ALL PAST & FUTURE EVENTS AS WELL AS MASTERCLASSES WITH A SINGLE ANNUAL PASS
Full Agenda
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10 March 2021
GE Research
Wednesday
Flexible Hybrid Electronics Applications for the Industrial World
More Details
02:30pm
Nancy Stoffel
Platform Leader for FHE at GE
This presentation overviews GE’s vision of the digital industrial challenges in manufacturing. It does this in the context of opportunities for sensors, and communication elements made using flexible hybrid electronics, for smart manufacturing, structural health monitoring, and for improved worker safety and productivity.
Nancy Stoffel
Platform Leader for FHE @ GE Research
Bio
Nancy Stoffel specializes in design and manufacturing of printed embedded systems and electronics packaging. She serves as GE’s representative on the Nextflex consortia Board of Governors and was recognized for her technical contributions by being named a Next Flex Fellow. Nancy holds a PhD in Materials Science from Cornell University. Her career has focused on materials and process development for electronics integration. During her 30+ industry career, she was Director of Microsystems Integration at STC MEMS & Technical Manager at Xerox Corp in-charge of inkjet device fluidic design, materials technology and process development for next generation product. During her time at IBM she developed new materials and process technology to create co-fired glass-ceramic multichip modules. She has been with GE Research for 9 years where her work has focused on the integration of sensors and electronics for power electronics, wearables and asset monitoring. She is active in the IEEE, and is the 2021 General Chair of the IEEE ECTC, the premier electronics packaging conference.
Flexible Hybrid Electro, All, Printed Electronics, Sensors
Flexible Hybrid Electronics Applications for the Industrial World
02:30pm
This presentation overviews GE’s vision of the digital industrial challenges in manufacturing. It does this in the context of opportunities for sensors, and communication elements made using flexible hybrid electronics, for smart manufacturing, structural health monitoring, and for improved worker safety and productivity.
Nancy Stoffel
Platform Leader for FHE @ GE Research
Bio
Nancy Stoffel specializes in design and manufacturing of printed embedded systems and electronics packaging. She serves as GE’s representative on the Nextflex consortia Board of Governors and was recognized for her technical contributions by being named a Next Flex Fellow. Nancy holds a PhD in Materials Science from Cornell University. Her career has focused on materials and process development for electronics integration. During her 30+ industry career, she was Director of Microsystems Integration at STC MEMS & Technical Manager at Xerox Corp in-charge of inkjet device fluidic design, materials technology and process development for next generation product. During her time at IBM she developed new materials and process technology to create co-fired glass-ceramic multichip modules. She has been with GE Research for 9 years where her work has focused on the integration of sensors and electronics for power electronics, wearables and asset monitoring. She is active in the IEEE, and is the 2021 General Chair of the IEEE ECTC, the premier electronics packaging conference.
10 March 2021
FIAT Research Centre
Wednesday
Materials Meets Electronics: A New Paradigm for Automotive Components
More Details
02:50pm
Nello Li Pira
Head of Materials Labs
This work discusses one of the main future challenge in automotive materials addressing the integration of embedded electronic functionalities and sustainability.
The cars of the future will have an elegant and ergonomic design with embedded sensors, touch surfaces and biomimetic multi-coloured components. E-mobility and autonomous driving are becoming fundamental demands in vehicles but at the same time, they have to merge with sustainability introducing biomaterials and strengthening the circular economy. This implies a continuous development of current products with increase of electronics contents meeting in parallel the main issues of economy of the future: limiting the presence of hazardous chemicals, increase uptake of recycled materials and developing bio-based plastics.
Nello Li Pira
Head of Materials Labs @ FIAT Research Centre
Bio
Nello Li Pira, Dr. General Physics, University of Torino, 2000. He obtained a PhD degree at the Polytechnic of Turin in 2010. He currently works as Global Materials R&I manager in FCA Material Engineering and additionally he is in charge of Electrics/Electronics and Multi-functional materials department in EMEA. He is the global manager of Advanced & Aesthetics Materials managing within the internal FCA Innovation Master plan on the development of novel innovative trims/solutions for different FCA projects including Alfa Romeo, Maserati, FIAT, and JEEP brands. He was involved in the development of interior trims and display materials for several FCA brands. Currently he is the reference for materials and optical assessment of display in FCA. He masters in surface and coating metrology and plastic electronics since 2009. He has international experiences in European projects as project coordinator: FP7 ICT PRIAM and scientific responsible in ICT, FOF and NMPB projects in the frame of H2020 and FP7 programs. He is inventor of more than 10 industrial patents and author of more than 10 international publications.
InMold Electronics, 3D Printed Electronics, Printed Materials, All
Materials Meets Electronics: A New Paradigm for Automotive Components
02:50pm
This work discusses one of the main future challenge in automotive materials addressing the integration of embedded electronic functionalities and sustainability.
The cars of the future will have an elegant and ergonomic design with embedded sensors, touch surfaces and biomimetic multi-coloured components. E-mobility and autonomous driving are becoming fundamental demands in vehicles but at the same time, they have to merge with sustainability introducing biomaterials and strengthening the circular economy. This implies a continuous development of current products with increase of electronics contents meeting in parallel the main issues of economy of the future: limiting the presence of hazardous chemicals, increase uptake of recycled materials and developing bio-based plastics.
Nello Li Pira
Head of Materials Labs @ FIAT Research Centre
Bio
Nello Li Pira, Dr. General Physics, University of Torino, 2000. He obtained a PhD degree at the Polytechnic of Turin in 2010. He currently works as Global Materials R&I manager in FCA Material Engineering and additionally he is in charge of Electrics/Electronics and Multi-functional materials department in EMEA. He is the global manager of Advanced & Aesthetics Materials managing within the internal FCA Innovation Master plan on the development of novel innovative trims/solutions for different FCA projects including Alfa Romeo, Maserati, FIAT, and JEEP brands. He was involved in the development of interior trims and display materials for several FCA brands. Currently he is the reference for materials and optical assessment of display in FCA. He masters in surface and coating metrology and plastic electronics since 2009. He has international experiences in European projects as project coordinator: FP7 ICT PRIAM and scientific responsible in ICT, FOF and NMPB projects in the frame of H2020 and FP7 programs. He is inventor of more than 10 industrial patents and author of more than 10 international publications.
10 March 2021
Jones Healthcare Group
Wednesday
Improving Medication Adherence with Packaging
More Details
03:10pm
James Lee
Director
This talk will discuss how an intelligent package using printed electronics can be used to improve medication adherence with patients. Those outside of the medical field are unaware of the impacts of low medication adherence, James will define medication adherence and studies performed by Jones to improve adherence among patients.
Printed Electronics, Smart Packaging, All
Improving Medication Adherence with Packaging
03:10pm
This talk will discuss how an intelligent package using printed electronics can be used to improve medication adherence with patients. Those outside of the medical field are unaware of the impacts of low medication adherence, James will define medication adherence and studies performed by Jones to improve adherence among patients.
10 March 2021
Dr. Jean Bausch GmbH
Wednesday
High-Volume of Printed Electronics: The LAB-2-FAB concept and industrial R2R printing
More Details
true
03:50pm
André Bausch
Managing Director
Roll-2-Roll production of Printed Electronics enables unprecedented throughput and breakthrough price levels. With the so-called LAB-2-FAB concept, InnovationLab provides the possibility to benefit from these advantages by a smooth transition from development of tailor-made integrated sensor systems over upscaling to an industrial production in cooperation with world market leader for printing presses Heidelberger Druckmaschinen AG.
The concept is exemplified by a medical product grade 1, the OccluSense® by Bausch. This first digital articulating paper was nothing but an idea some years ago and is now produced in millions.
Bio
Mr. André Bausch was born 1969 in Cologne
Since 1987 shareholder and marketing manager of Dr. Jean Bausch GmbH & Co. KG
Since 1998 until today Managing Partner of Dr. Jean Bausch GmbH & Co. KG
Since 2007 Director of Bausch Articulating Papers Japan K. K.
André Bausch has been awarded the "Cellerant Best of Class Technology Awards" for the newly developed OccluSense® system during the "ADA FDI World Dental Congress" in San Francisco in September 2019 .
Since 1953, the company Dr. Jean Bausch GmbH & Co. KG has been manufacturing occlusion test materials for dentistry since 1953. Bausch products are being used in more than 120 countries and sold through specialized dealers and Bausch’s subsidiaries in the United Staed, Australia, Japan, Korea and Brazil.
High-Volume of Printed Electronics: The LAB-2-FAB concept and industrial R2R printing
03:50pm
Roll-2-Roll production of Printed Electronics enables unprecedented throughput and breakthrough price levels. With the so-called LAB-2-FAB concept, InnovationLab provides the possibility to benefit from these advantages by a smooth transition from development of tailor-made integrated sensor systems over upscaling to an industrial production in cooperation with world market leader for printing presses Heidelberger Druckmaschinen AG.
The concept is exemplified by a medical product grade 1, the OccluSense® by Bausch. This first digital articulating paper was nothing but an idea some years ago and is now produced in millions.
Bio
Mr. André Bausch was born 1969 in Cologne
Since 1987 shareholder and marketing manager of Dr. Jean Bausch GmbH & Co. KG
Since 1998 until today Managing Partner of Dr. Jean Bausch GmbH & Co. KG
Since 2007 Director of Bausch Articulating Papers Japan K. K.
André Bausch has been awarded the "Cellerant Best of Class Technology Awards" for the newly developed OccluSense® system during the "ADA FDI World Dental Congress" in San Francisco in September 2019 .
Since 1953, the company Dr. Jean Bausch GmbH & Co. KG has been manufacturing occlusion test materials for dentistry since 1953. Bausch products are being used in more than 120 countries and sold through specialized dealers and Bausch’s subsidiaries in the United Staed, Australia, Japan, Korea and Brazil.
10 March 2021
InnovationLab GmbH
Wednesday
High-Volume of Printed Electronics: The LAB-2-FAB concept and industrial R2R printing
More Details
true
03:50pm
Florian Ullrich
Business Development
Roll-2-Roll production of Printed Electronics enables unprecedented throughput and breakthrough price levels. With the so-called LAB-2-FAB concept, InnovationLab provides the possibility to benefit from these advantages by a smooth transition from development of tailor-made integrated sensor systems over upscaling to an industrial production in cooperation with world market leader for printing presses Heidelberger Druckmaschinen AG.
The concept is exemplified by a medical product grade 1, the OccluSense® by Bausch. This first digital articulating paper was nothing but an idea some years ago and is now produced in millions.
R2R, All, Printed Electronics
High-Volume of Printed Electronics: The LAB-2-FAB concept and industrial R2R printing
03:50pm
Roll-2-Roll production of Printed Electronics enables unprecedented throughput and breakthrough price levels. With the so-called LAB-2-FAB concept, InnovationLab provides the possibility to benefit from these advantages by a smooth transition from development of tailor-made integrated sensor systems over upscaling to an industrial production in cooperation with world market leader for printing presses Heidelberger Druckmaschinen AG.
The concept is exemplified by a medical product grade 1, the OccluSense® by Bausch. This first digital articulating paper was nothing but an idea some years ago and is now produced in millions.
10 March 2021
Evonik
Wednesday
TAeTTOOz® Battery Materials: The Next Thin Thing
More Details
04:10pm
Carolina Gioscio
Marketing Manager
TAeTTOOz® is a new technology development from the strategic innovation unit of Evonik Operations. Based on redox-polymers, it allows for ultra-thin printed batteries that can be directly integrated into sensors and IoT devices. The new proprietary TAeTTOOz® technology enables new applications in the IoT field, promoting more accurate health monitoring, more efficient logistics and smarter infrastructure. Completely polymer-based, this new materials are environmentally benign and can be processed via printing technologies. This allows for a seamless integration of the battery into the production process, creating new dimensions of design freedom.
Carolina Gioscio
Marketing Manager Sustainable Solutions @ Evonik Creavis
Bio
As the Marketing Manager Sustainable Solutions at Creavis, the strategic innovation unit of Evonik, Carolina Gioscio brings her passion for developing strong relations to engage manufacturers and developers of IoT devices with TAeTTOOz® printable battery technology. With a MSc in Chemistry and a certificate in Business, Carolina holds over 15 years of experience in the field of specialty chemicals in different marketing and sales roles across regions in Asia, South America and Europe.
Carolina Gioscio is the Marketing Manager at the Sustainable Solutions unit of Creavis, the strategic innovation unit of Evonik, where she brings her passion for developing strong relations to engage manufacturers of IoT devices with TAeTTOOz® printable battery technology. With a MSc in Chemistry and a certificate in Business, holds over 15 years of experience in specialty chemicals in different marketing, sales and business development roles in South America, Asia and Europe.
Printed Electronics, All, Energy Storage
TAeTTOOz® Battery Materials: The Next Thin Thing
04:10pm
TAeTTOOz® is a new technology development from the strategic innovation unit of Evonik Operations. Based on redox-polymers, it allows for ultra-thin printed batteries that can be directly integrated into sensors and IoT devices. The new proprietary TAeTTOOz® technology enables new applications in the IoT field, promoting more accurate health monitoring, more efficient logistics and smarter infrastructure. Completely polymer-based, this new materials are environmentally benign and can be processed via printing technologies. This allows for a seamless integration of the battery into the production process, creating new dimensions of design freedom.
Carolina Gioscio
Marketing Manager Sustainable Solutions @ Evonik Creavis
Bio
As the Marketing Manager Sustainable Solutions at Creavis, the strategic innovation unit of Evonik, Carolina Gioscio brings her passion for developing strong relations to engage manufacturers and developers of IoT devices with TAeTTOOz® printable battery technology. With a MSc in Chemistry and a certificate in Business, Carolina holds over 15 years of experience in the field of specialty chemicals in different marketing and sales roles across regions in Asia, South America and Europe.
Carolina Gioscio is the Marketing Manager at the Sustainable Solutions unit of Creavis, the strategic innovation unit of Evonik, where she brings her passion for developing strong relations to engage manufacturers of IoT devices with TAeTTOOz® printable battery technology. With a MSc in Chemistry and a certificate in Business, holds over 15 years of experience in specialty chemicals in different marketing, sales and business development roles in South America, Asia and Europe.
10 March 2021
PolyPhotonix
Wednesday
Saving Sight With OLED Light
More Details
04:30pm
Richard Kirk
CEO
Bio
Whilst Richard had an early career as a successful artist based in France he is now known for his pioneering work in material science and bio-photonic medical research.
He has focused on biophotonic therapeutics to develop unique and novel approaches to the treatment of macular eye disease. The launch of the Noctura 400 Sleep Mask, a non-invasive and ground-breaking treatment for diabetic eye disease, has changed the paradigm of how this sight threatening disease is managed, it offers a cost-effective option for both late and early-stage prevention of this common but very serious complication of diabetes.
OLED and LED Lighting, All, Printed Materials, Printed Electronics, Advanced Displays
Saving Sight With OLED Light
04:30pm
Bio
Whilst Richard had an early career as a successful artist based in France he is now known for his pioneering work in material science and bio-photonic medical research.
He has focused on biophotonic therapeutics to develop unique and novel approaches to the treatment of macular eye disease. The launch of the Noctura 400 Sleep Mask, a non-invasive and ground-breaking treatment for diabetic eye disease, has changed the paradigm of how this sight threatening disease is managed, it offers a cost-effective option for both late and early-stage prevention of this common but very serious complication of diabetes.
10 March 2021
Saule Technologies
Wednesday
First Commercial Applications of Flexible Printed Perovskite Solar Modules
More Details
04:50pm
Dávid Forgács
Director of Knowledge Management"
Perovskite solar cell technology is fast approaching its first commercial deployment, with multiple companies working on the technology promising to offer their first products in the coming years. Conventional photovoltaic (PV) markets, such as utility scale PV, are quite rigid and very demanding for a new entrant. Perovskites offer several new value propositions, which offer monetization prospects in the near future, if properly used. In particular, functionalities such as flexibility, high specific power, and good low-light performance enable new applications and broadening of the conventional PV usage. The presentation will review the development of Saule Technologies, and demonstrate the go-to-market strategy of the company.
Perovskite, Printed Electronics, All, PV, Perovskite, Organic, CIGS, and Other Photovoltaics, Perovskite, Organic, CIGS and Other Photovoltaics
First Commercial Applications of Flexible Printed Perovskite Solar Modules
04:50pm
Perovskite solar cell technology is fast approaching its first commercial deployment, with multiple companies working on the technology promising to offer their first products in the coming years. Conventional photovoltaic (PV) markets, such as utility scale PV, are quite rigid and very demanding for a new entrant. Perovskites offer several new value propositions, which offer monetization prospects in the near future, if properly used. In particular, functionalities such as flexibility, high specific power, and good low-light performance enable new applications and broadening of the conventional PV usage. The presentation will review the development of Saule Technologies, and demonstrate the go-to-market strategy of the company.
10 March 2021
TactoTek
Wednesday
Realizing Smart Surfaces with In-Mold Electronics
More Details
05:30pm
Dave Rice
SVP Marketing
Brands increasingly use electronic functions and styling to delight their customers and reflect their design language. However, conventional electronics assemblies often come with design constraints and integration challenges that limit innovation. TactoTek develops and licenses in-mold structural electronics (IMSE™) technologies that merge mechanics and electronics into smart molded structures. IMSE parts deliver electronic functions in light, thin, 3D structures that are economically mass produced and environmentally friendly. TactoTek will introduce IMSE technology, discuss functional capabilities and key processes for making IMSE parts.
Dave Rice
SVP Marketing & Business Development @ TactoTek
Bio
Dave Rice leads marketing and product management at TactoTek®. He has built a career of transforming technology innovation into high value solutions for electronics and software markets for start-ups and mature public companies. He and his team engage prospects to identify market needs aligned with TactoTek’s in-mold structural electronics (IMSE™) technology, help focus internal technology development and collaborate with ecosystem partners for a full product solution.
InMold Electronics, 3D Printed Electronics, Printed Electronics, All
Realizing Smart Surfaces with In-Mold Electronics
05:30pm
Brands increasingly use electronic functions and styling to delight their customers and reflect their design language. However, conventional electronics assemblies often come with design constraints and integration challenges that limit innovation. TactoTek develops and licenses in-mold structural electronics (IMSE™) technologies that merge mechanics and electronics into smart molded structures. IMSE parts deliver electronic functions in light, thin, 3D structures that are economically mass produced and environmentally friendly. TactoTek will introduce IMSE technology, discuss functional capabilities and key processes for making IMSE parts.
Dave Rice
SVP Marketing & Business Development @ TactoTek
Bio
Dave Rice leads marketing and product management at TactoTek®. He has built a career of transforming technology innovation into high value solutions for electronics and software markets for start-ups and mature public companies. He and his team engage prospects to identify market needs aligned with TactoTek’s in-mold structural electronics (IMSE™) technology, help focus internal technology development and collaborate with ecosystem partners for a full product solution.
10 March 2021
Heraeus
Wednesday
Conformal EMI Shielding - Heraeus Intergrated Solution Platform
More Details
05:33pm
Franz Vollman
Head of Printed Electronics
Electromagnetic interference (EMI) is increasingly becoming a problem in design of electronic devices – especially in 5G mobile phones. Higher frequencies, reduced height and real estate in the phone and increasingly dense packaging of sensitive components causes interferences and requires new solutions.
To meet this challenge Heraeus now offers an innovative digital system solution based on a particle-free Ag-ink and inkjet printing technology. This provides excellent shielding performance, high thru-put on mass manufacturing equipment, the possibility to apply selective shielding without the need for any masking and thus the most cost effective EMI shielding solution.
Conductive Ink, Printed Electronics, All, Semiconductor Packaging, Advanced Materials
Conformal EMI Shielding - Heraeus Intergrated Solution Platform
05:33pm
Electromagnetic interference (EMI) is increasingly becoming a problem in design of electronic devices – especially in 5G mobile phones. Higher frequencies, reduced height and real estate in the phone and increasingly dense packaging of sensitive components causes interferences and requires new solutions.
To meet this challenge Heraeus now offers an innovative digital system solution based on a particle-free Ag-ink and inkjet printing technology. This provides excellent shielding performance, high thru-put on mass manufacturing equipment, the possibility to apply selective shielding without the need for any masking and thus the most cost effective EMI shielding solution.
10 March 2021
Geely
Wednesday
Challenges & Opportunities with Printed Electronics in Automotive
More Details
05:50pm
Andreas Friedrich
Chief Designer
Printed Electronics is one of the game changing technologies that will be a design enabler for future lightweight and smart solutions in many areas of Automotive. In this presentation we look at some of those, with the viewing angle of a designer and see what opportunities they might bring us and what challenges are still left to be solved.
Andreas Friedrich
Chief Designer @ Geely Design
Bio
Andreas Friedrich has a long track record in the automotive industry. He has worked with various customers, amongst others 8 years with Volvo Interior design during his 20 years with Consultancy company Semcon. Since 2013 he is part of Lynk & Co Design in Sweden where they design the Lynk & Co cars. There he has been working with Interior Design of the first car and was employed in 2016 as Chief Designer for Advanced Interior. Now he is Chief Designer for New Tech & Innovation and supports the whole GeelyDesign community of brands. As a trained Architect and Industrial Designer he has always had a big interest in New Technologies and how that can be used to enhance the user experience.
all, InMold Electronics, All
Challenges & Opportunities with Printed Electronics in Automotive
05:50pm
Printed Electronics is one of the game changing technologies that will be a design enabler for future lightweight and smart solutions in many areas of Automotive. In this presentation we look at some of those, with the viewing angle of a designer and see what opportunities they might bring us and what challenges are still left to be solved.
Andreas Friedrich
Chief Designer @ Geely Design
Bio
Andreas Friedrich has a long track record in the automotive industry. He has worked with various customers, amongst others 8 years with Volvo Interior design during his 20 years with Consultancy company Semcon. Since 2013 he is part of Lynk & Co Design in Sweden where they design the Lynk & Co cars. There he has been working with Interior Design of the first car and was employed in 2016 as Chief Designer for Advanced Interior. Now he is Chief Designer for New Tech & Innovation and supports the whole GeelyDesign community of brands. As a trained Architect and Industrial Designer he has always had a big interest in New Technologies and how that can be used to enhance the user experience.
10 March 2021
LPKF
Wednesday
Active Mold Packaging – Additive IC Packaging For mmWave Applications
More Details
05:50pm
Florian Roick
Business Development Manager
This presentation investigates the capabilities of Active Mold Packaging towards mmWave application. First the dielectric properties of three different AMP-EMCs are measured in the D-band. Second, the reflection coefficient S11, as well as the H- and E-plane radiation patterns are determined for a set of AMP manufactured 60 GHz bow-tie slot and dual dipole antennas. Where the measured results are compared to the design values and differences are discussed. And third, the D-band EMI shielding effectiveness of the electroless plated Cu/Ni/Au layer on the surface of three different AMP-EMCs is measured.
Florian Roick
Business Development Manager Active Mold Packaging @ LPKF
Bio
M. Sc. Florian Roick, Business Development Manager Active Mold Packaging. Born in 1981. He holds a degree as Bachelor of Science in Applied Physics from Dublin Institute of Technology. And a degree as Master of Science in Electrical Engineering with focus on laser systems, laser physics and microsystems engineering from Hochschule Bremen.
Since 2006 employed at LPKF Laser & Electronics AG, until 2008 as application engineer for the StencilLaser business unit. Between 2008 and 2019 strategic product manager responsible for aligning the product portfolio with the needs and requirements of the PCB and SMT markets.
Since 2019 Business Development Manager for LPKF’s Active Mold Packaging technology. That is to electrically functionalize the real-estate of the epoxy mold compound on the base of LPKF’s patented Laser Direct Structuring (LDS) technology. Co-inventor of the parametric stick-in and co-author of a variety of publications.
3D Printed Electronics, Printed Electronics, Conductive Ink, All, InMold Electronics, Semiconductor Packaging
Active Mold Packaging – Additive IC Packaging For mmWave Applications
05:50pm
This presentation investigates the capabilities of Active Mold Packaging towards mmWave application. First the dielectric properties of three different AMP-EMCs are measured in the D-band. Second, the reflection coefficient S11, as well as the H- and E-plane radiation patterns are determined for a set of AMP manufactured 60 GHz bow-tie slot and dual dipole antennas. Where the measured results are compared to the design values and differences are discussed. And third, the D-band EMI shielding effectiveness of the electroless plated Cu/Ni/Au layer on the surface of three different AMP-EMCs is measured.
Florian Roick
Business Development Manager Active Mold Packaging @ LPKF
Bio
M. Sc. Florian Roick, Business Development Manager Active Mold Packaging. Born in 1981. He holds a degree as Bachelor of Science in Applied Physics from Dublin Institute of Technology. And a degree as Master of Science in Electrical Engineering with focus on laser systems, laser physics and microsystems engineering from Hochschule Bremen.
Since 2006 employed at LPKF Laser & Electronics AG, until 2008 as application engineer for the StencilLaser business unit. Between 2008 and 2019 strategic product manager responsible for aligning the product portfolio with the needs and requirements of the PCB and SMT markets.
Since 2019 Business Development Manager for LPKF’s Active Mold Packaging technology. That is to electrically functionalize the real-estate of the epoxy mold compound on the base of LPKF’s patented Laser Direct Structuring (LDS) technology. Co-inventor of the parametric stick-in and co-author of a variety of publications.
10 March 2021
Lightworks
Wednesday
Technical & Styling Approaches For Intelligent Surface Illumination
More Details
06:10pm
Mathias Rönnfeldt
Technical Director
Current light system development is much more than the sum of the right light source, the material setup and light output. Together with our customers Lightworks GmbH is creating more and more user-oriented lighting experiences. Main focus is the seamless combination of innovative lighting technologies like IMSE as well as advanced surfaces, materials and processes out of our network. This approach allows maximum design freedom during concept and series development for our customers and their clients.
all, InMold Electronics
Technical & Styling Approaches For Intelligent Surface Illumination
06:10pm
Current light system development is much more than the sum of the right light source, the material setup and light output. Together with our customers Lightworks GmbH is creating more and more user-oriented lighting experiences. Main focus is the seamless combination of innovative lighting technologies like IMSE as well as advanced surfaces, materials and processes out of our network. This approach allows maximum design freedom during concept and series development for our customers and their clients.
10 March 2021
Optomec
Wednesday
Printed Interconnects & RF Devices for High Frequency Applications
More Details
06:10pm
Bryan Germann
Product Manager
Microwave & RF devices generally are not small, cheap or lightweight. Printed electronics has an opportunity to change this stigma, enabling the creation of smaller, lower mass, cheaper and in some cases higher performance devices than current manufacturing methodologies. Enabling unique & even mainstream applications in field of defense, automotive and even consumer grade electronic devices to advance. Optomec’s Bryan Germann will share details of device geometries, characterized performance as well as materials information and reliability data in order to showcase the success of using Optomec’s Aerosol Jet printed electronics platform for developing all manner of RF devices and structures for real world applications. Primary applications will include printed 3D RF microwave circuit elements, 3D & 2.5DIC chip interconnect methodologies, even some 3D conformal, multi-layered circuitry over complex surfaces for Optomec customers.
Bryan Germann
Product Manager @ Optomec
Bio
Optomec’s Aerosol Jet technology has a unique solution to enable panel front to backside connections without glass vias or vacuum processes. Aerosol Jet’s ability to print at high resolution, down to 10 μm, and at a high aspect ratio, as high as 5mm from the substrate regardless of topology, make it the ideal solution for both manufacturing and repair of metallization on glass edges. Demonstration of high speed, high density printing of connections from the front side of a panel to the backside will be shown along with repair of existing metallization created by other methods.
3D Printed Electronics, Printed Electronics, All, Electronic Packaging, InMold Electronics
Printed Interconnects & RF Devices for High Frequency Applications
06:10pm
Microwave & RF devices generally are not small, cheap or lightweight. Printed electronics has an opportunity to change this stigma, enabling the creation of smaller, lower mass, cheaper and in some cases higher performance devices than current manufacturing methodologies. Enabling unique & even mainstream applications in field of defense, automotive and even consumer grade electronic devices to advance. Optomec’s Bryan Germann will share details of device geometries, characterized performance as well as materials information and reliability data in order to showcase the success of using Optomec’s Aerosol Jet printed electronics platform for developing all manner of RF devices and structures for real world applications. Primary applications will include printed 3D RF microwave circuit elements, 3D & 2.5DIC chip interconnect methodologies, even some 3D conformal, multi-layered circuitry over complex surfaces for Optomec customers.
Bryan Germann
Product Manager @ Optomec
Bio
Optomec’s Aerosol Jet technology has a unique solution to enable panel front to backside connections without glass vias or vacuum processes. Aerosol Jet’s ability to print at high resolution, down to 10 μm, and at a high aspect ratio, as high as 5mm from the substrate regardless of topology, make it the ideal solution for both manufacturing and repair of metallization on glass edges. Demonstration of high speed, high density printing of connections from the front side of a panel to the backside will be shown along with repair of existing metallization created by other methods.
10 March 2021
Covestro
Wednesday
Exposing The Anatomy Of Functional Surfaces
More Details
06:30pm
John Skabardonis
Technical Marketing
Driven by the desire for ever more compact and sophisticated devices, increasing demands for improved functionality and for more customization options, OEMs are turning to functional integration. Thin, three-dimensional parts which were previously simply thought of as covers, or “skins” can now incorporate diverse functionality. This presentation will explore different means of achieving the above goals through the use of materials from Covestro.
John Skabardonis
High-Tech Materials for Electronics @ Covestro
Bio
John Skabardonis is a Chemist-turned-Marketer-Communicator in the Polycarbonates business unit at Covestro, LLC. He is responsible for technical marketing for electronics, electrical and appliances in the Americas region. John is fascinated by the rapid evolution of technology and is focused on materials and techniques which enable this evolution. He is also intensely interested in social media as a means of helping make information easily accessible. John received a Ph.D. in Physical/Organic Chemistry from Case Western Reserve University. He is a design advocate & a member of the Industrial Designers Society of America, a Distinguished Toastmaster and a chairholder in the Color Marketing Group.
all, InMold Electronics
Exposing The Anatomy Of Functional Surfaces
06:30pm
Driven by the desire for ever more compact and sophisticated devices, increasing demands for improved functionality and for more customization options, OEMs are turning to functional integration. Thin, three-dimensional parts which were previously simply thought of as covers, or “skins” can now incorporate diverse functionality. This presentation will explore different means of achieving the above goals through the use of materials from Covestro.
John Skabardonis
High-Tech Materials for Electronics @ Covestro
Bio
John Skabardonis is a Chemist-turned-Marketer-Communicator in the Polycarbonates business unit at Covestro, LLC. He is responsible for technical marketing for electronics, electrical and appliances in the Americas region. John is fascinated by the rapid evolution of technology and is focused on materials and techniques which enable this evolution. He is also intensely interested in social media as a means of helping make information easily accessible. John received a Ph.D. in Physical/Organic Chemistry from Case Western Reserve University. He is a design advocate & a member of the Industrial Designers Society of America, a Distinguished Toastmaster and a chairholder in the Color Marketing Group.
10 March 2021
Kuprion Inc
Wednesday
Innovative Thermal Vias: Meeting the Power Dissipation and Thermal Management Needs of Today’s Advanced High Performance Systems
More Details
06:30pm
Alfred Zinn
President
In today’s market, electronic systems have become ever more complex while current design methods for PCBs are limiting and inadequate. New approaches are needed to meet reliability demands for increased power dissipation and thermal management of advanced high performance systems. In this presentation, Kuprion, a spinout of Lockheed Martin, will not only detail these challenges, but demonstrate how new, innovative technologies like Active Cu (ActiveCopper™) filled thermal vias are addressing the requirements for more robust interconnect structures to enable thinner, cooler, more compact and reliable operating devices.
Printed Materials, Conductive Ink, Printed Electronics, Novel Inks, All, Advanced Materials, Semiconductor Packaging
Innovative Thermal Vias: Meeting the Power Dissipation and Thermal Management Needs of Today’s Advanced High Performance Systems
06:30pm
In today’s market, electronic systems have become ever more complex while current design methods for PCBs are limiting and inadequate. New approaches are needed to meet reliability demands for increased power dissipation and thermal management of advanced high performance systems. In this presentation, Kuprion, a spinout of Lockheed Martin, will not only detail these challenges, but demonstrate how new, innovative technologies like Active Cu (ActiveCopper™) filled thermal vias are addressing the requirements for more robust interconnect structures to enable thinner, cooler, more compact and reliable operating devices.
10 March 2021
Arburg
Wednesday
Automated IMSE Mass Production
More Details
06:50pm
Annika Müller
Application Engineering
Nowadays, finishing and functionalisation of the surface of high-quality plastic parts is a crucial topic and has a big influence on the industry.
To achieve this in a economically efficient and standardised manner, it is important to combine all the necessary steps in the perfect way.
In this presentation, we will have a look at each of these steps and how they are connected in a fully-automated production cell.
In the end, the plastic part is made out of a printed and functionalized foil – ready to use.
Video https://www.youtube.com/watch?v=azzLwrlO4vU
all, InMold Electronics
Automated IMSE Mass Production
06:50pm
Nowadays, finishing and functionalisation of the surface of high-quality plastic parts is a crucial topic and has a big influence on the industry.
To achieve this in a economically efficient and standardised manner, it is important to combine all the necessary steps in the perfect way.
In this presentation, we will have a look at each of these steps and how they are connected in a fully-automated production cell.
In the end, the plastic part is made out of a printed and functionalized foil – ready to use.
Video https://www.youtube.com/watch?v=azzLwrlO4vU
10 March 2021
Canatu
Wednesday
CNB Film Heaters for ADAS Sensors to Enable Any-Weather Safe Autonomous Driving
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07:10pm
Mari Makkonen
Marketing Director
The presentation focuses on CNB film heaters for ADAS camera and LiDAR sensors, covering ADAS market evolution, constraints to ADAS uptake, side effects of fair weather on LiDAR and camera systems, challenges associated with the conventional heating wires and the limitations can be overcome to improve safety and reliability. During the presentation, optical test results and integration possibilities will also be shared.
CNB heaters help vehicles “see” better and provide clear field of vision for ADAS systems to operate. These wire-free film heaters provide even heating and low optical distortion enabling accurate object detection. They can be 3D formed and either laminated or injection molded to provide a robust structure. Join our session to learn more!
Mari Makkonen
Marketing Director @ Canatu Oy
Bio
Marketing Director of Canatu, a carbon nanomaterial company, with extensive experience in global B2B technology marketing from nanomaterial, health tech, fire suppression and IT industries. Extensive experience in global B2B technology marketing from nanomaterial, health tech, fire suppression and IT industries.
Transparent Conduct, InMold Electronics, Carbon Nanotubes, Heaters, All, Printed Electronics, Advanced Materials
CNB Film Heaters for ADAS Sensors to Enable Any-Weather Safe Autonomous Driving
07:10pm
The presentation focuses on CNB film heaters for ADAS camera and LiDAR sensors, covering ADAS market evolution, constraints to ADAS uptake, side effects of fair weather on LiDAR and camera systems, challenges associated with the conventional heating wires and the limitations can be overcome to improve safety and reliability. During the presentation, optical test results and integration possibilities will also be shared.
CNB heaters help vehicles “see” better and provide clear field of vision for ADAS systems to operate. These wire-free film heaters provide even heating and low optical distortion enabling accurate object detection. They can be 3D formed and either laminated or injection molded to provide a robust structure. Join our session to learn more!
Mari Makkonen
Marketing Director @ Canatu Oy
Bio
Marketing Director of Canatu, a carbon nanomaterial company, with extensive experience in global B2B technology marketing from nanomaterial, health tech, fire suppression and IT industries. Extensive experience in global B2B technology marketing from nanomaterial, health tech, fire suppression and IT industries.
10 March 2021
NovaCentrix
Wednesday
Innovation in a Pandemic
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07:10pm
Stan Farnsworth
Chief Marketing Officer
Even with the challenges of the past year, innovation has moved forward. Stan will take a look at how a few of the key tech trends have fared in the past year, such as 5G, AI, and IoT. He will also connect those to the printed and flexible electronics space, and why we should pay attention to those universal trends. Finally, he will touch on his own experiences with innovation at NovaCentrix, and consider aspects of sustaining innovation versus true disruption.
All, Printed Electronics, Flexible Hybrid Electro
Innovation in a Pandemic
07:10pm
Even with the challenges of the past year, innovation has moved forward. Stan will take a look at how a few of the key tech trends have fared in the past year, such as 5G, AI, and IoT. He will also connect those to the printed and flexible electronics space, and why we should pay attention to those universal trends. Finally, he will touch on his own experiences with innovation at NovaCentrix, and consider aspects of sustaining innovation versus true disruption.
11 March 2021
SWAROVSKI
Thursday
Reinventing the Wheel? Printing (R)Evolution For A Luxury Brand
More Details
02:10pm
Rafael Michalczuk
Senior Technology & Funding Manager
Swarovski is innovating since decades in the additive manufacturing domain and printing technologies form an important puzzle piece in the manufacturing processes. But is it now time to reinvent Gutenberg´s invention? As proof-of-concept Swarovski will showcase in the talk different innovations – ranging from additive manufacturing in jewelry, 3D glass printing to 2D/3D printed electronics applications and nano-imprint lithography in various application areas for the luxury brand.
Rafael Michalczuk
Senior Technology & Funding Manager @ SWAROVSKI
Bio
Rafael Michalczuk, Senior Technology & Funding Manager at Swarovski, is supporting research, development and innovation projects within interdisciplinary and cross-functional teams at Swarovski, especially with key enabling technologies involved (e.g. additive manufacturing, printed electronics, artificial intelligence, robotics). Additionally he is founder of the innovation & funding consulting agency InnoPotentials. In this capacity he serves a broad portfolio of clients (from startups, SMEs to large companies and R&D institutions) to develop innovative business ideas, secure funding and support the overall innovation journey of the customers.
Printed Electronics, All
Reinventing the Wheel? Printing (R)Evolution For A Luxury Brand
02:10pm
Swarovski is innovating since decades in the additive manufacturing domain and printing technologies form an important puzzle piece in the manufacturing processes. But is it now time to reinvent Gutenberg´s invention? As proof-of-concept Swarovski will showcase in the talk different innovations – ranging from additive manufacturing in jewelry, 3D glass printing to 2D/3D printed electronics applications and nano-imprint lithography in various application areas for the luxury brand.
Rafael Michalczuk
Senior Technology & Funding Manager @ SWAROVSKI
Bio
Rafael Michalczuk, Senior Technology & Funding Manager at Swarovski, is supporting research, development and innovation projects within interdisciplinary and cross-functional teams at Swarovski, especially with key enabling technologies involved (e.g. additive manufacturing, printed electronics, artificial intelligence, robotics). Additionally he is founder of the innovation & funding consulting agency InnoPotentials. In this capacity he serves a broad portfolio of clients (from startups, SMEs to large companies and R&D institutions) to develop innovative business ideas, secure funding and support the overall innovation journey of the customers.
11 March 2021
Movesense by Suunto Oy
Thursday
In-mold Electronics Add Context Awareness to Smart Apparel
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true
02:30pm
Kimmo Pernu
Innovation Architect
Movesense is an open sensor platform for creating new solutions to track motion, heart rate and ECG. Movesense is used for building wearable sensor concepts and for integrating sensors with apparel. To enable smooth apparel integration and to provide context information for the sensor, Movesense team of the Finnish sports watch expert Suunto worked together with TactoTek, another Finnish tech company specialized in IME, to develop a flexible connector element that includes in-molded electronics and can be applied to clothing with typical textile industry methods. The presentation describes the project background and steps in practice.
InMold Electronics, Printed Electronics
In-mold Electronics Add Context Awareness to Smart Apparel
02:30pm
Movesense is an open sensor platform for creating new solutions to track motion, heart rate and ECG. Movesense is used for building wearable sensor concepts and for integrating sensors with apparel. To enable smooth apparel integration and to provide context information for the sensor, Movesense team of the Finnish sports watch expert Suunto worked together with TactoTek, another Finnish tech company specialized in IME, to develop a flexible connector element that includes in-molded electronics and can be applied to clothing with typical textile industry methods. The presentation describes the project background and steps in practice.
11 March 2021
Movesense by Suunto Oy
Thursday
In-mold Electronics Add Context Awareness to Smart Apparel
More Details
true
02:30pm
Terho Lahtinen
Senior Manager, Future Concepts
Movesense is an open sensor platform for creating new solutions to track motion, heart rate and ECG. Movesense is used for building wearable sensor concepts and for integrating sensors with apparel. To enable smooth apparel integration and to provide context information for the sensor, Movesense team of the Finnish sports watch expert Suunto worked together with TactoTek, another Finnish tech company specialized in IME, to develop a flexible connector element that includes in-molded electronics and can be applied to clothing with typical textile industry methods. The presentation describes the project background and steps in practice.
InMold Electronics, Printed Electronics
In-mold Electronics Add Context Awareness to Smart Apparel
02:30pm
Movesense is an open sensor platform for creating new solutions to track motion, heart rate and ECG. Movesense is used for building wearable sensor concepts and for integrating sensors with apparel. To enable smooth apparel integration and to provide context information for the sensor, Movesense team of the Finnish sports watch expert Suunto worked together with TactoTek, another Finnish tech company specialized in IME, to develop a flexible connector element that includes in-molded electronics and can be applied to clothing with typical textile industry methods. The presentation describes the project background and steps in practice.
11 March 2021
Jabil
Thursday
Bringing Flexible Hybrid Electronics to the Market
More Details
02:50pm
Girish Wable
Sensior Manager, Strategic Capabilities
Bio
With a Bachelor of Science in Mechanical Engineering and a Master of Science in Industrial Engineering, Girish Wable is a technology, operations, sourcing and business solutions strategist for Jabil. With more than 25 years of global experience in electronics manufacturing, high performance coatings, material handling, automation, additive manufacturing, printed electronics and digital transformation, Girish leads up strategic business and technical initiatives for Jabil. Girish, who started as an intern with Jabil, has authored several engineering publications, received multiple patents and enjoys engaging with ecosystem partners and research institutions to further the technology. Girish regularly contributes to engineering articles, reviews technical proposals, serves as advisory board, write blogs for Jabil.com and has been a keynote speaker at multiple conferences.
Flexible Hybrid Electro, All, Printed Electronics
Bringing Flexible Hybrid Electronics to the Market
02:50pm
Bio
With a Bachelor of Science in Mechanical Engineering and a Master of Science in Industrial Engineering, Girish Wable is a technology, operations, sourcing and business solutions strategist for Jabil. With more than 25 years of global experience in electronics manufacturing, high performance coatings, material handling, automation, additive manufacturing, printed electronics and digital transformation, Girish leads up strategic business and technical initiatives for Jabil. Girish, who started as an intern with Jabil, has authored several engineering publications, received multiple patents and enjoys engaging with ecosystem partners and research institutions to further the technology. Girish regularly contributes to engineering articles, reviews technical proposals, serves as advisory board, write blogs for Jabil.com and has been a keynote speaker at multiple conferences.
11 March 2021
Information Mediary Corporation
Thursday
Real World Smart Packaging For Pharmaceuticals
More Details
03:10pm
Michael Petersen
CEO
Bio
Michael is a sought after presenter at conferences and has taught master class sessions on digital health transformation, NFC/RFID, coldchain, and printed electronics, smart packaging in Europe, Asia and North America.
Michael has co-founded and shaped IMC (Information Mediary Corp) into the world’s leading smart-package and medication adherence solutions provider.
Experience the power of convergence with our connected smart packaging and innovative, patient centric adherence solutions. Our solutions run over global health platforms to connect patients and their data directly with their care teams to assist in behavioural modification and support both AI and human clinical decisions.
www.informationmediary.com
Printed Electronics, Smart Packaging, All
Real World Smart Packaging For Pharmaceuticals
03:10pm
Bio
Michael is a sought after presenter at conferences and has taught master class sessions on digital health transformation, NFC/RFID, coldchain, and printed electronics, smart packaging in Europe, Asia and North America.
Michael has co-founded and shaped IMC (Information Mediary Corp) into the world’s leading smart-package and medication adherence solutions provider.
Experience the power of convergence with our connected smart packaging and innovative, patient centric adherence solutions. Our solutions run over global health platforms to connect patients and their data directly with their care teams to assist in behavioural modification and support both AI and human clinical decisions.
www.informationmediary.com
11 March 2021
Australian Advanced Materials (AAM)
Thursday
Nanocube Ink Nanomaterial
More Details
03:50pm
David Lim
Business Development Manager
Australian Advanced Materials (AAM) is an Australian start-up company established to develop and commercialise revolutionary materials technology being developed in Australia. AAM is a wholly owned subsidiary of Strategic Elements Ltd. AAM is currently
developing a printed memory technology for the printed/flexible electronics sector based on its Nanocube Ink technology. This presentation will cover the current status of the printed memory development by AAM.
Printed Materials, Printed Electronics, All, ul
Nanocube Ink Nanomaterial
03:50pm
Australian Advanced Materials (AAM) is an Australian start-up company established to develop and commercialise revolutionary materials technology being developed in Australia. AAM is a wholly owned subsidiary of Strategic Elements Ltd. AAM is currently
developing a printed memory technology for the printed/flexible electronics sector based on its Nanocube Ink technology. This presentation will cover the current status of the printed memory development by AAM.
11 March 2021
Fujikura Kasei
Thursday
Materials With High Magnetic Permeability For RFID And Automotive Battery Case Applications
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