Regulate temperature through self-limiting properties that enhance safety and efficiency. Temperature Sensors:  Monitor and maintain optimal conditions using precise electrical signals. We are Exhibiting in California, USA. Visit our booth at the TechBlick event on 10-11 June 2026 . Contact us for your special discount coupon to attend These sensors find use across  wearable ,  diagnostic , and  industrial  applications, each with distinct design and material needs: Wearables Flexible and stretchable materials Stretchable inks Adhesive layers (for housing-to-patch or multilayer adhesion) Conductive skin contact layers Diagnostics Rigid or flexible substrates Microfluidic integration Specialized ink selection Sputtered precious metals Biochemical compatibility Industrial Durability under harsh conditions Long-term stability Resistance to temperature, moisture, and mechanical stress When designing any sensor,  key factors  such as  biocompatibility, sensitivity, selectivity, stability, and durability  must guide every decision. Material Selection Process: Define the use case Identify biological, mechanical, and electrochemical requirements Select candidate materials Prototype, test, and optimize Validate performance Sensors are more than components - they’re the foundation of innovation across industries. As demand grows for smarter, more connected, and more sustainable technologies, material and design choices will define the next generation of performance. We are Exhibiting in California, USA. Visit our booth at the TechBlick event on 10-11 June 2026 . Contact us for your special discount coupon to attend