Bio

Thomas Germann joined Identiv in 2013 in the R&D department of Identiv’s RFID transponder & reader business unit and is now its R&D Manager. He is mainly responsible for development of novel UHF & HF RFID tags, as well as Sensor-enabled NFC products with functionality beyond pure identification. Thomas brings a strong background in RFID label and printed electronics product development, which enable the development of cutting edge flexible RFID & NFC sensor tags and corresponding systems. Thomas holds a Diploma (M.Sc.) in Engineering Physics from the Technische Universität München (TUM).

FHE production becomes more and more important role in IOT and wearable devices manufacturing, the mature production solution is needed for the growing market development.
S&S’s DOP, Direct On Paper Solution integrates antenna printing and chip assembling in R2R mass production scale for RFID inlay with paper, serve as basis for realizing further FHE product development with low temperature substrates like paper.

Alan Wu
President @ Smooth & Sharp Corporation

Bio

Alan Wu is founder and President of S&S, Smooth & Sharp Corporation, he dedicates himself in RFID since 2002. Based on decades of RFID inlay manufacturing technology, he starts Flexible Hybrid Electronics production in 2016 in Taiwan.

Alan received his bachelor degree in technical orientated MBA at University Stuttgart, Germany in 1992. After his study in Germany, Alan creates numerous international business projects in RFID and Solar industry, he acts as leading management in local medium size companies before he founds S&S.

Bio

Steve is responsible for business development activities across CPI’s printed electronics platform. Steve’s expertise lies in the area of printed electronics, printed sensing and its role in the development of the internet of things and industry 4.0. Steve has delivered on a number of successful private projects at CPI, helping new research ideas develop from prototype and through to commercial deployment. Clients include industries such as automotive, aerospace, defence, packaging and medtech. These projects involve working with companies of all sizes ranging from large corporates to SMEs and academia.

Previously Steve held marketing positions at CPI, where he was responsible for managing the marketing operations of CPI’s printable electronics division. Steve’s role was to provide an end user focus in the scale up and commercialisation of products and processes related to printable electronics. He has extensive knowledge in emerging technology areas such as intelligent print, printed lighting and enabling technologies such as materials integration and barrier encapsulation.

Prior to joining CPI in 2008, Steve graduated from Northumbria University in Business Studies and is currently studying an Executive MBA at Warwick Business School.

Bio

Doyoung Byun received the PhD degree in Mechanical and Aerospace Engineering from the Korea Advanced Institute of Science and Technology (KAIST), Korea, in 2000. He has worked in several institutes and academies and founded the Enjet in 2009 in order to commercialize his high resolution printing and coating technologies for the printed electronics. Since 2009, he has served as CEO in the Enjet. He has developed the novel femto-liter droplet dispensing technology, electrostatic spray nozzle for functional coating, micro-fluidic devices, and MEMS devices. Based on these core technologies, he could commercialize ultra-fine printing and spray coating solutions for OLED display, micro-LED display, mobile phone, and bio-medical applications.

The Enjet is a high resolution inkjet printing solution leader and has a vision to provide innovative tools of printed electronics (2D and 3D), replacing conventional vacuum processes in OLED, PCB, Semiconductor, Glass, Bio-medical, and energy industries. The Enjet has further dreams to develop 3D additive manufacturing solutions for printed electronics. The Enjet has been developing a high resolution inkjet head with multi-nozzles, which can dispense higher viscous ink than the conventional ones and form pico-liter or even femto-liter droplets. With this novel inkjet head, we can print and manufacture 3D electronic devices from the provided model data and personal customized products.

Bio

Eric W. Forsythe, Ph.D is the Team Leader for Flexible Electronics at the US Army Research Laboratory, Adelphi, MD. His responsibilities include; the Program Manager for the Flexible Hybrid Electronics Manufacturing Innovation Institute. Recently, Dr Forsythe was the Deputy Program Manager for the U.S. Army’s Flexible Display Center that demonstrated the World’s Largest flexible organic ligtht emitting diode displays and most recently the World’s Largest flexible digital x-ray imagers for DOD Explosive Ordnance Disposal. Additional responsibilities include the co-PI with the human performancde team for the ARL initiaitive “Continuous, Real-Time Assessment of Soldiers:The Foundation for Future Individualized and Adaptive Technologies” and the ARL Directors Initiative entitle “Ultrafast Electron Spectrocopy” for unique materials science exploration. Prior to joining ARL in 2001, Dr Forsythe was a Research Associate at the University of Rochester where he worked on electronic interfaces in organic light emitting diodes (OLEDs) with Eastman Kodak, the inventors of the commercial OLED display technology. In 1996, Dr Forsythe received his Ph.D in Engineering Physics at Stevens Institute of Technology. He has spent time working at small businesses on SBIR-projects in wide range of technologies and at Kearfott Guidance and Navigation on the Trident Missile stellar inertial guidance system, in the mid-1980’s. Dr Forsythe has more than 60 publications (2000 citations, H-index 19), and 5 patents filed or issued.

We introduce the ultra-precise deposition (UPD) technology for rapid prototyping of microelectronic devices. UPD allows maskless deposition of high-viscosity metallic and non-metallic inks with the printed feature size as small as 1 μm. XTPL technology answers some of the key challenges in the fabrication of high-density microelectronics, including the ability to print on complex 3D substrates and obtain structures with arbitrary shapes, including lines, dots, crosses, and meshes

ChipInFlex is CEA-Leti's latest development towards the integration of ultra-thin, bare silicon chips within a flexible film. Today, electronic systems are becoming smaller, thinner and, above all, flexible. Flexibility makes possible new functions and hence new usages. With Chip-In-Flex, CEA-Leti is introducing a new paradigm for integrating ultra-thin, bare chips into a flexible label made on a silicon wafer.

Conventional silicon technology has embedded at least one integrated circuit into every smart device on Earth. However, it faces key challenges to make everyday objects smarter. Cost is the most important factor but flexibility and conformability are highly desirable.
Our approach is to develop integrated circuits using flexible electronic fabrication techniques, thus paving the way towards natively-flexible LSI and VLSI ICs.

Jedrzej Kufel
Staff Research Engineer @ Arm
Bio

Dr Jedrzej Kufel is a Staff Research Engineer. He joined Arm in 2014, working in the IoT product team before moving to Research in 2016. His current interests are in the area of low-power integrated circuit design using flexible/printed electronics, validation and test methodologies and circular economy. Jedrzej holds a MEng in Mechatronics and Robotic Systems from University of Liverpool and a PhD from University of Southampton.

Coatema delivered a pilot line in 2012 to the University of Thessaloniki in Greece. (Auth). Since them there had been a continuous scale up of the system with the integration of different quality control systems like inline spectroscopy and others. In a new European project called Real Nano additional quality control systems are being installed.
The talk describes the used systems, the influence of the different parameters like coating, drying, tension control and others.

Thomas Kolbusch
Vice President @ Coatema® Coating Machinery GmbH
Bio

Thomas Kolbusch is Vice President of Coatema Coating Machinery GmbH, an equipment manufacturing company for coating, printing and laminating solutions located in Dormagen, Germany.
He is member of the board of the OE-A (Organic Electronic Association) in Germany, a global association for printed electronics.
He serves in the advisory board of Fraunhofer ITA institute.
He served as member of the board of COPT.NRW, a local association in Germany, as well as exhibition chair of the LOPEC in Munich for five years. Thomas is active in the field of fuel cells, batteries, printed electronics, photovoltaics and medical applications. He organizes the international Coatema Coating Symposium for over 19 years and represents Coatema in a number of public funded German and European projects. Thomas Kolbusch studied Business Economics at the Niederrhein University of Applied Sciences and got his degree as business economist in 1997. He started his career at 3M, Germany. Since 1999 he is working for Coatema Coating Machinery in different positions.

Bio

Douglas Hackler, Co-founder of American Semiconductor 2001. 30+ years of experience in wafer fabrication, process development, manufacturing and commercialization at M/A-Com, Zilog, Intel, NorTel and General Instrument. Engineering degrees from Boise State University (BSEE) and the University of Idaho (MSEE). Business degree from Texas Tech University (BBA). Doug has multiple patents and patents pending for advanced packaging and flexible technology and has published numerous technical papers. At American Semiconductor Doug maintains overall corporate and operational responsibilities.

​

​

Traditional semiconductor manufacturing has remained largely unchanged throughout the modern era, and growing efforts to increase throughput and reduce cost provide an ever more compelling case for applications where the flexibility of additive manufacturing can intercept. This talk will explore opportunities, challenges and the road ahead towards adaptation of printed electronics within the semiconductor industry.

We will present an investigation of risks of failure in a prototype printed hybrid electronics (PHE) Arduino-type circuit to be fabricated using a variety of additive manufacturing technologies including aerosol-jet, syringe, and stereolithography (SLA) printing. The interfaces of different components and materials in this design introduce potential sources of failure including thermal expansion mismatches and silver migration resulting from temperature cycling. We will discuss the design rationale, fabrication methods, and testing conditions of three different test coupons, each of which isolates a different area of interest in the PHE assembly and seeks to identify and prevent the greatest risks.

​

​

​

ACI will introduce to the world its Alchemy Conductive Inks. These high-performance printable conductors allow PTF ink like ease of use and processing with fired/sintered thick film electrical performance. The talk will describe some of the overall benefits of using these materials in manufacture of flexible and 3D printed electronics including:
low volume resistivity and sheet resistance
higher current carrying capacity
lower cost per ohm square in use
superior crease ability of narrow traces
formulation latitude from viscous paste to sprayable
Several examples will be presented including
3D circuit structures
high resolution traces
high power density busbars
reflow solder ability

CondAlign’s technology represents a novel process for production of anisotropic, conductive films. Using an electric field to structure and align particles, the results in a z-axis conductive film structure. One product type we can produce is anisotropic conductive adhesive (ACA) films with thicknesses from a few µm to some hundreds µm and resistance below 0,01 Ohm/cm^2. With very high chain densities (pitch below 10µm), these films are currently being tested in several bonding processes, like FOB, FOF, COB, COF, as an alternative to traditional ACF. The process is demonstrated in roll-to-roll production, proofing it is scalable and cost effective.

Morten Lindberget
VP Business Development @ CondAlign
Bio

An enabler with 25 years international experience from leadership, sales and business development roles in technology consulting, contract manufacturing, medical device technology and scale up. Morten holds a MSc in Mech. Engineering from TU Delft, the Netherlands, and an Executive Master of Management from BI, Norway.

Digital printing has clearly established itself for graphics printing, thanks to the advantages it offers over traditional processes like screen printing. More recently, digital printing started morphing into digital manufacturing and also Printed Electronics is taking advantage of that evolution. In this talk we will review Agfa's digital conductive inks based on nanomaterials, and highlight some features of newly developed inks. In the second part of the talk, Nanogate Netherlands will discuss the application of additive digital manufacturing in motor sport products.

Peter Willaert
Global Marketing Manager Printed Electronics @ Agfa
Bio

Experienced Product Marketing and Business Development Manager in Printed Electronics with a background in Electronic Engineering. Over the years I have developed a broad knowledge about materials and processes for applications like RFID, iOT, Sensors, Displays etc.

Digital printing has clearly established itself for graphics printing, thanks to the advantages it offers over traditional processes like screen printing. More recently, digital printing started morphing into digital manufacturing and also Printed Electronics is taking advantage of that evolution. In this talk we will review Agfa's digital conductive inks based on nanomaterials, and highlight some features of newly developed inks. In the second part of the talk, Nanogate Netherlands will discuss the application of additive digital manufacturing in motor sport products.

​

Bio

As the Technical Program Lead at NovaCentrix, Rudy Ghosh helps translate technical innovations into customer ready products. He works closely with NovaCentrix’s customers, technology partners, and collaborators across the world to solve technical challenges and identify new avenues for the application of NovaCentrix’s industry leading technologies in PulseForge tools and Metalon inks for printed and flexible electronics. As a technical expert in the printed electronics industry, he is often an invited speaker for a variety of printed electronics conferences. Rudy also works with the global business team to define and engage in commercial opportunities related to the technical program and furthers those areas of opportunity through industry outreach and engagement. Before joining NovaCentrix, Rudy was a Post-Doc at the Microelectronics Research Center at the University of Texas at Austin, where he led the Center’s research into the synthesis of 2D materials. Rudy holds a PhD in Physics from the University of North Carolina at Chapel Hill and a MS in Physics from the Indian Institute of Technology, Bombay. Rudy has authored over 30 publications in a variety of technical journals.

​

​

Continued advances in Flexible Hybrid Electronics have required material suppliers to deliver improved functionality to the device developers in broad applications such as sensors, displays, barrier films, photovoltaics, medical diagnostics, consumer electronics, HMI (Human Machine Interface), and Flexible Printed Circuits (FPCs).
Demands on the film substrate suppliers can vary widely, and polymer property requirements typically include: clean surfaces with low surface defects, optically clear films with low haze and iridescence, near zero thermal shrinkage for multilayer print registration and component attach via solder reflow, UV and Hydrolysis resistance, and VTM-0 Flame Retardance. Many requests also include an ability to further tailor the surface chemistry to improve and enhance the downstream processing performance. New commercial polyester film types have been introduced by DuPont Teijin Films, and their typical end use applications will be described.

Fraunhofer FEP performs Roll-to-Roll film processing, and they are developing transparent and robust permeation Barrier Films for Flexible Electronics. The substrate choice is critical for optimized performance, and Fraunhofer FEP will describe their journey and key learnings.

Continued advances in Flexible Hybrid Electronics have required material suppliers to deliver improved functionality to the device developers in broad applications such as sensors, displays, barrier films, photovoltaics, medical diagnostics, consumer electronics, HMI (Human Machine Interface), and Flexible Printed Circuits (FPCs).
Demands on the film substrate suppliers can vary widely, and polymer property requirements typically include: clean surfaces with low surface defects, optically clear films with low haze and iridescence, near zero thermal shrinkage for multilayer print registration and component attach via solder reflow, UV and Hydrolysis resistance, and VTM-0 Flame Retardance. Many requests also include an ability to further tailor the surface chemistry to improve and enhance the downstream processing performance. New commercial polyester film types have been introduced by DuPont Teijin Films, and their typical end use applications will be described.

Fraunhofer FEP performs Roll-to-Roll film processing, and they are developing transparent and robust permeation Barrier Films for Flexible Electronics. The substrate choice is critical for optimized performance, and Fraunhofer FEP will describe their journey and key learnings.

John Fahlteich
Group Leader coFlex | Deputy Head of Department R2R Technologies @ Fraunhofer FEP

Bio

Dr. John Fahlteich born 1981, graduated from the University of Leipzig with a diploma in physics in 2005. In 2010, he earned a PhD from the Technical University of Chemnitz with a thesis about vacuum deposited permeation barrier layers. In total, he has now 15 years of experience in Roll-to-Roll Thin Film Coating on Plastic Web. John is a Research Group Leader in the Business Unit “Plasma Technology” at Fraunhofer FEP. As of today, he published over 40 papers, conference contributions and patents as well as three book chapters in the field. John is currently principal consortium coordinator of three Horizon 2020 funded Projects (Switch2Save, NanoQI, and the Open Innovation Test Bed FlexFunction2Sustain).

Bio

This presentation reviews two of META’s key technology development strands: metaOPTIX™ holographic optical technology and NanoWeb® transparent conductive nanostructures
metaOPTIX™ holographic optical components are fabricated on META’s Holography platform. Interference patterns are recorded with a laser into a light-sensitive photopolymer material to form Volume Holographic Gratings (VHGs), which transmit or reflect light in various ways, depending on the geometric structure of the recorded pattern.
NANOWEB® is a transparent conductor made of an invisible metal mesh that can be fabricated onto any glass or plastic surface. It offers a superior alternative to Indium Tin Oxide (ITO), Silver Nanowire (AgNW), graphene and carbon nanotube among other ITO-alternative technologies.

This presentation will explore the mega-trends driving the development of pliable circuit technologies and survey current material and construction options. The speaker will provide an update on the development of a novel, thermosetting stretchable film technology that has the potential to enable future generations of conformable devices for use in industries like health, medical, automotive and aerospace.

Andy Behr
Senior Technology Manager @ Panasonic
Bio

Andy Behr is a Technology Manager with Panasonic Electronic Materials Business. He leads a multi-national research and marketing team based in Silicon Valley that develops leading-edge materials for electronic device fabrication and other emerging applications. Andy holds a bachelor’s degree in biology and a master’s degree in business administration. He has authored numerous technical papers and holds several patents. He has more than twenty-five years of experience in working with innovative electronic materials. Andy began his career in research and has subsequently held positions in marketing and business leadership.

​

​

The electronics industry has the potential to be an attractive market for the additive industry and wants to be conquered. To put it somewhat provocatively, this is currently happening more on the part of the AM than on the part of the electronics industry - although there are many large overlaps here. Small components, sustainability, free geometries, specific customer solutions, sensors and antennas, Industry 4.0...just to name a few.
But how easy is the fusion of the two industries really? What hurdles have to be overcome, what challenges are ahead and what opportunities are opening up?
The presentation will give an insight into the methods and projects from practice at Würth Elektronik eiSos and is intended to create incentives to go new ways.

Hybrid additive manufacturing is a flexible production method to realize integration of electronics in 3D printed products. In this presentation the development and integration of the key technologies will be highlighted: additive manufacturing, printing 3D electrical structures, assembly and interconnect. This was realized in the Hyb-Man project, with 11 partners from Germany and the Netherlands, who together cover the complete value chain of materials, processes, manufacturing equipment and products. The hybrid manufacturing technologies developed are used to design, manufacture and evaluate LED lighting prototypes.

Liisa Hakola
Senior Scientist @ VTT Technical Research Centre of Finland
Bio

Liisa Hakola works at VTT Technical Research Centre of Finland Ltd. at research team of Flexible and printed devices. She received her M.Sc. degree in Graphic Arts from Helsinki University of Technology in 2002. After graduation she has worked at VTT, currently as Senior Scientist and Project Manager. She has research experience in the field of printed functional solutions, specifically related to printed sensors, smart tags and indicators. She is at the moment coordinating Finnish national ecosystem project on sustainable solutions for electronics and optics - ECOtronics.

Bio

Jan Thiele has been an entrepreneur in the field of printed electronics for more than 13 years. In 2007 he co-founded Printechnologics, a pioneering company that was among the first worldwide to market fully printed electronic technologies on a large scale. During that time, Jan managed an R&D and product development team that delivered astonishing interactive features, entirely made in a printing machine. In the following years Jan’s work resulted in several strategic investments and partnerships with global industry leaders and brands.
In 2016 he co-founded Prismade Labs (Printed Smart Devices) to develop a breakthrough approach for electronic identification based on recyclable, yet electronic features that seamlessly connect with smartphones. In 2018 Prismade became part of the edding group to ensure a global distribution of those new technologies under a strong brand. Today, as co-CEO at Prismade, Jan is responsible for the strategic business development aspects of the business, focusing on applications for secure and interactive documents.

The desire for sophisticated backlit displays and user interfaces requires high performance
light diffusion films. With advances in decorative and functional inks there is a big potential
to integrate multiple functions into a single layer by using the diffusion film as base material.
3D formable diffusion films allow even more creative and functional freedom for designers
to create new user experiences.

Bio

I studied physics at the University of Cologne and did my PhD in thin film magnetism at the Research Center Juelich. At Siemens AG I was project manager for magnetic sensors and for printed electronics. I am cofounder of PolyIC as a Joint venture between Siemens AG and Leonhard Kurz Stiftung & Co. KG, which ist 100% owned by Kurz since 2010. As Member of the Managing Board and director of Product Managment and Business Development I am responsible for our touchs sensor products in all industries like automotive, home appliances or consumer electronics worldwide.

Bio

Working in the field of PE since 2008. At Schreiner Group GmbH I was responsible for Technology and Product Development. Since 2018 Kundisch is entering the market of Printed Electronics.

Bio

John D Voultos is the Vice President of Business Development and Marketing for Flex’s Sheldahl Flexible Technologies Business based out of Northfield, MN for last four ½ years. Before joining Flex, John was with DuPont for 29 years, leading DuPont’s In-Mold Electronics Technology as his last effort.
In the previous seven years at DuPont and at Sheldahl, John has been heavily involved in the development of HMI Technology using Smart Plastics. John has been working with the value chain to deliver on the consumer wants for a compelling HMI solution.

Bio

Shon Medin is the Marketing Specialist for Flex’s Sheldahl Flexible Technologies based in Northfield, MN for the last 1 year. Prior to joining Sheldahl, Shon was the Director of Strategic Relations for Breakthrough, building Breakthrough recognition throughout the music industry through advertising, concerts, and endorsements/sponsorships.
In the last year at Sheldahl, Shon has been leading the development and creation of Sheldahl’s content in HMI throughout their different social media outlets, website, publications, and presentations.

The emergence of conductive inks has been a transformational innovation in the printed electronics ecosystem. In this context, e2ip in collaboration with the National Research Council of Canada (NRC), has continuously promoted research and development and has invented a new Molecular ink (MINK) that resolves limitations of traditional flake inks when formed into 3D shapes. This new generation of inks, has several innovative features such as elongation, formability or high conductivity and will enable the development of smarter surfaces and advanced HMI. In this presentation we will be demonstrating MINK’s useability in various applications with a special focus on MINK applied to Printed & In-Mold Electronics applications.

The emergence of conductive inks has been a transformational innovation in the printed electronics ecosystem. In this context, e2ip in collaboration with the National Research Council of Canada (NRC), has continuously promoted research and development and has invented a new Molecular ink (MINK) that resolves limitations of traditional flake inks when formed into 3D shapes. This new generation of inks, has several innovative features such as elongation, formability or high conductivity and will enable the development of smarter surfaces and advanced HMI. In this presentation we will be demonstrating MINK’s useability in various applications with a special focus on MINK applied to Printed & In-Mold Electronics applications.

Bio

Anurag Bansal has more than twenty-two years of experience within international construction, polymers and chemical companies.
During this tenure, he has worked in different areas of Composites-product value-chain for example, product and process development, manufacturing, supply chain management including sourcing and outsourcing, business development including key-customer coordination and product portfolio management, technology intelligence and transfer and, production facility setup.
Currently, he is also collaborating, among several other projects, in devlopment of LEE-BED’s wireless sensor technology, by sharing his expertise in composites product manufacturing, logistics and installation in construction industry.

Bio

MSc. in Applied Physics, PhD. in Electrical Engineering. Have worked with micro and nano electromechanical systems and sensors and printed electronic technologies for the last 20 years.

Bio

Dr. Adam M. Scotch is currently Director of R&D, Smart Devices and Printed Electronics at Brewer Science in Springfield, MO. Prior to joining Brewer Science, Adam was Director of Manufacturing at antenna tech start-up Wafer for 3.5 years, responsible for product development, engineering, scale to manufacturing, and general operations. Adam held various technical leadership roles over 13 years in R&D at lighting company OSRAM, and lead the company’s efforts in printed electronics. His expertise is in materials science, process development, LED devices, and packaging. Prior to OSRAM, he was a National Research Council Postdoctoral Fellow at the National Institute of Standards and Technology (NIST). He holds 20 U.S. Patents and 9 refereed journal publications. Adam has a B.S. and Ph.D. in Materials Science and Engineering from Lehigh University, Bethlehem, PA.

Bio

After completing the Material Engineering studies in 2004, Francesca decided to pursue the Academic career by undertaking a PhD in Material Science and Engineering, with main focus on nano and bio technologies. In parallel established a 5 years collaboration with the Dentistry Department in order to increase the knowledge and awareness about dental materials in this sector.
In 2008 decided to leave the Academic path to jump into the entrepreneurial adventure and joining full-time the start-up Genefinity, a spin-off of the University of Trieste, which she founded in 2005 together with 3 other PhD colleagues. The company grew successfully for about 10 years by developing specific competences on thin films depositions, mainly PVD and ALD techniques, with main markets biomedical, food, solar and cosmetic.
In 2016, decided to jump into a new adventure and joined Applied Materials Italy as Business Developer, with the main target to expand the current solar market to other sector of the printed electronics.

Bio

Kris Erickson is a Research Manager and Senior Research Scientist in the 3D Lab at HP Labs, leading R&D projects in multiple topical areas of 3D printing. He obtained Bachelor degrees in Chemistry and Chemical Engineering from the University of Minnesota – Twin Cities, then his PhD in Chemistry at the University of California – Berkeley researching nanomaterials and was a post-doctoral appointee at Sandia National Labs prior to joining HP. At HP, his research has spanned from 3D polymer printing to 3D metal printing and 3D printed electronics, with an emphasis on materials and applications development.

Bio

Mr. Keicher has been involved in the field of Additive Manufacturing (AM) since 1993. He is an inventor of the Laser Engineered Net Shaping (LENS) process developed at Sandia National Laboratories. Mr. Keicher is a founder of Optomec and was instrumental in the development and commercialization of the LENS and Aerosol Jet printing processes at Optomec. While at Optomec, Mr. Keicher was instrumental in growing Optomec from approximately $150k/year to over $10M/year prior to exiting Optomec in 2011. Mr. Keicher returned to Sandia in 2011 after his exit from Optomec to focus on developing new technologies in the AM arena. During his tenure at Sandia, Mr. Keicher was able to collaborate with Dr. Marcelino Essien to develop the next generation aerosol printing technology trademarked NanoJet™. Together Dr. Essien and Mr. Keicher have developed and productized the NanoJet printing technology to address needs in aerosol printing. Mr. Keicher joined Integrated Deposition Systems (IDS) in July 2018 to help drive the commercialization of the NanoJet technology at IDS. The NanoJet print technology is gaining industry acceptance by providing a compact, reliable, easy to use and cost-effective aerosol printing technology well suited for production applications.

​

​

​