Printed, Hybrid, Structural, & 3D Electronics

MAY 2021

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Topics Covered

Printed | Hybrid | Structural | 3D Electronics

Anurag Bansal

ACCIONA

Anurag Bansal

ACCIONA
LEE-BED: Services and infrastructure within printed and embedded electronics

Bio

Anurag Bansal has more than twenty-two years of experience within international construction, polymers and chemical companies.
During this tenure, he has worked in different areas of Composites-product value-chain for example, product and process development, manufacturing, supply chain management including sourcing and outsourcing, business development including key-customer coordination and product portfolio management, technology intelligence and transfer and, production facility setup.
Currently, he is also collaborating, among several other projects, in devlopment of LEE-BED’s wireless sensor technology, by sharing his expertise in composites product manufacturing, logistics and installation in construction industry.

Mike Mastropietro

ACI Materials

Mike Mastropietro

VP of Engineering

ACI Materials
ACI Alchemy Conductive Inks -Enabling Next Generation Flexible & 3D Electronics

ACI will introduce to the world its Alchemy Conductive Inks. These high-performance printable conductors allow PTF ink like ease of use and processing with fired/sintered thick film electrical performance. The talk will describe some of the overall benefits of using these materials in manufacture of flexible and 3D printed electronics including:
low volume resistivity and sheet resistance
higher current carrying capacity
lower cost per ohm square in use
superior crease ability of narrow traces
formulation latitude from viscous paste to sprayable
Several examples will be presented including
3D circuit structures
high resolution traces
high power density busbars
reflow solder ability

 Jedrzej Kufel

ARM

Jedrzej Kufel

Staff Research Engineer

ARM
Towards Natively Flexible ICs

Conventional silicon technology has embedded at least one integrated circuit into every smart device on Earth. However, it faces key challenges to make everyday objects smarter. Cost is the most important factor but flexibility and conformability are highly desirable.
Our approach is to develop integrated circuits using flexible electronic fabrication techniques, thus paving the way towards natively-flexible LSI and VLSI ICs.

Jedrzej Kufel
Staff Research Engineer @ Arm
Bio

Dr Jedrzej Kufel is a Staff Research Engineer. He joined Arm in 2014, working in the IoT product team before moving to Research in 2016. His current interests are in the area of low-power integrated circuit design using flexible/printed electronics, validation and test methodologies and circular economy. Jedrzej holds a MEng in Mechatronics and Robotic Systems from University of Liverpool and a PhD from University of Southampton.

Frank Louwet

Agfa

Frank Louwet

Global Marketing Manager - PE

Agfa
Printed Electronics made with Digital Printing: Materials and Applications in Motor Sport

Digital printing has clearly established itself for graphics printing, thanks to the advantages it offers over traditional processes like screen printing. More recently, digital printing started morphing into digital manufacturing and also Printed Electronics is taking advantage of that evolution. In this talk we will review Agfa's digital conductive inks based on nanomaterials, and highlight some features of newly developed inks. In the second part of the talk, Nanogate Netherlands will discuss the application of additive digital manufacturing in motor sport products.

Peter Willaert
Global Marketing Manager Printed Electronics @ Agfa
Bio

Experienced Product Marketing and Business Development Manager in Printed Electronics with a background in Electronic Engineering. Over the years I have developed a broad knowledge about materials and processes for applications like RFID, iOT, Sensors, Displays etc.

Dennis Hahn

Airbus Operations GmBH

Dennis Hahn

Project Leader, Printed Electronics

Airbus Operations GmBH
End User Panel Discussion: Printed Electronics in Aviation

Rahul Raut

Alpha Assembly

Rahul Raut

Director, Strategy and Technology Acquisitio

Alpha Assembly
Ultralow Temperature Solder For Flexible Hybrid Electronics

Doug Hackler

American Semiconductor

Doug Hackler

CEO

American Semiconductor
State-of-the-Art and Issues for Bluetooth® Flexible Hybrid Electronics (FHE)

Bio

Douglas Hackler, Co-founder of American Semiconductor 2001. 30+ years of experience in wafer fabrication, process development, manufacturing and commercialization at M/A-Com, Zilog, Intel, NorTel and General Instrument. Engineering degrees from Boise State University (BSEE) and the University of Idaho (MSEE). Business degree from Texas Tech University (BBA). Doug has multiple patents and patents pending for advanced packaging and flexible technology and has published numerous technical papers. At American Semiconductor Doug maintains overall corporate and operational responsibilities.

Francesca Antoniolli

Applied Materials

Francesca Antoniolli

Global Product Manager

Applied Materials
Advanced screen printing for PE: two case studies of industrial applications in medical and display

Bio

After completing the Material Engineering studies in 2004, Francesca decided to pursue the Academic career by undertaking a PhD in Material Science and Engineering, with main focus on nano and bio technologies. In parallel established a 5 years collaboration with the Dentistry Department in order to increase the knowledge and awareness about dental materials in this sector.
In 2008 decided to leave the Academic path to jump into the entrepreneurial adventure and joining full-time the start-up Genefinity, a spin-off of the University of Trieste, which she founded in 2005 together with 3 other PhD colleagues. The company grew successfully for about 10 years by developing specific competences on thin films depositions, mainly PVD and ALD techniques, with main markets biomedical, food, solar and cosmetic.
In 2016, decided to jump into a new adventure and joined Applied Materials Italy as Business Developer, with the main target to expand the current solar market to other sector of the printed electronics.

Adam Scotch

Brewer Science

Adam Scotch

Tech Leader

Brewer Science
Printed Smart Devices: Enabling Widespread, Real-Time Sensing

Bio

Dr. Adam M. Scotch is currently Director of R&D, Smart Devices and Printed Electronics at Brewer Science in Springfield, MO. Prior to joining Brewer Science, Adam was Director of Manufacturing at antenna tech start-up Wafer for 3.5 years, responsible for product development, engineering, scale to manufacturing, and general operations. Adam held various technical leadership roles over 13 years in R&D at lighting company OSRAM, and lead the company’s efforts in printed electronics. His expertise is in materials science, process development, LED devices, and packaging. Prior to OSRAM, he was a National Research Council Postdoctoral Fellow at the National Institute of Standards and Technology (NIST). He holds 20 U.S. Patents and 9 refereed journal publications. Adam has a B.S. and Ph.D. in Materials Science and Engineering from Lehigh University, Bethlehem, PA.

Jean-Rémi Pouliot

Brilliant Matters

Jean-Rémi Pouliot

CEO

Brilliant Matters
New Generation Of Photovoltaic Materials

Ajay Virkar

C3Nano

Ajay Virkar

Co-Founder and CTO

C3Nano
Platform Optoelectronic Materials: Flexible, Rollable, Large-Area, Biotech & Beyond

Jean-Charles Souriau

CEA

Jean-Charles Souriau

Project Leader

CEA
Ultrathin Flexible ICs For Flexible Electronics

ChipInFlex is CEA-Leti's latest development towards the integration of ultra-thin, bare silicon chips within a flexible film. Today, electronic systems are becoming smaller, thinner and, above all, flexible. Flexibility makes possible new functions and hence new usages. With Chip-In-Flex, CEA-Leti is introducing a new paradigm for integrating ultra-thin, bare chips into a flexible label made on a silicon wafer.

Thomas Kolbusch

COATEMA Coating Machinery GmbH

Thomas Kolbusch

Vice President