The Future of Electronics RESHAPED 2025 USA

Aerospace and defense industry requires thick film solutions for specialty low-thermal expansion substrates that can withstand high operating temperatures. A package consisting of RuO2-based resistive inks and optional underglaze dielectric/sealing overglaze targeting the firing temperature of 1020°C was developed. The materials show excellent high temperature stability and can tolerate rapid thermal cycling. The inks can be deposited by screen printing or spraying and are fully compatible with Ceramic Matrix Composite (CMC), Silicon Carbide, and Fused Quartz substrates.

The COTS CNC is the perfect platform for multifunctional conformal printed electronics manufacturing. It offers reliability, low operating costs and flexibility. The 5-axis CNC is designed to perform multi-axis movements simultaneously and with its multiple built-in easy-to-use relays and a tool changer, multi-layer conformal printing is like printing on a flat surface. The precise printing of multiple layers on a conformal surface requires multiple tools and the integrated automatic tool changer is a game changer. We will present the integration of printing tools, accessory tools, post processing, automatic tool changer and CNC based motion platform.

This presentation will show how next-generation printable conductors enable cost-effective, fully additive manufacturing of durable, flexible hybrid electronics, e-textiles, and wearables. It introduces key concepts, such as the advantages of advanced conductive materials in real-world applications, highlighting solderability and print resolution that enable higher-density circuits, including smaller surface-mounted devices (SMDs). The discussion addresses environmental challenges with the current assembly of printed conductors, specifically the galvanic corrosion of electrically conductive adhesives (ECA) under damp heat conditions compared with the latest solderable printed conductors. The cost-effectiveness of alternative materials is also analyzed, comparing resistivity and manufacturing processes.   The materials sets in e-textiles (stretchable/formable) will also be covered with the current two-step and emerging direct transfer methods.

As the demand for smaller, faster, and more energy-efficient electronics accelerates, traditional manufacturing methods struggle to keep pace with design flexibility, material compatibility, and environmental requirements. This presentation introduces a novel direct-write microfabrication approach that enables the selective deposition of a wide range of materials, down to the atomic scale, without the need for masks, resists, or extensive post-processing. By streamlining patterning and material integration into a single-step process, this technology opens new possibilities for advanced packaging, heterogeneous integration, and rapid prototyping of complex electronic architectures.
The talk will explore how this method overcomes critical challenges in high-resolution additive manufacturing, such as temperature sensitivity, chemical waste, and alignment precision. Application examples will illustrate its potential to drastically reduce energy consumption and material waste while unlocking new geometries and functionalities across semiconductors, MEMS, and beyond. This paradigm shift in microfabrication is poised to reshape the future of electronics—from lab to fab.

Explore the current state of 3D printed electronic CAD/CAM software tools, system platforms and developments from the perspective of scalability and flexibility. Wider adoption of printed electronics is deterred primarily by challenges with design tools, manufacturing scale and performance. Rich Neill, Founder/CEO of Advanced Printed Electronic Solutions, will introduce you to the company's efforts to mitigate these challenges through incorporation of the latest in CAD/CAM tools, adaptive manufacturing and other emerging technologies.

Global competition, tariffs, and supply chain issues demand agile, nimble hardware development. With rising demand for embedded electronics across industries, traditional methods just can’t keep up—teams must adapt quickly to survive and thrive. Agile: it’s not just for software anymore.

Hardware teams have to reshape electronic development processes and the workflow technology they run on. A modern development process must allow all cross-functional experts to become stronger through collaboration as they prototype electronics. System architects, product managers, electrical engineers, component buyers, supply chain managers, project managers, and software engineers must work in sync. Only modern cloud technology can make those modern processes work fast enough and accurately enough.

This talk will share specific examples of how five of those key players in electronics development–system architects, project managers, electrical engineers, part purchasers, and mechanical engineers–can work more closely together. Learn how quickly you can move when AI helps create requirements and a shared cloud platform ensures that those requirements are visible for every major design decision. Learn how project managers can tame the chaos caused by new or changing requirements. Learn how electrical engineers can team up with mechanical engineers on shared designs, while procurement leaders can look in and get a jump on building their BOMs.

The Ambient IoT ecosystem is experiencing unprecedented momentum, with significant advances in Bluetooth, IEEE, and 3GPP standards, culminating in the formation of the Ambient IoT Alliance between industry leaders Atmosic, Infineon Technologies AG, Intel, PepsiCo, Qualcomm, VusionGroup, and Wiliot. Drawing from 7+ years of experience as an early practitioner in the Ambient IoT space, this presentation will examine the technical standards evolution and the compelling business use cases driving widespread adoption. We'll explore how this technology is fundamentally transforming the relationship between artificial intelligence and the physical world, creating a foundation for ambient intelligence that extends AI capabilities beyond digital interfaces. The session will highlight real-world implementations that demonstrate how organizations across multiple industries are leveraging these connections to drive operational efficiency, enhance customer experiences, and enable new business models previously impossible without the marriage of AI and ubiquitous sensing capabilities.
Steve Statler Speaker Bio
Steve Statler is a recognized authority in the IoT and ambient computing space. As the author of "Beacon Technologies: The Hitchhiker's Guide to the Beacosystem" and host of the popular "Mr. Beacon" podcast, he has helped shape industry understanding of proximity technologies and IoT innovations. With over 20 years of experience in wireless technologies, Statler was the first field employee at Wiliot, where he spent 7+ years helping pioneer Ambient IoT solutions. He currently serves as CEO and co-founder of AmbAI, focusing on connecting AI to the physical world. As the official spokesperson for the Ambient IoT Alliance, Statler continues to advocate for standards and technologies that bridge the digital and physical worlds.

As the printed electronics market needs shift to finer line printing, reduced paste metal content, and lower processing temperatures, it is necessary to customize the conductive filler to meet these technical targets. Influencing material properties such particle morphology, aspect ratio, dispersion, and residual organic content is critical to make a paste functional and robust for the end user. The use of various post processing techniques to classify and filter out oversized particles/ agglomerates are used to ensure printing nozzles/ screens remain clog-free and metal is dispersed uniformly in the paste. For liquid phase powder precipitation, manipulation of these reactions focuses on the influence of fluid dynamics, reduction potentials, and dispersing agents for any given particle manufacturing process. Together, these factors control particle nucleation and growth steps to produce a desired crystallinity, morphology, and particle size suited for a targeted application.

Arkema Piezotech polymers are 2 range of electroactive polymers. Piezotech FC: P(VDF-TrFE) copolymers, which are piezoelectric, pyroelectric, and ferroelectric and often be used for sensor, energy harvesting, speaker; Piezotech RT, P(VDF-TrFE-CTFE) and P(VDF-TrFE-CFE) terpolymers with remarkable high-k, electrostrictive, and electrocaloric properties, which be applied in OTFT, actuators and electrocaloric devices. these polymers are fine, lightweight and flexible, and can be integrated using simple process. In this presentation, we will firstly use some graphic to demonstrate the mechanism of the Piezo effect, how & what happen at the molecular level. then we will show different applications with videos of sensors, actuators made by Piezotech material that turn surfaces, objects and buildings into smart systems.
1. printed pressure/vibration sensor integrated into insole & mattress to monitor for health, wellness and safety. comparing to force resistive sensor, Piezo material has better efficient (drift, sensor fatigue) and reliability. we will show short video of monitoring data, case study of smart sleep mattress, smart insole, pulse monitoring.
2. Sensor to be applied into sport equipment, such as golf club, tennis racket.
3. Electrostrictive effect of Piezotech® RT polymers, a guide wire for endovascular navigation in order to reach the target regions inside blood vessels and through the tortuously curved pathways of blood vasculature. Minimizing risks and complications of the procedure by improving steerability performance. Decrease the probability of infection;
4. Acoustic monitoring sensor for H2 tank structural health monitoring. Record and localize acoustic waves resulting from mechanical modifications of the composite using piezo-active polymers. Increasing the security of tanks by fatigue/impact identification and realizing the requalification of the tank in real time (life time prediction). such application could be on applied to monitor the status of the wind turbine blade to allow remote management, optimize maintenance and extend lifetime;
5. Haptic glove which is glove with haptic module made by PIEZO terpolymer

Multilayer sweat-rate electrodes (SREs) with conductors and resistors were successfully screen-printed using a solvent-based silver ink and a water-based CB ink, respectively, and their environmental and mechanical reliability was comprehensively investigated. Water-based carbon inks provide a cost effective and sustainable alternative to organic-solvent based metal conductive inks, making them attractive for wearable sensor applications. However, poor adhesion on nonporous polymer substrates and susceptibility to temperature and humidity fluctuations raise concerns about printability and reliability, hindering their widespread commercial adoption. This study focuses on screen-printing defect-free multilayer structures on flexible and stretchable polymer substrates using a commercial water-based conductive carbon black (CB) ink and evaluating their reliability. A robust printing process was developed by modifying the fabrication flow, optimizing printing parameters, and maintaining atmospheric relative humidity (RH) between 70% and 75%. The water-based carbon resistors printed on polyimide substrate demonstrated promising results. Ambient-dried resistors on polyimide exhibited satisfactory electrical performance and reliability, while thermal curing further reduced their electrical resistance by 18% without compromising reliability. Moreover, these resistors demonstrated excellent environmental and mechanical reliability by withstanding thermal exposure at 125 ◦C, RH of 15%, and 500 tensile bending cycles at a 1-cm bend radius, suggesting their suitability for wearable sensors. Failure analysis revealed the development of crater-like morphological structures during the drying process, which later acted as stress concentration points. Resistors printed on polyester, high-density polyethylene, and thermoplastic polyurethane (TPU) substrates failed due to cracking, delamination, ink-to-ink interactions, or out-of-plane deformation. Cracking and delamination patterns provided useful insights into failure mechanisms.

As the electronics industry faces new challenges in miniaturization and performance, there is a critical need for innovative materials and processes to drive the next wave of growth. Traditional microelectronics technologies, from photolithography to PCB fabrication, have remained largely unchanged for decades. While additive manufacturing has seen rapid development, primarily on polymers and metals for structural applications, there is a significant opportunity to advance materials specifically
for electronics, such as low-loss dielectrics materials for high-frequency applications. Brewer Science is at the forefront of this innovation, leveraging its extensive expertise in polymer chemistry to develop printable, low-loss dielectric materials that meet the needs of modern electronics. These materials have the potential to revolutionize domestic electronics packaging by enabling new capabilities, reducing costs, and supporting a more resilient domestic supply chain. Additive manufacturing will enable more freedom for integrated and innovative design approaches, such as creating complex 3D traces and vias, and embedded functions like RF and optical waveguides, all within a single manufacturing process. This holistic method allows for the construction of electronic circuits from the ground up, breaking down traditional silos by merging the function of chips, packages, and PCBs into unified multifunctional components. As the U.S seeks to close the gap with global competitors and build a robust domestic infrastructure, additive manufacturing offers a pathway to achieving these goals. With astrong foundation in material science and a commitment to advancing additive electronics, Brewer Science is poised to lead the charge for disruptive change in the electronics industry, just as it did with bottom antireflective coatings 40 years ago.

When using metal nanoparticles as a material for conductive nanoink for inkjet use, it is necessary to carefully consider surface protection of the metal nanoparticles. This is because while surface protection is essential for metal nanoparticles when they are dispersed in liquid, at the stage of coating and drying to form a conductive coating, the stabilizer on the nanoparticle surface is a factor that inhibits conductivity. We have been the first in the world to report on pi-junction metal nanoparticles that are stabilized by planar coordination of planar pi-conjugated molecules such as porphyrin and phthalocyanine. In particular, it has been demonstrated that pi-junctions can stably disperse metal nanoparticles in liquids using extremely small amounts of molecules. The fact that only a small amount of molecules are required to protect the nanoparticles is directly linked to the fact that the conductivity after coating and drying is advantageous.
By utilizing the above properties, conductive nanoink for inkjet using pi-junction metal nanoparticles satisfies several important properties that were previously impossible, and is actually used in mass production in industry. This time, I will explain the factors that led to this.

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From analyte sensing to comprehensive healthcare monitoring, sensors play a vital role in a wide range of wearable devices. In addition to sensor technology, the construction is critical to optimal performance. The importance of raw material selection; inks, substrates, chemistry, adhesives is crucial for product quality, manufacturing costs, and overall business success.
Conductive Technologies serves as a trusted partner in contract manufacturing to deliver precision-engineered solutions that bring innovations to life. With unmatched expertise in conductive printing, biosensor, and precision manufacturing. Conductive Technologies expertly guides customers through the complexities of wearable device development towards successful and optimized outcomes.

Investigation of Interface Materials on ECG Signal Clarity and Stability

Comparative Analysis: Elefix, Dry Electrode Interface, and OmnIWAVE vs. Traditional Hydrogels

Electrocardiogram (ECG) signal clarity is crucial for accurate cardiac monitoring and diagnosis. Traditional hydrogels have long been the standard interface material used with Ag:AgCl electrodes due to their superior conductivity, skin adhesion properties, and ability to maintain stable and repeatable signal transmission. However, alternatives in electrode interface materials, such as Elefix, dry electrode interfaces, and OmniWAVE, present potential improvements in ECG signal clarity, stability, and repeatability, while also enhancing overall patient comfort.

Elefix, a novel conductive paste, is designed to enhance signal transmission and reduce impedance at the electrode-skin interface. Preliminary studies suggest that Elefix provides comparable, if not superior, performance to traditional hydrogels in terms of signal clarity, stability, and repeatability. It also offers advantages in terms of ease of application and reduced skin irritation. Dry electrode interfaces, on the other hand, eliminate the need for conductive gels or pastes. These materials aim to maintain consistent contact with the skin, providing reliable ECG signal acquisition without the mess or discomfort associated with hydrogels, while ensuring stable and repeatable signal quality. However, their performance in high-motion environments remains a subject of ongoing research.

OmniWAVE represents another innovative approach, incorporating advanced materials and designs to optimize signal clarity, stability, and repeatability. Early evaluations indicate that OmniWAVE interfaces may deliver enhanced signal fidelity, particularly in long-term monitoring scenarios. These interfaces potentially offer greater patient comfort and reduced artifact presence compared to traditional hydrogels. Comprehensive studies are needed to confirm these findings and establish standardized protocols for their use. Comparing these modern interface materials to traditional hydrogels could lead to significant improvements in ECG monitoring, offering clearer, more stable, and repeatable signals, thereby enhancing overall patient experience.

With the growing incidence of record high temperatures, extended heat waves, and extreme weather events, taking steps to minimize the risk of heat stress in workers is necessary for both safety and productivity reasons. Maintaining proper hydration is a key part of this process; just 2% dehydration is enough to cause significant short-term physical and cognitive reductions. However, both the rate and salt content of sweat can vary significantly by person, weather conditions, activity type and intensity, and other factors. Thus there is a need for personalized monitoring devices tailored to the individual and the type of activity. Here we present the Connected Hydration wearable system for monitoring fluid and sodium loss through sweat, along with fluid intake, skin temperature, and activity level. A reusable module provides control circuitry while a flexible electrofluidic sensor enables direct measurement of sweat production. Haptic motors provide real-time feedback of sweat loss, while a companion mobile app provides quantitative data and cloud synchronization on-demand. Results of field studies show that use of Connected Hydration promotes improved hydration for individual workers, and aggregated data across workers provide support for organizational changes that help reduce the risk of heat stress.

With the increasing demand for wearable sensors and smart devices, printed electronics has gained significant momentum in recent years. Offering more flexible, thinner, and lighter products compared to traditional technologies, this emerging field introduces unique process challenges—especially in material transfer and component assembly.

Choosing the right transfer technology for conductive and nonconductive adhesives is critical. Factors such as particle size, form, metal load, and density greatly influence rheology and, in turn, the dispensability of adhesives. The same level of precision and adaptability is required for the accurate mounting of ultra-small and sensitive components on non-traditional substrates.

In this presentation, Essemtec shares its latest innovations in both high-precision jetting and mounting tailored for printed electronics. We will explore how our adaptive all-in-one platforms address common production challenges, from fine-pitch dispensing to component placement on flexible materials. Test cases and real-world examples will be presented, offering a glimpse into our proven solutions and application know-how.

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Roll‑to‑roll (R2R) printing can cut costs and boost throughput in flexible electronics - but only if electrical properties stay within spec. This session shows how Meyers keeps sheet resistance within ± 15% during high‑volume production by pairing a structured Design of Experiments (DOE) with a predictive process model. We outline the key factors identified in the DOE and show how the model defines operating windows that keep the process on target. Attendees will leave with a quick‑checklist for deciding when R2R is the right path and a practical workflow for applying DOE to lock in critical electrical properties, ultimately delivering consistent quality at web speeds.

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In this presentation, Dr. Yeo will explore the foundational scientific principles behind integrated soft sensors and electronics in wearable formats for advancing digital healthcare. He will address the limitations of current biomedical systems employed for continuous health monitoring, persistent human-machine interfaces, and disease diagnosis. A series of innovative solutions designed to overcome these challenges will be presented in detail. Specifically, Dr. Yeo will elaborate on unique strategies for the design and fabrication of new systems utilizing soft and hybrid materials. He will also present a variety of recent digital healthcare projects that focus on the development of soft electronic sensors and platforms. These projects include VR-AR-integrated brain sensors, wearable energy harvesters, drug efficacy evaluation systems, and health monitors tailored for outdoor workers. The presentation will showcase both in vitro and in vivo study examples that emphasize the distinctiveness of these nanomembrane electronic systems and their considerable advantages over existing alternatives, particularly in areas such as real-time continuous health monitoring, portable healthcare, quantitative disease diagnosis, and connected therapeutics. Finally, he will address ongoing initiatives aimed at advancing education in the sustainable development of biomedical devices and promoting translational research in the commercialization of medical devices.

Glucose monitoring is fundamental to managing diabetes, which affects approximately 14% of the global adult population. However, the inconvenience and high cost of current invasive solutions limit accessibility. To address these challenges, we have developed Talisman, a needle-free wearable continuous glucose monitor (CGM) based on magnetohydrodynamics (MHD). Talisman, designed for large-scale manufacturing, comprises a reusable, rechargeable device, replaceable sensors, and a smartphone app. In a study involving 100 participants (10 healthy individuals and 90 with type 2 diabetes), Talisman achieved a Mean Absolute Relative Difference (MARD) of 13%, demonstrating strong correlation with reference blood glucose measurements. Safety assessments, including dermatological examinations and measurements of transepidermal water loss, revealed no evidence of adverse skin reactions. By providing an accurate, cost-effective, sustainable, and needle-free glucose monitoring solution, Talisman has the potential to significantly enhance diabetes management and expand access to glucose monitoring globally.

Affordable, disposable diagnostic platforms are critical for decentralizing healthcare and enhancing global health outcomes. GrapheneDx has developed an innovative solution leveraging Graphene Field Effect Transistors (GFETs) and scalable silicon wafer fabrication technology. This fully disposable, highly
portable, instrument-free platform enables the multiplexed detection of up to a dozen targets, including proteins, small molecules, and nucleic acids. Delivering highly accurate results within minutes, without requiring instrumentation, this transformative technology bridges the gap between cutting-edge biosensing and widespread, affordable accessibility in global healthcare.

The reshoring of advanced High-Density Interconnect (HDI) printed circuit board (PCB) manufacturing in the United States presents a strategic opportunity to not only strengthen domestic production capability and capacity, but presents a path to environmentally responsible manufacturing. With increasing regulatory pressure and the need for more sustainable operations, the integration of Zero Liquid Discharge (ZLD) systems is becoming essential. ZLD technology eliminates wastewater discharge, enabling PCB manufacturers to minimize environmental impact while ensuring compliance with strict water regulations.

Beyond traditional PCB production, reshoring also opens the door to bringing back advanced technologies that are currently unavailable in the US, such as IC substrate manufacturing with Semi-Additive Processes (SAP). These capabilities are critical for reducing reliance on overseas suppliers.

In this talk, we will outline the roadmap for expansion, detailing how ZLD and advanced manufacturing technologies can be integrated into US facilities.”

Advances in digital light processing (DLP) now enable additive micro-manufacturing of parts on the centimeter scale, with features on the order of 10 μm using UV curable polymer or ceramic resins. Leveraging this technology we have developed an approach to fabricate interposers with near arbitrary routing of electrical signals. Ceramic interposers with curved and angled vias with diameters and pitches as small as 9 µm and 18 µm, respectively and sizes up to 2 cm x 2
cm x 0.7 cm were printed. The vias were subsequently metallized by melt infiltration to provide
electric pathways with resistivities as low as ~4 x 10 -8 Ω·m. We demonstrated two different
interposer designs: 1) a curved interposer intended to connect a curved infrared detector with a
planar read-out integrated circuit (ROIC); and 2) a fan-out interposer that spreads the pitch of an array of vias from 60 µm to 220 µm. These interposers require thousands of curved and angled vias, respectively, that cannot be realized using conventional microelectronics processing approaches. The unprecedented via routing enabled by this additive technology offers new packaging options for the 3D integration of microelectronic subsystems.

In the current printed electronics landscape, the scalability of printed electronics is constrained by the sources used to sinter material. Currently, thermal ovens and infrared lamps have high temperatures and long processing times, which limits the material choices and slows production significantly.
This talk will focus on the different types of light/thermal sources available on the market (including, Ovens, LEDS, Lamps, and Lasers), and a brief look at the history of these light sources.
Additionally, we will cover the relevant specifications for selecting sources for sintering and curing of printed electronics. In addition to relevant challenges and limitations associated with each source type.
Leveraging strengths and overcoming the weaknesses of the source used for sintering is critical to the expansion and adoption of printed electronics today and into the future. Understanding these parameters is the first step in this journey.

This presentation explores recent materials development for high conductive printed electronics circuits. We will discuss the key properties of these materials, including their conductivity, flexibility, and durability, which are crucial for electronics applications. We will review the various materials used, such as Silver, Silver Plated Copper (SPC), and Water-Based Carbon, discussing their performance and potential for the future of printed electronics. We will also review the different application techniques, like screen printing, gravure and pad printing, highlighting their respective advantages and disadvantages.

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The adoption of medical wearables in healthcare remains challenging. While there is a clear need to
transition toward digital, data-driven care, actual uptake—particularly in terms of reimbursement and
clinical integration—has been slow. One area where the benefits of digital innovation could be
especially impactful is wound management.

A compelling example of successful digital health implementation is continuous glucose monitoring
(CGM), which has transformed diabetes management by enabling real-time tracking, early
intervention, and improved patient outcomes. Wound care could benefit from a similar digital
Transformation.

Wound healing and early signs of infection can be tracked using a range of biophysical markers—such
as temperature, oxygen saturation, and pressure—as well as chemical and biological indicators
including pH, nitric oxide, and bacterial presence. However, wound assessment still often relies on
subjective observation rather than continuous, objective data.

Recent advancements in miniaturized electronics, sensor technologies, sustainable materials, and
scalable manufacturing are paving the way for next-generation solutions in wound care. These
innovations have the potential to improve healthcare efficiency, reduce clinical workload, accelerate
healing, and enhance both patient outcomes and quality of life—while also reducing the cost of care.

In this work, we present insights from medical and technology experts on the future of smart wound
care. A key enabler identified is hybrid printed electronics, which allow for scalable, cost-effective,
large-area and more sustainable manufacturing of smart wound dressings. Our research shows that
integrating components onto flexible substrates significantly enhances comfort and wearability,
compared to traditional rigid circuit board-based approaches.

We are also exploring eco-friendly materials with improved functionalities, supporting the
development of more sustainable medical devices.

Guided by clinical feedback, we developed several smart wound dressing concepts and conducted lab
testing to evaluate sensor accuracy, sensitivity, and wear duration over 5–10 days. Results highlight that
integrating multiple sensor modalities into a single flexible platform remains a major challenge—each
modality requires different material build-ups and design considerations.

The successful commercialization of smart wound dressings will depend on collaboration across
sectors—including technology development, manufacturing, clinical research, healthcare systems, and
policy reform. From a technical standpoint, once reliable integration is achieved and supported by
clinical validation, smart wound care will become a tangible and transformative reality

Physiological monitoring is essential for early detection of health anomalies and continuous performance assessment, particularly in high-demand operational settings such as defense and aerospace. However, conventional wearable systems are often limited by rigid electronics, poor skin conformity, and signal degradation during movement - factors that compromise long-term reliability and usability. This study introduces TacMON, a textile-based physiological monitoring garment and next-generation compression eGarment platform. TacMON employs a novel Soft Electronics Assembly method to embed conductive pathways directly into stretchable textiles, enabling seamless biosignal acquisition with enhanced flexibility, durability, and wearer comfort. TacMON’s performance was validated through the development of PHYSIO, an aircrew physiological monitoring solution fabricated from flame-retardant materials and tested in U.S. Air Force cockpit environments. Human subject trials confirmed reliable ECG and respiratory signal acquisition under dynamic and in-flight conditions, demonstrating stable signal fidelity and robust system performance.

Printed electronics has become a key technology for the automotive industry, thanks to its undeniable advantages like, lightweight, high integrability, mechanical flexibility and design freedom as well as high-volume and low-cost production capabilities. In most cases it acts as an almost imperceptible servant in a variety of applications to make our car journey, more comfortable, safer and convenient – in some cases already for many years. For instance, the seat belt reminder function enabled by a printed electronic device, contributed decisively that fastening the seatbelt became a matter of course for people. Thus, it has been helping to save thousands of lives and prevent serious injuries until now for more than 25 years. In fact, since the beginning printed electronics played a significant role when important advances were made in the area of passenger safety in automobiles, which keeps on setting cornerstones for additional supporting functions till today. In this regard, printed and flexible electronics has emerged to be an enabler for cost-efficient solutions to support new trends and helps to meet new, emerging legal requirements and to implement consumer rating incentives. Key drivers in the automotive market are software defined mobility, connected and autonomous vehicles, e-mobility as well as the emergence of smart traffic and road safety applications. It follows that the need for new sensor systems, highly reliable, real-time data acquisition, transfer and processing become more than ever a mandatory prerequisite. So- called software defined sensing solutions will evolve in the future. By fusing individual inputs from standalone sensors, intelligent sensing platforms are created using the methodology of distributed, connected and collaborative sensors to realize novel functions and applications more efficiently, e.g. in-cabin monitoring systems. Within this scope, hybrid printed electronics has an important role to play as potential enabler for upcoming requirements in terms of connectivity & communication as well as edge-computing. Beyond this, advanced infotainment systems, user experience and sustainability are further important drivers and will foster novel applications like lighting technologies, tire state monitoring and smart surfaces as well as novel materials and processes for large scale recyclability of devices. Overall, printed and flexible electronics has a promising future in the automotive sector as continued advances in materials science and manufacturing technologies will pave the way to comply with upcoming novel trends in the future mobility.

Manufacturers’ very demanding reshoring and miniaturization roadmaps are creating much
higher expectations for material deposition processes. New capabilities are urgently required,
from higher resolution and accuracy to enhanced flexibility in material selection and design, all
in a digital and sustainable form.
The ideal solution is an additive digital material deposition process with industrial productivity
and low cost of ownership
With Continuous Laser Assisted Deposition (CLAD), ioTech brings to reality a capability to
build functional structures by delivering a combination of robust, high-speed, high-resolution,
high-accuracy and multi-material deposition process.
CLAD can be applied to multiple use cases. In this presentation, we will explain the technical
aspect of how laser can transfer material and will introduce the io300 system. We will focus on
the new capabilities that the io300 creates, going well beyond what current technologies can
deliver. The capabilities to be show-cased include 2D & 3D multi-material deposition. In one
example of RDL, a single process combines conductive bridges over dielectric structures.
CLAD and the io300 have been warmly welcomed by the industry, attracting innovation
awards, leading industrial investors, prestigious semiconductor customers and co-funding from
the European Union.
Technical background:
In the CLAD technology, a material evenly coated on a carrier foil, passes under a laser. The laser applies a short burst of energy which releases perfectly consistent drops of material onto the substrate below. The material drops can then be sintered or cured inline. CLAD delivers both high-resolution and a very wide range of geometries and form factors. Fully digital, CLAD requires neither tools such as nozzles or screens nor material reformulation.

Printed graphene-based biosensors are transforming molecular diagnostics by enabling amplification-free, label-free detection of nucleic acid targets in real-time, outside of traditional laboratory settings. This talk introduces a scalable diagnostic platform that uses screen-printed, functionalized graphene inks to deliver highly sensitive and selective results—without the need for PCR, enzymes, or fluorescent labels.

We will explore how functionalized graphene inks, tailored for screen printing, provide the electrical and chemical properties necessary for real-time detection without amplification. The presentation will cover:
Ink formulation and stability challenges
Integration with ssDNA probes and fluidics systems
Signal transduction mechanisms
Use cases in infectious disease, oncology and beyond
Validation, regulatory and commercialization pathways
This work demonstrates how nanomaterials and additive manufacturing can disrupt conventional molecular testing—making rapid, on-site diagnostics possible anywhere, from clinics and farms to industrial sites and homes.

Aerosol jet printing (AJP) offers significant potential for conformal electronics fabrication, but
realizing this potential in a manufacturing environment remains a challenge. This presentation
will focus on efforts to reduce two key barriers to this vision: manufacturing reliability and
complex motion planning. To support process consistency, an AJP closed loop control system
has been developed that automatically adjusts process parameters to maintain stable print
output. This was validated on commercial printing equipment for >8 hour print runs, effectively
mitigating drift and limiting process variability. This improves manufacturing readiness of AJP as
a general technology, streamlining process development and quality monitoring for both planar
and conformal printing. Complex toolpath planning presents a second challenge to conformal
deposition, undermining the rapid prototyping capability of this digital printing method. This
presentation will discuss a recently developed computational framework to efficiently wrap
complex planar toolpaths onto curved 3D geometries, expediting the design-to-manufacture
workflow for conformal electronics for aerosol jet or other direct write deposition modalities.
Together, these capabilities highlight opportunities to better leverage the digital nature of direct
write printing methods to advance reliability and agility for conformal electronics fabrication.

Black phosphorus (BP) has emerged as a promising two-dimensional material due to its unique properties, including a tunable bandgap, high carrier mobility, and strong light-matter interaction. In recent years, research efforts have intensified to explore the potential of BP in various applications, particularly in photonics and printed electronics. Moreover, the development of scalable synthesis routes has enabled the production of black phosphorus inks in large quantities, making them suitable for industrial applications. This abstract presents an overview of our team’s latest advancements in black phosphorus photonic inks, focusing on their synthesis, characterization, and device applications for photonic devices.

BP photonic inks were utilized in the fabrication of optoelectronic devices using aerosol jet printing. Example devices include pn diodes and photodetectors, as we build towards ink-printed light-emitting diodes. Looking forward, BP photonic inks offer opportunities for the development of novel active components via heterogeneous integration onto photonic chips, including light emitters and detectors for silicon photonics.

Additionally, the compatibility of BP photonic inks with printed electronics processes presents exciting prospects for the integration of BP-based materials for semiconductor device applications. Aerosol jet printing and other additive manufacturing techniques offer a pathway for the scalable fabrication of BP-based semiconductor devices with tailored functionalities. This opens up avenues for the realization of flexible and wearable electronics, as well as the development of low-cost sensors for environmental monitoring and healthcare applications.

Addressing a global healthcare challenge – Jones Healthcare Group innovates with connected packaging design, integrating sustainability, automation compatibility, and user-friendliness to improve medication adherence and patient medication therapy. This session will discuss the story of how we developed connected adherence packs, where we are going with them and real world patient data that shows the technology can be beneficial for a patients’ outcomes.

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Technology is rapidly transforming the landscape of healthcare, particularly in the realm of medical wearables. Cutting-edge technologies are enabling the development of highly efficient and cost-effective devices capable of real-time health monitoring. From miniaturized sensors to advanced data analytics, these innovations are driving the next generation of wearable technology.

In this presentation, we will review the potential synergies of diverse technologies in creating innovative electronic skin patches, with a focus on printed electronic, materials and industrial processes. These wearable devices promise to revolutionize healthcare by enabling round-the-clock tracking of vital signs and other health metrics, facilitating timely identification of potential health issues, and providing individuals with the tools to proactively manage their health. By exploring the intersection of various technological advancements, we aim to shed light on the future of wearable healthcare and its transformative impact on patient care.

Mark is the Senior Sales Manager for North America at Linxens Healthcare, where he leads the charge in driving growth in the field of Medical Wearable ("Stick to Skin") solutions. He joined Linxens in April 2025 and has over 23 years of sales and business development management experience within the Printed Electronics industry.

Prior to his current role, Mark held key senior sales leadership roles at East West Manufacturing (Eastprint Division) and Parlex Corporation, where he established himself as a trusted customer advocate within the Medical and Healthcare markets.

Mark has an education from the U.S. Navy in Advanced Electronics and Electro-Mechanical Systems/Communications.

This study explores the use of a novel EEG net, Inknet2, which utilizes high-resistance conductive ink on a polymer thick film, to enable high-quality simultaneous EEG and fMRI imaging. Traditional MR-conditional EEG nets often limit the types of MRI sequences that can be used due to image artifacts and radiofrequency shielding. Inknet2 was designed to address these limitations by reducing interference with magnetic fields, thereby expanding the range of usable MRI modalities during simultaneous EEG-fMRI acquisition.
We employed a multi-step approach to evaluate Inknet2’s performance. Simulations were first used to model the net’s effects on magnetic field homogeneity and image quality. These were followed by phantom scans comparing the image quality of scans using a conventional copper EEG net, the Inknet2, and no net. Subsequently, human imaging studies were conducted on five subjects at 3 Tesla and three at 7 Tesla using both structural and functional MRI sequences, with and without Inknet2, to assess the device's practical impact.
Results across simulations, phantom experiments, and human scans consistently showed that Inknet2 caused significantly fewer image artifacts than conventional copper nets. Moreover, image quality obtained with Inknet2 closely matched that of scans without any EEG net, supporting its compatibility with a broad array of MRI sequences at both standard and ultra-high field strengths. These findings highlight the potential of Inknet2 to facilitate advanced multimodal neuroimaging studies that were previously constrained by hardware limitations.

The growing accumulation of electronic waste (e-waste) presents a significant environmental challenge due to the non-degradable nature and limited recyclability of conventional polyimide (PI)-based substrates. We report the design and synthesis of a family of photopatternable, degradable polyimide network substrates that maintains high mechanical and electronic performance for reprocessible flex electronic circuitry. By incorporating degradable ester linkages within diallyl bisimide monomers and thiol crosslinkers, the substrate can be depolymerized under mild conditions for reprocessing without damaging the electronic components. Like other polyimide materials, these material exhibit desirable thermal properties (conductivity, K = 0.37–0.54 W m−1 K−1; degradation temperature, Td > 300 °C), mechanical properties (Young's modulus, ∼50 MPa; ultimate elongation, dL/L0 > 5%), and stable dielectric properties (dielectric constant, Dk = 2.81–3.05; dielectric loss, Df < 0.024) suitable for flexible electronic applications. Furthermore, the photopatternability can be leveraged for multilayered circuit manufacture. Our resin possesses a low viscosity for deposition at modest temperatures (< 80C), low shrinkage, and can survive solder reflow processes. By ulitilizing conventional photomasks, we selectively photopolymerize our PI in desired regions for build-up and redistribution layers. This additive approach yields the necessary "via" directly; we can simply remove the uncured and backfill the "via" with a conductor. The next layer's traces and components can then be built conventionally while simultaneously achieving the desired insulation and conductivity with the previous layer. This workflow is repeatable and infinite for an arbitrary number of layers of flexible circuitry. Our proposed manufacturing approach significantly reduces the complexity of building multilayered PI based circuits.

The ability to combine multiple polymeric, metallic, and dielectric structures having nano- and microscale features on flexible substrates opens the door to the production of otherwise prohibitively expensive functional films. Scalable and cost-effective R2R processing can create these materials at dramatically reduced costs and with increased throughput. Substrates with multiple functionalities are an enabling technology for applications in flexible electronics and other fields, such as high-efficiency OLED lighting (trapped light extraction), waste-heat-to-electricity conversion (IR rectennas), spectral signature control (LWIR plasmonic metamaterials), light guiding for edge-lit films, to name a few. An important example of this kind of multi-dimensional, multi-material process that will be discussed in this talk is our development of working substrates for OLED solid-state lighting panels with improved output efficiency using a combination of periodic nanoarrays for extracting trapped light and high transparency (&gt;98%) conformal metal mesh electrode layers for large-area current spreading. Our company, MicroContinuum, Inc. (Watertown MA), develops custom solutions, from proof-of-concept to production scale-up, for clients’ demanding applications.

3D Printing of Electronics is being used at NASA Goddard Space Flight Center to develop custom solutions not achievable with traditional manufacturing methods. Unique designs can be achieved that meet mission requirements to achieve science previously not achievable, such as designing communications and instrumentation antennas to be printed on instrument and system surfaces. The trades often made between material dielectric constant, material thickness, mechanical compatibility, and noise minimization can all be mutually accommodated by leveraging printed antenna designs. Custom designs for astrophysics measurements will also be discussed, extending the constellation of achievable measurement for x-ray detection and polarimetry.
Printing strain gauges, localized heaters, and temperature and humidity sensors can help monitor instrument and electronics health as well as take relevant measurements. The capability to print localized sensors and heaters exactly where they are needed to make critical measurements or provide temperature control is a far-reaching advancement in technological development that can increase reliability of spacecraft missions, all while saving size, weight and power (SWaP).
The 3DPE lab also prototypes Printed Circuit Boards, enabling nonrecurring engineering cycles to occur up front as designers complete their preliminary designs. Iterating circuit board designs early and often can quickly eliminate design flaws, enabling a more agile project posture on the path to final flight boards. This creates a more efficient board design cycle, with gains in both cost and schedule.

With the rapid development of various wearables aimed at preventive care and disease management, the need for suitable batteries has become essential. To drive this transformation further, we are excited to introduce our new series of Li-ion rechargeable batteries, specifically designed for wearable devices. These batteries are ultra-thin, lightweight, safe, long-lasting, and fast-charging. Our semi-solid-state batteries feature proprietary crystal-oriented ceramic electrodes, distinguishing them from conventional Li-ion batteries. By utilizing active materials sintered as ceramics with minimal liquid electrolyte, we enhance both safety and reliability by eliminating organic binders. In this session, we will provide detailed into our battery technology and our contribution, focusing on our latest battery.

As the demand for wearable and stretchable electronics continues to expand, the need for advanced conductive inks capable of withstanding mechanical deformation and environmental exposure becomes increasingly critical. Printed electronics play a vital role in enabling flexible and stretchable devices, but traditional conductive inks often struggle to maintain performance under repeated stretching, bending, and washing. Developing a next-generation conductive ink that meets these rigorous requirements presents significant challenges in material formulation, adhesion, and conductivity retention.
This talk will explore the key considerations in designing a robust conductive ink tailored for wearable and stretchable applications. It will address the challenges of achieving optimal stretchability and durability while maintaining reliable electrical performance. By examining innovations in material science and printing techniques, this discussion will highlight how these advancements are shaping the future of flexible and wearable electronic devices.

The direct attachment of chiplets to 2D embroidered conductive yarn networks at a 180µm pitch enables a range of novel textile-integrated systems with superior capabilities and comfort. By distributing and disaggregating these dense semiconductor devices, the non-native rigidity imparted on textiles with the addition of traditional electronics can be almost entirely mitigated. This direct die attach method is an important step toward the scalable manufacture of leading-edge sensor systems that look and feel like the fabrics people wear every day. Textile-chiplet integration methods and materials are positioned at the intersection of traditional textile and electronics manufacturing methods. This deliberate constraint enables the use of highly automated textile and electronics manufacturing equipment conducive to high-throughput additive planar assembly methods widely adopted in their respective industries today. This enabling industrial advantage in combination with the requisite design, modeling, and manufacturing execution tools presents a clear path to the cost-effective manufacture of a broad range of impactful textile-integrated systems at scale.

The presentation will focus on a method for creating aligned nickel (Ni) nanoparticles with unique and customizable structures on various substrates for electronic and magnetic applications. The ink can be printed in ambient conditions, and upon heating in the presence of a magnetic field, it forms aligned elemental Ni nanostructures over large areas. The use of templates or subsequent purification is not required. This technique is very flexible and allows the preparation of unique patterns to produce structures with enhanced anisotropic electrical, magnetic, and thermal properties.

Additive manufacturing methods offer countless new opportunities for electronics applications, and even more so when combined with other emerging technologies such as functional fabrics. NextFlex, Advanced Functional Fabrics of America (AFFOA), and the Drexel University Center for Functional Fabrics, are collaborating to integrate physiological and situational awareness monitoring electronics into soldiers' garments for their safety and security in the field. The project team has integrated additively manufactured hybrid electronics and functional fabrics into a soldier’s shirt, body armor vest, and helmet creating a wired and wireless network of sensing and communication devices.
While this project was focused on military applications, there is clearly an appetite for civilian applications as well. This framework of sensing, compute, and communications integrated imperceptibly into textile systems has significant merit for applications including occupational safety or athletic physiological monitoring. In this talk, we will describe both the challenges that the team faced as well as some of the innovative solutions implemented during the project.

Existing devices—such as cell phones, computers, and robots – are made from rigid materials, which is in direct contrast to the soft materials that compose the human body. In this talk, I willdiscuss several topics relate liquid metals within the context of creating devices (actuators, sensors, electronics) with tissue-like properties. Gallium-based liquid metals are often overlooked despite their remarkable properties: melting points below room temperature, water-like viscosity, low-toxicity, and effectively zero vapor pressure (they do not evaporate). Normally small volumes of liquids with large tension form spherical or hemi-spherical structures to minimize surface energy. Yet, these liquid metals can be patterned into non-spherical shapes (cones, wires, antennas) due to a thin, oxide skin that forms rapidly on its surface. Recently, we have discovered a simple way to separate the oxide from the metal as a way to deposit 2D-like oxides at ambient conditions. The process works by dragging a meniscus of liquid metal across a surface. At the right conditions, the fluid inside the meniscus is unstable and only oxide is left behind on the surface. Doing so enables direct-write printing of very thin (~3 nm) oxides without the need for vacuum processing. Surprisingly, the oxide is conductive because the printing process deposits a bilayer film inside which is a metallic-like layer. The ability to deposit oxide coatings is important for electronics, sensors, optics, and touch screens.

The talk titled “Scaling Innovations: Industrial Electronics Manufacturing via Inkjet and EHD Printing” will explore the transformative potential of advanced printing technologies in the electronics manufacturing industry. Inkjet and Electrohydrodynamic (EHD) printing are emerging as pivotal methods for producing high-precision electronic components. These techniques offer significant advantages over traditional manufacturing processes, including reduced material waste, lower production costs, and the ability to create complex, miniaturized structures with high accuracy. The presentation will delve into the fundamental principles of these technologies, highlighting their unique capabilities and the scientific advancements that have enabled their development. In the second part of the talk, we will examine real-world applications and case studies where inkjet and EHD printing have been successfully implemented in industrial settings revolutionizing the way electronic components are designed and manufactured. The discussion will include insights into the challenges faced during the adoption of these technologies and the innovative solutions that have been developed to overcome them. Attendees will gain a comprehensive understanding of how these printing techniques are being integrated into existing manufacturing workflows and the impact they are having on product development cycles. Finally, the talk will address the future prospects and potential for scaling these innovations to meet the growing demands of the electronics industry. We will explore ongoing research and development efforts aimed at enhancing the capabilities of inkjet and EHD printing, such as improving printing resolution, increasing production speeds, and expanding the range of printable materials. The presentation will also consider the broader implications of these advancements, including their role in promoting sustainable manufacturing practices and enabling the creation of next-generation electronic devices. By the end of the talk, attendees will have a clear vision of the future landscape of industrial electronics manufacturing and the pivotal role that inkjet and EHD printing will play in shaping it.

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Transparent conductive films are critical for a wide range of applications, from touch screen displays and electromagnetic interference (EMI) shielding to photovoltaic cells and de-icing systems. Metallic mesh stands out as a particularly promising option, offering superior optical transmission, high electrical conductivity, and a broad transmission spectrum without bandgap limitations. Although metallic wire networks have been successfully deployed in applications such as EMI shielding, window de-icing, heat reflection, and transparent electrodes, fabricating truly “invisible” meshes—those with micron-scale linewidths—has traditionally required costly tools, limiting their broader adoption.

An electrical circuit printed on a TPU substrate can be used for many diverse applications for
wearable and flexible electronics, it is usually, but not exclusively, applied to a textile woven or
nonwoven and it can carry signals, monitor the level of stretch, transfer heat etc., but it is usually difficult to print. In fact, screen printing works best with flat and stable substrates. During the printing process, the typical difficulties in the use of TPU materials are caused first by the printed sheet sticking to the mesh and lifting off the platen after being printed and second by the exposure to the curing temperature of the ink that affects the flatness and the dimensional accuracy of the TPU and the printed circuit on it. These issues are difficult to address and result in a great amount of scrap and, at times, in the total inability to produce a workable circuit. Once (or if) the printed circuit is finally produced there is a need for a dielectric layer to be applied over the tracks, usually a liquid varnish that polymerizes and becomes a stiff and rigid film. This type of dielectric layer does not match the elasticity of TPUs and breaks when Stretched. During the final step, the transfer of the printed circuit on the textile material, the heat necessary to obtain a good bond between the TPU printed circuit and the textile will soften the TPU and damage the integrity of the tracks thus reducing the level of conductivity. We have developed a product line and an application process to eliminate all these issues and allow the production of multiple layer circuits. The base product is called ELECROM STRECH TS, available as CLEAR or WHITE version, and it is used effectively in combination with ELECROM STETCH ENCAPSULATE that replaces the dielectric layer but also can work as a base for multiple based circuits. We will show a short video that explains the printing and assembly procedures for the
ELECROM STRECH product line. The sample project chosen for this video is a circuit to be
applied to a glove and furnish pressure sensors to the fingers of a hand to monitor the amount
of force applied to hold an object. Next is a 2 min video showing the various steps of the process. The fin We have compared the conductivity of ELECROM STRETCH TS which is a TPU supported by a heat stabilized and surface treated PET vs a STD PET substrate used for the production of membrane switches. The table shows a very similar behavior in terms of conductivity. The conclusion will list a number of application sectors, previously unthinkable, that can be now approached with this new material and process.

Cost-effective copper conductive inks are considered as the most promising alternative to expensive silver conductive inks for use in printed electronics. However, the low stability and high sintering temperature of copper inks hinder their practical application. Herein, we report air-stable and highly conductive copper-nickel complex inks. We found that the Cu-Ni inks can form uniform Cu@Ni core-shell nanostructures by a self-assembling process, resulting in the nickel coating on the surface. Thus, the addition of nickel overcomes the weakness of conventional copper inks, achieving high oxidation resistance and high electrical conductivity. The formed Cu-Ni wiring shows high conductivity of 10 μΩ cm and the high oxidation resistance can be maintained at 180°C. Furthermore, the printed Cu-Ni alloy patterns exhibit good adhesion to flexible substrates and high flexibility, making them ideal for flexible electronics such as flexible RF-ID tags and various wearable sensors.

Additive manufacturing (AM) methods are continuing to mature not only to fabricate structural and prototype parts but also to fabricate high-quality electronic components and circuits. Direct-write (DW) printing is becoming a powerful tool for AM fabrication of printed circuitization, printed interconnects, and other printed passive circuit components. These Flexible and printed hybrid electronics (FHE & PHE) fabrication methods provide specific advantages for heterogeneous integration at both the package and board levels for RF and conformal electronics. PHE fabrication methods are being used to fabricate demonstrator parts for board level printing of polymer coatings for circuit card assembly fabrication steps. Additional PHE fabrication methods are being matured in order to expand board level printing to include printed resistors, capacitors, and inductors. Printable versions of passive components will provide next-gen manufacturing methods that include i) improved reliability, ii) decreased size, weight, and power consumption (SWaP) along with reducing/eliminating the need for solder attach of microelectronics components, iii) enabling both component level tuning by design and while in-situ printing, and iv) enabling new form factors for integrating electronics directly into structural parts. Such PHE fabrication capabilities that are being developed at the Raytheon UMass Lowell Research Institute (RURI) will be highlighted.

High current power electronics applications present challenges for traditional printed electronics processes and materials. In a perfect world, it would be possible to digitally print conductive traces that mimic the performance of heavy gauge copper wire for these applications. This talk will present an emerging technology that does just that. On-demand molten metal jetting (MMJ) jets discrete droplets of molten metal towards a moving substrate where they cool down and solidify to produce the desired circuit geometry. This talk will present recent results in which molten copper and silver traces are printed with conductivities matching those of the bulk metals. An exciting recent development that will be presented is the first demonstration of multi-nozzle MMJ that further increases the speed and throughput of the process. The talk will conclude with discussion of remaining challenges to be overcome with this new process.

Our latest generation developments in Screen, Laser Exposure and Rotary Screen Printing enable printed electronics producers to reach high quality at industrial production levels. The presentation will take you through one of our latest case studies step by step, from ink selection to final production. This will show how vital it is to not only understand the Printing itself, but also having full control over the Screen specifications and Laser Exposure process.

1: The Challenge and the Approach : The increasing demand for flexible and wearable electronic devices necessitates the development of circuit boards capable of withstanding significant mechanical deformation. Traditional PCBs struggle to maintain conductivity and structural integrity under strain, limiting their applicability in dynamic environments. This presentation introduces a novel approach to stretchable PCBs utilizing liquid metals as conductive traces.
2: Key Features and Benefits: The core of this technology lies in the unique properties of liquid metals, which maintain electrical conductivity even under continuous stretching. These liquid metal traces are encapsulated within a flexible substrate, forming a robust and adaptable circuit structure. This approach offers significant advantages in terms of durability, stretchability and conformability compared to conventional rigid or flexible PCBs. The inherent fluidity of the conductive traces allows for dynamic reconfiguration of the circuit pathways, enabling new possibilities for adaptive electronics.
3: Potential Impact: This technology has the potential to revolutionize the design and fabrication of wearable electronics, biomedical devices, and soft robotics. The ability to create highly stretchable and conformable circuits opens up new avenues for integrating electronics seamlessly with the human body and other dynamic surfaces. Future research directions include developing advanced fabrication techniques for creating complex stretchable circuits and preparing for higher volume production. This technology promises to enable a new generation of electronic devices that are more robust, adaptable, and integrated with their environment.

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Electrochemical sensors are used for medical, agricultural, and environmental monitoring. The range of applications is expanding and extends to medical and wearable electrodes and sensors; for health and wellbeing monitoring, as well as cosmetic applications. The presentation will provide an insight into newer requirements of biosensor materials, material properties and performance evaluation methods used for characterization of electrochemical functional materials.