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ALL PAST & FUTURE EVENTS AS WELL AS MASTERCLASSES WITH A SINGLE ANNUAL PASS

Printed, Flexible, Hybrid, & InMold Electronics

10-11 March 2021

CET

Virtual Event

Printed | Flexible | Additive | Hybrid | 3D | Structural | R2R | InMold

Leading global speakers include:
Geely
Dr. Jean Bausch GmbH
Jabil
Neotech AMT GmbH
Copprint
Canatu
FIAT Research Centre
SWAROVSKI
Jones Healthcare Group
Eastman Kodak Company
NanoDimension
Information Mediary Corporation
Optomec
JCDecaux
Movesense by Suunto Oy
Movesense by Suunto Oy
Printable Electronics Research Center China
ChemCubed
Kuprion Inc
GE Research
NovaCentrix
Fujikura Kasei
TactoTek
LPKF
Australian Advanced Materials (AAM)
Evonik
COATEMA Coating Machinery GmbH
Arburg
InnovationLab GmbH
Lightworks
PrintCB
Covestro
Heraeus
CHASM Advanced Materials
National Research Council Canada (NRCC)
Saule Technologies
PolyPhotonix
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The times below is Central European Times (CET).
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10 March 2021

JCDecaux

Wednesday

Technologies For Out-Of-Home & New Applications

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02:10pm

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Thomas Morel

R&D Director

All, Printed Electronics, Flexible Displays, Advanced Displays

Technologies For Out-Of-Home & New Applications

02:10pm

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10 March 2021

GE Research

Wednesday

Flexible Hybrid Electronics Applications for the Industrial World

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02:30pm

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Nancy Stoffel

Platform Leader for FHE at GE

This presentation overviews GE’s vision of the digital industrial challenges in manufacturing. It does this in the context of opportunities for sensors, and communication elements made using flexible hybrid electronics, for smart manufacturing, structural health monitoring, and for improved worker safety and productivity.

Nancy Stoffel
Platform Leader for FHE @ GE Research

Bio

Nancy Stoffel specializes in design and manufacturing of printed embedded systems and electronics packaging. She serves as GE’s representative on the Nextflex consortia Board of Governors and was recognized for her technical contributions by being named a Next Flex Fellow. Nancy holds a PhD in Materials Science from Cornell University. Her career has focused on materials and process development for electronics integration. During her 30+ industry career, she was Director of Microsystems Integration at STC MEMS & Technical Manager at Xerox Corp in-charge of inkjet device fluidic design, materials technology and process development for next generation product. During her time at IBM she developed new materials and process technology to create co-fired glass-ceramic multichip modules. She has been with GE Research for 9 years where her work has focused on the integration of sensors and electronics for power electronics, wearables and asset monitoring. She is active in the IEEE, and is the 2021 General Chair of the IEEE ECTC, the premier electronics packaging conference.

Flexible Hybrid Electro, All, Printed Electronics, Sensors

Flexible Hybrid Electronics Applications for the Industrial World

02:30pm

This presentation overviews GE’s vision of the digital industrial challenges in manufacturing. It does this in the context of opportunities for sensors, and communication elements made using flexible hybrid electronics, for smart manufacturing, structural health monitoring, and for improved worker safety and productivity.

Nancy Stoffel
Platform Leader for FHE @ GE Research

Bio

Nancy Stoffel specializes in design and manufacturing of printed embedded systems and electronics packaging. She serves as GE’s representative on the Nextflex consortia Board of Governors and was recognized for her technical contributions by being named a Next Flex Fellow. Nancy holds a PhD in Materials Science from Cornell University. Her career has focused on materials and process development for electronics integration. During her 30+ industry career, she was Director of Microsystems Integration at STC MEMS & Technical Manager at Xerox Corp in-charge of inkjet device fluidic design, materials technology and process development for next generation product. During her time at IBM she developed new materials and process technology to create co-fired glass-ceramic multichip modules. She has been with GE Research for 9 years where her work has focused on the integration of sensors and electronics for power electronics, wearables and asset monitoring. She is active in the IEEE, and is the 2021 General Chair of the IEEE ECTC, the premier electronics packaging conference.

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10 March 2021

FIAT Research Centre

Wednesday

Materials Meets Electronics: A New Paradigm for Automotive Components

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02:50pm

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Nello Li Pira

Head of Materials Labs

This work discusses one of the main future challenge in automotive materials addressing the integration of embedded electronic functionalities and sustainability.

The cars of the future will have an elegant and ergonomic design with embedded sensors, touch surfaces and biomimetic multi-coloured components. E-mobility and autonomous driving are becoming fundamental demands in vehicles but at the same time, they have to merge with sustainability introducing biomaterials and strengthening the circular economy. This implies a continuous development of current products with increase of electronics contents meeting in parallel the main issues of economy of the future: limiting the presence of hazardous chemicals, increase uptake of recycled materials and developing bio-based plastics.

Nello Li Pira
Head of Materials Labs @ FIAT Research Centre

Bio

Nello Li Pira, Dr. General Physics, University of Torino, 2000. He obtained a PhD degree at the Polytechnic of Turin in 2010. He currently works as Global Materials R&I manager in FCA Material Engineering and additionally he is in charge of Electrics/Electronics and Multi-functional materials department in EMEA. He is the global manager of Advanced & Aesthetics Materials managing within the internal FCA Innovation Master plan on the development of novel innovative trims/solutions for different FCA projects including Alfa Romeo, Maserati, FIAT, and JEEP brands. He was involved in the development of interior trims and display materials for several FCA brands. Currently he is the reference for materials and optical assessment of display in FCA. He masters in surface and coating metrology and plastic electronics since 2009. He has international experiences in European projects as project coordinator: FP7 ICT PRIAM and scientific responsible in ICT, FOF and NMPB projects in the frame of H2020 and FP7 programs. He is inventor of more than 10 industrial patents and author of more than 10 international publications.

InMold Electronics, 3D Printed Electronics, Printed Materials, All

Materials Meets Electronics: A New Paradigm for Automotive Components

02:50pm

This work discusses one of the main future challenge in automotive materials addressing the integration of embedded electronic functionalities and sustainability.

The cars of the future will have an elegant and ergonomic design with embedded sensors, touch surfaces and biomimetic multi-coloured components. E-mobility and autonomous driving are becoming fundamental demands in vehicles but at the same time, they have to merge with sustainability introducing biomaterials and strengthening the circular economy. This implies a continuous development of current products with increase of electronics contents meeting in parallel the main issues of economy of the future: limiting the presence of hazardous chemicals, increase uptake of recycled materials and developing bio-based plastics.

Nello Li Pira
Head of Materials Labs @ FIAT Research Centre

Bio

Nello Li Pira, Dr. General Physics, University of Torino, 2000. He obtained a PhD degree at the Polytechnic of Turin in 2010. He currently works as Global Materials R&I manager in FCA Material Engineering and additionally he is in charge of Electrics/Electronics and Multi-functional materials department in EMEA. He is the global manager of Advanced & Aesthetics Materials managing within the internal FCA Innovation Master plan on the development of novel innovative trims/solutions for different FCA projects including Alfa Romeo, Maserati, FIAT, and JEEP brands. He was involved in the development of interior trims and display materials for several FCA brands. Currently he is the reference for materials and optical assessment of display in FCA. He masters in surface and coating metrology and plastic electronics since 2009. He has international experiences in European projects as project coordinator: FP7 ICT PRIAM and scientific responsible in ICT, FOF and NMPB projects in the frame of H2020 and FP7 programs. He is inventor of more than 10 industrial patents and author of more than 10 international publications.

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10 March 2021

Jones Healthcare Group

Wednesday

Improving Medication Adherence with Packaging

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03:10pm

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James Lee

Director

This talk will discuss how an intelligent package using printed electronics can be used to improve medication adherence with patients. Those outside of the medical field are unaware of the impacts of low medication adherence, James will define medication adherence and studies performed by Jones to improve adherence among patients.

Printed Electronics, Smart Packaging, All

Improving Medication Adherence with Packaging

03:10pm

This talk will discuss how an intelligent package using printed electronics can be used to improve medication adherence with patients. Those outside of the medical field are unaware of the impacts of low medication adherence, James will define medication adherence and studies performed by Jones to improve adherence among patients.

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10 March 2021

Dr. Jean Bausch GmbH

Wednesday

High-Volume of Printed Electronics: The LAB-2-FAB concept and industrial R2R printing

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03:50pm

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André Bausch

Managing Director

Roll-2-Roll production of Printed Electronics enables unprecedented throughput and breakthrough price levels. With the so-called LAB-2-FAB concept, InnovationLab provides the possibility to benefit from these advantages by a smooth transition from development of tailor-made integrated sensor systems over upscaling to an industrial production in cooperation with world market leader for printing presses Heidelberger Druckmaschinen AG.
The concept is exemplified by a medical product grade 1, the OccluSense® by Bausch. This first digital articulating paper was nothing but an idea some years ago and is now produced in millions.

Bio

Mr. André Bausch was born 1969 in Cologne
Since 1987 shareholder and marketing manager of Dr. Jean Bausch GmbH & Co. KG
Since 1998 until today Managing Partner of Dr. Jean Bausch GmbH & Co. KG
Since 2007 Director of Bausch Articulating Papers Japan K. K.
André Bausch has been awarded the "Cellerant Best of Class Technology Awards" for the newly developed OccluSense® system during the "ADA FDI World Dental Congress" in San Francisco in September 2019 .

Since 1953, the company Dr. Jean Bausch GmbH & Co. KG has been manufacturing occlusion test materials for dentistry since 1953. Bausch products are being used in more than 120 countries and sold through specialized dealers and Bausch’s subsidiaries in the United Staed, Australia, Japan, Korea and Brazil.

High-Volume of Printed Electronics: The LAB-2-FAB concept and industrial R2R printing

03:50pm

Roll-2-Roll production of Printed Electronics enables unprecedented throughput and breakthrough price levels. With the so-called LAB-2-FAB concept, InnovationLab provides the possibility to benefit from these advantages by a smooth transition from development of tailor-made integrated sensor systems over upscaling to an industrial production in cooperation with world market leader for printing presses Heidelberger Druckmaschinen AG.
The concept is exemplified by a medical product grade 1, the OccluSense® by Bausch. This first digital articulating paper was nothing but an idea some years ago and is now produced in millions.

Bio

Mr. André Bausch was born 1969 in Cologne
Since 1987 shareholder and marketing manager of Dr. Jean Bausch GmbH & Co. KG
Since 1998 until today Managing Partner of Dr. Jean Bausch GmbH & Co. KG
Since 2007 Director of Bausch Articulating Papers Japan K. K.
André Bausch has been awarded the "Cellerant Best of Class Technology Awards" for the newly developed OccluSense® system during the "ADA FDI World Dental Congress" in San Francisco in September 2019 .

Since 1953, the company Dr. Jean Bausch GmbH & Co. KG has been manufacturing occlusion test materials for dentistry since 1953. Bausch products are being used in more than 120 countries and sold through specialized dealers and Bausch’s subsidiaries in the United Staed, Australia, Japan, Korea and Brazil.

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10 March 2021

InnovationLab GmbH

Wednesday

High-Volume of Printed Electronics: The LAB-2-FAB concept and industrial R2R printing

More Details

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03:50pm

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Florian Ullrich

Business Development

Roll-2-Roll production of Printed Electronics enables unprecedented throughput and breakthrough price levels. With the so-called LAB-2-FAB concept, InnovationLab provides the possibility to benefit from these advantages by a smooth transition from development of tailor-made integrated sensor systems over upscaling to an industrial production in cooperation with world market leader for printing presses Heidelberger Druckmaschinen AG.
The concept is exemplified by a medical product grade 1, the OccluSense® by Bausch. This first digital articulating paper was nothing but an idea some years ago and is now produced in millions.

R2R, All, Printed Electronics

High-Volume of Printed Electronics: The LAB-2-FAB concept and industrial R2R printing

03:50pm

Roll-2-Roll production of Printed Electronics enables unprecedented throughput and breakthrough price levels. With the so-called LAB-2-FAB concept, InnovationLab provides the possibility to benefit from these advantages by a smooth transition from development of tailor-made integrated sensor systems over upscaling to an industrial production in cooperation with world market leader for printing presses Heidelberger Druckmaschinen AG.
The concept is exemplified by a medical product grade 1, the OccluSense® by Bausch. This first digital articulating paper was nothing but an idea some years ago and is now produced in millions.

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10 March 2021

Evonik

Wednesday

TAeTTOOz® Battery Materials: The Next Thin Thing

More Details

04:10pm

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Carolina Gioscio

Marketing Manager

TAeTTOOz® is a new technology development from the strategic innovation unit of Evonik Operations. Based on redox-polymers, it allows for ultra-thin printed batteries that can be directly integrated into sensors and IoT devices. The new proprietary TAeTTOOz® technology enables new applications in the IoT field, promoting more accurate health monitoring, more efficient logistics and smarter infrastructure. Completely polymer-based, this new materials are environmentally benign and can be processed via printing technologies. This allows for a seamless integration of the battery into the production process, creating new dimensions of design freedom.

Carolina Gioscio
Marketing Manager Sustainable Solutions @ Evonik Creavis

Bio

As the Marketing Manager Sustainable Solutions at Creavis, the strategic innovation unit of Evonik, Carolina Gioscio brings her passion for developing strong relations to engage manufacturers and developers of IoT devices with TAeTTOOz® printable battery technology. With a MSc in Chemistry and a certificate in Business, Carolina holds over 15 years of experience in the field of specialty chemicals in different marketing and sales roles across regions in Asia, South America and Europe.

Carolina Gioscio is the Marketing Manager at the Sustainable Solutions unit of Creavis, the strategic innovation unit of Evonik, where she brings her passion for developing strong relations to engage manufacturers of IoT devices with TAeTTOOz® printable battery technology. With a MSc in Chemistry and a certificate in Business, holds over 15 years of experience in specialty chemicals in different marketing, sales and business development roles in South America, Asia and Europe.

Printed Electronics, All, Energy Storage

TAeTTOOz® Battery Materials: The Next Thin Thing

04:10pm

TAeTTOOz® is a new technology development from the strategic innovation unit of Evonik Operations. Based on redox-polymers, it allows for ultra-thin printed batteries that can be directly integrated into sensors and IoT devices. The new proprietary TAeTTOOz® technology enables new applications in the IoT field, promoting more accurate health monitoring, more efficient logistics and smarter infrastructure. Completely polymer-based, this new materials are environmentally benign and can be processed via printing technologies. This allows for a seamless integration of the battery into the production process, creating new dimensions of design freedom.

Carolina Gioscio
Marketing Manager Sustainable Solutions @ Evonik Creavis

Bio

As the Marketing Manager Sustainable Solutions at Creavis, the strategic innovation unit of Evonik, Carolina Gioscio brings her passion for developing strong relations to engage manufacturers and developers of IoT devices with TAeTTOOz® printable battery technology. With a MSc in Chemistry and a certificate in Business, Carolina holds over 15 years of experience in the field of specialty chemicals in different marketing and sales roles across regions in Asia, South America and Europe.

Carolina Gioscio is the Marketing Manager at the Sustainable Solutions unit of Creavis, the strategic innovation unit of Evonik, where she brings her passion for developing strong relations to engage manufacturers of IoT devices with TAeTTOOz® printable battery technology. With a MSc in Chemistry and a certificate in Business, holds over 15 years of experience in specialty chemicals in different marketing, sales and business development roles in South America, Asia and Europe.

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10 March 2021

PolyPhotonix

Wednesday

Saving Sight With OLED Light

More Details

04:30pm

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Richard Kirk

CEO

Bio

Whilst Richard had an early career as a successful artist based in France he is now known for his pioneering work in material science and bio-photonic medical research.
He has focused on biophotonic therapeutics to develop unique and novel approaches to the treatment of macular eye disease. The launch of the Noctura 400 Sleep Mask, a non-invasive and ground-breaking treatment for diabetic eye disease, has changed the paradigm of how this sight threatening disease is managed, it offers a cost-effective option for both late and early-stage prevention of this common but very serious complication of diabetes.

OLED and LED Lighting, All, Printed Materials, Printed Electronics, Advanced Displays

Saving Sight With OLED Light

04:30pm

Bio

Whilst Richard had an early career as a successful artist based in France he is now known for his pioneering work in material science and bio-photonic medical research.
He has focused on biophotonic therapeutics to develop unique and novel approaches to the treatment of macular eye disease. The launch of the Noctura 400 Sleep Mask, a non-invasive and ground-breaking treatment for diabetic eye disease, has changed the paradigm of how this sight threatening disease is managed, it offers a cost-effective option for both late and early-stage prevention of this common but very serious complication of diabetes.

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10 March 2021

Saule Technologies

Wednesday

First Commercial Applications of Flexible Printed Perovskite Solar Modules

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04:50pm

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Dávid Forgács

Director of Knowledge Management"

Perovskite solar cell technology is fast approaching its first commercial deployment, with multiple companies working on the technology promising to offer their first products in the coming years. Conventional photovoltaic (PV) markets, such as utility scale PV, are quite rigid and very demanding for a new entrant. Perovskites offer several new value propositions, which offer monetization prospects in the near future, if properly used. In particular, functionalities such as flexibility, high specific power, and good low-light performance enable new applications and broadening of the conventional PV usage. The presentation will review the development of Saule Technologies, and demonstrate the go-to-market strategy of the company.

Perovskite, Printed Electronics, All, PV, Perovskite, Organic, CIGS, and Other Photovoltaics, Perovskite, Organic, CIGS and Other Photovoltaics

First Commercial Applications of Flexible Printed Perovskite Solar Modules

04:50pm

Perovskite solar cell technology is fast approaching its first commercial deployment, with multiple companies working on the technology promising to offer their first products in the coming years. Conventional photovoltaic (PV) markets, such as utility scale PV, are quite rigid and very demanding for a new entrant. Perovskites offer several new value propositions, which offer monetization prospects in the near future, if properly used. In particular, functionalities such as flexibility, high specific power, and good low-light performance enable new applications and broadening of the conventional PV usage. The presentation will review the development of Saule Technologies, and demonstrate the go-to-market strategy of the company.

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10 March 2021

TactoTek

Wednesday

Realizing Smart Surfaces with In-Mold Electronics

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05:30pm

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Dave Rice

SVP Marketing

Brands increasingly use electronic functions and styling to delight their customers and reflect their design language. However, conventional electronics assemblies often come with design constraints and integration challenges that limit innovation. TactoTek develops and licenses in-mold structural electronics (IMSE™) technologies that merge mechanics and electronics into smart molded structures. IMSE parts deliver electronic functions in light, thin, 3D structures that are economically mass produced and environmentally friendly. TactoTek will introduce IMSE technology, discuss functional capabilities and key processes for making IMSE parts.

Dave Rice
SVP Marketing & Business Development @ TactoTek

Bio

Dave Rice leads marketing and product management at TactoTek®. He has built a career of transforming technology innovation into high value solutions for electronics and software markets for start-ups and mature public companies. He and his team engage prospects to identify market needs aligned with TactoTek’s in-mold structural electronics (IMSE™) technology, help focus internal technology development and collaborate with ecosystem partners for a full product solution.

InMold Electronics, 3D Printed Electronics, Printed Electronics, All

Realizing Smart Surfaces with In-Mold Electronics

05:30pm

Brands increasingly use electronic functions and styling to delight their customers and reflect their design language. However, conventional electronics assemblies often come with design constraints and integration challenges that limit innovation. TactoTek develops and licenses in-mold structural electronics (IMSE™) technologies that merge mechanics and electronics into smart molded structures. IMSE parts deliver electronic functions in light, thin, 3D structures that are economically mass produced and environmentally friendly. TactoTek will introduce IMSE technology, discuss functional capabilities and key processes for making IMSE parts.

Dave Rice
SVP Marketing & Business Development @ TactoTek

Bio

Dave Rice leads marketing and product management at TactoTek®. He has built a career of transforming technology innovation into high value solutions for electronics and software markets for start-ups and mature public companies. He and his team engage prospects to identify market needs aligned with TactoTek’s in-mold structural electronics (IMSE™) technology, help focus internal technology development and collaborate with ecosystem partners for a full product solution.

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10 March 2021

Heraeus

Wednesday

Conformal EMI Shielding - Heraeus Intergrated Solution Platform

More Details

05:33pm

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Franz Vollman

Head of Printed Electronics

Electromagnetic interference (EMI) is increasingly becoming a problem in design of electronic devices – especially in 5G mobile phones. Higher frequencies, reduced height and real estate in the phone and increasingly dense packaging of sensitive components causes interferences and requires new solutions.
To meet this challenge Heraeus now offers an innovative digital system solution based on a particle-free Ag-ink and inkjet printing technology. This provides excellent shielding performance, high thru-put on mass manufacturing equipment, the possibility to apply selective shielding without the need for any masking and thus the most cost effective EMI shielding solution.

Conductive Ink, Printed Electronics, All, Semiconductor Packaging, Advanced Materials

Conformal EMI Shielding - Heraeus Intergrated Solution Platform

05:33pm

Electromagnetic interference (EMI) is increasingly becoming a problem in design of electronic devices – especially in 5G mobile phones. Higher frequencies, reduced height and real estate in the phone and increasingly dense packaging of sensitive components causes interferences and requires new solutions.
To meet this challenge Heraeus now offers an innovative digital system solution based on a particle-free Ag-ink and inkjet printing technology. This provides excellent shielding performance, high thru-put on mass manufacturing equipment, the possibility to apply selective shielding without the need for any masking and thus the most cost effective EMI shielding solution.

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10 March 2021

Geely

Wednesday

Challenges & Opportunities with Printed Electronics in Automotive

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05:50pm

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Andreas Friedrich

Chief Designer

Printed Electronics is one of the game changing technologies that will be a design enabler for future lightweight and smart solutions in many areas of Automotive. In this presentation we look at some of those, with the viewing angle of a designer and see what opportunities they might bring us and what challenges are still left to be solved.

Andreas Friedrich
Chief Designer @ Geely Design
Bio

Andreas Friedrich has a long track record in the automotive industry. He has worked with various customers, amongst others 8 years with Volvo Interior design during his 20 years with Consultancy company Semcon. Since 2013 he is part of Lynk & Co Design in Sweden where they design the Lynk & Co cars. There he has been working with Interior Design of the first car and was employed in 2016 as Chief Designer for Advanced Interior. Now he is Chief Designer for New Tech & Innovation and supports the whole GeelyDesign community of brands. As a trained Architect and Industrial Designer he has always had a big interest in New Technologies and how that can be used to enhance the user experience.

all, InMold Electronics, All

Challenges & Opportunities with Printed Electronics in Automotive

05:50pm

Printed Electronics is one of the game changing technologies that will be a design enabler for future lightweight and smart solutions in many areas of Automotive. In this presentation we look at some of those, with the viewing angle of a designer and see what opportunities they might bring us and what challenges are still left to be solved.

Andreas Friedrich
Chief Designer @ Geely Design
Bio

Andreas Friedrich has a long track record in the automotive industry. He has worked with various customers, amongst others 8 years with Volvo Interior design during his 20 years with Consultancy company Semcon. Since 2013 he is part of Lynk & Co Design in Sweden where they design the Lynk & Co cars. There he has been working with Interior Design of the first car and was employed in 2016 as Chief Designer for Advanced Interior. Now he is Chief Designer for New Tech & Innovation and supports the whole GeelyDesign community of brands. As a trained Architect and Industrial Designer he has always had a big interest in New Technologies and how that can be used to enhance the user experience.

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10 March 2021

LPKF

Wednesday

Active Mold Packaging – Additive IC Packaging For mmWave Applications

More Details

05:50pm

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Florian Roick

Business Development Manager

This presentation investigates the capabilities of Active Mold Packaging towards mmWave application. First the dielectric properties of three different AMP-EMCs are measured in the D-band. Second, the reflection coefficient S11, as well as the H- and E-plane radiation patterns are determined for a set of AMP manufactured 60 GHz bow-tie slot and dual dipole antennas. Where the measured results are compared to the design values and differences are discussed. And third, the D-band EMI shielding effectiveness of the electroless plated Cu/Ni/Au layer on the surface of three different AMP-EMCs is measured.

Florian Roick
Business Development Manager Active Mold Packaging @ LPKF

Bio

M. Sc. Florian Roick, Business Development Manager Active Mold Packaging. Born in 1981. He holds a degree as Bachelor of Science in Applied Physics from Dublin Institute of Technology. And a degree as Master of Science in Electrical Engineering with focus on laser systems, laser physics and microsystems engineering from Hochschule Bremen.
Since 2006 employed at LPKF Laser & Electronics AG, until 2008 as application engineer for the StencilLaser business unit. Between 2008 and 2019 strategic product manager responsible for aligning the product portfolio with the needs and requirements of the PCB and SMT markets.
Since 2019 Business Development Manager for LPKF’s Active Mold Packaging technology. That is to electrically functionalize the real-estate of the epoxy mold compound on the base of LPKF’s patented Laser Direct Structuring (LDS) technology. Co-inventor of the parametric stick-in and co-author of a variety of publications.

3D Printed Electronics, Printed Electronics, Conductive Ink, All, InMold Electronics, Semiconductor Packaging

Active Mold Packaging – Additive IC Packaging For mmWave Applications

05:50pm

This presentation investigates the capabilities of Active Mold Packaging towards mmWave application. First the dielectric properties of three different AMP-EMCs are measured in the D-band. Second, the reflection coefficient S11, as well as the H- and E-plane radiation patterns are determined for a set of AMP manufactured 60 GHz bow-tie slot and dual dipole antennas. Where the measured results are compared to the design values and differences are discussed. And third, the D-band EMI shielding effectiveness of the electroless plated Cu/Ni/Au layer on the surface of three different AMP-EMCs is measured.

Florian Roick
Business Development Manager Active Mold Packaging @ LPKF

Bio

M. Sc. Florian Roick, Business Development Manager Active Mold Packaging. Born in 1981. He holds a degree as Bachelor of Science in Applied Physics from Dublin Institute of Technology. And a degree as Master of Science in Electrical Engineering with focus on laser systems, laser physics and microsystems engineering from Hochschule Bremen.
Since 2006 employed at LPKF Laser & Electronics AG, until 2008 as application engineer for the StencilLaser business unit. Between 2008 and 2019 strategic product manager responsible for aligning the product portfolio with the needs and requirements of the PCB and SMT markets.
Since 2019 Business Development Manager for LPKF’s Active Mold Packaging technology. That is to electrically functionalize the real-estate of the epoxy mold compound on the base of LPKF’s patented Laser Direct Structuring (LDS) technology. Co-inventor of the parametric stick-in and co-author of a variety of publications.

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10 March 2021

Lightworks

Wednesday

Technical & Styling Approaches For Intelligent Surface Illumination

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06:10pm

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Mathias Rönnfeldt

Technical Director

Current light system development is much more than the sum of the right light source, the material setup and light output. Together with our customers Lightworks GmbH is creating more and more user-oriented lighting experiences. Main focus is the seamless combination of innovative lighting technologies like IMSE as well as advanced surfaces, materials and processes out of our network. This approach allows maximum design freedom during concept and series development for our customers and their clients.

all, InMold Electronics

Technical & Styling Approaches For Intelligent Surface Illumination

06:10pm

Current light system development is much more than the sum of the right light source, the material setup and light output. Together with our customers Lightworks GmbH is creating more and more user-oriented lighting experiences. Main focus is the seamless combination of innovative lighting technologies like IMSE as well as advanced surfaces, materials and processes out of our network. This approach allows maximum design freedom during concept and series development for our customers and their clients.

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10 March 2021

Optomec

Wednesday

Printed Interconnects & RF Devices for High Frequency Applications

More Details

06:10pm

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Bryan Germann

Product Manager

Microwave & RF devices generally are not small, cheap or lightweight. Printed electronics has an opportunity to change this stigma, enabling the creation of smaller, lower mass, cheaper and in some cases higher performance devices than current manufacturing methodologies. Enabling unique & even mainstream applications in field of defense, automotive and even consumer grade electronic devices to advance. Optomec’s Bryan Germann will share details of device geometries, characterized performance as well as materials information and reliability data in order to showcase the success of using Optomec’s Aerosol Jet printed electronics platform for developing all manner of RF devices and structures for real world applications. Primary applications will include printed 3D RF microwave circuit elements, 3D & 2.5DIC chip interconnect methodologies, even some 3D conformal, multi-layered circuitry over complex surfaces for Optomec customers.

Bryan Germann
Product Manager @ Optomec

Bio

Optomec’s Aerosol Jet technology has a unique solution to enable panel front to backside connections without glass vias or vacuum processes. Aerosol Jet’s ability to print at high resolution, down to 10 μm, and at a high aspect ratio, as high as 5mm from the substrate regardless of topology, make it the ideal solution for both manufacturing and repair of metallization on glass edges. Demonstration of high speed, high density printing of connections from the front side of a panel to the backside will be shown along with repair of existing metallization created by other methods.

3D Printed Electronics, Printed Electronics, All, Electronic Packaging, InMold Electronics

Printed Interconnects & RF Devices for High Frequency Applications

06:10pm

Microwave & RF devices generally are not small, cheap or lightweight. Printed electronics has an opportunity to change this stigma, enabling the creation of smaller, lower mass, cheaper and in some cases higher performance devices than current manufacturing methodologies. Enabling unique & even mainstream applications in field of defense, automotive and even consumer grade electronic devices to advance. Optomec’s Bryan Germann will share details of device geometries, characterized performance as well as materials information and reliability data in order to showcase the success of using Optomec’s Aerosol Jet printed electronics platform for developing all manner of RF devices and structures for real world applications. Primary applications will include printed 3D RF microwave circuit elements, 3D & 2.5DIC chip interconnect methodologies, even some 3D conformal, multi-layered circuitry over complex surfaces for Optomec customers.

Bryan Germann
Product Manager @ Optomec

Bio

Optomec’s Aerosol Jet technology has a unique solution to enable panel front to backside connections without glass vias or vacuum processes. Aerosol Jet’s ability to print at high resolution, down to 10 μm, and at a high aspect ratio, as high as 5mm from the substrate regardless of topology, make it the ideal solution for both manufacturing and repair of metallization on glass edges. Demonstration of high speed, high density printing of connections from the front side of a panel to the backside will be shown along with repair of existing metallization created by other methods.

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10 March 2021

Covestro

Wednesday

Exposing The Anatomy Of Functional Surfaces

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06:30pm

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John Skabardonis

Technical Marketing

Driven by the desire for ever more compact and sophisticated devices, increasing demands for improved functionality and for more customization options, OEMs are turning to functional integration. Thin, three-dimensional parts which were previously simply thought of as covers, or “skins” can now incorporate diverse functionality. This presentation will explore different means of achieving the above goals through the use of materials from Covestro.

John Skabardonis
High-Tech Materials for Electronics @ Covestro

Bio

John Skabardonis is a Chemist-turned-Marketer-Communicator in the Polycarbonates business unit at Covestro, LLC. He is responsible for technical marketing for electronics, electrical and appliances in the Americas region. John is fascinated by the rapid evolution of technology and is focused on materials and techniques which enable this evolution. He is also intensely interested in social media as a means of helping make information easily accessible. John received a Ph.D. in Physical/Organic Chemistry from Case Western Reserve University. He is a design advocate & a member of the Industrial Designers Society of America, a Distinguished Toastmaster and a chairholder in the Color Marketing Group.

all, InMold Electronics

Exposing The Anatomy Of Functional Surfaces

06:30pm

Driven by the desire for ever more compact and sophisticated devices, increasing demands for improved functionality and for more customization options, OEMs are turning to functional integration. Thin, three-dimensional parts which were previously simply thought of as covers, or “skins” can now incorporate diverse functionality. This presentation will explore different means of achieving the above goals through the use of materials from Covestro.

John Skabardonis
High-Tech Materials for Electronics @ Covestro

Bio

John Skabardonis is a Chemist-turned-Marketer-Communicator in the Polycarbonates business unit at Covestro, LLC. He is responsible for technical marketing for electronics, electrical and appliances in the Americas region. John is fascinated by the rapid evolution of technology and is focused on materials and techniques which enable this evolution. He is also intensely interested in social media as a means of helping make information easily accessible. John received a Ph.D. in Physical/Organic Chemistry from Case Western Reserve University. He is a design advocate & a member of the Industrial Designers Society of America, a Distinguished Toastmaster and a chairholder in the Color Marketing Group.

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10 March 2021

Kuprion Inc

Wednesday

Innovative Thermal Vias: Meeting the Power Dissipation and Thermal Management Needs of Today’s Advanced High Performance Systems

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06:30pm

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Alfred Zinn

President

In today’s market, electronic systems have become ever more complex while current design methods for PCBs are limiting and inadequate. New approaches are needed to meet reliability demands for increased power dissipation and thermal management of advanced high performance systems. In this presentation, Kuprion, a spinout of Lockheed Martin, will not only detail these challenges, but demonstrate how new, innovative technologies like Active Cu (ActiveCopper™) filled thermal vias are addressing the requirements for more robust interconnect structures to enable thinner, cooler, more compact and reliable operating devices.

Printed Materials, Conductive Ink, Printed Electronics, Novel Inks, All, Advanced Materials, Semiconductor Packaging

Innovative Thermal Vias: Meeting the Power Dissipation and Thermal Management Needs of Today’s Advanced High Performance Systems

06:30pm

In today’s market, electronic systems have become ever more complex while current design methods for PCBs are limiting and inadequate. New approaches are needed to meet reliability demands for increased power dissipation and thermal management of advanced high performance systems. In this presentation, Kuprion, a spinout of Lockheed Martin, will not only detail these challenges, but demonstrate how new, innovative technologies like Active Cu (ActiveCopper™) filled thermal vias are addressing the requirements for more robust interconnect structures to enable thinner, cooler, more compact and reliable operating devices.

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10 March 2021

Arburg

Wednesday

Automated IMSE Mass Production

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06:50pm

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Annika Müller

Application Engineering

Nowadays, finishing and functionalisation of the surface of high-quality plastic parts is a crucial topic and has a big influence on the industry.
To achieve this in a economically efficient and standardised manner, it is important to combine all the necessary steps in the perfect way.
In this presentation, we will have a look at each of these steps and how they are connected in a fully-automated production cell.
In the end, the plastic part is made out of a printed and functionalized foil – ready to use.

Video https://www.youtube.com/watch?v=azzLwrlO4vU

all, InMold Electronics

Automated IMSE Mass Production

06:50pm

Nowadays, finishing and functionalisation of the surface of high-quality plastic parts is a crucial topic and has a big influence on the industry.
To achieve this in a economically efficient and standardised manner, it is important to combine all the necessary steps in the perfect way.
In this presentation, we will have a look at each of these steps and how they are connected in a fully-automated production cell.
In the end, the plastic part is made out of a printed and functionalized foil – ready to use.

Video https://www.youtube.com/watch?v=azzLwrlO4vU

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10 March 2021

Canatu

Wednesday

CNB Film Heaters for ADAS Sensors to Enable Any-Weather Safe Autonomous Driving

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07:10pm

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Mari Makkonen

Marketing Director

The presentation focuses on CNB film heaters for ADAS camera and LiDAR sensors, covering ADAS market evolution, constraints to ADAS uptake, side effects of fair weather on LiDAR and camera systems, challenges associated with the conventional heating wires and the limitations can be overcome to improve safety and reliability. During the presentation, optical test results and integration possibilities will also be shared.
CNB heaters help vehicles “see” better and provide clear field of vision for ADAS systems to operate. These wire-free film heaters provide even heating and low optical distortion enabling accurate object detection. They can be 3D formed and either laminated or injection molded to provide a robust structure. Join our session to learn more!

Mari Makkonen
Marketing Director @ Canatu Oy

Bio

Marketing Director of Canatu, a carbon nanomaterial company, with extensive experience in global B2B technology marketing from nanomaterial, health tech, fire suppression and IT industries. Extensive experience in global B2B technology marketing from nanomaterial, health tech, fire suppression and IT industries.

Transparent Conduct, InMold Electronics, Carbon Nanotubes, Heaters, All, Printed Electronics, Advanced Materials

CNB Film Heaters for ADAS Sensors to Enable Any-Weather Safe Autonomous Driving

07:10pm

The presentation focuses on CNB film heaters for ADAS camera and LiDAR sensors, covering ADAS market evolution, constraints to ADAS uptake, side effects of fair weather on LiDAR and camera systems, challenges associated with the conventional heating wires and the limitations can be overcome to improve safety and reliability. During the presentation, optical test results and integration possibilities will also be shared.
CNB heaters help vehicles “see” better and provide clear field of vision for ADAS systems to operate. These wire-free film heaters provide even heating and low optical distortion enabling accurate object detection. They can be 3D formed and either laminated or injection molded to provide a robust structure. Join our session to learn more!

Mari Makkonen
Marketing Director @ Canatu Oy

Bio

Marketing Director of Canatu, a carbon nanomaterial company, with extensive experience in global B2B technology marketing from nanomaterial, health tech, fire suppression and IT industries. Extensive experience in global B2B technology marketing from nanomaterial, health tech, fire suppression and IT industries.

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10 March 2021

NovaCentrix

Wednesday

Innovation in a Pandemic

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07:10pm

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Stan Farnsworth

Chief Marketing Officer

Even with the challenges of the past year, innovation has moved forward. Stan will take a look at how a few of the key tech trends have fared in the past year, such as 5G, AI, and IoT. He will also connect those to the printed and flexible electronics space, and why we should pay attention to those universal trends. Finally, he will touch on his own experiences with innovation at NovaCentrix, and consider aspects of sustaining innovation versus true disruption.

All, Printed Electronics, Flexible Hybrid Electro

Innovation in a Pandemic

07:10pm

Even with the challenges of the past year, innovation has moved forward. Stan will take a look at how a few of the key tech trends have fared in the past year, such as 5G, AI, and IoT. He will also connect those to the printed and flexible electronics space, and why we should pay attention to those universal trends. Finally, he will touch on his own experiences with innovation at NovaCentrix, and consider aspects of sustaining innovation versus true disruption.

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11 March 2021

SWAROVSKI

Thursday

Reinventing the Wheel? Printing (R)Evolution For A Luxury Brand

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02:10pm

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Rafael Michalczuk

Senior Technology & Funding Manager

Swarovski is innovating since decades in the additive manufacturing domain and printing technologies form an important puzzle piece in the manufacturing processes. But is it now time to reinvent Gutenberg´s invention? As proof-of-concept Swarovski will showcase in the talk different innovations – ranging from additive manufacturing in jewelry, 3D glass printing to 2D/3D printed electronics applications and nano-imprint lithography in various application areas for the luxury brand.

Rafael Michalczuk
Senior Technology & Funding Manager @ SWAROVSKI

Bio

Rafael Michalczuk, Senior Technology & Funding Manager at Swarovski, is supporting research, development and innovation projects within interdisciplinary and cross-functional teams at Swarovski, especially with key enabling technologies involved (e.g. additive manufacturing, printed electronics, artificial intelligence, robotics). Additionally he is founder of the innovation & funding consulting agency InnoPotentials. In this capacity he serves a broad portfolio of clients (from startups, SMEs to large companies and R&D institutions) to develop innovative business ideas, secure funding and support the overall innovation journey of the customers.

Printed Electronics, All

Reinventing the Wheel? Printing (R)Evolution For A Luxury Brand

02:10pm

Swarovski is innovating since decades in the additive manufacturing domain and printing technologies form an important puzzle piece in the manufacturing processes. But is it now time to reinvent Gutenberg´s invention? As proof-of-concept Swarovski will showcase in the talk different innovations – ranging from additive manufacturing in jewelry, 3D glass printing to 2D/3D printed electronics applications and nano-imprint lithography in various application areas for the luxury brand.

Rafael Michalczuk
Senior Technology & Funding Manager @ SWAROVSKI

Bio

Rafael Michalczuk, Senior Technology & Funding Manager at Swarovski, is supporting research, development and innovation projects within interdisciplinary and cross-functional teams at Swarovski, especially with key enabling technologies involved (e.g. additive manufacturing, printed electronics, artificial intelligence, robotics). Additionally he is founder of the innovation & funding consulting agency InnoPotentials. In this capacity he serves a broad portfolio of clients (from startups, SMEs to large companies and R&D institutions) to develop innovative business ideas, secure funding and support the overall innovation journey of the customers.

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11 March 2021

Movesense by Suunto Oy

Thursday

In-mold Electronics Add Context Awareness to Smart Apparel

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02:30pm

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Kimmo Pernu

Innovation Architect

Movesense is an open sensor platform for creating new solutions to track motion, heart rate and ECG. Movesense is used for building wearable sensor concepts and for integrating sensors with apparel. To enable smooth apparel integration and to provide context information for the sensor, Movesense team of the Finnish sports watch expert Suunto worked together with TactoTek, another Finnish tech company specialized in IME, to develop a flexible connector element that includes in-molded electronics and can be applied to clothing with typical textile industry methods. The presentation describes the project background and steps in practice.

InMold Electronics, Printed Electronics

In-mold Electronics Add Context Awareness to Smart Apparel

02:30pm

Movesense is an open sensor platform for creating new solutions to track motion, heart rate and ECG. Movesense is used for building wearable sensor concepts and for integrating sensors with apparel. To enable smooth apparel integration and to provide context information for the sensor, Movesense team of the Finnish sports watch expert Suunto worked together with TactoTek, another Finnish tech company specialized in IME, to develop a flexible connector element that includes in-molded electronics and can be applied to clothing with typical textile industry methods. The presentation describes the project background and steps in practice.

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11 March 2021

Movesense by Suunto Oy

Thursday

In-mold Electronics Add Context Awareness to Smart Apparel

More Details

true

02:30pm

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Terho Lahtinen

Senior Manager, Future Concepts

Movesense is an open sensor platform for creating new solutions to track motion, heart rate and ECG. Movesense is used for building wearable sensor concepts and for integrating sensors with apparel. To enable smooth apparel integration and to provide context information for the sensor, Movesense team of the Finnish sports watch expert Suunto worked together with TactoTek, another Finnish tech company specialized in IME, to develop a flexible connector element that includes in-molded electronics and can be applied to clothing with typical textile industry methods. The presentation describes the project background and steps in practice.