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ALL PAST & FUTURE EVENTS AS WELL AS MASTERCLASSES WITH A SINGLE ANNUAL PASS

Printed, Hybrid, Structural, & 3D Electronics

11-12 May 2021

CET

Virtual Event

Printed | Hybrid | Structural | 3D Electronics

Leading global speakers include:
The Coca-Cola Company
Panasonic Electronic Materials
Signify
American Semiconductor
Hewlett Packard
META (Metamaterial)
ACI Materials
PolyIC
National Research Council Canada (NRCC)
Phillips 66
Airbus Operations GmBH
Fraunhofer FEP
ACCIONA
Brilliant Matters
Sheldahl Flexible Technologies
VTT
C3Nano
SUNEW
Procter & Gamble
Parsons
KIMOTO
Applied Materials
Alpha Assembly
Nano OPS
Kundisch GmbH & Co. KG
Danish Technological Institute
The Boeing Company
COATEMA Coating Machinery GmbH
Texas Instruments
Brewer Science
NovaCentrix
SAFI-Tech
CondAlign AS
VSParticle
U.S. Army Combat Capabilities Development Command
DuPont  Teijin Films
IDENTIVE
ENJET Inc
Agfa
E2ip Technologies
CPI
IDS Inc
ARM
Wuerth
Ntrium
XTPL
CEA
Nanogate
Prismade Labs GmbH
Smooth & Sharp Corporation
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The times below is Central European Times (CET).
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11 May 2021

IDENTIVE

Tuesday

NFC & UHF Flexible & Hybrid Sensor Tags

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01:10pm

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Thomas Germann

R&D Manager

Bio

Thomas Germann joined Identiv in 2013 in the R&D department of Identiv’s RFID transponder & reader business unit and is now its R&D Manager. He is mainly responsible for development of novel UHF & HF RFID tags, as well as Sensor-enabled NFC products with functionality beyond pure identification. Thomas brings a strong background in RFID label and printed electronics product development, which enable the development of cutting edge flexible RFID & NFC sensor tags and corresponding systems. Thomas holds a Diploma (M.Sc.) in Engineering Physics from the Technische Universität München (TUM).

Flexible Hybrid Electr, R2R, All, Printed Electronics, Flexible Hybrid Electro

NFC & UHF Flexible & Hybrid Sensor Tags

01:10pm

Bio

Thomas Germann joined Identiv in 2013 in the R&D department of Identiv’s RFID transponder & reader business unit and is now its R&D Manager. He is mainly responsible for development of novel UHF & HF RFID tags, as well as Sensor-enabled NFC products with functionality beyond pure identification. Thomas brings a strong background in RFID label and printed electronics product development, which enable the development of cutting edge flexible RFID & NFC sensor tags and corresponding systems. Thomas holds a Diploma (M.Sc.) in Engineering Physics from the Technische Universität München (TUM).

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11 May 2021

Smooth & Sharp Corporation

Tuesday

Printed RFID inlay in Mass Production Scale as basis for further FHE product

More Details

01:30pm

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Alan Wu

President

FHE production becomes more and more important role in IOT and wearable devices manufacturing, the mature production solution is needed for the growing market development.
S&S’s DOP, Direct On Paper Solution integrates antenna printing and chip assembling in R2R mass production scale for RFID inlay with paper, serve as basis for realizing further FHE product development with low temperature substrates like paper.

Alan Wu
President @ Smooth & Sharp Corporation

Bio

Alan Wu is founder and President of S&S, Smooth & Sharp Corporation, he dedicates himself in RFID since 2002. Based on decades of RFID inlay manufacturing technology, he starts Flexible Hybrid Electronics production in 2016 in Taiwan.

Alan received his bachelor degree in technical orientated MBA at University Stuttgart, Germany in 1992. After his study in Germany, Alan creates numerous international business projects in RFID and Solar industry, he acts as leading management in local medium size companies before he founds S&S.

R2R, Flexible Hybrid Electro, Printed Electronics, All

Printed RFID inlay in Mass Production Scale as basis for further FHE product

01:30pm

FHE production becomes more and more important role in IOT and wearable devices manufacturing, the mature production solution is needed for the growing market development.
S&S’s DOP, Direct On Paper Solution integrates antenna printing and chip assembling in R2R mass production scale for RFID inlay with paper, serve as basis for realizing further FHE product development with low temperature substrates like paper.

Alan Wu
President @ Smooth & Sharp Corporation

Bio

Alan Wu is founder and President of S&S, Smooth & Sharp Corporation, he dedicates himself in RFID since 2002. Based on decades of RFID inlay manufacturing technology, he starts Flexible Hybrid Electronics production in 2016 in Taiwan.

Alan received his bachelor degree in technical orientated MBA at University Stuttgart, Germany in 1992. After his study in Germany, Alan creates numerous international business projects in RFID and Solar industry, he acts as leading management in local medium size companies before he founds S&S.

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11 May 2021

CPI

Tuesday

Applications Utilising Roll to Roll Fexible Hybrid Electronics

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01:50pm

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Steven Bagshaw

Business Development Manager

Bio

Steve is responsible for business development activities across CPI’s printed electronics platform. Steve’s expertise lies in the area of printed electronics, printed sensing and its role in the development of the internet of things and industry 4.0. Steve has delivered on a number of successful private projects at CPI, helping new research ideas develop from prototype and through to commercial deployment. Clients include industries such as automotive, aerospace, defence, packaging and medtech. These projects involve working with companies of all sizes ranging from large corporates to SMEs and academia.

Previously Steve held marketing positions at CPI, where he was responsible for managing the marketing operations of CPI’s printable electronics division. Steve’s role was to provide an end user focus in the scale up and commercialisation of products and processes related to printable electronics. He has extensive knowledge in emerging technology areas such as intelligent print, printed lighting and enabling technologies such as materials integration and barrier encapsulation.

Prior to joining CPI in 2008, Steve graduated from Northumbria University in Business Studies and is currently studying an Executive MBA at Warwick Business School.

Flexible Hybrid Electro, All

Applications Utilising Roll to Roll Fexible Hybrid Electronics

01:50pm

Bio

Steve is responsible for business development activities across CPI’s printed electronics platform. Steve’s expertise lies in the area of printed electronics, printed sensing and its role in the development of the internet of things and industry 4.0. Steve has delivered on a number of successful private projects at CPI, helping new research ideas develop from prototype and through to commercial deployment. Clients include industries such as automotive, aerospace, defence, packaging and medtech. These projects involve working with companies of all sizes ranging from large corporates to SMEs and academia.

Previously Steve held marketing positions at CPI, where he was responsible for managing the marketing operations of CPI’s printable electronics division. Steve’s role was to provide an end user focus in the scale up and commercialisation of products and processes related to printable electronics. He has extensive knowledge in emerging technology areas such as intelligent print, printed lighting and enabling technologies such as materials integration and barrier encapsulation.

Prior to joining CPI in 2008, Steve graduated from Northumbria University in Business Studies and is currently studying an Executive MBA at Warwick Business School.

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11 May 2021

ENJET Inc

Tuesday

High-Resolution Printing from 2D to 3D for Additive Manufacturing of Printed Electronics

More Details

01:50pm

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Doyoung Byun

CEO

Bio

Doyoung Byun received the PhD degree in Mechanical and Aerospace Engineering from the Korea Advanced Institute of Science and Technology (KAIST), Korea, in 2000. He has worked in several institutes and academies and founded the Enjet in 2009 in order to commercialize his high resolution printing and coating technologies for the printed electronics. Since 2009, he has served as CEO in the Enjet. He has developed the novel femto-liter droplet dispensing technology, electrostatic spray nozzle for functional coating, micro-fluidic devices, and MEMS devices. Based on these core technologies, he could commercialize ultra-fine printing and spray coating solutions for OLED display, micro-LED display, mobile phone, and bio-medical applications.

The Enjet is a high resolution inkjet printing solution leader and has a vision to provide innovative tools of printed electronics (2D and 3D), replacing conventional vacuum processes in OLED, PCB, Semiconductor, Glass, Bio-medical, and energy industries. The Enjet has further dreams to develop 3D additive manufacturing solutions for printed electronics. The Enjet has been developing a high resolution inkjet head with multi-nozzles, which can dispense higher viscous ink than the conventional ones and form pico-liter or even femto-liter droplets. With this novel inkjet head, we can print and manufacture 3D electronic devices from the provided model data and personal customized products.

Ultraprecision Printing, Printed Electronics, Advanced Displays, All, UltraFineLine Printing, adva

High-Resolution Printing from 2D to 3D for Additive Manufacturing of Printed Electronics

01:50pm

Bio

Doyoung Byun received the PhD degree in Mechanical and Aerospace Engineering from the Korea Advanced Institute of Science and Technology (KAIST), Korea, in 2000. He has worked in several institutes and academies and founded the Enjet in 2009 in order to commercialize his high resolution printing and coating technologies for the printed electronics. Since 2009, he has served as CEO in the Enjet. He has developed the novel femto-liter droplet dispensing technology, electrostatic spray nozzle for functional coating, micro-fluidic devices, and MEMS devices. Based on these core technologies, he could commercialize ultra-fine printing and spray coating solutions for OLED display, micro-LED display, mobile phone, and bio-medical applications.

The Enjet is a high resolution inkjet printing solution leader and has a vision to provide innovative tools of printed electronics (2D and 3D), replacing conventional vacuum processes in OLED, PCB, Semiconductor, Glass, Bio-medical, and energy industries. The Enjet has further dreams to develop 3D additive manufacturing solutions for printed electronics. The Enjet has been developing a high resolution inkjet head with multi-nozzles, which can dispense higher viscous ink than the conventional ones and form pico-liter or even femto-liter droplets. With this novel inkjet head, we can print and manufacture 3D electronic devices from the provided model data and personal customized products.

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11 May 2021

U.S. Army Combat Capabilities Development Command

Tuesday

Hybrid Electronics: Expanding manufacturing options for electronic assembly and packaging

More Details

02:10pm

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Eric Forsythe

SAMM-ERP Hybrid Electronics Thrust Lead

Bio

Eric W. Forsythe, Ph.D is the Team Leader for Flexible Electronics at the US Army Research Laboratory, Adelphi, MD. His responsibilities include; the Program Manager for the Flexible Hybrid Electronics Manufacturing Innovation Institute. Recently, Dr Forsythe was the Deputy Program Manager for the U.S. Army’s Flexible Display Center that demonstrated the World’s Largest flexible organic ligtht emitting diode displays and most recently the World’s Largest flexible digital x-ray imagers for DOD Explosive Ordnance Disposal. Additional responsibilities include the co-PI with the human performancde team for the ARL initiaitive “Continuous, Real-Time Assessment of Soldiers:The Foundation for Future Individualized and Adaptive Technologies” and the ARL Directors Initiative entitle “Ultrafast Electron Spectrocopy” for unique materials science exploration. Prior to joining ARL in 2001, Dr Forsythe was a Research Associate at the University of Rochester where he worked on electronic interfaces in organic light emitting diodes (OLEDs) with Eastman Kodak, the inventors of the commercial OLED display technology. In 1996, Dr Forsythe received his Ph.D in Engineering Physics at Stevens Institute of Technology. He has spent time working at small businesses on SBIR-projects in wide range of technologies and at Kearfott Guidance and Navigation on the Trident Missile stellar inertial guidance system, in the mid-1980’s. Dr Forsythe has more than 60 publications (2000 citations, H-index 19), and 5 patents filed or issued.

All, Printed Electronics, Advanced Displays

Hybrid Electronics: Expanding manufacturing options for electronic assembly and packaging

02:10pm

Bio

Eric W. Forsythe, Ph.D is the Team Leader for Flexible Electronics at the US Army Research Laboratory, Adelphi, MD. His responsibilities include; the Program Manager for the Flexible Hybrid Electronics Manufacturing Innovation Institute. Recently, Dr Forsythe was the Deputy Program Manager for the U.S. Army’s Flexible Display Center that demonstrated the World’s Largest flexible organic ligtht emitting diode displays and most recently the World’s Largest flexible digital x-ray imagers for DOD Explosive Ordnance Disposal. Additional responsibilities include the co-PI with the human performancde team for the ARL initiaitive “Continuous, Real-Time Assessment of Soldiers:The Foundation for Future Individualized and Adaptive Technologies” and the ARL Directors Initiative entitle “Ultrafast Electron Spectrocopy” for unique materials science exploration. Prior to joining ARL in 2001, Dr Forsythe was a Research Associate at the University of Rochester where he worked on electronic interfaces in organic light emitting diodes (OLEDs) with Eastman Kodak, the inventors of the commercial OLED display technology. In 1996, Dr Forsythe received his Ph.D in Engineering Physics at Stevens Institute of Technology. He has spent time working at small businesses on SBIR-projects in wide range of technologies and at Kearfott Guidance and Navigation on the Trident Missile stellar inertial guidance system, in the mid-1980’s. Dr Forsythe has more than 60 publications (2000 citations, H-index 19), and 5 patents filed or issued.

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11 May 2021

XTPL

Tuesday

High-Resolution 3D-Printed Conductive Features In Single Micron Scale

More Details

02:10pm

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Filip Granek

CEO

We introduce the ultra-precise deposition (UPD) technology for rapid prototyping of microelectronic devices. UPD allows maskless deposition of high-viscosity metallic and non-metallic inks with the printed feature size as small as 1 μm. XTPL technology answers some of the key challenges in the fabrication of high-density microelectronics, including the ability to print on complex 3D substrates and obtain structures with arbitrary shapes, including lines, dots, crosses, and meshes

Ultraprecision Printing, Conducti, All, Printed Electronics, Conductive Ink, Advanced Materials

High-Resolution 3D-Printed Conductive Features In Single Micron Scale

02:10pm

We introduce the ultra-precise deposition (UPD) technology for rapid prototyping of microelectronic devices. UPD allows maskless deposition of high-viscosity metallic and non-metallic inks with the printed feature size as small as 1 μm. XTPL technology answers some of the key challenges in the fabrication of high-density microelectronics, including the ability to print on complex 3D substrates and obtain structures with arbitrary shapes, including lines, dots, crosses, and meshes

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11 May 2021

CEA

Tuesday

Ultrathin Flexible ICs For Flexible Electronics

More Details

02:50pm

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Jean-Charles Souriau

Project Leader

ChipInFlex is CEA-Leti's latest development towards the integration of ultra-thin, bare silicon chips within a flexible film. Today, electronic systems are becoming smaller, thinner and, above all, flexible. Flexibility makes possible new functions and hence new usages. With Chip-In-Flex, CEA-Leti is introducing a new paradigm for integrating ultra-thin, bare chips into a flexible label made on a silicon wafer.

Ultrathin IC, Flexible Hybrid Electro, All

Ultrathin Flexible ICs For Flexible Electronics

02:50pm

ChipInFlex is CEA-Leti's latest development towards the integration of ultra-thin, bare silicon chips within a flexible film. Today, electronic systems are becoming smaller, thinner and, above all, flexible. Flexibility makes possible new functions and hence new usages. With Chip-In-Flex, CEA-Leti is introducing a new paradigm for integrating ultra-thin, bare chips into a flexible label made on a silicon wafer.

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11 May 2021

ARM

Tuesday

Towards Natively Flexible ICs

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03:10pm

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Jedrzej Kufel

Staff Research Engineer

Conventional silicon technology has embedded at least one integrated circuit into every smart device on Earth. However, it faces key challenges to make everyday objects smarter. Cost is the most important factor but flexibility and conformability are highly desirable.
Our approach is to develop integrated circuits using flexible electronic fabrication techniques, thus paving the way towards natively-flexible LSI and VLSI ICs.

Jedrzej Kufel
Staff Research Engineer @ Arm
Bio

Dr Jedrzej Kufel is a Staff Research Engineer. He joined Arm in 2014, working in the IoT product team before moving to Research in 2016. His current interests are in the area of low-power integrated circuit design using flexible/printed electronics, validation and test methodologies and circular economy. Jedrzej holds a MEng in Mechatronics and Robotic Systems from University of Liverpool and a PhD from University of Southampton.

Flexible Hybrid Electr, Ultrathin IC, Printed Electronics, All

Towards Natively Flexible ICs

03:10pm

Conventional silicon technology has embedded at least one integrated circuit into every smart device on Earth. However, it faces key challenges to make everyday objects smarter. Cost is the most important factor but flexibility and conformability are highly desirable.
Our approach is to develop integrated circuits using flexible electronic fabrication techniques, thus paving the way towards natively-flexible LSI and VLSI ICs.

Jedrzej Kufel
Staff Research Engineer @ Arm
Bio

Dr Jedrzej Kufel is a Staff Research Engineer. He joined Arm in 2014, working in the IoT product team before moving to Research in 2016. His current interests are in the area of low-power integrated circuit design using flexible/printed electronics, validation and test methodologies and circular economy. Jedrzej holds a MEng in Mechatronics and Robotic Systems from University of Liverpool and a PhD from University of Southampton.

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11 May 2021

COATEMA Coating Machinery GmbH

Tuesday

Improvement of yield and performance of OPV by using inline quality control systems and process monitoring

More Details

03:10pm

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Thomas Kolbusch

Vice President

Coatema delivered a pilot line in 2012 to the University of Thessaloniki in Greece. (Auth). Since them there had been a continuous scale up of the system with the integration of different quality control systems like inline spectroscopy and others. In a new European project called Real Nano additional quality control systems are being installed.
The talk describes the used systems, the influence of the different parameters like coating, drying, tension control and others.

Thomas Kolbusch
Vice President @ Coatema® Coating Machinery GmbH
Bio

Thomas Kolbusch is Vice President of Coatema Coating Machinery GmbH, an equipment manufacturing company for coating, printing and laminating solutions located in Dormagen, Germany.
He is member of the board of the OE-A (Organic Electronic Association) in Germany, a global association for printed electronics.
He serves in the advisory board of Fraunhofer ITA institute.
He served as member of the board of COPT.NRW, a local association in Germany, as well as exhibition chair of the LOPEC in Munich for five years. Thomas is active in the field of fuel cells, batteries, printed electronics, photovoltaics and medical applications. He organizes the international Coatema Coating Symposium for over 19 years and represents Coatema in a number of public funded German and European projects. Thomas Kolbusch studied Business Economics at the Niederrhein University of Applied Sciences and got his degree as business economist in 1997. He started his career at 3M, Germany. Since 1999 he is working for Coatema Coating Machinery in different positions.

Electronic, Printed Electronics

Improvement of yield and performance of OPV by using inline quality control systems and process monitoring

03:10pm

Coatema delivered a pilot line in 2012 to the University of Thessaloniki in Greece. (Auth). Since them there had been a continuous scale up of the system with the integration of different quality control systems like inline spectroscopy and others. In a new European project called Real Nano additional quality control systems are being installed.
The talk describes the used systems, the influence of the different parameters like coating, drying, tension control and others.

Thomas Kolbusch
Vice President @ Coatema® Coating Machinery GmbH
Bio

Thomas Kolbusch is Vice President of Coatema Coating Machinery GmbH, an equipment manufacturing company for coating, printing and laminating solutions located in Dormagen, Germany.
He is member of the board of the OE-A (Organic Electronic Association) in Germany, a global association for printed electronics.
He serves in the advisory board of Fraunhofer ITA institute.
He served as member of the board of COPT.NRW, a local association in Germany, as well as exhibition chair of the LOPEC in Munich for five years. Thomas is active in the field of fuel cells, batteries, printed electronics, photovoltaics and medical applications. He organizes the international Coatema Coating Symposium for over 19 years and represents Coatema in a number of public funded German and European projects. Thomas Kolbusch studied Business Economics at the Niederrhein University of Applied Sciences and got his degree as business economist in 1997. He started his career at 3M, Germany. Since 1999 he is working for Coatema Coating Machinery in different positions.

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11 May 2021

American Semiconductor

Tuesday

State-of-the-Art and Issues for Bluetooth® Flexible Hybrid Electronics (FHE)

More Details

03:30pm

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Doug Hackler

CEO

Bio

Douglas Hackler, Co-founder of American Semiconductor 2001. 30+ years of experience in wafer fabrication, process development, manufacturing and commercialization at M/A-Com, Zilog, Intel, NorTel and General Instrument. Engineering degrees from Boise State University (BSEE) and the University of Idaho (MSEE). Business degree from Texas Tech University (BBA). Doug has multiple patents and patents pending for advanced packaging and flexible technology and has published numerous technical papers. At American Semiconductor Doug maintains overall corporate and operational responsibilities.

Ultrathin IC and TFTs, Printed Electronics, Flexible Hybrid Electr, Flexible Hybrid Electro, All, Semiconductor Packaging

State-of-the-Art and Issues for Bluetooth® Flexible Hybrid Electronics (FHE)

03:30pm

Bio

Douglas Hackler, Co-founder of American Semiconductor 2001. 30+ years of experience in wafer fabrication, process development, manufacturing and commercialization at M/A-Com, Zilog, Intel, NorTel and General Instrument. Engineering degrees from Boise State University (BSEE) and the University of Idaho (MSEE). Business degree from Texas Tech University (BBA). Doug has multiple patents and patents pending for advanced packaging and flexible technology and has published numerous technical papers. At American Semiconductor Doug maintains overall corporate and operational responsibilities.

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11 May 2021

SUNEW

Tuesday

OPV Production Scale-Up & Installation Challenge

More Details

03:30pm

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Vinicius Zanchin

Production Manager

OPV, Organic Materials, PV, All, Printed Materials, Printed Electronics, Perovskite, Organic, CIGS, and Other Photovoltaics, Perovskite, Perovskite, Organic, CIGS and Other Photovoltaics, Advanced Materials

OPV Production Scale-Up & Installation Challenge

03:30pm

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11 May 2021

Brilliant Matters

Tuesday

New Generation Of Photovoltaic Materials

More Details

03:50pm

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Jean-Rémi Pouliot

CEO

New Generation Of Photovoltaic Materials

03:50pm

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11 May 2021

Texas Instruments

Tuesday

Semiconductor and Printed Electronics Industries: Overview of emerging applications

More Details

03:50pm

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Sean Chang

Process Engineer

Traditional semiconductor manufacturing has remained largely unchanged throughout the modern era, and growing efforts to increase throughput and reduce cost provide an ever more compelling case for applications where the flexibility of additive manufacturing can intercept. This talk will explore opportunities, challenges and the road ahead towards adaptation of printed electronics within the semiconductor industry.

All, Printed Electronics

Semiconductor and Printed Electronics Industries: Overview of emerging applications

03:50pm

Traditional semiconductor manufacturing has remained largely unchanged throughout the modern era, and growing efforts to increase throughput and reduce cost provide an ever more compelling case for applications where the flexibility of additive manufacturing can intercept. This talk will explore opportunities, challenges and the road ahead towards adaptation of printed electronics within the semiconductor industry.

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11 May 2021

Parsons

Tuesday

Design and Manufacture of Test Coupons for Risk Reduction Studies of Printed Hybrid Electronics Assemblies

More Details

04:10pm

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Alison Kritz

Materials Engineer

We will present an investigation of risks of failure in a prototype printed hybrid electronics (PHE) Arduino-type circuit to be fabricated using a variety of additive manufacturing technologies including aerosol-jet, syringe, and stereolithography (SLA) printing. The interfaces of different components and materials in this design introduce potential sources of failure including thermal expansion mismatches and silver migration resulting from temperature cycling. We will discuss the design rationale, fabrication methods, and testing conditions of three different test coupons, each of which isolates a different area of interest in the PHE assembly and seeks to identify and prevent the greatest risks.

Printed Electronics, Semiconductor Packaging, Flexible Hybrid Electro, Flexible Hybrid Electr

Design and Manufacture of Test Coupons for Risk Reduction Studies of Printed Hybrid Electronics Assemblies

04:10pm

We will present an investigation of risks of failure in a prototype printed hybrid electronics (PHE) Arduino-type circuit to be fabricated using a variety of additive manufacturing technologies including aerosol-jet, syringe, and stereolithography (SLA) printing. The interfaces of different components and materials in this design introduce potential sources of failure including thermal expansion mismatches and silver migration resulting from temperature cycling. We will discuss the design rationale, fabrication methods, and testing conditions of three different test coupons, each of which isolates a different area of interest in the PHE assembly and seeks to identify and prevent the greatest risks.

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11 May 2021

Phillips 66

Tuesday

Photoactive Polymers Tailored to Industrial Printing of High Performing and Stable Organic Photovoltaics

More Details

04:10pm

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Reed Eisenhart

Director, Solar Energy

Printed Electronics, OPV, PV, R2, All, Perovskite, Organic, CIGS, and Other Photovoltaics, Perovskite, Organic, CIGS and Other Photovoltaics, Advanced Materials

Photoactive Polymers Tailored to Industrial Printing of High Performing and Stable Organic Photovoltaics

04:10pm

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11 May 2021

Alpha Assembly

Tuesday

Ultralow Temperature Solder For Flexible Hybrid Electronics

More Details

04:50pm

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Rahul Raut

Director, Strategy and Technology Acquisitio

Flexible Hybrid Electro, All

Ultralow Temperature Solder For Flexible Hybrid Electronics

04:50pm

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11 May 2021

Ntrium

Tuesday

Recent EMI Shielding Process for Advanced Packaging

More Details

04:50pm

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Kisu Joo

Technical Marketing

All, Printed Electroncis

Recent EMI Shielding Process for Advanced Packaging

04:50pm

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11 May 2021

ACI Materials

Tuesday

ACI Alchemy Conductive Inks -Enabling Next Generation Flexible & 3D Electronics

More Details

05:10pm

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Mike Mastropietro

VP of Engineering

ACI will introduce to the world its Alchemy Conductive Inks. These high-performance printable conductors allow PTF ink like ease of use and processing with fired/sintered thick film electrical performance. The talk will describe some of the overall benefits of using these materials in manufacture of flexible and 3D printed electronics including:
low volume resistivity and sheet resistance
higher current carrying capacity
lower cost per ohm square in use
superior crease ability of narrow traces
formulation latitude from viscous paste to sprayable
Several examples will be presented including
3D circuit structures
high resolution traces
high power density busbars
reflow solder ability

All, Printed Electronics, 3D Printing, InMold Electronics

ACI Alchemy Conductive Inks -Enabling Next Generation Flexible & 3D Electronics

05:10pm

ACI will introduce to the world its Alchemy Conductive Inks. These high-performance printable conductors allow PTF ink like ease of use and processing with fired/sintered thick film electrical performance. The talk will describe some of the overall benefits of using these materials in manufacture of flexible and 3D printed electronics including:
low volume resistivity and sheet resistance
higher current carrying capacity
lower cost per ohm square in use
superior crease ability of narrow traces
formulation latitude from viscous paste to sprayable
Several examples will be presented including
3D circuit structures
high resolution traces
high power density busbars
reflow solder ability

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11 May 2021

CondAlign AS

Tuesday

Advantages With Anisotropic Conductive Adhesive Films Comprising Aligned Particles

More Details

05:10pm

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Pål Morten Lindberget

VP Sales and Marketing

CondAlign’s technology represents a novel process for production of anisotropic, conductive films. Using an electric field to structure and align particles, the results in a z-axis conductive film structure. One product type we can produce is anisotropic conductive adhesive (ACA) films with thicknesses from a few µm to some hundreds µm and resistance below 0,01 Ohm/cm^2. With very high chain densities (pitch below 10µm), these films are currently being tested in several bonding processes, like FOB, FOF, COB, COF, as an alternative to traditional ACF. The process is demonstrated in roll-to-roll production, proofing it is scalable and cost effective.

Morten Lindberget
VP Business Development @ CondAlign
Bio

An enabler with 25 years international experience from leadership, sales and business development roles in technology consulting, contract manufacturing, medical device technology and scale up. Morten holds a MSc in Mech. Engineering from TU Delft, the Netherlands, and an Executive Master of Management from BI, Norway.

Flexible Hybrid Electro, Die Attach, All, Advanced Materials, Semiconductor Packaging

Advantages With Anisotropic Conductive Adhesive Films Comprising Aligned Particles

05:10pm

CondAlign’s technology represents a novel process for production of anisotropic, conductive films. Using an electric field to structure and align particles, the results in a z-axis conductive film structure. One product type we can produce is anisotropic conductive adhesive (ACA) films with thicknesses from a few µm to some hundreds µm and resistance below 0,01 Ohm/cm^2. With very high chain densities (pitch below 10µm), these films are currently being tested in several bonding processes, like FOB, FOF, COB, COF, as an alternative to traditional ACF. The process is demonstrated in roll-to-roll production, proofing it is scalable and cost effective.

Morten Lindberget
VP Business Development @ CondAlign
Bio

An enabler with 25 years international experience from leadership, sales and business development roles in technology consulting, contract manufacturing, medical device technology and scale up. Morten holds a MSc in Mech. Engineering from TU Delft, the Netherlands, and an Executive Master of Management from BI, Norway.

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11 May 2021

Agfa

Tuesday

Printed Electronics made with Digital Printing: Materials and Applications in Motor Sport

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05:30pm

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Frank Louwet

Global Marketing Manager - PE

Digital printing has clearly established itself for graphics printing, thanks to the advantages it offers over traditional processes like screen printing. More recently, digital printing started morphing into digital manufacturing and also Printed Electronics is taking advantage of that evolution. In this talk we will review Agfa's digital conductive inks based on nanomaterials, and highlight some features of newly developed inks. In the second part of the talk, Nanogate Netherlands will discuss the application of additive digital manufacturing in motor sport products.

Peter Willaert
Global Marketing Manager Printed Electronics @ Agfa
Bio

Experienced Product Marketing and Business Development Manager in Printed Electronics with a background in Electronic Engineering. Over the years I have developed a broad knowledge about materials and processes for applications like RFID, iOT, Sensors, Displays etc.

All, Printed Electronics

Printed Electronics made with Digital Printing: Materials and Applications in Motor Sport

05:30pm

Digital printing has clearly established itself for graphics printing, thanks to the advantages it offers over traditional processes like screen printing. More recently, digital printing started morphing into digital manufacturing and also Printed Electronics is taking advantage of that evolution. In this talk we will review Agfa's digital conductive inks based on nanomaterials, and highlight some features of newly developed inks. In the second part of the talk, Nanogate Netherlands will discuss the application of additive digital manufacturing in motor sport products.

Peter Willaert
Global Marketing Manager Printed Electronics @ Agfa
Bio

Experienced Product Marketing and Business Development Manager in Printed Electronics with a background in Electronic Engineering. Over the years I have developed a broad knowledge about materials and processes for applications like RFID, iOT, Sensors, Displays etc.

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11 May 2021

Nanogate

Tuesday

Printed Electronics made with Digital Printing: Materials and Applications in Motor Sport

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05:30pm

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Jurgen van Peer

Application Manager

Digital printing has clearly established itself for graphics printing, thanks to the advantages it offers over traditional processes like screen printing. More recently, digital printing started morphing into digital manufacturing and also Printed Electronics is taking advantage of that evolution. In this talk we will review Agfa's digital conductive inks based on nanomaterials, and highlight some features of newly developed inks. In the second part of the talk, Nanogate Netherlands will discuss the application of additive digital manufacturing in motor sport products.

All, Printed Electronics

Printed Electronics made with Digital Printing: Materials and Applications in Motor Sport

05:30pm

Digital printing has clearly established itself for graphics printing, thanks to the advantages it offers over traditional processes like screen printing. More recently, digital printing started morphing into digital manufacturing and also Printed Electronics is taking advantage of that evolution. In this talk we will review Agfa's digital conductive inks based on nanomaterials, and highlight some features of newly developed inks. In the second part of the talk, Nanogate Netherlands will discuss the application of additive digital manufacturing in motor sport products.

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11 May 2021

SAFI-Tech

Tuesday

Supercooled Fully Metallic FHE Interconnect Technology

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05:30pm

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Ian Tevis

CTO

Flexible Hybrid Electro, Printed Electronics, Die Attach, All, Advanced Materials, Semiconductor Packaging

Supercooled Fully Metallic FHE Interconnect Technology

05:30pm

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11 May 2021

NovaCentrix

Tuesday

PulseForge Soldering-Using flash lamp technology for conventional solder alloy reflow

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05:50pm

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Rudy Ghosh

Technical Program Lead

Bio

As the Technical Program Lead at NovaCentrix, Rudy Ghosh helps translate technical innovations into customer ready products. He works closely with NovaCentrix’s customers, technology partners, and collaborators across the world to solve technical challenges and identify new avenues for the application of NovaCentrix’s industry leading technologies in PulseForge tools and Metalon inks for printed and flexible electronics. As a technical expert in the printed electronics industry, he is often an invited speaker for a variety of printed electronics conferences. Rudy also works with the global business team to define and engage in commercial opportunities related to the technical program and furthers those areas of opportunity through industry outreach and engagement. Before joining NovaCentrix, Rudy was a Post-Doc at the Microelectronics Research Center at the University of Texas at Austin, where he led the Center’s research into the synthesis of 2D materials. Rudy holds a PhD in Physics from the University of North Carolina at Chapel Hill and a MS in Physics from the Indian Institute of Technology, Bombay. Rudy has authored over 30 publications in a variety of technical journals.

All, Printed Electronics

PulseForge Soldering-Using flash lamp technology for conventional solder alloy reflow

05:50pm

Bio

As the Technical Program Lead at NovaCentrix, Rudy Ghosh helps translate technical innovations into customer ready products. He works closely with NovaCentrix’s customers, technology partners, and collaborators across the world to solve technical challenges and identify new avenues for the application of NovaCentrix’s industry leading technologies in PulseForge tools and Metalon inks for printed and flexible electronics. As a technical expert in the printed electronics industry, he is often an invited speaker for a variety of printed electronics conferences. Rudy also works with the global business team to define and engage in commercial opportunities related to the technical program and furthers those areas of opportunity through industry outreach and engagement. Before joining NovaCentrix, Rudy was a Post-Doc at the Microelectronics Research Center at the University of Texas at Austin, where he led the Center’s research into the synthesis of 2D materials. Rudy holds a PhD in Physics from the University of North Carolina at Chapel Hill and a MS in Physics from the Indian Institute of Technology, Bombay. Rudy has authored over 30 publications in a variety of technical journals.

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11 May 2021

VSParticle

Tuesday

Accelerating the development of new value added materials

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05:50pm

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Aaike van Vugt

CEO

Conductive Ink, Printed Electronics, Novel Inks, Advanced Materials

Accelerating the development of new value added materials

05:50pm

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11 May 2021

C3Nano

Tuesday

Platform Optoelectronic Materials: Flexible, Rollable, Large-Area, Biotech & Beyond

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06:30pm

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Ajay Virkar

Co-Founder and CTO

Transparent Conduct, AgNWs, All, Perovskite, Organic, CIGS, and Other Photovoltaics, Advanced Materials

Platform Optoelectronic Materials: Flexible, Rollable, Large-Area, Biotech & Beyond

06:30pm

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11 May 2021

DuPont Teijin Films

Tuesday

Advances in Polyester Film Substrates for Flexible Electronics

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06:30pm

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Scott Gordon

New Business Development Manager

Continued advances in Flexible Hybrid Electronics have required material suppliers to deliver improved functionality to the device developers in broad applications such as sensors, displays, barrier films, photovoltaics, medical diagnostics, consumer electronics, HMI (Human Machine Interface), and Flexible Printed Circuits (FPCs).
Demands on the film substrate suppliers can vary widely, and polymer property requirements typically include: clean surfaces with low surface defects, optically clear films with low haze and iridescence, near zero thermal shrinkage for multilayer print registration and component attach via solder reflow, UV and Hydrolysis resistance, and VTM-0 Flame Retardance. Many requests also include an ability to further tailor the surface chemistry to improve and enhance the downstream processing performance. New commercial polyester film types have been introduced by DuPont Teijin Films, and their typical end use applications will be described.

Fraunhofer FEP performs Roll-to-Roll film processing, and they are developing transparent and robust permeation Barrier Films for Flexible Electronics. The substrate choice is critical for optimized performance, and Fraunhofer FEP will describe their journey and key learnings.

All, Printed Electronics

Advances in Polyester Film Substrates for Flexible Electronics

06:30pm

Continued advances in Flexible Hybrid Electronics have required material suppliers to deliver improved functionality to the device developers in broad applications such as sensors, displays, barrier films, photovoltaics, medical diagnostics, consumer electronics, HMI (Human Machine Interface), and Flexible Printed Circuits (FPCs).
Demands on the film substrate suppliers can vary widely, and polymer property requirements typically include: clean surfaces with low surface defects, optically clear films with low haze and iridescence, near zero thermal shrinkage for multilayer print registration and component attach via solder reflow, UV and Hydrolysis resistance, and VTM-0 Flame Retardance. Many requests also include an ability to further tailor the surface chemistry to improve and enhance the downstream processing performance. New commercial polyester film types have been introduced by DuPont Teijin Films, and their typical end use applications will be described.

Fraunhofer FEP performs Roll-to-Roll film processing, and they are developing transparent and robust permeation Barrier Films for Flexible Electronics. The substrate choice is critical for optimized performance, and Fraunhofer FEP will describe their journey and key learnings.

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11 May 2021

Fraunhofer FEP

Tuesday

Advances in Polyester Film Substrates for Flexible Electronics

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06:30pm

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John Fahlteich

Group Leader coFlex

Continued advances in Flexible Hybrid Electronics have required material suppliers to deliver improved functionality to the device developers in broad applications such as sensors, displays, barrier films, photovoltaics, medical diagnostics, consumer electronics, HMI (Human Machine Interface), and Flexible Printed Circuits (FPCs).
Demands on the film substrate suppliers can vary widely, and polymer property requirements typically include: clean surfaces with low surface defects, optically clear films with low haze and iridescence, near zero thermal shrinkage for multilayer print registration and component attach via solder reflow, UV and Hydrolysis resistance, and VTM-0 Flame Retardance. Many requests also include an ability to further tailor the surface chemistry to improve and enhance the downstream processing performance. New commercial polyester film types have been introduced by DuPont Teijin Films, and their typical end use applications will be described.

Fraunhofer FEP performs Roll-to-Roll film processing, and they are developing transparent and robust permeation Barrier Films for Flexible Electronics. The substrate choice is critical for optimized performance, and Fraunhofer FEP will describe their journey and key learnings.

John Fahlteich
Group Leader coFlex | Deputy Head of Department R2R Technologies @ Fraunhofer FEP

Bio

Dr. John Fahlteich born 1981, graduated from the University of Leipzig with a diploma in physics in 2005. In 2010, he earned a PhD from the Technical University of Chemnitz with a thesis about vacuum deposited permeation barrier layers. In total, he has now 15 years of experience in Roll-to-Roll Thin Film Coating on Plastic Web. John is a Research Group Leader in the Business Unit “Plasma Technology” at Fraunhofer FEP. As of today, he published over 40 papers, conference contributions and patents as well as three book chapters in the field. John is currently principal consortium coordinator of three Horizon 2020 funded Projects (Switch2Save, NanoQI, and the Open Innovation Test Bed FlexFunction2Sustain).