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David Dewey

Sales

Fujikura Kasei

Japan

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DOTITE Electrically Conductive Sintering Adhesives and Package Level Shielding for Semiconductors

Innovations Festival: Printed, Flexible, Hybrid, 3D, Wearable, & Textile Electronics 2023

21 June 2023

Online

TechBlick Platform

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Presenting DOTITE materials designed to improve performance and open up new design possibilities for semiconductors and other electronic components.

Watch the 5-minute excerpt from the talk

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