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ALL PAST & FUTURE EVENTS AS WELL AS MASTERCLASSES WITH A SINGLE ANNUAL PASS

Innovations Festival:
Printed, Flexible, Hybrid, 3D, Wearable, & Textile Electronics

22 June 2023
10:30am - 9:30pm

CET:

Virtual Festival

(Free-to-Attend) Innovations Festival: RESHAPING the Future of Electronics


We invite engineers, researchers, entrepreneurs, inventors, and end users from around the world to join 500+ participants, 65+ presenters, and 50+ exhibitors online on 22 June at the interactive TechBlick Innovation Festival


#AdditiveElectronics #PrintedElectronics #3DElectronics #WearableTextiles #TextileElectronics  #SoftElectronics #SustainableElectronics


This is a carefully curated event weaving together fantastic talks with superb networking and immersive virtual exhibition where you can move around with your own avatar. 


The programme covers all key application and technology advancements, reflecting the beautiful diversity of this field. 


The networking will happen in the immersive virtual platform as well as in round-robin speed networking sessions.


This event makes virtual interaction real and you will feel the buzz of meeting where you can have many spontaneous and serendipitous discussions.


Do not miss our Innovations Festival on 25 April 2024


R2R Nanolithography | Nano-Scale Wafer Printing | Smart Skin Patches | 3D Touch Surfaces | Quantum Dots | Stretchable Liquid Metal Inks | Jet Metallization | Laser Induced Forward Transfer | Fuel Cells | Printed Batteries | Organic Photovoltaics | R2R PCB Production | Hybrid Circuits | 3D Electronics | InMold Electronics | Smart Surfaces | Ultra Fine Line Printing | Novel Interconnect Technology | E-Textiles | Printed Displays | Printed Sensors | Printed Sensors | Innovative Paste Technologies | Smart Packaging | Additively Manufactured Electronics | OTFTs | Perovskites | Inkjet | Aerosol | Electrohydrodynamic Printing | Advanced Dispensing | 3D Printing | LIFT | Digital Plating | Direct Wire | Robotic Platforms | Ink-Less Printing | Path Planning and Control | Selective Jetting | Lighting | 3D Printed Electronics | PCB Production | Semiconductor Packaging | EMI Shielding | Microwave and mmWave Devices | Semiconductor Production | Photovoltaics | Photodetectors | Quantum Dots | QLEDs | OLED-QLED | MicroLEDs | Circuit and/or PCB Design and Prototyping | Ceramic (HTCC/LTCC) | Batteries | Screen Printing | Assembly | R2R | Electronic Textiles | Wearable Medical Sensors | Intelligent Skin Patches

Leading global speakers include:
Jabil
Smooth & Sharp
Hahn-Schickard
Notion Systems
ChemCubed
Kimoto
AIT Austrian Institute of Technology
ELANTAS Europe
Northeastern University
Heraeus
Purdue College of Engineering
Coatema
Fraunhofer IKTS
Nagase
 Bingham University
Brewer Science
ImageXpert
XTPL
Henkel
Danish Technological Institute
Hummink
Coveme
SUSS MicroTec
Eastman Kodak
Innovation Lab
NETO Innovation
Conductive Technologies
Witte Technology
NextFlex
ZSK/3E Smart Solutions
RISE Research Institutes of Sweden
SunRay Scientific
NSM Norbert Schläfli
Akoneer
Hamamatsu
TracXon
QustomDot
Fraunhofer IAP
Printed Electronics Ltd
Joanneum Research
CondAlign AS
PST Sensors
DoMicro
Arkema
Fujikura Kasei
OrelTech
Brilliant Matters
Quantica3D
TNO at Holst
Printed Energy
Siemens
Sij Technology
Warsaw University
Quad Industries
C3Nano
Metafas
Celanese
IDS
binder ITZ
BeLink Solutions
Auburn University
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Full Agenda

The times below is Central European Times (CET).

TechBlick
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TechBlick

Welcome & Introduction

10.30AM

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Khasha Ghaffarzadeh
Short Demo

Khasha Ghaffarzadeh

Welcome & Introduction

10.30AM

Abstract

Watch Demo Video
Sij Technology
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Sij Technology

The potential of femtoliter-level droplet with super inkjet systems

10.35AM

joint

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 Dr.Kazuhiro Murata

Dr.Kazuhiro Murata

CEO, Founder

The potential of femtoliter-level droplet with super inkjet systems

10.35AM

Abstract

Watch Demo Video
QustomDot
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QustomDot

Cd-free Quantum Dot Colour Converters for MicroLED Applications

10.48AM

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Mohammad Kiaee

Mohammad Kiaee

Materials Scientist

MicroLED technology is on its way to replacing traditional display technologies by bringing added value
propositions to the consumer market, including high brightness, excellent lifetime, high resolution,
and superior efficiency, with applications spanning from wearable devices, augmented/virtual reality,
and ultrahigh-definition TVs.
To date, challenges in scaling pick-and-place processes and producing highly efficient red and green
native microLEDs hamper microLED mass production. A quantum dot (QD) color conversion strategy
to produce an RGB display from an array of blue microLEDs is an elegant way to simplify the
manufacturing process and to overcome several technological challenges in the mass-transfer
process, the display brightness, and the driving electronics. QustomDot’s mission is to bring
unmatched colors to micro-LED devices through QD color conversion layers to overcome the
challenges above and facilitate market entry of miroLED-based devices.
Over the past few years, QustomDot has made a giant leap towards QD resins containing Cd-free
RoHS-compliant InP QDs. Our focus has been to formulate QD resins with ultra-high solid loading,
excellent shelf life, and processability, adapted for various processing methods, including
photolithography, nano-imprint lithography, and high-precision printing methods. In addition to
excellent processability, our QD resins result in QD films with high solid loading, excellent absorption
at the sub-10 µm thickness, and high conversion efficiency while matching, if not exceeding, the
reliability of commercially available InP-based QDs. Our talk will showcase our recent progress
towards optimization of our red and green QD resins to obtain color conversion films with optical
properties one step closer to fulfilling the challenging requirements of commercial microLED displays.

Cd-free Quantum Dot Colour Converters for MicroLED Applications

10.48AM

Abstract

Watch Demo Video
Fraunhofer IAP
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Fraunhofer IAP

Inkjet printable stretchable
electrodes for organic electronic applications.

11.01AM

joint

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Manuel Gensler

Manuel Gensler

Physical Chemist, Research Scientist

Inkjet printable stretchable
electrodes for organic electronic applications.

11.01AM

Abstract

Watch Demo Video
XTPL
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XTPL

Revolutionizing Microelectronics Applications with XTPL's Ultra-Precise Deposition Solution

11.14AM

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Lukasz Kosior

Lukasz Kosior

Business Development Manager

Revolutionizing Microelectronics Applications with XTPL's Ultra-Precise Deposition Solution

11.14AM

Abstract

Watch Demo Video
SUSS MicroTec
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SUSS MicroTec

Join the printing Ecosystem with the SUSS LP50 platform

11.27AM

joint

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Dennis Kuppens

Dennis Kuppens

Product manager inkjet

Join the printing Ecosystem with the SUSS LP50 platform

11.27AM

Abstract

Watch Demo Video
Hamamatsu
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Hamamatsu

Laser Sintering - a sustainable and rapid post-process for high volume production

11.40AM

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Alexander Goerk

Alexander Goerk

Business Development Manager

Diode lasers are by far the most efficient method to introduce thermal energy into NIR absorbing materials. Fortunately, most conductive inks absorb the 940nm of the Hamamatsu cw SPOLD laser, allowing a homogeneous and rapid sintering result comparable to other thermal post-processing technologies. The use of laser line optics favours scalable, yet highly sustainable high volume production, for example in an R2R machine or ITO Touch display manufacturing. Hamamatsu's own developments in terms of lasers and optics make it possible to adapt to customer-specific requirements, materials and processes.

Laser Sintering - a sustainable and rapid post-process for high volume production

11.40AM

Abstract

Watch Demo Video
Speed Networking
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Speed Networking

Speed Networking

11:53AM

joint

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Short Demo

Speed Networking

11:53AM

Abstract

Watch Demo Video
Smooth & Sharp
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Smooth & Sharp

Smart and Smarter, with Additive Manufacturing Solution, Beyond Simple Sustainable RFID antenna/inlay.

12.45PM

joint

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Phil Chen

Phil Chen

General Manager

S&S’s DOP, Direct On Paper is a sustainable paper RFID antenna solution which is both plastic-free and avoids chemical etching process. A HF loop antenna can be printed directly onto standard graphic printing paper with DOP solution.

More than 10 years ago, PragmatIC created a new type of integrated circuit (IC) called FlexICs, that are thin, flexible and ultra-low cost, aimed at connecting for trillions of smart objects. Today, PragmatIC comes to another milestone, smartphones are able to work with NFC FlexIC that can be embedded into high volume everyday items.

NFC FlexICs can be assembled with etched Aluminium loop antenna by providing the connection bridge across the two ends of the loop antenna. In our process concept, we use FlexIC's unique thin and flexible product characteristics (vs rigid silicon IC) with DOP's ultra-thin HF antenna loop. The benefits of this process concept are the material, process and resource saving during antenna production. By using a single loop antenna and eliminating the connection bridge, we avoid an additional printing process or double-sided Aluminium antenna substrate.

A tiny natural resource saving in one inlay with NFC FlexIC for trillions of smart objects ... and beyond.

Smart and Smarter, with Additive Manufacturing Solution, Beyond Simple Sustainable RFID antenna/inlay.

12.45PM

Abstract

Watch Demo Video
NSM Norbert Schläfli
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NSM Norbert Schläfli

Highly Scaled Gravure Printing

12.58PM

joint

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Rolf Meyerhans

Rolf Meyerhans

nsm, based in Zofingen, Switzerland is a company which specializes in the developing and manufacturing of high-precision printing and coating systems in the field of Printed Electronics. Rolf joint nsm in 2022. He has over 30 years worked in the development of mechanical components. He gained a long experience in mechanical design, dimensioning, process analysis and structural simulations. He is responsible for the technological strategy and the implementation of customer requirements together with a team of technology experts.

Highly Scaled Gravure Printing

12.58PM

Abstract

Watch Demo Video
Printed Electronics Ltd
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Printed Electronics Ltd

Methods for Printed and Additively-Manufactured Electronics: “which one(s) should I use for my application”?

1.11PM

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Neil Chilton

Neil Chilton

Technical Director

With an increasingly large number of electronic additive-manufacturing processes available, it can be confusing to know which methods are applicable for your application. Printed Electronics Limited (PEL) is a manufacturer and product development company with very long experience printable electronics. PEL also represent some of the leading equipment manufacturers in the industry. In this short presentation we will provide some key pointers to assist in the choice of equipment and manufacturing approach.

Methods for Printed and Additively-Manufactured Electronics: “which one(s) should I use for my application”?

1.11PM

Abstract

Watch Demo Video
OrelTech
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OrelTech

Printed platinum and palladium? Really!

1.24PM

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Klaus Mertens

Klaus Mertens

CEO

Inkjet printed silver and copper can be considered “established” at least among printed electronics insiders – with their industry adoption starting to pick up speed. As a result, new variants of particle inks and innovations and curing have been emerging, which gives industrial producers a few curing options beyond brute heating. In contrast, the range of metals available for printing – esp. high precision inkjet printing, is still very limited. The talk will introduce two first-timers: printable platinum and printable palladium inks by OrelTech from Berlin. Just as all of their inks (including silver, silver transparent, gold, and more to come), they have a range of other advantages: 1) nanoparticle free, 2) low-temperature curing, and 3) high layer purity. Therefore, applications in the biosensor, medical and, more generally, printed flexible electronics market are in focus.

Printed platinum and palladium? Really!

1.24PM

Abstract

Watch Demo Video
TracXon
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TracXon

Hybrid Printed Electronics (HPE) Are The Future Of The Industry.

1.37PM

joint

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Ashok Sridhar

Ashok Sridhar

CEO

Hybrid Printed Electronics (HPE) Are The Future Of The Industry.

1.37PM

Abstract

Watch Demo Video
NETO Innovation
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NETO Innovation

Unlock your project's full potential with NETO Innovation

1.50PM

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Stéphanie Limage

Stéphanie Limage

Innovation Manager Associate

NETO Innovation specializes in setting up projects to finance your R&D: Horizon Europe projects, EIC (Pathfinder, Transition and Accelerator), Eureka and National French projects. Our team is composed of 3 PhDs with expertise in green energies (solar, hydrogen, batteries, bio-energy, carbon capture and storage), printed and flexible hybrid electronics and their related applications (IoT, EMI shielding, in-mold electronics, sensors, displays, OLEDs, OPVs), healthcare (immunology, oncology, and medical devices) and innovative materials (biomaterials, nano-based materials, metal oxides) from manufacturing to application.

Unlock your project's full potential with NETO Innovation

1.50PM

Abstract

Watch Demo Video
Purdue College of Engineering
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Purdue College of Engineering

Robust internet-of-thing devices for digital agriculture, food, healthcare and smart infrastructure

2.03PM

joint

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Ali Shakouri

Ali Shakouri

Professor of Electrical and Computer Engineering

Integrated circuits (ICs) have revolutionized computing and communication in the last couple of decades. There are many efforts to use similar principles to develop low-cost Internet of things (IoT) devices to help solve societal grand challenges in water, food and healthcare. Here, we present development of a low-cost printed sensor platform as well as its hybrid integration with ICs for electronics, communication and networking for field deployment.

Most existing commercial chemical and gas sensors are expensive, work in well-controlled environment and require frequent calibrations. It is very challenging to achieve high sensitivity and selectivity and stable continuous operation in a harsh environment. Roll-to-roll manufacturing and printing can be used to make low-cost functional films and sensors. However, printed devices have inherently more variability than traditional vacuum processes for ICs. We show examples where in-line characterization and imaging during manufacturing enable reducing the device variability by up to 80%. We also present a novel design paradigm where sensor diversity and physics-guided machine learning and statistical techniques are used to make accurate measurements in noisy and harsh outside environment. We demonstrate continuous nitrate measurement with 3ppm sensitivity in an agricultural field with LoRa network over two weeks. Similar ideas for robust sensors for pharmaceutical manufacturing, marine environment, as well as point-of-care devices will be briefly mentioned. Roll-to-roll manufacturing of composite polymer films can also be used to make large-area physical sensors and actuators. We will describe flexible semi-transparent piezoelectric vibration monitor and loudspeakers.

In some "drop and forget" applications, one can eliminate the readout electronics completely. We present novel battery-less chipless RFID sensors with drone read-out electronics for characterizing moisture and microbial activity in the soil. This can be fully biodegradable working for couple of weeks to months. Similar sensors can be used for food safety and freshness for supply-chain monitoring.

Robust internet-of-thing devices for digital agriculture, food, healthcare and smart infrastructure

2.03PM

Abstract

Watch Demo Video
Exhibition 1
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Exhibition 1

Exhibition Session 1

2.16PM

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Short Demo

Exhibition Session 1

2.16PM

Abstract

Watch Demo Video
ELANTAS Europe
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ELANTAS Europe

Overview About ELANTAS High Potential Functional Inks And Application Cases

3.16PM

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Philipp Hölzl

Philipp Hölzl

Technical Sales Manager

In this presentation, we will talk about new inks for Heaters in the field of InMold applications. Autonomous driving comes more and more important for the automotive industry. For that reason, we need Radar System which can work under every weather conditions. We will introduce the challenge of thermoformable silver conductive ink in the field of thermoforming process and how to avoid “Hot Spots”.

Overview About ELANTAS High Potential Functional Inks And Application Cases

3.16PM

Abstract

Watch Demo Video
Coatema
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Coatema

Sustainable & smart packaging
New social and industrial challenges for printed electronics

3.29PM

joint

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Thomas Kolbusch

Thomas Kolbusch

Director Sales, Marketing, Technology, VP

Smart packaging is becoming increasingly important in the context of steadily rising packaging waste.
Plastic films and paper materials are used in a wide range of daily life products. The largest amount of this use is attributable to the packaging industry e.g., food and pharmaceutical packaging. Global production of packaging-related materials is continuously growing and as a result the industry and consumers are producing more packaging waste than ever before without considering the recyclability.
The response from politicians, industry and society is to introduce new policies and stricter regulations, as well as new societal expectations to the industry.
To handle the resulting ecological requirements, the industry faces new technological and logistical challenges. Beside the use of recyclable and biodegradable materials for products, the digitalization of production processes and the implementation of intelligent and smart products are essential for maintaining competitiveness.

In this context, this presentation emphasizes the rising importance of printed electronics in terms of sustainable smart packaging and addresses how the aforementioned challenges can be overcome by implementing ecological solutions on an industrial scale.
Work from various EU-funded projects dealing with the further development of sustainable and smart packaging as well as the introduction of industrial roll to roll process steps for the realization of the developed approaches will be presented.

Sustainable & smart packaging
New social and industrial challenges for printed electronics

3.29PM

Abstract

Watch Demo Video
Eastman Kodak
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Eastman Kodak

Additive Manufacture of Copper Micro-Wire Transparent Heaters

3.42PM

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Chris O'Connor

Chris O'Connor

VP, Global Business Group

Many flexible heater products are produced using printing techniques. As applications requiring transparent antennas increase in number, it makes sense to use similar additive manufacturing techniques for flexible heaters. In all cases, each mass-produced heater is a replicate of the last, making their manufacture well suited for “analog” print manufacturing, such as flexography. The use of high-resolution printing enables the additive manufacturing of custom transparent heater designs – built from copper micro-wires for transparency and function.

This talk will provide an overview of the requirements for different transparent heater applications and how these requirements can be achieved with copper micro-wire patterns. Examples and data will be shared from lab-scale and production scale evaluations.

Additive Manufacture of Copper Micro-Wire Transparent Heaters

3.42PM

Abstract

Watch Demo Video
AIT Austrian Institute of Technology
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AIT Austrian Institute of Technology

Surface modification of wearable microneedle-based biosensor systems

3.55PM

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Dr. Giorgio C. Mutinati

Dr. Giorgio C. Mutinati

Senior Research Engineer & Project Manager

To serve the increasing demand for low-cost and easy-to-use point-of-care (POC) diagnostic systems for healthcare and lifestyle, upscaling of the underlying biosensor system concepts using novel functionalization strategies for sample preparation or signal generation is crucial. The Molecular Diagnostics competence unit of the AIT Austrian Institute of Technology GmbH addresses this need by investigating key research issues for low-volume (picoliter/nanoliter) inkjet printing or “high volume” spotting techniques (microliter), and therefore, works on the development of printing processes and (bio)inks for reproducible batch production, e.g., for functional (bio)sensors, immuno- or enzymatic assays, as well as nucleic acid diagnostic devices. In this presentation, we will review results related to these aspects from the ELSAH project (H2020, No 825549). ELSAH aims at the realization of a wearable, microneedle-based biosensor system for the continuous monitoring of glucose and lactate in the interstitial fluid for lifestyle diagnostics. Formulated bioinks comprise direct electron transfer (DET) enzymes containing PEDOT:PSS inks (PEDET ink) and hydrogel precursors inks. The developed spotting techniques allow local deposition of glucose- or lactate-sensitive PEDET inks and hydrogel protection layers on microneedle-based amperometric sensors.

Surface modification of wearable microneedle-based biosensor systems

3.55PM

Abstract

Watch Demo Video
Coveme
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Coveme

Latest coating line: premises, challenges and outcomes

4.08PM

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Marco de Luca

Marco de Luca

Division Manager Flexible Substrates

Latest coating line: premises, challenges and outcomes

4.08PM

Abstract

Watch Demo Video
Brilliant Matters
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Brilliant Matters

Materials for Next-Generation Organic Photovoltaic Modules

4.21PM

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Arthur Hendsbee

Arthur Hendsbee

Technology Director

Organic photovoltaic technologies are a 3rd generation solar technology which has been steadily improving in the past decade due to rapid evolutions in materials design, device stacks and processing strategies. Due to their high efficiency, non-toxic nature and low-cost-high-volume manufacturing potential, several market-ready applications are now emerging for this technology. For instance, photovoltaic modules for indoor energy harvesting, for integration into buildings such as greenhouses, office buildings or even vehicles. In this presentation Brilliant Matters will outline some of the current challenges in the field of high performance and scalable OPVs from a materials chemistry perspective and will discuss novel materials systems for efficient and scalable OPV devices.

Materials for Next-Generation Organic Photovoltaic Modules

4.21PM

Abstract

Watch Demo Video
Innovation Lab
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Innovation Lab

Sustainable flexPCB Production: Reflow-solderable Printed Electronics

4.34PM

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Kevin Schmid

Kevin Schmid

Manager & Engineer

InnovationLab presents a novel printed circuit boards (PCBs ) production method based on additive manufacturing, which helps to meet higher environmental standards for electronics production while also reducing costs. The circuits are screen printed and are compatible with a conventional reflow soldering processes.

Sustainable flexPCB Production: Reflow-solderable Printed Electronics

4.34PM

Abstract

Watch Demo Video
Exhibition 2
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Exhibition 2

Exhibition Session 2

4.47PM

joint

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Short Demo

Exhibition Session 2

4.47PM

Abstract

Watch Demo Video
DoMicro
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DoMicro

Micro Assembly For SiC-Based Power Modules

5.47PM

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Aart-Jan Hoeven

Aart-Jan Hoeven

International Project / Technology Manager

The technology for integrating dies is an important enabler for the realization of advanced applications. This includes applications with power modules. Critical steps for the integration of such modules are in the micro assembly, for example in the wire bonding and the die attach. This presentation will highlight results from work on these steps in a project for prototyping power modules for electric vehicles (EVs).

Important for applications such as EVs and renewable energy supplies is the availability of reliable and efficient power modules. These are needed for converting from AC to DC, from DC to AC, for driving an electric motor and for various other purposes. SiC-based solutions are often preferred for high end applications, because they offer a higher efficiency, higher switching frequencies, reduced switching losses, higher operation temperatures and a better robustness as compared to traditional silicon components. A challenge in the integration of power modules is in the wirebonding. The problem is that wirebonding is a major source of failures because of thermal or mechanical stress, and therefore causes a reduced life time. Improved micro assembly processes can bring solutions for this problem.

Micro Assembly For SiC-Based Power Modules

5.47PM

Abstract

Watch Demo Video
Notion Systems
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Notion Systems

Making an Impact with Inkjet. Additive process in Electronics Production. The Future of Additive Manufacturing

6.00PM

joint

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