Introducing the Electronics RESHAPED USA Program - Hybrid Electronic Manufacturing and Scale-Up
- 13 hours ago
- 5 min read
The Future of Electronics RESHAPED USA conference and exhibition (10 & 11 JUNE 2026, Mountain View) is set to be the most important event of the year in Silicon Valley focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics. Hosted at the iconic Computer History Museum, this event serves as the global hub for the next generation of electronics.
This year the program features a world-class agenda with over 75 superb invited talks from around the world, 8 industry- or expert-led masterclasses, 2 tours, and over 75 onsite exhibitors.
In this article, we discuss and highlight various innovative talks at the event around the theme of Hybrid Electronic Manufacturing and Scale-Up. In other articles we cover themes like materials innovation, additive electronics in packaging and PCBs, wearables and sensors, soft robotics, additive and 3D electronics, sustainable electronics, and more.
Explore the full agenda now and join the global industry in Mountain View on 10 & 11 JUNE 2026. Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable.
🚨Explore the Full Agenda and Register before 3 May when early bird rates expire
NextFlex – Dan Gamota discusses manufacturing readiness for hybrid electronics. In this session, Dan explores the lack of standardized data and validated qualification pathways that currently slow the transition from lab innovation to industrial deployment. Emphasis is placed on roadmapping technical needs for defense and commercial sectors, including high-reliability interconnects. This work offers improved validation frameworks to accelerate the commercialization of complex integrated systems.
Smooth & Sharp Corporation – Alan Wu presents a proven R2R production solution for NFC antennas. Alan explores the complexity barriers that usually prevent additive manufacturing from moving beyond single-layer UHF antennas to sophisticated electronic functions. The talk reveals successful large-scale mass production techniques for multi-layer RFID/NFC circuits. This work offers proof that complicated circuit designs are now possible at scale using additive R2R processes.
TracXon – Ashok Sridhar unveils high-density printed electronics with VIAs. Ashok explores the fundamental limitation where a lack of printed vertical interconnects (VIAs) prevents printed electronics from reaching the complexity levels of traditional etched PCBs. TracXon is building the first dedicated VIA filling machine compatible with R2R lines to enable double-sided circuitry. This solution provides the missing link for high-density printed electronics, significantly closing the gap with traditional manufacturing.
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👉 Intellivation LLC – Mark George highlights an R2R platform for active and passive thin films. In this talk, Mark explores how the high cost of mask fabrication and labor-intensive lithography steps hinder rapid product development for flexible sensors. By combining sputtering with in-line laser ablation, multi-layers can be patterned without damaging sensitive substrates. This technology offers a high-throughput, mask-less manufacturing method for fully functional semiconducting devices.
👉 Quad Industries – Wim Christiaens discusses scaling wearable printed electronics for the mass market. Wim explores the "valley of death" where promising laboratory prototypes fail to meet the reliability and repeatability standards required for industrial manufacturing. The talk uses case studies to analyze how material selection and design choices directly impact cost-effective production. This session offers a roadmap for translating functional wearable prototypes into reliable, mass-market products.
Henkel – Julie Ferrigno discusses materials and processes for printed antennas. Julie explores how high-frequency designs often suffer from surface roughness and thickness non-uniformity, which compromises RF efficiency. The talk highlights high-conductivity silver and silver-plated copper (SPC) inks optimized for precise features. This solution provides a lower-cost, scalable pathway for both low-frequency and 3D-structured antennas using high-throughput pad printing.
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Eastman Kodak Company – Carolyn R. Ellinger explores flexo for high-resolution roll-to-roll (R2R) manufacturing. Carolyn explores why screen printing, while dominant, often hits throughput and resolution limits when trying to mass-produce exact replicates of complex circuitry. The presentation compares lab-scale and production-scale data to demonstrate the precision of flexography. This work offers a highly efficient "analog" printing alternative for volume production of high-resolution designs.
Auburn University – Pradeep Lall discusses additively printed In-Mold Electronics (IME) for automotive. Pradeep explores the problematic weight of conventional wire harnesses, which can reach 36 kg per vehicle, complicating the path to stricter CO2 standards. The study examines various print processes, such as gravure offset, on substrates like PC and PETG for human-machine interfaces. This research offers a way to integrate signal processing and biosensors directly into structural parts, significantly reducing vehicle weight and carbon footprint.
SPG Prints – Daan de Kubber highlights mass-producing sustainable RFID using the Basalt printer. Daan explores the environmental and economic waste associated with traditional RFID manufacturing, which relies on subtractive aluminum etching. The talk presents a case study using roll-to-roll rotary screen printing on paper substrates with graphite-based inks. This solution eliminates aluminum waste and cuts costs by up to 25%, making eco-friendly tags affordable for mass adoption.
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Swansea University – John Lau presents a masterclass on challenges and opportunities in high-resolution screen printing. John explores the misconception that print quality depends on single parameters rather than the complex interaction of the entire printing system. This session focuses on the interplay between mesh, ink-substrate behavior, and press configuration. This work offers a fundamental industrial understanding needed to develop robust, high-accuracy processes for functional electronics.
Brewer Science – Austin Peters presents printed electronics solutions for trace PFAS detection. Austin explores the current reliance on expensive, centralized laboratory testing (LC-MS/MS), which makes real-time field monitoring of "forever chemicals" impossible. By leveraging decades of thin-film expertise, Brewer Science is developing a low-cost, species-selective printed sensor platform. This solution transforms PFAS testing into a widely deployable tool, empowering communities and utilities with rapid detection.
Linxens explores merging technologies for medical wearables. The session explores the construction challenges of integrating diverse components—biosensors, skin adhesives, and communication modules (NFC/Bluetooth)—into a single reliable device. By harmonizing these flexible materials, the talk highlights the next level of patient engagement. This work offers a path to revolutionized preventive care through sophisticated, multi-functional medical monitoring systems.
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ALQIO – Fabien Resweber discusses scalable innovation in functional surfaces. Fabien explores the difficulties in accelerating electroactive technologies from design to large-scale industrial production. The focus is on P(VDF-TrFE) copolymers known for their superior piezoelectric properties. This solution provides the manufacturing foundation for next-generation haptic interfaces and flexible medical instrumentation.
Conductive Technologies – Alicen Pittenger presents process improvements in materials and equipment. Alicen explores the market volatility of precious metals like silver, which poses a significant risk to the cost-sensitivity of large-scale manufacturing. The talk introduces silver-carbon blends and copper-based inks paired with high-precision Sakurai press technology. This work offers a strategy to improve performance and control costs while scaling printed electronics more confidently.
INO, d.o.o. – Nives Vehar discusses printing touch from equipment and process perspectives. Nives explores the common hurdles in capacitive keyboard production, such as maintaining mechanical reliability while managing high material costs. The presentation details perspectives on pattern precision and multi-layer alignment. This session offers practical approaches to overcome manufacturing challenges for reliable, scalable smart devices.
MicroScreen LLC – Art Dobie examines the effect of nano surface treatments on screen release. Art explores the difficult release behavior of resistive PTC carbon pastes, which often stick to emulsion screens and cause print defects. By investigating hydrophobic and oleophobic nano-treatments on PVA-PVOH emulsion screens, the study quantifies improvements in paste release. This work offers a technical solution to improve the consistency and yield of screen-printed heater applications.
🚨 Explore the Full Agenda and Register before 3 May when early bird rates expire
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