Introducing the Electronics RESHAPED USA Program - Additive Electronics in Packaging and PCB Manufacturing
- Apr 7
- 6 min read
Updated: Apr 20
The Future of Electronics RESHAPED USA conference and exhibition (10 & 11 JUNE 2026, Mountain View) is set to be the most important event of the year focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics. Hosted at the iconic Computer History Museum, this event serves as the global hub for the next generation of electronics.
This year the program features a world-class agenda with over 75 superb invited talks from around the world, 8 industry- or expert-led masterclasses, 2 tours, and over 75 onsite exhibitors.
In this article, we discuss and highlight various innovative talks at the event around the theme of Additive Electronics in Packaging and PCB Manufacturing. In other articles we cover themes like materials innovation, hybrid electronic manufacturing and scale-up, wearables and sensors, soft robotics, additive and 3D electronics, sustainable electronics, and more.
Explore the full agenda now and join the global industry in Mountain View on 10 & 11 JUNE 2026. Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable.
🚨Explore the Full Agenda and Register before 3 May when early bird rates expire
GE Aerospace Research – David Lin discusses 3D MEMS IMU enabled by additive packaging. In this session, David explores how traditional 3D assembly is highly susceptible to long-term drift driven by package-induced stress. By utilizing an additively printed Aluminum Nitride (AlN) ceramic frame, GE achieves a 70% reduction in CTE mismatch compared to alumina. This work offers a compact, single-component IMU that provides ultra-low SWaP-C and excellent stability in harsh environments.
Raytheon | An RTX Business – Daniel Hines discusses hybrid electronics for sustainable board-level manufacturing. Here, Daniel explores the environmental bottleneck of traditional PCB manufacturing, which relies on eco-unfriendly materials and generates significant hazardous waste. The talk focuses on printing passive insulator materials for solder masks and next-gen RF filters. This solution enables the tighter integration of digital and RF electronics while significantly reducing the carbon footprint of board-level fabrication.
NASA Marshall Space Flight Center – Cadre Francis explores in-space manufacturing of electronics. Cadre explores the critical challenge of maintaining patterning fidelity and device reliability in microgravity where gravity-assisted flow is absent. This work investigates how material formulation and deposition behavior evolve under reduced gravity and variable thermal conditions. The research offers a resource-efficient pathway to create sensors and power elements critical for long-duration space missions.
🚨Explore the Full Agenda and Register before 3 May when early bird rates expire
Fabric8Labs – Michael Matthews highlights Electrochemical Additive Manufacturing (ECAM) for next-gen AI cooling. In this talk, Michael explores how traditional liquid cooling is reaching its physical limits as AI accelerators push heat flux densities beyond 4 W/mm². ECAM utilizes a backplane with 33-micron pixels to deposit copper atom-by-atom at room temperature. This technology offers a 90% lower GHG footprint and provides a high-resolution cooling structure that eliminates the thermal stresses of traditional 3D printing.
Komori America – Reza Kazemi introduces as part of his masterclass high-precision gravure offset printing for next-generation electronics. Reza explores the limitations of current plating processes, which are often eco-polluting and struggle with high-density alignment. Capable of ±5 µm positional accuracy, this process enables micro-solder and copper paste deposition for micro-LED assembly. This solution offers an eco-friendly alternative that ensures high reliability and strong resistance to migration in advanced packaging.
Air Force Research Laboratory – Christopher Tabor presents resilient packaging for stretchable electronics. Christopher explores the difficulty of maintaining electrical performance in wearable electronics under extreme mechanical loads and reactive environments. Utilizing liquid metal inks and conformable substrates like spider silk, the AFRL creates breathable, biocompatible electrodes. This strategy offers a pathway to reconfigurable, self-healing electronic systems that can maintain performance at strains up to 300%.
🚨Explore the Full Agenda and Register before 3 May when early bird rates expire
TracXon – Ashok Sridhar unveils a patented, high-speed R2R-compatible VIA production process. Ashok explores the industry-wide bottleneck where the lack of printed VIAs forces expensive "stack printing" that increases material consumption and cost. By addressing this lack of robust vertical interconnects, TracXon enables double-sided, high-density circuitry. This concept offers the ability to close the gap with traditional subtractive PCBs in terms of circuitry complexity and scalability.
Sunray Scientific – John Yundt discusses fine-pitch direct die attach using magnetically aligned anisotropic conductive adhesives (ZTACH® ACE). In this presentation, John explores how traditional bonding methods like solder or ECAs struggle with fine-pitch requirements, often leading to brittle joints or slow processing times. This pressure-less, low-temperature process enables 100-micron pitch bonding with 5-10x the strength of solder. The solution offers a single-step adhesive application that provides both electrical interconnection and mechanical reinforcement without the need for underfill.
Hummink – Pascal Boncenne introduces High Precision Capillary Printing (HPCaP) for advanced packaging. Pascal explores the resolution limits of conventional inkjet printing, which often fails at the micron scale and requires external energy sources like UV. Leveraging capillary forces, this AFM-inspired technology achieves sub-micron accuracy down to 100nm. It offers a versatile and sustainable solution for high-viscosity materials and fine interconnects in semiconductor packaging and biosensors.
🚨Explore the Full Agenda and Register before 3 May when early bird rates expire
Holst Centre – Hylke Akkerman explores 3D microelectronics via foil laminated stereolithography (f-SLA). Hylke explores the constraints of planar electronics which limit design freedom and lead to complex value chains. This approach integrates bare dies at the 10–20 µm scale and forms vertical interconnects directly during the print process. This platform offers a route toward fully spatial, ultra-miniaturized systems with significantly shorter lead times.
Akoneer – Tadas Kildusis presents Selective Surface Activation Induced by Laser (SSAIL) for high-density Cu traces. Tadas explores the waste-heavy nature of traditional PCB production, which relies on chemical etching and expensive masks. The technology creates 1-25 µm traces on organic, glass, and ceramic substrates for both FPC and semiconductor packaging. This solution enables a novel manufacturing method that drastically reduces power consumption and chemical waste.
NanoPrintek – Masoud Mahjouri-Samani highlights ink-free multimaterial dry printing. Masoud explores the polluting supply chain and high-temperature post-processing requirements inherent in current ink-based printed electronics. This disruptive technology prints directly from raw materials, generating pure nanoparticles in-situ via laser sintering. It offers a supply-chain-agnostic, clean technology that enables multifunctional hybrid materials to be printed on demand across multiple industries.
🚨Explore the Full Agenda and Register before 3 May when early bird rates expire
Notion Systems – Simon Rihm discusses shaping R&D with the n.jet evo inkjet system. Simon explores the challenges of replacing subtractive process chains with additive steps in a way that remains industrially relevant. The talk demonstrates how industrial-standard desktop inkjet tools enable rapid research into functional inks and substrates. This work offers a bridge for R&D labs to overcome traditional manufacturing barriers efficiently and simply.
UMass Lowell – Guinevere Strack presents printed resistors for low-cost, sustainable, semi-additive PCBs. Guinevere explores the need for eco-friendly alternatives to conventional subtractive manufacturing that often result in excessive material waste and high production costs. The talk outlines how additive resistor printing can be integrated into sustainable PCB workflows. This solution provides a low-cost pathway for fabricating passive components directly on-board, enhancing the viability of semi-additive manufacturing.
VTT – Tuomas Happonen explores elastic multilayer printed circuits manufactured via sheet-based processing. Tuomas explores the difficulty of creating sensitive, interference-tolerant elastic circuits that can withstand the mechanical rigors of wearable applications. The method involves stacking pre-perforated TPU films and curing conductive circuits with filled vias. This work offers a robust architecture for mixed-signal systems and RF applications that require high flexibility without sacrificing electrical performance.
NoiseFigure Research – Dr. Manish Ojha showcases high-resolution printed copper antennas for flexible mmWave electronics. Manish explores the lack of flexible mmWave antennas capable of high resolution and speed for 24 GHz applications. Using screen printing with copper conductive inks on polyimide and alumina ribbon ceramics, a resolution of 50 µm was achieved. This work offers a proven method for integrating bare die chipsets with flexible antennas, showing strong agreement between simulation and measured performance.
🚨 Explore the Full Agenda and Register before 3 May when early bird rates expire
Comments