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Future of Electronics RESHAPED: USA conference arrives in Mountain View, California, on 10-11 June 2026. Held at the Computer History Museum, this global gathering focuses on the commercialization and technical advancement of additive, printed, 3D, and wearable electronics. This is the most important and the largest conference and exhibition of the year dedicated to printed electronics, additive electronics, 3D electronics, wearable electronics, flexible electronics and hybrid electronics. The 2026 agenda features deep-tech presentations from industry leaders covering material innovations, scalable roll-to-roll (R2R) manufacturing, and novel hardware applications. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link High-precision capillary printing, roll-to-roll VIA printing, and electrochemical additive manufacturing (ECAM) for thermal management. Sub-Micron Printing, Scalable FHE, and Next-Gen AI Cooling? Here we introduce the talks to be given in Mountain View at Day 1, Track 1, Keynote Presentations covering high-precision capillary printing, roll-to-roll VIA printing, and electrochemical additive manufacturing (ECAM) for thermal management. Hummink | Pascal Boncenne Topic: HPCaP (High Precision Capillary Printing) : A Technology for Advanced Packaging. Pascal explores the strict micron-scale limitations of traditional inkjet printing, which relies on external lasers, pressure, or UV energy and struggles with high-viscosity materials. The presentation reveals High Precision Capillary Printing (HPCaP), an AFM-inspired glass micropipette mechanism that leverages natural capillary forces and controlled resonance to deposit polymers and conductive inks down to 100 nanometers. This solution delivers a sustainable, sub-micron patterning alternative tailored for semiconductor packaging, display repair, and biosensors. TracXon | Thomas Kolbush Topic: Scaling Roll-to-Roll Flexible Hybrid Electronics: From Patented VIA Fabrication to Mainstream Manufacturing. The session explores the heavy infrastructure and resource-intensive constraints of decades-old subtractive PCB technology, which cannot sustainably scale to meet the demand for hundreds of billions of new IoT devices. The talk unveils the industry’s first commercial roll-to-roll VIA printer, an additive technology capable of manufacturing double-sided circuitry on flexible substrates 10x faster than traditional lines. This patented equipment provides a high-throughput, responsible blueprint that slashes CO₂ emissions by 5x and material consumption by 10x. Fabric8Labs | Michael Matthews Topic: Reshaping Thermal Management: How ECAM Unlocks Next-Gen Cooling for AI & High-Performance Computing. Michael explores how traditional skiving and powder-based 3D printing fail to manufacture the complex, high-resolution geometries required to cool AI accelerators pushing power densities beyond 4 W/mm². The talk introduces Electrochemical Additive Manufacturing (ECAM), which uses a micro-electrode array to deposit pure copper atom-by-atom at room temperature without thermal stress. This technology delivers a 90% lower greenhouse gas footprint while providing optimized cold plates that achieve an 8.2°C reduction in maximum temperature for data center cooling. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Wearables in pharma, sustainable FHE manufacturing, internal physiological insight tracking, and body-integrated medical sensors. Next-Gen Wearable Electronics & Invisible Monitoring? Here we introduce the talks to be given in Mountain View at Day 1, Track 1, Session 2 covering wearables in pharma, sustainable FHE manufacturing, internal physiological insight tracking, and body-integrated medical sensors. Genentech (Roche Group) | Paul Upham Topic: Wearables in Pharma. Paul explores how traditional pharmaceutical development often lacks continuous, real-world data from the patient's home environment to establish stronger clinical endpoints. The talk highlights how integrating wearable technologies across multiple disease domains captures high-utility patient data. This work offers a powerful framework for utilizing wearables to improve clinical trial accuracy and accelerate drug development. GE Healthcare | Gurvinder Topic: Sustainability-to-Scalability in FHE: Screening LCA Insights and AI/ML-Enabled Manufacturing. Gurvinder explores the high environmental impacts and slow qualification cycles that limit the scale-up of conventional flex circuitry. The presentation reveals a life cycle assessment (LCA) proving printed flex reduces fabrication impacts by up to 80%, paired with an AI/ML workflow for in-line defect detection. This solution provides an optimized, low-emission roadmap for mass-producing vital sign monitoring patches. Datwyler Switzerland Inc. | Mattia Lucchini Topic: A Glimpse Inside: How Next-Gen Wearables are Unlocking Internal Physiological and Mental Insights. Mattia explores the current limitation of wearable devices, which have historically focused on superficial, external behavioral tracking rather than deeper internal states. The talk demonstrates how breakthrough functional materials and advanced sensor fusion unlock continuous access to complex biosignals like EEG and EMG. This work offers a transformative method for objectively assessing a user's true mental and physiological status unobtrusively. Linxens Heealthcare | Bryce Hinkson Topic: From Invasive to Invisible, How Wearable Technologies Transform Our Practices. Bryce explores the patient burden and clinical limitations associated with invasive, episodic healthcare monitoring solutions. The session outlines how advancements in flexible electronics and skin-contact sensors enable continuous, "invisible" physiological tracking without compromising medical accuracy or regulatory compliance. This solution provides healthcare providers and medtech innovators with a scalable pathway toward truly patient-centric care. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link The Future of Electronics RESHAPED: High-resolution 3D printing, advanced in-situ material annealing, and microgravity electronics manufacturing. High-Resolution 3D Printing & Space-Based Manufacturing of Electronics? Here we introduce the talks to be given in Mountain View at Day 1, Track 1, Session 3 covering high-resolution 3D printing, advanced in-situ material annealing, and microgravity electronics manufacturing. Holst Centre | Hylke Akkerman Topic: 3D Microelectronics Without Limits: High Resolution Printing for the Next Generation of Integration. Hylke explores how planar manufacturing constraints limit the transition to fully spatial, ultra-miniaturized electronic systems. The presentation details foil laminated stereolithography (f-SLA), which combines high-resolution UV structuring with vertical interconnects formed directly during printing. This work offers a highly sustainable, short-lead-time platform for embedded bare die integration at a 10–20 µm scale. Rice University | Yong Lin Kong Topic: Near-field microwave 3D printing of electronics. Yong explores a fundamental limitation in electronic 3D printing where the inability to selectively anneal materials destroys temperature-sensitive substrates. The talk reveals how focusing microwaves using a metamaterial-inspired near-field electromagnetic structure (Meta-NFS) achieves rapid, highly selective volumetric heating in situ. This solution provides a method to locally program electronic properties, broadening the material palettes compatible with 3D printing. Notion Systems | Simon Rihm Topic: From Subtractive to Additive: Shaping the Future of R&D with the new n.jet evo. Simon explores the complex manufacturing challenges that arise when trying to replace traditional subtractive process chains with additive steps. The session demonstrates how the n.jet evo desktop inkjet system allows R&D labs to evaluate new processes, functional inks, and substrates under industrial standards. This work offers a simple, efficient bridge to push additive manufacturing from lab concepts to industrial scale. NASA Marshall Space Flight Center | Cadre Francis Topic: In-Space Manufacturing of Electronics. Cadre explores the logistical risks of long-duration space missions that rely entirely on earth-supplied electronics rather than autonomous, on-demand fabrication. The presentation evaluates how material formulation and deposition behave in microgravity environments without gravity-assisted flow. This solution provides critical insights into establishing real-time print stabilization, enhancing the resilience of future space exploration architectures. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Multi-layer R2R mass production, high-resolution flexographic printing, and sustainable rotary screen printing for RFID. Roll-to-Roll (R2R) Mass Production of Printed Electronics? Here we introduce the talks to be given in Mountain View at Day 1, Track 1, Session 3 covering multi-layer R2R mass production, high-resolution flexographic printing, and sustainable rotary screen printing for RFID. Smooth & Sharp Corporation | Alan Wu Topic: A Proven R2R Production Solution of NFC Antenna. Alan explores the complexity barriers that usually prevent additive manufacturing from moving beyond single-layer UHF antennas to sophisticated electronic functions. The talk reveals successful large-scale mass production techniques for multi-layer RFID/NFC circuits. This work offers proof that complicated circuit designs are now possible at scale using additive R2R processes. Eastman Kodak Company | Carolyn Ellinger Topic: Flexography for High-Resolution Roll-to-Roll Manufacturing. Carolyn explores the boundaries of expanding volume production for high-resolution designs using traditional screen printing, which currently dominates printed electronics. The presentation provides an overview of how transitioning to roll-to-roll flexography can optimize the mass fabrication of highly replicated circuitry. This work offers a strategic analysis of the precise benefits and operational challenges of adopting flexo lines for high-volume manufacturing. SPG Prints | Daan Dekubber Topic: Mass-Producing Sustainable RFID: How the Basalt Printer Delivers High-Capacity Innovation. Daan explores the heavy material waste and high environmental costs associated with traditional aluminum-etched RFID manufacturing. The session introduces a roll-to-roll rotary screen printing process utilizing paper substrates and graphite-based conductive inks to cut production costs by up to 25%. This solution provides an affordable, highly scalable, and completely aluminum-free pathway for mass-producing eco-friendly tags. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Stretchable low-temperature Ag inks, micro-transfer printing of liquid metal, liquid metal elastomer thermal interfaces, and silver MOD inks. High-Performance Inks & Stretchable Electronic Materials? Here we introduce the talks to be given in Mountain View at Day 1, Track 2, Session 2 covering stretchable low-temperature Ag inks, micro-transfer printing of liquid metal, liquid metal elastomer thermal interfaces, and silver MOD inks. Heraeus Electronics | Sai Vijayaraghavan Topic: Ag Inks for Stretchable Electronics. Sai explores the critical design and processing trade-offs required to ensure low-temperature silver inks maintain robust and reliable performance under mechanical deformation. The presentation evaluates how material selection and cure parameters directly influence electromechanical properties. This work offers a validated framework for optimizing ink performance in next-generation stretchable devices. University of Southern California | Hangbo Zhao Topic: High-Resolution Liquid Metal-Based Stretchable Electronics Enabled By Colloidal Self-Assembly and Micro-Transfer Printing. Hangbo explores the manufacturing limitations that prevent liquid metal-based electronics from achieving scalable, high-resolution patterning below traditional macro-scales. The talk reveals an integrated method combining colloidal self-assembly and micro-transfer printing to achieve liquid metal particle features as small as 5 µm. This solution provides ultra-stretchable, low-impedance microelectrode arrays capable of high-resolution cardiac mapping under extreme deformations. Arieca Inc | Navid Kazem Topic: Liquid Metal Embedded Elastomer Composites for Thermal Management of Next Generation High Performance Computing. Navid explores the extreme thermal and warpage challenges in AI semiconductor packaging where power densities are outstripping conventional thermal interface materials. The presentation demonstrates how translating liquid metal embedded elastomer (LMEE) technology into packaging provides a unique combination of high thermal dissipation and soft mechanical compliance. This work offers a reliable material architecture to reduce power consumption in next-generation high-performance computing centers. Electroninks | Mitchell Smith Topic: Silver MOD Inks: Advancing Performance Beyond Particle Pastes. Mitchell explores the cost vulnerabilities and performance limits of traditional silver particle-based pastes facing volatile market pricing and high curing temperature requirements. The session breaks down the chemical mechanisms of metal organic decomposition (MOD) inks, which form denser conductive films using significantly less metal. This solution provides a lower-temperature curing pathway that opens high-performance conductive circuits to temperature-sensitive plastic substrates. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Embodied AI, intelligent cardiac monitoring, elastic multilayer printed circuits, and flexible ceramic battery solutions. Data, AI, and Advanced Materials for Next-Gen Wearables? Here we introduce the talks to be given in Mountain View at Day 1, Track 2, Session 3 covering embodied AI, intelligent cardiac monitoring, elastic multilayer printed circuits, and flexible ceramic battery solutions. Stanford University | Angela McIntyre Topic: Wearables as Embodied AI. Angela explores how traditional wearable devices often operate as passive trackers rather than closed-loop, physical agents that interpret and anticipate human intent. The session outlines how merging advanced machine learning with physical biological feedback allows AI to become physically "embodied." This framework provides the foundational hardware-software loop necessary to anticipate human movement and seamlessly bridge real-world biological feedback with physical hardware. Medtronic | Rohan Sonawane Topic: Data and AI in Cardiac Monitoring. Rohan explores the challenge of turning massive streams of continuous physiological data into timely, meaningful insights without overwhelming care teams with false alerts. The talk demonstrates how AI can interpret continuous cardiac data within context to highlight critical patient risks early. This solution provides an intelligent, proactive monitoring system that helps anticipate deterioration in heart failure care and guide personalized interventions outside the hospital. VTT | Tuomas Happonen Topic: Elastic Multilayer Printed Circuits. Tuomas explores the difficulty of manufacturing sensitive, interference-tolerant elastic circuits that can withstand the physical requirements of mixed-signal and RF applications. The presentation details a sheet-based manufacturing method that stacks pre-perforated TPU films and cures screen-printed conductive circuits with filled vias layer by layer. This work offers a robust architecture for integrating surface-mounted devices onto highly flexible, multilayer laminates. NGK Insulators LTD | Masahiro Furukawa Topic: Ceramic-Based Li-ion Rechargeable Battery Solutions Optimized for Close-Contact Remote Health Monitoring. Masahiro explores the need for ultra-safe, thin, and flexible battery solutions that can fit body contours without the safety risks of traditional organic components in skin-contact applications. The session introduces a semi-solid, ceramic-based Li-ion rechargeable battery featuring low self-discharge and high over-discharge resistance. This technology provides a highly reliable, fast-charging power source tailored for remote health monitoring patches and medical devices. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Yarn-sensor smart apparel, conductive silver ink printing on cotton, and mass-market scalability for wearables. Smart Apparel, Textile Printing, and Scaled Production? Here we introduce the talks to be given in Mountain View at Day 1, Track 2, Session 4 covering yarn-sensor smart apparel, conductive silver ink printing on cotton, and mass-market scalability for wearables. Texavie | Peyman Servati Topic: Empowering Personalized Therapy and Wellness Anywhere with Texavie’s MarsWear Smart Apparels. Peyman explores the difficulty of developing comfortable, everyday wearable therapeutics that provide clinicians with highly accurate, objective biometric data. The talk introduces a smart textile platform using advanced yarn sensor technologies and machine learning, alongside integrated patented solar fabrics for green energy harvesting. This solution provides an intelligent, highly versatile system for personalized therapy, gaming, and AR/VR control. Voltera | Giovanni Obando Topic: Wearable Electronics: Printing Silver Conductive Ink on Cotton Fabric. Giovanni explores the processing challenges and setting parameters required to print highly functional conductive inks directly onto rough, absorbent textiles like cotton without losing performance. The presentation evaluates the direct application of silver conductive inks to construct fully functioning heating elements. This work offers a validated manufacturing methodology for creating direct-to-fabric consumer products like heated medical and outdoor apparel. Quad Industries | Wim Christiaens Topic: Scaling wearable printed electronics for mass-market applications. Wim explores the technical bottleneck where high-functioning laboratory wearable prototypes consistently fail to achieve reliable, repeatable replication during mass industrial fabrication. The session analyzes real-world case studies to demonstrate how critical design choices and material selections impact the cost-effective production floor. This work provides an optimized framework for successfully scaling printed electronics into mass-market commercial applications. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Sustainable board-level additive manufacturing, printed embedded resistors, 3D MEMS IMU additive packaging, and programmable cloud-native PLM software. Additive Packaging, Printed Passives, and Next-Gen PLM Systems? Here we introduce the talks to be given in Mountain View at Day 1, Track 3, Session 2 covering sustainable board-level additive manufacturing, printed embedded resistors, 3D MEMS IMU additive packaging, and programmable cloud-native PLM software. Raytheon | An RTX Business | Daniel Hines Topic: Hybrid Electronics for Environmentally Sustainable Board Level, Additive Manufacturing of Passive Components. Daniel explores the strict size, weight, and power (SWaP) demands alongside traditional PCB material waste challenges that limit eco-friendly domestic electronics manufacturing. The presentation highlights hybrid electronics (HE) design methods used to print passive insulator materials for solder masks and replace bulky, heavy, manually tuned RF filters. This work offers a highly sustainable manufacturing alternative that enables tight, eco-friendly integration of digital and RF circuit card assemblies. UMass Lowell | Guinevere Strack Topic: Printed Resistors for Low-Cost Sustainable, Semi-Additive PCBs. Guinevere explores how current state-of-the-art embedded resistor technologies rely on complex, energy-intensive subtractive processes that generate excessive hazardous waste. The talk outlines an additive manufacturing framework for printing thick-film resistors directly onto PCB substrates using resistive inks. This solution provides a low-cost, scalable pathway to eliminate surface-mounted component counts, reduce parasitics, and seamlessly integrate additive technologies into high-throughput production lines. GE Aerospace Research | David Lin Topic: 3D MEMS IMU enabled by Additive Packaging. David explores how complex, rigid 3D assemblies of traditional MEMS inertial measurement units are highly vulnerable to package-induced stress and long-term thermal drift. The session reveals an innovative aluminum nitride (AlN) based additive packaging process that replaces multi-component frames with a single, compact, direct pick-and-place component. This technology provides an ultra-low SWaP-C IMU that yields a 3X improvement in thermally induced drift, optimized to survive harsh environmental navigation. Altium & Duro | Justin Sears & Michael Corr Topic: When Your Electronics Bend, Your PLM Shouldn't Break. Justin and Michael explore how hardware engineering groups adopting flexible, hybrid, and stretchable form factors are constrained by legacy, rigid Product Lifecycle Management (PLM) architectures. The talk breaks down a modernized approach featuring cloud-native, AI-driven, and API-first architectures that treat product data as an automated, living, and queryable ecosystem. This framework offers electronic hardware teams the infrastructure to accelerate design iterations much like modern agile software teams. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Fine-line screen printing, conductive ink formulations, alternative metal paste equipment, and nano-surface mesh treatments. Fine Line Screen Printing & Material Innovations? Here we introduce the talks to be given in Mountain View at Day 1, Track 3, Session 3 covering fine-line screen printing, conductive ink formulations, alternative metal paste equipment, and nano-surface mesh treatments. Sefar | Mark Pintar Topic: Fine Line Screen Printed Electronics. Mark explores the critical operational gap between lab-scale possibilities and real-world floor practicality in modern screen printing workflows. The presentation breaks down practical manufacturing limits and demonstrates how to optimize current setup assets for high-precision jobs. This work provides attendees with a direct baseline to audit their current printing infrastructure for fine-feature readiness. Nagase ChemteX | Brandon Peters Topic: Materials and Process Innovations in Fine Line Conductive Ink Printing. Brandon explores the complex synchronization needed between ink chemistry, screen engineering, and substrate properties to prevent line blurring at advanced micro-scales. The session reveals how careful adjustments to mesh counts, emulsion profiles, and substrate surface energies dramatically improve electrical performance and line definition. This solution delivers a robust roadmap for achieving highly repeatable ultra-fine feature resolution. Conductive Technologies | Alicen Pittenger Topic: Process Improvements in Materials and Equipment for Printed Electronics. Alicen explores how raw silver market volatility and outdated equipment registration limit cost-sensitive, high-volume production lines. The talk highlights the adoption of alternative silver-carbon blends and copper inks paired with high-speed Sakurai optical registration press hardware. This combination provides a predictable framework to boost print precision, stabilize material costs, and scale production runs with confidence. MicroScreen LLC | Art Dobie Topic: Effect of Hydrophobic/Oleophobic Nano Surface Treatment on the Release of Resistive PTC carbon paste from Emulsion Screens for Screen-Printed Heater Applications. Art explores the poor paste release and sticky screen-peel behavior that degrades print accuracy when using resistive PTC carbon pastes for printed heater elements. The presentation evaluates the transfer of successful stencil nano-coatings directly onto PVA-PVOH emulsion screen cavities to smooth the paste release dynamics. This empirical study delivers quantified deposition data to resolve transfer-efficiency issues in functional paste printing. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Silver-coated copper trace pastes, printed antenna processing, and full silver ink substitution with copper High-Performance Copper Substitutes & Antenna Materials? Here we introduce the talks to be given in Mountain View at Day 1, Track 3, Session 4 covering silver-coated copper trace pastes, printed antenna processing, and full silver ink substitution with copper Tatsuta | Robert Wilson Topic: Silver-Coated Copper Particle Circuit Trace Conductive Pastes. Robert explores how severe oxidation issues in fine copper particles compromise reliability, while pure silver inks remain too expensive for mass additive PCB/FPC workflows. The talk details an innovative silver-coated copper particle trace paste that reduces CO₂ emissions to 18% and liquid waste to 7% compared to subtractive chemical etching. This work offers an economically competitive, eco-friendly solution for high-volume manufacturing lines. Henkel | Julie Ferrigno Topic: Materials & Processes for Printed Antennas. Julie explores the processing trade-offs required to maintain precise feature uniformities and low surface roughness for high-frequency RF antenna structures. The presentation evaluates the performance spectrum of high-conductivity silver inks, lower-cost silver-plated copper (SPC) alternatives, and high-throughput 3D pad printing methods. This work provides an optimized material selection framework for balancing production costs with strict RF performance metrics. Copprint | Ofer Shochet Topic: Silver performance, copper price – the inevitable transition to copper. Ofer explores how massive demand surges from photovoltaics and EVs have turned raw silver into a punishing "silver tax" that heavily threatens the gross margins of printed electronics. The session challenges the long-term viability of silver-coated alternatives, presenting the technical and financial case for full copper ink substitution. This solution maps a realistic transition pathway to help manufacturers manage risk and shield their supply chains from raw material price volatility. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Additive high-temperature antennas, flexible mmWave copper antennas, laser-assisted ultra-high adhesion traces, and inkless dry-additive nanomanufacturing. High-Temperature Antennas, Fine-Line Copper, and Inkless Nano-Printing? Here we introduce the talks to be given in Mountain View at Day 2, Track 1, Session 1 covering additive high-temperature antennas, flexible mmWave copper antennas, laser-assisted ultra-high adhesion traces, and inkless dry-additive nanomanufacturing. Lockheed Martin | Paul Gaylo Topic: Enabling High Temperature Antennas with Additive Manufacturing. Paul explores how extreme heat environments present severe engineering challenges that cannot be resolved by high-temperature materials alone. The presentation outlines how traditional fabrication methods fall short in managing the tight dimensional tolerances, mechanical joints, and metal-ceramic integration required for these devices. This work demonstrates how advanced additive manufacturing provides a preferred path to production by embedding multi-material interfaces and precise microstructural control into complex, heat-resilient antenna geometries. NoiseFigure Research | Manish Ojha Topic: High-Resolution Printed Copper Antennas for Flexible mm Wave Electronics. Manish explores the lack of flexible mmWave antennas capable of high resolution and high production speeds for 24 GHz applications. The talk presents screen printing with copper conductive inks on polyimide and alumina ribbon ceramics to achieve an exceptional 50 µm resolution at a speed of 10,000 sq mm/s. This work offers a proven method for integrating bare die chipsets with flexible antennas, showing strong agreement between simulation and measured performance. Akoneer | Tadas Kildusis Topic: Creating high density and high adhesion Cu traces on any dielectric substrate. Tadas explores the difficulty of achieving high feature density alongside strong trace adhesion when trying to pattern copper across diverse, non-traditional dielectric substrates. The session introduces the SSAIL direct-write method, which utilizes ultrashort pulsed laser and chemical processing to plate electroless copper traces down to 1 µm. This technology provides excellent surface roughness and trace adhesion of 6–30 N/mm², optimized for high-power and high-frequency applications. NanoPrintek | Masoud Mahjouri-Samani, PhD Topic: Beyond Inks: Physics-Driven, AI-Enabled Additive Nanomanufacturing for Standardized Electronics. Masoud explores how reliance on complex, proprietary chemical ink formulations limits process stability, certification, and long-term supply-chain independence. The talk unveils an inkless, dry-additive nanomanufacturing platform that generates pure solid nanoparticles on demand, transporting and laser-sintering them in real time without binders or solvents. This physics-driven approach integrates AI closed-loop optimization to establish a deterministic, qualification-ready manufacturing standard. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Extreme-temperature thermocouple inks, 3D carbon microheaters, pilot-scale graphene printing, and high-purity carbon nanotube AI hardware. High-Temperature Materials & Advanced Carbon Nanomaterials? Here we introduce the talks to be given in Mountain View at Day 2, Track 2, Session 1 covering extreme-temperature thermocouple inks, 3D carbon microheaters, pilot-scale graphene printing, and high-purity carbon nanotube AI hardware. Applied Nanotech Inc | Richard Fink Topic: Novel Ink Development, Characterization, and Tests for Extreme Environments. Richard explores the severe shortage of cost-effective printed electronics capable of surviving oxygen-rich environments above 800 °C. The presentation details the development of Chromel and Alumel inks for Type-K thermocouples, alongside molybdenum materials protected by an oxidation barrier for high-temperature ceramic antennas. This work demonstrates a predictable, linear frequency shift in air, providing a robust sensing framework for extreme thermal environments. iGii (Integrated Graphene) | Michelle Ntola Topic: 3D Carbon Nanomaterials to Change the Landscape of Functional Materials. Michelle explores the supply-chain risks and high costs facing manufacturers heavily reliant on silver and traditional metal-heavy electrode formulations. The talk highlights Gii, a proprietary 3D carbon platform engineered as a metal-lean, drop-in alternative for roll-to-roll microheaters reaching 400 °C and high-reproducibility printed batteries. This solution provides a highly scalable, low-temperature fabrication method capable of producing millions of robust, cost-stable components annually. Graphene Engineering Innovation Centre | Andrew Strudwick Topic: Graphene and 2D materials printed electronics. Andrew explores the technical gap between early laboratory excitement for 2D materials and the commercial scale-up required for practical industrial deployment. The session outlines how pilot-scale printing equipment and collaborative research frameworks accelerate the transition of graphene into next-generation products. This work provides an established engineering pathway for integrating 2D materials into environmental health sensors, flexible electronics, and energy-efficient heating elements. NanoIntegris Technologies | Jefford Humes Topic: Beyond Silicon: High‑Purity Semiconducting Carbon Nanotubes as a Foundation for Next‑Generation AI Hardware. Jefford explores the physical and economic boundaries of conventional silicon, which currently constrain the energy efficiency needed for modern AI computing workloads. The talk reveals how high-purity semiconducting single-walled carbon nanotubes (s-SWCNTs) remove metallic degradation pathways to enable low-power, high-mobility field-effect transistors. This technology provides a printable, low-temperature fabrication standard for building reconfigurable edge devices, neuromorphic hardware, and energy-efficient in-memory computing systems. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Electroactive P(VDF-TrFE) coatings, capacitive keyboard production, printed trace PFAS detection sensors, and in-line R2R laser ablation patterning. Functional Surfaces, Smart Interface Printing, and Real-Time Environmental Sensing? Here we introduce the talks to be given in Mountain View at Day 2, Track 3, Session 1 covering electroactive P(VDF-TrFE) coatings, capacitive keyboard production, printed trace PFAS detection sensors, and in-line R2R laser ablation patterning. ALQIO | Fabien Resweber Topic: Empowering Scalable Innovation in Functional Surfaces. Fabien explores the challenge of transitioning flexible electroactive applications from experimental design to reliable, high-volume industrial processing. The presentation focuses on advanced formulation and coating capabilities utilizing piezoelectric P(VDF-TrFE) copolymers. This work offers a robust manufacturing pathway to integrate flexible haptic interfaces, heating surfaces, and medical instrumentation seamlessly into mass-market product architectures. INO, d.o.o., Žiri | Matjaz Finzgar Topic: Printing Touch: Equipment and Process Perspectives on Capacitive Keyboard Production. Matjaz explores the critical process bottlenecks of capacitive keyboard manufacturing, where multi-layer registration errors and improper ink curing routinely threaten mechanical and electrical reliability. The talk outlines targeted equipment and process adjustments designed to maintain highly precise pattern geometries during scale-up. This solution provides a practical manufacturing blueprint to stabilize high equipment and material costs during the shift from prototyping to production. Brewer Science | Shane Gumm Topic: Printed Electronics Solutions for Trace PFAS Detection and Measurement. Shane explores the major logistical bottleneck in environmental monitoring where dangerous, trace-level PFAS contaminants can only be identified via slow, expensive, centralized laboratory mass spectrometry. The session introduces a species-selective, low-cost printed sensor platform capable of executing rapid, real-time field testing. This advanced thin- and thick-film deposition technology delivers a decentralized monitoring model to empower utilities and communities with instant environmental data. Intellivation LLC | Mark George Topic: R2R Platform for Deposition of Active and Passive Thin Films and Patterning for Flexible Electronic Sensors and Devices. Mark explores the high cost and labor-intensive constraints of using traditional mask lithography for patterning flexible active and passive thin films. The presentation demonstrates a high-throughput roll-to-roll sputtering platform paired with in-line laser ablation to pattern multilayers without causing sub-surface substrate degradation. This physics-driven solution combines digital laser annealing and subtractive patterning to manufacture fully functional flexible sensors rapidly and cost-effectively. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Solvent-free vapor jet printing, roll-to-roll printed OLED light films, and interactive organic electronic smart packaging. Mask-less Deposition & Printed OLED Technologies? Here we introduce the talks to be given in Mountain View at Day 2, Track 1, Session 2 covering solvent-free vapor jet printing, roll-to-roll printed OLED light films, and interactive organic electronic smart packaging. Universal Display Corporation | Mike Hack Topic: Universal Vapor Jet Printing (UVJP) - a Transformative Dry, solvent-free Printing and Deposition Technology. Mike explores the processing vulnerabilities of printing organic electronics via methods dependent on aggressive solvents and complex, multi-step lithography. The presentation unveils a digitally programmable, mask-less UVJP deposition platform that jets functional materials at low temperatures without any solvents. This technology provides a highly sustainable manufacturing alternative that protects solvent-sensitive substrates and unlocks previously unattainable device architectures. Sinovia Technologies | Whitney Gaynor Topic: Roll-to-Roll Printed Light Film. Whitney explores how heavy reliance on expensive, ultra-high-vacuum deposition processes restricts organic light-emitting diodes (OLEDs) from achieving widespread, affordable commercial scale. The talk details the core fluid dynamics and layer uniformity principles required to successfully manufacture OLEDs via high-throughput flexographic printing lines. This work offers a strategic roadmap for using proprietary transparent conductive films to scale low-cost light films for Human-Machine Interface (HMI) applications. Inuru | Speaker Marcin Ratajczak Topic: Seamless Integration of Printed OLEDs into Smart Packaging and Consumer Surfaces. The session explores how inkjet printing OLED lighting can create fully new use cases and applications. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link FHE-enabled soft robotics, electrohydraulic artificial muscles, and multimodal printed tactile sensors. Soft Robotics & Human-Like Tactile Sensing? Here we introduce the talks to be given in Mountain View at Day 2, Track 2, Session 3 covering FHE-enabled soft robotics, electrohydraulic artificial muscles, and multimodal printed tactile sensors. GE Aerospace | Deepak Trivedi Topic: FHE Enabled Soft Robotics: Scaling Intelligence Beyond Compute. Deepak explores the scaling limitations of conventional robotics, which concentrate functions in rigid assemblies with centralized processing and suffer from exponential control burdens as degrees of freedom multiply. The presentation demonstrates an emerging paradigm where flexible electronics shift robots from assembled subsystems into unified functional materials with co-located sensing, actuation, and memristive neuromorphic computing. This work leverages materials science and electronic manufacturing to manage continuous deformation fields and enable edge-level feedback loops. Artimus Robotics | Eric Acome Topic: From Rigid Motors to Flexible Artificial Muscles: The Development of Polymer-Based Electrohydraulic Actuators. Eric explores how physical AI is structurally limited by standard electric motors, which suffer from poor adaptability, high heat generation, and complex miniaturization. The talk details HASEL electrohydraulic actuators that utilize thin polymer films, flexible printed conductors, and liquid dielectrics to serve as true artificial muscles. This technology delivers direct linear motion and high power-to-weight ratios for dexterous robotic hands, wearables, and bio-inspired machinery. Yamagata University | Shizuo Tokito Topic: Flexible Printed Sensors for Robotic Hands: Toward Human-Like Tactile Sensing. Shizuo explores the lack of lightweight, conformable tactile arrays needed to give humanoid robotic platforms human-like skin sensitivity and precise object manipulation. The session outlines a printing-based fabrication process using printed silver electrodes and porous, carbon-based piezoresistive and piezoelectric polymer inks. This advanced integration of materials science and flexible electronics enables robotic hands to detect subtle pressure, shear force, texture, and temperature for delicate object handling. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Dual-use hybrid validation frameworks, circular IoT hardware recycling, and viscous-jet drop-on-demand digital printing. Manufacturing Readiness, Circular IoT, and High-Viscosity Jetting? Here we introduce the talks to be given in Mountain View at Day 2, Track 3, Session 2 covering dual-use hybrid validation frameworks, circular IoT hardware recycling, and viscous-jet drop-on-demand digital printing. NextFlex | Dan Gamota Topic: Manufacturing Readiness for Hybrid Electronics. Dan explores how a lack of standardized industrial data and validated qualification pathways currently slows the transition of hybrid electronics from lab innovations to mass deployment. The presentation identifies critical manufacturing challenges and roadmaps the technical requirements for conformal RF and integrated sensing systems across defense and commercial sectors. This work offers improved validation frameworks to accelerate cross-sector collaboration and secure distributed production lines. Boeing | Kalsi Kwan Topic: Sustainable Additive Electronics for IoT Devices. Kalsi explores the massive global waste and fragile supply chains associated with conventional subtractive, un-recyclable microcontroller assemblies used in IoT devices. The talk details early-stage product design optimized for low-volume additive print chemistries, biodegradable substrates, and specialized repairable manufacturing processes. This solution outlines a circular framework to safely recover, test, and reuse expensive, reliably sourced microcontroller components at a product's end-of-life. Printed Electronics Limited | Neil Chilton: Topic:Printing with High Viscosity Fluids In this session, Neil explores the dominance of screen printing in fabricating printed electronics, driven by its ability to process highly-loaded functional inks (exceeding 5,000 cP) for single-pass performance. After evaluating the strengths and limitations of state-of-the-art screen printing, Neil addresses the challenges of transitioning these viscous inks to a digitally-defined process, where traditional inkjet printing is fundamentally limited to low-viscosity fluids (under 100 cP). To bridge this gap, the presentation will showcase innovative processes and systems developed at PEL. By highlighting Piezovalve viscous-jet deposition and other advanced drop-on-demand methods, Neil will demonstrate several viable technologies for digitally printing extremely viscous functional materials. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Plasma jet conformal printing, single-step surface tuning and sintering, and in-flight aerosol plasma reduction. Single-Step Plasma Printing & Aerosol Metallization? Here we introduce the talks to be given in Mountain View at Day 1, Track 1, Session 3 covering plasma jet conformal printing, single-step surface tuning and sintering, and in-flight aerosol plasma reduction. Space Foundry | Ram Gandhiraman Topic: Plasma Jet Printing of Conformal Electronics for Electronic Warfare. Ram explores how conventional planar manufacturing cannot easily embed sophisticated electronics onto the curved body panels and nose cones of large, airborne RF structures. The talk reveals a gravity-independent plasma jet printing technology that uses electromagnetic fields to achieve in-situ chemical reduction of metal ions like copper and silver. This solution provides an industrially feasible path to print antennas and frequency-selective surfaces directly onto non-planar military drone surfaces without post-cure processing. Oregon State University | Harish Subbaraman Topic: Plasma-Assisted Processing for Surface Property Tuning, Sintering, and Pattering: Towards Applications in Flexible Hybrid Electronics. Harish explores the efficiency bottlenecks of traditional flexible electronics printing methods, which are bound to a slow, multi-stage workflow of substrate pretreatment, material printing, and separate sintering. The presentation outlines the unique capacity of plasma-jet printing to condense this three-step process into a single step while tandem-depositing multiple materials. This work offers a hybrid approach to pattern sub-micron metal features on-demand, reducing waste and cost for high-performance flexible devices. New Mexico State University | Chaitanya Mahajan Topic: Single-step aerosol printing of metallic nanostructures via in-flight plasma reduction. Chaitanya explores how traditional direct-write metallic printing rarely achieves functional conductivity in a single step, requiring heat-intensive post-processing that destroys temperature-sensitive substrates. The session details a low-temperature, plasma-assisted aerosol deposition process that achieves direct in-flight metallization and co-deposition of nickel and copper biphasic alloyed films. This work establishes a clear process-structure framework optimized for rapid space manufacturing and biocompatible electronic coatings. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Smart interactive label technologies, silicone-based dry electrode biosensing, and AI-boosted neuromuscular tracking. Intelligent Labels, Biosensing Patches, and Multi-Modal Tracking? Here we introduce the talks to be given in Mountain View at Day 1, Track 1, Session 1 covering smart interactive label technologies, silicone-based dry electrode biosensing, and AI-boosted neuromuscular tracking. Tapecon | Brad Hull Topic: The Evolution of Smart Labels: From Identification to Intelligent Interaction. Brad explores how standard barcoded identification no longer satisfies the data demands of modern logistics, healthcare, and retail ecosystems. The presentation outlines a versatile toolbox of emerging technologies designed to transform passive packaging into intelligent devices capable of autonomous authentication, sensing, and communication. This work provides original equipment manufacturers (OEMs) with a practical guide to speed up distributed workflows and enable real-time interactive product tracking. DuPont | Julia Kozhukh Topic: Skin-Friendly Biosensing Patches for Excellent Signal Quality and Patient Comfort. Julia explores the medical and technical challenges of remote cardiac monitoring, where standard patch materials cause skin irritation and suffer from signal degradation during extended patient wear. The talk details an innovative patch design utilizing silicone pressure-sensitive adhesives combined with specialized, silicone-based dry electrodes. This solution delivers an ultra-comfortable, skin-friendly architecture that maintains excellent signal quality to support early clinical detection of post-operative cardiac anomalies. University of North Carolina | Wubin Bai Topic: Multi-modal noninvasive in vivo biosensing system to leverage sensor-algorithm synergy for enhanced accuracy. Wubin explores the physical limitations of current muscle tracking devices, which are constrained by superficial surface measurements or rigid ultrasound hardware requiring specialized skin coupling. The session introduces a wireless wearable system combining deep-penetrating near-infrared (NIR) light sensors with an integrated inertial measurement unit (IMU). Powered by a recurrent neural network (RNN), this multi-modal platform filters out motion artifacts to deliver highly accurate, non-invasive tracking for rehabilitation feedback and neuromuscular disease diagnostics. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link

Next-Gen Wearable Electronics & Invisible Monitoring? Here we introduce the talks to be given in Mountain View at Day 1, Track 1, Session 2 covering wearables in pharma, sustainable FHE manufacturing, internal physiological insight tracking, and body-integrated medical sensors. Genentech (Roche Group) | Paul Upham Topic: Wearables in Pharma. Paul explores how traditional pharmaceutical development often lacks continuous, real-world data from the patient's home environment to establish stronger clinical endpoints. The talk highlights how integrating wearable technologies across multiple disease domains captures high-utility patient data. This work offers a powerful framework for utilizing wearables to improve clinical trial accuracy and accelerate drug development. GE Healthcare | Gurvinder Topic: Sustainability-to-Scalability in FHE: Screening LCA Insights and AI/ML-Enabled Manufacturing. Gurvinder explores the high environmental impacts and slow qualification cycles that limit the scale-up of conventional flex circuitry. The presentation reveals a life cycle assessment (LCA) proving printed flex reduces fabrication impacts by up to 80%, paired with an AI/ML workflow for in-line defect detection. This solution provides an optimized, low-emission roadmap for mass-producing vital sign monitoring patches. Datwyler Switzerland Inc. | Mattia Lucchini Topic: A Glimpse Inside: How Next-Gen Wearables are Unlocking Internal Physiological and Mental Insights. Mattia explores the current limitation of wearable devices, which have historically focused on superficial, external behavioral tracking rather than deeper internal states. The talk demonstrates how breakthrough functional materials and advanced sensor fusion unlock continuous access to complex biosignals like EEG and EMG. This work offers a transformative method for objectively assessing a user's true mental and physiological status unobtrusively. Linxens Heealthcare | Bryce Hinkson Topic: From Invasive to Invisible, How Wearable Technologies Transform Our Practices. Bryce explores the patient burden and clinical limitations associated with invasive, episodic healthcare monitoring solutions. The session outlines how advancements in flexible electronics and skin-contact sensors enable continuous, "invisible" physiological tracking without compromising medical accuracy or regulatory compliance. This solution provides healthcare providers and medtech innovators with a scalable pathway toward truly patient-centric care. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link

Intelligent Labels, Biosensing Patches, and Multi-Modal Tracking? Here we introduce the talks to be given in Mountain View at Day 1, Track 1, Session 1 covering smart interactive label technologies, silicone-based dry electrode biosensing, and AI-boosted neuromuscular tracking. Tapecon | Brad Hull Topic: The Evolution of Smart Labels: From Identification to Intelligent Interaction. Brad explores how standard barcoded identification no longer satisfies the data demands of modern logistics, healthcare, and retail ecosystems. The presentation outlines a versatile toolbox of emerging technologies designed to transform passive packaging into intelligent devices capable of autonomous authentication, sensing, and communication. This work provides original equipment manufacturers (OEMs) with a practical guide to speed up distributed workflows and enable real-time interactive product tracking. DuPont | Julia Kozhukh Topic: Skin-Friendly Biosensing Patches for Excellent Signal Quality and Patient Comfort. Julia explores the medical and technical challenges of remote cardiac monitoring, where standard patch materials cause skin irritation and suffer from signal degradation during extended patient wear. The talk details an innovative patch design utilizing silicone pressure-sensitive adhesives combined with specialized, silicone-based dry electrodes. This solution delivers an ultra-comfortable, skin-friendly architecture that maintains excellent signal quality to support early clinical detection of post-operative cardiac anomalies. University of North Carolina | Wubin Bai Topic: Multi-modal noninvasive in vivo biosensing system to leverage sensor-algorithm synergy for enhanced accuracy. Wubin explores the physical limitations of current muscle tracking devices, which are constrained by superficial surface measurements or rigid ultrasound hardware requiring specialized skin coupling. The session introduces a wireless wearable system combining deep-penetrating near-infrared (NIR) light sensors with an integrated inertial measurement unit (IMU). Powered by a recurrent neural network (RNN), this multi-modal platform filters out motion artifacts to deliver highly accurate, non-invasive tracking for rehabilitation feedback and neuromuscular disease diagnostics. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link

Author: Masoud Mahjouri-Samani | info@nanoprintek.com For decades, printed electronics has promised a future of rapid, flexible, and low-cost manufacturing. From wearable sensors and smart packaging to flexible antennas and next-generation energy systems, the vision has been compelling. Yet despite impressive progress, many technologies still struggle to transition into reproducible manufacturing platforms. Besides the challenge of what materials can be printed, the greater challenge is whether they can be manufactured reliably, repeatedly, and independently of fragile material supply chains. Traditional printed electronics rely heavily on highly engineered liquid formulations composed of nanoparticles, solvents, binders, surfactants, dispersants, rheology modifiers, and proprietary additives. While these formulations enable printing, they also introduce a significant burden on manufacturing consistency and qualification. Small variations in ink composition, aging, storage conditions, viscosity, or supplier changes can drastically alter print performance and final device characteristics. Even more challenging, many inks are proprietary and evolve over time. Suppliers may discontinue formulations, modify ingredients, or change processing routes, forcing manufacturers and researchers to repeatedly recalibrate and requalify processes. For industries requiring long-term reliability, including aerospace, defense, medical systems, and energy infrastructure, this creates substantial barriers to adoption. We are exhibiting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026. Please register to meet us in person and see our technology in action. NanoPrintek was founded on the belief that the future of advanced manufacturing requires a fundamentally different approach. Instead of relying on liquid inks, NanoPrintek’s technology directly uses solid raw materials, including metals, ceramics, dielectrics, and composites, to generate nanoparticles in real time during printing, without ink, solvents, binders, or post-processing steps. This transforms manufacturing from a formulation-dependent process into a physics-defined process. In traditional workflows, qualification often becomes an ongoing challenge because even small changes in ink chemistry may require revalidation of electrical performance, adhesion, curing conditions, reliability, and environmental stability. In contrast, direct-from-raw-material manufacturing offers a pathway toward more stable and repeatable process definitions rooted in measurable physical parameters. This is especially important as industries increasingly seek supply-chain resilience and domestic manufacturing capabilities. Instead of depending on specialized liquid formulations with limited shelf life, manufacturing can be performed directly from stable solid materials that are easier to source, store, transport, and standardize. We are presenting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026. Please register to meet us in person and listen to our presentation. We are presenting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026. Artificial intelligence further strengthens this vision. With NanoPrintek’s AI-enabled Smart Manufacturing Interface (AI-SMI) module, manufacturing evolves beyond static process execution into a continuously learning system. Process conditions, print outcomes, and characterization data can be streamed directly into AI-driven optimization frameworks that autonomously identify improved manufacturing parameters. This enables closed-loop process optimization in which the system can design, print, characterize, learn, and refine process conditions with minimal human intervention. As manufacturing becomes increasingly digital and AI-assisted, reproducibility and scalability become easier to achieve across different users, facilities, and applications. The combination of ink-free manufacturing and AI-driven optimization creates a powerful foundation for next-generation electronics production. The impact of this approach is particularly compelling in aerospace, defense, and remote manufacturing environments where logistics, reliability, and adaptability are critical. Eliminating liquid ink reduces storage complexity, contamination risks, and material degradation concerns while enabling on-demand manufacturing in locations where conventional supply chains may not exist. At its core, NanoPrintek represents a shift in how advanced manufacturing is defined, toward digitally programmable, physics-based manufacturing systems designed for reproducibility, sustainability, and resilience. The future of printed electronics will be defined by not only what we can print, but also by how reliably, intelligently, and independently we can manufacture it. NanoPrintek is helping define the future of standardized, qualified, and supply-chain-resilient electronics manufacturing.

Picture: Ms. Jennifer Lin, AUO Corporation Vice President of Innovation Development, and Mr. Ness Benamran, Aledia Chief Financial Officer, announced the partnership in the presence of the Minister of Economic Affairs of Taiwan, Mr. Kung Ming-Hsin Grenoble, France & Hsinchu, Taiwan - April 10th 2026 -AUO Corporation ("AUO") and Aledia today announced a strategic partnership to develop a new generation of microLED display technology combining high brightness, low power consumption, and high resolution. The collaboration will integrate Aledia's high-voltage microLED {µLED) technology-based on its proprietary 3D nanowire architecture-onto AUO's advanced display backplane. MicMiD project for enhanced microLED displays The project has been selected as part of the France-Taiwan cooperation funding program, announced in Paris on March 31, 2026, in the presence of representatives from both governments and industry. The objective is to enable energy-efficient, high-performance displays addressing the growing demand for next-generation display technologies. By combining AUO's expertise in display engineering and system integration with Aledia's microLED technology designed for high-volume semiconductor manufacturing, the partnership aims to accelerate the industrialization of microLED displays and support their adoption across emerging applications. Beyond display use cases, the collaboration also opens opportunities in adjacent domains such as optical interconnects for Al data centers and microLED-based solutions for augmented reality devices. "This marks the beginning of a close and strategic partnership between AUO and Aledia. While we are starting with displays, we are looking to extend our collaboration beyond, opening opportunities in optical interconnects for Al data centers, as well as augmented reality glasses." said Ness Ben am ran, CFO of Aledia. AUO and Aledia acknowledge the support of the Taiwanese and French governments in fostering this collaboration, which contributes to strengthening innovation ecosystems and advancing microLED technologies on a global scale. The partnership was formally introduced in Paris in the presence of Taiwan's Minister of Economic Affairs Mr. Kung Ming-Hsin, French and Taiwanese public organizations, and participating companies. ''AUO is aggressively pushing next-generation display technologies based on microLED. On my wrist, I wear the world's first microLED watch, which is the result of more than one-decade efforts of development. Our ambition is to bring this technology to every consumer, and we expect Aledia's unique 8-inch silicon-based 3D nanowire technology can help us to scale it to the next level." said Jennifer Lin, Vice President of Innovation Development, AUO. Acknowledgments AUO and Aledia thank the organizations supporting this initiative, including the French Direction Genera le des Entreprises (DGE), Bpi France, the France 2030 investment plan, the Taiwanese Industrial Technology Research Institute (ITRI), the Taiwanese Department of Industrial Technology (DOIT), and Taiwan Ministry of Economic Affairs. Technical Contact Eric BUTAUD - Senior Director Product Marketing +33 6 15 95 20 11 eric.butaud@aledia.com Press contact Nathalie N ERi - Communication, Marketing & Customer Relation officer +33 6 85 23 50 27 Nathalie.neri@aledia.com

Author: Varun Vohra, Engineering Department Manager, Brilliant Matters | v.vohra@brilliantmatters.com Organic Photovoltaics (OPVs) for Solar Heat Gain (SHG) Mitigation Buildings are among the largest contributors to global energy consumption and greenhouse gas emissions, accounting for a significant portion of worldwide energy-related CO₂ output. They are responsible for roughly one-third of global final energy use, with operational energy demand dominated by heating, ventilation, and air conditioning (HVAC). In modern commercial and high-performance residential buildings, HVAC systems typically represent 30% to 60% of total building energy consumption [1]. In recent years, buildings with high glazing ratios or window-to-wall ratios (WWRs) exceeding 70% have become increasingly common worldwide. This trend has been enabled by advances in high-strength glazing materials and window-frame engineering, which allow large glass façades to be implemented safely while enhancing daylight access and spatial openness for occupants. However, high WWRs also substantially increase cooling demand, often making HVAC systems the dominant contributor to building electricity consumption, accounting for more than 75% of total electrical use in some cases [2]. Conventional glazing lets through a large fraction of near-infrared (NIR) solar radiation (700–2500 nm), which carries more than half of the sun’s thermal energy. Transmitted NIR radiation is absorbed by interior surfaces and re-emitted as heat, increasing indoor temperatures and driving up cooling loads. Technologies that selectively filter NIR radiation, such as those used in Burj Khalifa, directly address this challenge by mitigating SHG at the façade and glazing levels. Similar to conventional solar heat-blocking technologies—i.e., solar control films that reflect or absorb NIR radiation, OPV panels strongly attenuate NIR transmission while preserving usable visible light transmission and maintaining aesthetically pleasing, neutral or soothing colors. As global roadmaps and agency reports consistently identify buildings as a key sector for energy efficiency and decarbonization [3], OPV panels demonstrate strong potential as next-generation SHG mitigation technologies that can simultaneously reduce HVAC loads and contribute to on-site power generation, thereby improving the overall energy efficiency of modern buildings without compromising architectural design. We are exhibiting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026. Please register to meet us in person and see our technology in action. Brilliant Solutions for Next-Generation Energy-Saving Windows Unlike conventional silicon PV panels, which are manufactured through energy-intensive processes, flexible OPV panels are produced using low-temperature, high-throughput, and high-yield roll-to-roll techniques similar to newspaper printing (Figure 1a). As a result, OPV panels can achieve energy payback times that are significantly shorter than those of conventional PV technologies [4]. Since they typically weigh less than 1 kg/m² and, in many cases, around 0.5 kg/m²—about 20 times lighter than silicon PV panels—they impose minimal additional structural loads and reduce stress on building structures. Despite their favorable weight, form factor, and NIR-blocking capability, OPV panels have not yet achieved widespread adoption. Figure 1: (a) Photograph of roll-to-roll manufacturing of OPV prototypes, provided by PHD Semicon, a Brazilian semiconductor company specializing in the large-scale printing of flexible OPV panels; (b) Schematic representation of the multilayer structure of an OPV panel. The first barrier to widespread adoption has been the limited advancement of active layer systems in commercial OPV modules over the last decade, resulting in stagnation in operational power output and lifetime. Throughout that decade, commercial OPV panels relied on the same organic semiconductor system in the active layer—i.e., the key layer responsible for absorbing sunlight and converting it into electricity (Figure 1b). While this pioneering industrial active layer played an important role in launching the industry and enabling the development and optimization of roll-to-roll manufacturing processes for OPV panels, the technology continued to exhibit limited performance, with power outputs stagnating at around 30 W/m² under standard test conditions and operational lifetimes restricted to approximately five years. Drawing on Brilliant Matters’ expertise in chemistry, ink formulation, and engineering, alongside years of collaboration with leading printed electronics manufacturers, we commercialized the BM7 active layer solution in 2025. BM7 is produced via low-complexity synthetic routes and without toxic precursors, making this OPV solution highly scalable while maintaining production costs compatible with mass-market adoption. Additionally, BM7 was developed to ensure hassle-free manufacturing of industrial OPV panels by focusing on producing high-quality, defect-free active layers. Commercial 32-cell OPV panels employing BM7 active layers produce 60–70 W/m² and open-circuit voltages of approximately 25.6 V (0.8 V per cell) under standard test conditions. Their outdoor operational lifetime is estimated to be approximately 10 years, a significant improvement compared to the aforementioned first generation of OPV panels. As a result, BM7 has emerged as the market-leading active layer for see-through flexible and lightweight commercial PV panels, paving the way for the large-scale adoption of OPV technology, particularly for retrofitted building-integrated photovoltaics (BIPV) applications. Figure 2: OPV-based BIPV window modules developed and manufactured by OET Energy Technologies, a Greek pioneer in advanced roll-to-roll manufacturing of semi-transparent OPV panels for next-generation BIPV applications, seamlessly integrated onto building glazing for energy-generating architectural façades; and self-powered roller shades with integrated OPV panels from PHD Semicon. In fact, BIPV provides an ideal framework to address the second major barrier to the widespread adoption of OPV technology, namely, the lack of clear real-world case studies demonstrating the short monetary payback time (MPBT) and high return on investment (ROI) of OPV panels. When applied to transparent surfaces such as the glazing of modern or high-rise buildings, BM7’s subtle tint can create a visually soothing atmosphere for occupants while still allowing views of the outside. This soft blue coloration resembles the tone of the sky, allowing OPV surfaces to blend naturally with surrounding environments. The lightweight flexible panels, which are less than 1 mm thick, can easily be retrofitted with minimal cost to existing façades and glazing or integrated into modern smart designs like self-powered roller shades, all of which generate electricity while providing solar control (Figure 2) [5]. The panels block more than 75% of radiation in the 700–1400 nm range and approximately 95% in the 1400–2500 nm range (Figure 3a). To assess the thermal control capacity of BM7 panels, we simulated SHG in buildings with high glazing ratios using an acrylic box with one side exposed to a halogen lamp—i.e., artificial sunlight. A mild temperature rise of 14°C over 15 min was observed when the BM7 panel was applied to the exposed side of the building model, which is significantly lower than the approximately 40°C rise measured for the uncoated building model (Figure 3b). This experiment also confirms that BM7 panels provide superior thermal control compared to a commercial solar-control film under identical conditions, as the latter produced a higher temperature increase of 20°C, highlighting the potential of BM7 panels to reduce cooling demand and associated energy costs [6]. Figure 3: (a) UV-Vis-NIR spectrum of BM7 panels along with solar spectral irradiance and (b) SHG experiment results of BM7 OPV panels compared to conventional solar heat-blocking films. SHG experiments were carried out by GSI Creos, a key Japanese player in advanced materials and technology development. Applying conventional solar heat-blocking films to apartment windows can generate annual energy savings of 9–16% in Mexico [7]. Depending on location, solar exposure, WWR, baseline glazing performance, and building characteristics, even higher savings may be achievable. Based on findings from the Mexico study and previous customer case studies, installing BM7 panels in the southern United States is expected to reduce HVAC energy demand by more than 10%, consistent with reported SHG mitigation benefits associated with solar-control glazing technologies. However, the magnitude of HVAC-related savings will vary depending on building envelope properties, HVAC system configuration, shading conditions, orientation, and local climate. For a modern industrial building with 240 m² of glazing, installing BM7 OPV panels across all available surfaces would cost under US$170,000, with estimated annual savings of approximately US$60,000 from reduced HVAC demand and an additional US$5,000 from on-site energy generation. This illustrative case assumes a conservative power output of 50 W/m² and an operational lifetime of 10 years, while excluding any government incentives. Under these assumptions, the BM7 OPV panel-based system would deliver an MPBT and ROI of approximately 2.7 years and 280%, respectively. These results demonstrate that, beyond their energy-generation capability, BM7 OPV modules can provide substantial operational cost reductions through simultaneous HVAC load mitigation. Although the projected economic performance remains sensitive to site-specific factors such as electricity prices, solar exposure, orientation, and shading conditions, the system compares favorably with similarly sized silicon photovoltaic installations by offering a substantially shorter MPBT while remaining near the upper end of the typical ROI range. Summary and Outlook In conclusion, BM7-enabled OPV technology represents a meaningful advancement in retrofitted building-integrated energy solutions, addressing SHG mitigation, on-site power generation, and seamless architectural integration. By overcoming historical limitations in performance and lifetime, BM7 enables the practical and economic deployment of OPVs at scale. As the industry moves toward more distributed energy models such as low-voltage DC microgrids in commercial buildings, the concepts of delivering “power where it is needed” and “efficient energy use to reduce overall demand” are gaining traction, positioning integrated OPV systems as a natural fit for next-generation building design. In parallel, BM7 OPV panels contribute to contemporary aesthetics. Their subtle blue hue complements modern architectural design while minimizing visual impact, blending naturally with elements such as the sky seen through glazing surfaces (Figure 4). Figure 4: View of the Tokyo metropolitan area from the GSI Creos headquarters seen through conventional glazing and through a BM7 OPV panel. Looking ahead, continued progress in materials and system integration is expected to further expand the role of OPVs across both new construction and retrofit applications, thereby supporting broader decarbonization efforts. Brilliant Matters welcomes collaboration with partners seeking to integrate OPV technology into their projects. Stakeholders are encouraged to engage with our team to explore tailored solutions that combine performance, cost efficiency, and design integration. Join the flagship TechBlick events in California on 10-11 June 2026, and in Berlin on 21-22 October 2026 This event is the global home of the Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year, the California event will also feature. The Future of Wearables Reshaped References [1] Ryu, D.; Yoo, W. Ventilation-dominated energy savings in large commercial buildings: Multi-measure assessment revealing HVAC optimization priorities for hot-humid climates. Case Stud. Therm. Eng. 2025, 74, 107034. https://doi.org/10.1016/j.csite.2025.107034 [2] Abdou, Y; Kim, Y.K.; Abdou, A.; Anabtawi, R. Energy Optimization for Fenestration Design: Evidence-Based Retrofitting Solution for Office Buildings in the UAE. Buildings 2022, 12, 1541. https://doi.org/10.3390/buildings12101541 [3] https://www.ipcc.ch/report/ar6/wg3/chapter/chapter-9/ https://www.iea.org/energy-system/buildings [4] Yue, D.; Khatav, P.; You, F.; Darling, S.B. Deciphering the uncertainties in life cycle energy and environmental analysis of organic photovoltaics. Energy Environ. Sci. 2012, 5, 9163-9172. https://doi.org/10.1039/C2EE22597B [5] https://opv-installations.com/building-integration-biopvs/ https://www.nacleanenergy.com/alternative-energies/introducing-the-orenge-printed-semiconductor-shade-system [6] https://www.3m.com/3M/en_US/home-window-solutions-us/solutions/energy-savings/ [7] Chavez-Galan, J.; Almanza, R. Solar filters based on iron oxides used as efficient windows for energy savings. Sol. Energy. 2007, 81, 13-19. https://doi.org/10.1016/j.solener.2006.06.009 This year, the Berlin event will also feature: Perovskite Connect, Sustainable Electronics RESHAPED, Electronic Textiles RESHAPED

Author: Jurgen Westerhoff | jurgen.westerhoff@spgprints.com Why printed electronics projects succeed or fail at the business case stage Printed electronics has moved well beyond the experimental phase. Applications such as RFID antennas, in-mould heaters, biosensors, and energy components are increasingly transitioning into industrial-scale production. The technical promise is clear: lightweight designs, scalable manufacturing, and new functional integration possibilities. Yet many projects stall at a critical point — not because the technology fails, but because the business case remains unclear. In most development trajectories, technical feasibility comes first. Teams focus on whether the application works: signal performance, resistance levels, feature resolution, and material compatibility. These are essential steps. Without them, there is no viable product. However, technical validation alone does not justify investment. A recurring issue in printed electronics projects is that financial validation happens too late. Organizations often confirm that a product works before asking whether it can be produced profitably, reliably, and at scale. This creates a structural risk. By the time cost models, yield assumptions, and capital requirements are analysed, significant time and resources have already been committed. We are exhibiting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026. Please register to meet us in person and see our technology in action. Two dimensions that define a viable business case 1. Product economics At scale, small process variations translate into significant financial impact. Key variables include: Cost per unit of output Yield and repeatability at production speed Sensitivity to raw material costs such as silver volatility Competitive positioning against alternative production technologies In high-volume applications such as antennas, material consumption alone can determine profitability. Even marginal improvements in ink deposition or yield can shift the economics substantially. 2. Capital investment Beyond unit economics, investment decisions depend on: Required CapEx and installation timeline Total Cost of Ownership (TCO) Expected return on investment (ROI) Alignment with growth strategy A common pitfall is improving individual components without considering system-level performance. Printed electronics production is an interdependent system where throughput, yield, material usage, and uptime are tightly linked. Business cases fail when this system perspective is missing. We are presenting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026. Please register to meet us in person and listen to our presentation. We are presenting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026. As production scales, consistency becomes more important than peak performance. The key question becomes: can it work continuously, predictably, and within defined cost limits? Achieving this requires alignment between equipment, process parameters, and application requirements. To help with this analysis SPGPrints made an ROI calculator to find out the financial differences between flatbed and rotary screen printing: Printed Electronics ROI Calculation Tool The role of an integrated technology partner For many organisations, bridging the gap between feasibility and a robust business case requires more than in-house engineering. It requires a partner that understands both process performance and production economics. SPGPrints approaches printed electronics from a system perspective, combining rotary screen printing technology, screen manufacturing, and application expertise. This integrated approach reduces variability between process steps and enables more predictable outcomes at production scale. Rather than focusing on individual components, the emphasis is on line-level performance: consistent ink deposition, controlled feature definition, and repeatable results at industrial speeds. These factors directly influence yield, material efficiency, and ultimately cost per unit. In parallel, application specialists support the translation of technical parameters into economic models. By linking process settings to cost drivers such as silver consumption, uptime, and scrap rates, organisations can build more accurate and defensible business cases. Successful projects bring technical and financial evaluation together from the start. Instead of sequential decision-making, they model cost-per-output alongside feasibility testing, validate yield under realistic conditions, and assess sensitivity to process variation. This reduces the risk of late-stage surprises and strengthens internal decision-making. Conclusion: Treat the business case as a design parameter Printed electronics projects do not fail due to lack of innovation. They fail when economic validation lags behind technical progress. By integrating financial analysis early, focusing on system-level performance and working with partners who understand both technology and production conomics, organisations can move beyond feasibility and build a credible path to scale. The key shift is simple: treat the business case not as a final checkpoint, but as a core design parameter from the outset. Join the flagship TechBlick events in California on 10-11 June 2026, and in Berlin on 21-22 October 2026 This event is the global home of the Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year, the California event will also feature. The Future of Wearables Reshaped This year, the Berlin event will also feature: Perovskite Connect, Sustainable Electronics RESHAPED, Electronic Textiles RESHAPED

Author: Kyle Pucci | pucci@imagexpert.com At ImageXpert, we design inkjet development platforms with one goal in mind: enabling users to develop, validate and scale applications with confidence. In this context, curing is no longer a downstream step. In advanced functional and industrial applications, even small changes in UV dose, wavelength or timing can determine whether a printed layer performs as intended—or fails later during testing or scale-up. Collaborative Success Traditionally, curing has been treated as a secondary consideration in inkjet R&D, often handled using stand-alone lamps or externally controlled units. However, as applications become more demanding, this separation can limit development accuracy and process understanding. To overcome this, ImageXpert has partnered with IST INTECH to bring fully integrated UV-LED curing directly into our JetXpert printing platforms. By embedding it within the core system architecture, ImageXpert enables users to treat curing as a fully controllable and optimisable process parameter—alongside jetting, motion and fluid behaviour. Adjustable Operating Window A defining strength of ImageXpert equipment is flexibility. Our platforms are built to support a wide range of applications, allowing users for example to evaluate different fluid chemistries and viscosities, jetting and long-term reliability, layer application and thicknesses, print process speeds and quality seamlessly. All towards end-use requirements—and within a single system. The integration of a modular UV-LED solution extends this flexibility towards investigating curing processes. Users can explore a wide operating window of output levels ranging from approximately 3–28 W/cm² using a single adjustable lamp head. This enables rapid comparison of curing strategies directly within the ImageXpert platform. Lower-power pinning can also be simulated through software control or via integration of compact pinning units. Arc lamps can be integrated additionally when required. Print Pod _ UV LED Pin As Kyle Pucci, Director of Applications Engineering at ImageXpert, explains: “When our customers are first getting started with a new inkjet application, there are so many things to learn in the jetting and printing process, including the right way to cure their material for top performance. The ability to avoid committing to a fixed curing setup early on—and instead adapt it as development progresses—gets a tremendously positive response from users.” We are exhibiting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026. Please register to meet us in person and see our technology in action. Fully Integrated, Open Architecture ImageXpert platforms are built around an open and fully integrated control architecture. The curing system is not an add-on—it is embedded within the same control environment as the printheads and motion system. This means lamp settings, triggering and output levels can be managed directly through the ImageXpert user interface, providing the same level of programmability and synchronisation as every other process parameter. Complex, multi-step processes can be developed dynamically, with curing precisely aligned to jetting and substrate movement. Multi-Wavelength Capability To support the broad application scope of ImageXpert equipment, multiple wavelengths—including 365nm, 385nm, 395nm and 405nm—can be configured within a single system. This capability allows users to work with advanced and specialised chemistries, including those requiring multi-wavelength exposure for optimal cure depth and adhesion. Where formulations extend beyond LED capabilities, ImageXpert platforms can also integrate Arc lamp solutions, enabling hybrid curing approaches within the same machine. Matching System Configuration And Understanding Dose Another key advantage of the JetXpert inkjet development platforms is scalability. Avoiding the inefficiencies associated with oversized or daisy-chained lamps ensures that development results are highly representative of production conditions. Platforms can be configured in fine width increments, ensuring that curing is closely matched to the printed area. For reliable process development, a strong emphasis on real-world curing conditions is placed — particularly the concept of dose. While intensity (W/cm²) describes lamp output, delivered dose (J/cm²)—a function of intensity and exposure time—is what determines whether a chemistry fully cures. By integrating curing into the ImageXpert platform, users can evaluate dose under true process conditions, accounting for print speed, lamp positioning and exposure dynamics. Reducing the risk of incomplete cure, adhesion failure or long-term durability issues during scale-up. IST INTECH UV Dose vs Intensity A Clearer Path To Production A core strength of ImageXpert equipment is the ability to bridge development and production. Through our collaboration with IST INTECH, the same curing platform can be used across different system sizes, ensuring continuity of process parameters. This enables customers to move seamlessly from PrintLab or Print Station platforms into customised production or pre-production systems—without re-engineering the curing process. The result is reduced development risk, faster time-to-market and simplified system specification. Print Station _ IST UV Hg and LED Supporting Development Of New Inkjet Applications ImageXpert platforms are increasingly used for advanced applications where tight process requirements and performance is critical to functionality—not just visual appearance. Applications such as advanced coatings, adhesives, functional materials and biomedical materials require precise control from the earliest development stage. By combining ImageXpert’s flexible platform with integrable print process add-ons such as curing, or pre-treatment or print quality inspection tools, users can fine-tune print processes during initial trials and establish robust, scalable processes. Enabling Progress Through Collaboration At ImageXpert, we believe that innovation happens through close collaboration. By working with partners such as IST INTECH, we integrate specialist technologies directly into our platforms to solve real process challenges. This approach ensures that curing parameters can be defined, measured and optimised early in development—removing barriers to innovation and enabling confident progression to production. Demonstrated Performance – Seeing Is Believing The capabilities of ImageXpert equipment with integrated curing have been demonstrated at leading industry events, including RadTech North America, the European Coatings Show and the Printed Electronics event LOPEC in Munich. ImageXpert continues to work closely with ink developers, formulators and system integrators, helping them explore new applications, optimise processes and scale with confidence using fully integrated inkjet development systems. Connect with our team for your live demonstrations using ImageXpert platforms equipped with print process Add-Ons, such as LED curing—allowing faster, more reliable qualification of new applications. Join the flagship TechBlick events in California on 10-11 June 2026, and in Berlin on 21-22 October 2026 This event is the global home of the Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year, the California event will also feature. The Future of Wearables Reshaped This year, the Berlin event will also feature: Perovskite Connect, Sustainable Electronics RESHAPED, Electronic Textiles RESHAPED

How the SPS ASTRON QX Series Advances Cylinder Printing for Printed Electronics Author: Ron Hayden | ron@rhsolutionsllc.com Figure 1: The automatic 4-post SPS ASTRON QX57 - The newest generation of STOP cylinder screen printing machines In printed electronics, a few microns can determine whether a device performs as intended or fails entirely. Conductive traces must align precisely with dielectric layers, resistive elements must maintain consistent geometry, and each deposited layer must deliver repeatable electrical performance. Achieving this level of consistency depends on one critical factor: the stability of the printing platform. Applications such as membrane switches, capacitive sensors, automotive HMI interfaces, and flexible electronics rely on the controlled deposition of conductive, dielectric, and resistive inks. Each layer must be printed with high positional accuracy while maintaining uniform ink thickness across the substrate. Even minor variations in the print process can affect conductivity, resistance, or sensor response. Figure 2: Live video of SPS Astron QX57 operating For manufacturers of functional devices, printing stability is not simply a measure of visual quality. It is fundamental to product reliability. To meet these requirements, new press architectures are emerging that move beyond the mechanical drive systems traditionally used in cylinder screen printing. The SPS ASTRON QX series represents a significant step in this evolution. Built around a fully servo-driven motion platform, it replaces cam-driven and pneumatic systems with digitally synchronized motion control designed for high-precision functional printing. Figure 3: Servo-motor main cylinder drive Figure 4: Linear electromagnetic drive We are exhibiting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026. Please register to meet us in person and see our technology in action. Servo Motion Brings New Control to Cylinder Printing Traditional cylinder presses rely on cam drives and pneumatic components to generate motion during the print cycle. While robust and productive, particularly in decorative printing, these systems inherently introduce small variations in acceleration, stroke dynamics, and positional repeatability. Functional printing demands tighter control. The ASTRON QX series replaces these mechanical systems with coordinated servo drives governing all critical movements. The printing cylinder is powered by a direct-drive servo motor, enabling precise synchronization between cylinder rotation and the print stroke. This design eliminates the inertia effects found in older presses, where rack-and-pinion drives operating from one side introduce lag across the cylinder width. At the same time, the screen carrier is driven by linear electromagnetic motors on both sides of the press. This dual-sided drive maintains balanced forces across the full print width, improving positional stability. The result is a digitally synchronized motion system in which cylinder rotation, screen movement, and print stroke operate under unified control. Eliminating mechanical backlash and uncontrolled acceleration improves sheet-to-sheet repeatability and stabilizes the print stroke. Direct-drive servo accuracy reaches ≤30 µm. In functional screen printing, this level of control directly affects ink transfer. Conductive silver pastes, carbon-based inks, and dielectric coatings are sensitive to shear forces during printing. Variations in squeegee motion can alter layer thickness, distort fine features, or reduce line definition. Servo-controlled motion minimizes vibration and maintains consistent stroke dynamics across the entire print area. Figure 5: High lift quick screen insert function Figure 6: High lift quick screen insert controls Precision Control of the Print Stroke Ink transfer in screen printing is governed by the interaction between the squeegee, stencil, and substrate. For functional applications, this interaction must be tightly controlled. The ASTRON QX incorporates a servo-driven squeegee and flood system designed for precision and repeatability. A heavy-duty assembly, driven by servo motors with precision ball screws and hydraulic support, allows accurate control of vertical positioning throughout the print cycle. Squeegee pressure is generated through servo motors, hydraulics and mechanical functions, and adjusted digitally via the human-machine interface (HMI). Pressure is defined in newtons per centimeter, enabling consistent force distribution across varying print widths. This level of control allows the print stroke to be tuned to the rheology of specific inks. High-viscosity silver pastes may require slower, controlled strokes to maintain fine line definition, while dielectric or protective layers can be printed at higher speeds to increase throughput. All parameters are digitally stored and recallable, with capacity for up to 500 recipes. This reduces setup time and ensures repeatable process conditions across production runs. The system also incorporates a high-lift screen and carriage design. Operators can slide screens in from the operator side, remove them for cleaning, and return them without losing registration. Raising the four-post screen and squeegee carriage, combined with a lowered delivery section, provides clear access to the cylinder, lay stops, and side guides, improving both usability and maintenance efficiency. Figure 7: Vacuum transport belts Figure 8: Double sheet detection sensor Stable Handling for Sensitive Substrates Functional printing often involves thin and flexible materials such as PET, polycarbonate, Mylar, polyimide, and coated specialty substrates. These materials require controlled handling to prevent distortion, scratching, or registration drift. The ASTRON QX integrates a fully servo-driven single-sheet feeder designed for reliable separation and transport. Spring-loaded suction elements assist with sheet pickup, while ultrasonic double-sheet detection prevents feeding errors—particularly important when processing thin substrates. Servo-driven vacuum transport belts guide sheets smoothly through the print section while minimizing surface contact. Independent speed synchronization between transport and downstream drying systems helps maintain sheet stability while protecting sensitive surfaces or previously printed layers. For improved accessibility, the substrate exit table lowers to provide unobstructed access to the cylinder area, including lay stops, hold-downs, and side guides. By synchronizing feeder motion with cylinder rotation and screen movement, the system maintains consistent sheet positioning throughout the entire print cycle. Figure 9: CCD camera-based registration Camera-Based Registration for Multilayer Structures Most printed electronic devices are built from multiple functional layers. Conductive traces, dielectric coatings, resistive elements and protective layers must align with high positional accuracy to create reliable electronic structures. To support these requirements, the SPS ASTRON QX incorporates a CCD camera-based registration system designed for precision multilayer printing. Two CCD cameras positioned near the side-lay stops detect fiducial marks on each sheet during the print cycle. After the substrate reaches the front lays, the side-lay system positions the sheet and the gripper closes. The cameras then measure the exact position of the fiducials. Based on this data, multiple servo-driven screen axes automatically compensate for positional deviation before printing begins. The system delivers repeatable registration accuracy of ≤30 µm. This closed-loop registration process compensates for substrate variation and dimensional changes in previously printed layers. The result is improved layer-to-layer alignment and reduced cumulative registration drift during long production runs. For multilayer printed electronics, camera-based registration provides significantly greater process stability and repeatability than conventional manual alignment methods. 10: Digital Process Control Interface Figure 11: Digital parameter settings for squeegee and floor bar pressure Digital Process Control for Modern Production The servo-driven platform is supported by an advanced human-machine interface that centralizes control of machine parameters and production data. Operators can configure print speeds, stroke profiles, and pressure settings while monitoring system performance in real time. Up to 500 production recipes can be stored and recalled, enabling consistent setup across repeat jobs. Production data and machine logs can also be integrated into factory monitoring systems, with optional software to support Industry 4.0 connectivity and process traceability. For manufacturers focused on repeatability, documentation, and quality control, digital process management reduces setup variability while maintaining consistent machine performance. A Platform Designed for Functional Printing As printed electronics expand into applications such as smart surfaces, automotive systems, and energy technologies, the demands placed on screen printing equipment continue to increase. Precision registration, controlled ink deposition, and stable multilayer production are no longer optional—they are required. By combining servo-driven motion control, camera-based registration, and digitally managed process parameters, the SPS ASTRON QX series provides a platform engineered for these demands. The result is a cylinder screen printing architecture designed not only for print quality, but for the level of process stability required by modern functional devices. About RH Solutions LLC. RH Solutions LLC is a North American supplier of functional screen printing equipment and process solutions, supporting manufacturers across printed electronics, automotive, packaging, glass, and functional print applications. The company partners with leading global manufacturers, including ATMA and SPS, to provide high-precision printing systems, integration support, and technical expertise. Through its focus on application-driven solutions, in-house testing, and customer training, RH Solutions helps engineers and production teams optimize print processes, improve repeatability, and scale functional printing technologies from development to full production. Website: https://www.rhsolutionsllc.com/ Telephone: 513-407-5399 Address: 4295 Armstrong Blvd, Batavia, OH 45103 USA Join the flagship TechBlick events in California on 10-11 June 2026, and in Berlin on 21-22 October 2026 This event is the global home of the Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year, the California event will also feature. The Future of Wearables Reshaped This year, the Berlin event will also feature: Perovskite Connect, Sustainable Electronics RESHAPED, Electronic Textiles RESHAPED

21 & 22 OCT 2026 Berlin, Estrel Congress Centre co-located with the TechBlick Electronics RESHAPED Show echBlick is launching the Sustainable Electronics RESHAPED conference and exhibition - an event dedicated to Sustainable Electronic Materials, Resource Efficient Electronic Manufacturing, and Circular Designs. This event will be co-located with the Future of Electronics RESHAPED in Berlin on 21 and 22 OCT 2026 - our flagship event dedicated to additive manufacturing of electronics. The synergy is natural. Additive electronics enables material-efficient, low-energy, and resource-conscious manufacturing, making it intrinsically aligned with sustainable and circular electronics. The combined event will feature 650 participants, 85 exhibitors and over 100 conference talks. World-Class Program We will curate a fantastic program. In fact, confirmed speakers include Signify Research, AT&S, AUMOVIO, 4MOD, PrintOCell, Fraunhofer IZM, Yamagata University, Silicon Austria Labs GmbH, University of Maryland, Auburn University, DP Patterning, EMPA and others Exhibition - special pricing We are offering a special exhibition package to our Sustainable Electronics RESHAPED exhibitors. The special pricing is possible thanks to our close collaboration with the Smart Textile Alliance. Please contact tom@techblick.com for further information regarding pricing and the details of the packages

Applications: Antennas · Electrodes · Conductors · Heaters · Circuit Boards Conventional flex-PCB production is still dominated by wet chemical etching or printed conductive inks—processes built around multiple material steps, hazardous chemicals, and inherently unstable cost structures driven by silver and other volatile inputs. While widely adopted, these methods are increasingly misaligned with what the market now demands: scalable production, supply chain resilience, regulatory compliance, and verifiable sustainability. Across industries, regulatory pressure is tightening. ESG (Environmental, Social and Governance) reporting requirements, restrictions on hazardous substances, and increasing scrutiny of chemical-intensive manufacturing processes are forcing companies to rethink not only what they produce, but how it is produced and documented. At the same time, geopolitical uncertainty and material volatility are exposing the fragility of globalized, chemistry-dependent supply chains. DP Patterning’s patented Dry Phase Patterning (DPP) technology was developed to remove these constraints entirely. At its core, DP Patterning replaces chemistry-based etching processes with a fully dry, mechanical roll-to-roll method. Instead of defining circuit geometry by selectively removing material through etchants and chemical processes, the pattern is formed directly in a metal-clad flexible substrate—typically aluminum-based laminates—using mechanical processing. The process is based on two important steps to achieve well-defined structures: First, a cliché is patterned with the desired geometry. Second, a high-precision milling wheel removes only the protruded metal regions, leaving behind fully formed conductive traces on a flexible carrier. The result is a continuous roll-to-roll production flow that converts raw laminate into finished flexible circuits without any wet chemistry, inks, or curing steps. This has direct implications not only for performance and cost, but also for regulatory compliance and supply chain resilience. Why DP Patterning is Outperforming Conventional Methods Performance: Solid-metal conductivity instead of particle-based inks Because DP Patterning uses solid aluminum and copper cladded aluminum (CCA)- foils rather than printed conductive inks, it delivers significantly higher and more stable electrical performance. Conductivity is typically 2–3× higher than printed electronics solutions, with improved long-term stability due to the absence of particle sintering or binder degradation. Cost efficiency: Decoupling from material volatility and process complexity By design, DP Patterning enables the use of widely available conductive materials and substrates such as aluminium-clad aluminium, and flexible carriers based on plastic or paper. This reduces dependence on silver-based inks and other high-cost, high-volatility materials, creating a more stable and predictable cost base. In addition, the process eliminates multiple conventional manufacturing steps such as printing, drying, and sintering, thereby simplifying the overall production flow. Simplicity and scalability: Fewer steps, higher industrial robustness Traditional flex-PCB manufacturing relies on multi-step chemical sequences, each introducing variability, yield loss, and environmental burden. DP Patterning collapses this into a continuous mechanical process, significantly reducing process variability and enabling high-throughput roll-to-roll manufacturing suitable for industrial scale-up. Sustainability & regulation readiness: Designed for a changing compliance landscape Because DP Patterning is fully mechanical, it eliminates the need for etchants, solvents, and water-intensive processing. This directly reduces hazardous material handling, simplifies environmental reporting, and supports compliance with increasingly strict chemical and sustainability regulations in global manufacturing. Material removed during patterning is generated as dry metal particles that can be recycled, avoiding liquid waste streams entirely. This is confirmed by an Independent Fraunhofer Institute Life Cycle Assessment (LCA), which reports up to ~98% reductions in CO₂, emissions and energy use compared to wet etching production - achieved through process step elimination rather than downstream compensation. In a regulatory environment increasingly shaped by traceability, chemical restrictions, and ESG accountability, this represents a structurally compliant manufacturing model by design—not adaptation. Supply chain resilience: From global dependency to local production By removing reliance on complex chemical supply chains and volatile raw material inputs, DP Patterning enables a more robust and geographically flexible production model. Combined with roll-to-roll scalability and modular deployment, this supports localized manufacturing closer to end markets. This reduces exposure to geopolitical disruption, shortens lead times, and increases control over critical production capacity—key requirements in an increasingly fragmented global supply environment. From Process Innovation to Industrial Large-scale Production Dry Phase Patterning introduces a fundamentally new approach to FLEX Electronics-manufacturing. It represents a different process architecture —one that removes chemical processing entirely, reduces material cost volatility, and enables scalable production without sacrificing electrical performance. In doing so, DP Patterning addresses a challenge the industry has faced for decades: how to achieve high performance, low cost, regulatory compliance, supply chain resilience, and real sustainability at the same time—without trade-offs. This is what makes Dry Phase Patterning fundamentally different. And why it is emerging as a new standard for flexible electronics manufacturing. We look forward to discussing the technology and its applications in practice. Visit DP Patterning at booth #E11. We are exhibiting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026 Please register to meet us in person and see our technology in action. Join the flagship TechBlick events in California on 10-11 June 2026 This event is the global hub for Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year, the event in California will also feature. The Future of Wearables Reshaped The event in Berlin will also feature: Perovskite Connect, Sustainable Electronics RESHAPED, Electronic Textiles RESHAPED

Researchers and product developers continually push the limits of precision and resolution in material dispensing. Dot dispensing in electronics and other advanced fields such as additive manufacturing, chemical engineering, and biomedicine provides the fine control needed for cutting-edge applications, enabling features such as fine solder paste application, DNA microarrays (a kind of biochip), or adhesive micro dots. How dot dispensing works In dot dispensing (a form of drop-on-demand printing), a small volume of functional material is ejected from a nozzle to form a droplet (”dot”) that lands on a substrate at a specified location. Each dot is typically on the order of microliters, nanoliters, or even picoliters in volume. The process is digitally controlled: each droplet is generated only when and where needed, allowing precise patterning and minimizing waste. By adjusting process parameters (such as pressure pulses or actuator voltage), the system controls the volume of each drop and thus the dot size on the substrate. Applications of dot dispensing The applications of dot dispensing include microelectronics packaging (e.g., solder paste, conductive adhesives), flexible printed electronics, microfluidics fabrication, biomaterial and cell-based bioprinting, LED phosphor dispensing, underfill encapsulation, and the construction of microstructured sensors and actuators for electronic skin and wearable technology. They provide high accuracy, repeatability, and scalability critical for complex device fabrication and advanced material development [1]. Types of dot dispensers There are several engineering approaches to generate and dispense tiny dots. Based on one classification framework of Lee J M, et al. [2], dot dispensing mechanisms fall into two broad categories: Material jetting: A non-contact method that uses actuation mechanisms such as piezoelectric or solenoid jet valves to eject discrete droplets Material extrusion: A contact-based method where material is deposited through pressure-driven flow, including pneumatic time-pressure and positive displacement systems Each category is suited to a different viscosity range and precision level. Material jetting Piezoelectric inkjet dot dispensers Piezoelectric inkjet dispensers use a piezoelectric actuator to create a pressure pulse in a small ink chamber, ejecting a droplet through a fine orifice. They produce extremely small droplets (single picoliters), enabling high-resolution patterning and precise application in the form of thin, accurate deposit dots and lines [3][4]. A piezoelectric actuated jetting system © Agarwal, S., CC BY 4.0 The limitation of piezoelectric inkjet, however, is that they impose strict ink property requirements: typically a viscosity below 40 cP and surface tension in the 20-70 mN/m-1 range for reliable jetting [5]. As such, piezoelectric inkjet dispensers are only suitable for micro volume dispensing of low-viscosity functional inks such as conductive polymers and nanoparticle inks [3]. Quality of epoxy adhesive droplets with ~300 µm diameter jetted by a piezo-driven dispense valve © Agarwal, S., CC BY 4.0 Solenoid jetting dot dispensers A pneumatic-solenoid valve droplet dispensing system, adapted from © Lee, S., et al., CC BY 4.0 Different from a piezo-actuated valve dispenser, where a piezoelectric stack or bending element drives the needle open and closed, in a solenoid jet valve, a coil generates a magnetic force to lift the valve needle off its seat momentarily, allowing fluid to jet out until the spring or magnetic force closes it again. Similar to piezoelectric jetting systems, solenoid jetting dispensers excel at very high-speed dotting (up to kHz firing rates) and tiny dot sizes (tens of microns), but can handle viscosities up to about 40 cP. Although researchers have been experimenting with pushing jetting into the higher viscosity range, challenges of pattern fidelity remain to be solved. In addition, a material jetting system is more complex than a simple time-pressure syringe. It requires a precision-machined valve assembly and a dedicated driver (for the solenoid or piezo). These systems are often more expensive per dispense head than a basic pneumatic time-pressure dispenser, limiting their scalability. Material extrusion Pneumatic time-pressure dot dispensers A time-pressure pneumatic dispenser uses a controlled pressure (air or inert gas) applied to a fluid reservoir to push material through a nozzle. By adjusting pressure and valve open time, discrete droplets can be dispensed [6]. We are exhibiting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026 and in Berlin on 21-22 October 2026. Please register to meet us in person and see our technology in action. A pneumatic time-pressure dispenser © Xiao, X., et al., CC BY 4.0 Compared to piezo or microvalve systems, pneumatic dispensers tolerate higher viscosity fluids than inkjet heads (typically 100-100,000 cP), making them versatile in their applications. They are suitable for thick adhesives, silicone sealants, solder pastes, or polymer gels that piezo inkjets cannot eject [7]. GelMa hydrogel beads containing tumor cells dispensed by a pneumatic dispensing system, © Wei, X., et al [8], CC BY 4.0 However, the precision and minimum dot size achievable by pneumatic dispensers are more limited. The dispensed volume depends on several factors (pressure level, time, fluid viscosity, nozzle diameter, and even air compressibility) [9], which makes ultra-fine control challenging. Without additional feedback or mechanical pinch-off, achieving very small, consistent dot volumes (in the low-nanoliter range) is difficult due to variability in how the fluid stream breaks off [1]. Positive displacement dot dispensers Solder dots dispensed by Voltera’s NOVA materials dispensing system under different settings Positive displacement dot dispensing machines use mechanical actuators (e.g., pistons, auger/screws) to directly displace fluid, eliminating air compressibility errors inherent in pneumatic systems. This enables superior volumetric accuracy (< about 1.5% coefficient of variation for 100 nL volumes) and precise control over high-viscosity fluids (up to 1,000,000 cP) [10]. Extrusion-based direct ink writing equipment, such as NOVA (pressure-feedback positive displacement dispensing), falls into this category, capable of accommodating highly viscous, paste-like inks that are orders of magnitude thicker than inks for inkjet dispensers. For example, silver-filled conductive adhesives with nano- or micro-particles, or solder paste with metal alloy powder, can be dispensed by DIW systems when they would clog a fine inkjet nozzle. The ability to deposit such high-solids, thixotropic fluids is a key advantage of extrusion-based dot dispensing [9]. Conclusion Dot dispensing technology continues to evolve, expanding its scope into new materials and applications. Improvements in actuator design, fluidics, and control software are pushing the boundaries of what can be dispensed in tiny dot form. By choosing the appropriate dispensing mechanism for a given material and feature size, scientists and engineers can reliably deposit microscopic amounts of material exactly where needed, enabling the fabrication of next-generation devices and materials, one tiny drop at a time. Ready to learn more about materials dispensing? Explore these resources: Blog: What are Precision Fluid Dispensing Systems? Blog: What is Viscosity? Blog: High-Resolution Electronics Prototyping: Pushing the Limits with Closed-Loop Dispensing Systems Video: Dot, Dot, Dot...Optimized Dispensing for Silver-Filled Conductive Epoxy Adhesives Want to discuss your dot dispensing needs? Book a meeting to speak with one of Voltera’s technical representatives. References [1] Lee, S., Choi, I. H., Kim, Y. K., & Kim, J. (2014). Velocity control of nanoliter droplets using a pneumatic dispensing system. Micro and Nano Systems Letters, 2(1). https://doi.org/10.1186/s40486-014-0005-8. [2] Lee, J. M., Sing, S. L., Zhou, M., & Yeong, W. Y. (2018). 3D bioprinting processes: A perspective on classification and terminology. International Journal of Bioprinting, 4(2). https://doi.org/10.18063/ijb.v4i2.151. [3] Bernasconi, R., Brovelli, S., Viviani, P., Soldo, M., Giusti, D., & Magagnin, L. (2021). Piezoelectric Drop‐On‐Demand Inkjet Printing of High‐Viscosity Inks. Advanced Engineering Materials, 24(1), 2100733. https://doi.org/10.1002/adem.202100733. [4] Ng, W. L., Lee, J. M., Yeong, W. Y., & Win Naing, M. (2017). Microvalve-based bioprinting – process, bio-inks and applications. Biomaterials Science, 5(4), 632–647. https://doi.org/10.1039/c6bm00861e. [5] Tsai, H.-L., Hwang, W.-S., Wang, J.-K., Peng, W.-C., & Chen , S.-H. (2015). Fabrication of Microdots Using Piezoelectric Dispensing Technique for Viscous Fluids. Materials, 8(10), 7006–7016. https://doi.org/10.3390/ma8105355. [6] Durham, M., Wade, G., Judd, B., & Boggiatto, J. (n.d.). Process Optimization for Fine Feature Solder Paste Dispensing. Retrieved May 9, 2025, from https://www.ipc.org/system/files/technical_resource/E40%26S16_01%20-%20Maria%20Durham.pdf. [7] Xiao, X., Li, G., Liu, T., & Gu, M. (2022). Experimental Study of the Jetting Behavior of High-Viscosity Nanosilver Inks in Inkjet-Based 3D Printing. Nanomaterials, 12(17), 3076. https://doi.org/10.3390/nano12173076. [8] Wei, X., Huang, B., Chen, K., Fan, Z., Wang, L., & Xu, M. (2022). Dot extrusion bioprinting of spatially controlled heterogenous tumor models. Materials & Design, 223, 111152. https://doi.org/10.1016/j.matdes.2022.111152. [9] Polychronopoulos, N. D., & Angeliki Brouzgou. (2024). Direct Ink Writing for Electrochemical Device Fabrication: A Review of 3D-Printed Electrodes and Ink Rheology. Catalysts, 14(2), 110–110. https://doi.org/10.3390/catal14020110. [10] Ando, T., Hirano, M., Ishige, Y., & Adachi, S. (2016). Precise Dispensing Technology Using Electroformed Tubes for Micro-Volume Blood Diagnosis. IEEE journal of translational engineering in health and medicine, 6, 2800506. https://doi.org/10.1109/JTEHM.2018.2852664. Join the flagship TechBlick events in California on 10-11 June 2026, and in Berlin on 21-22 October 2026 This event is the global home of the Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year, the events will also feature. In California: The Future of Wearables Reshaped In Berlin: Perovskite Connect, Sustainable Electronics RESHAPED, Electronic Textiles RESHAPED