TechBlick’s event on 29-30 March 2023 focuses on all additive technologies used and/or suited to prototyping and manufacturing of semiconductor packaging - from sub-micro to macro scale - from low-frequency to mmWave - from 2D to 2.5D and 3D.
Additive electronics can not only replace subtractive processes based on cost and green credentials but can also enable truly novel designs, components, and...
Watch the 5-minute excerpts of the presentations from the following companies:
Aix-Marseille Université
Pol Sopena Martinez
Postdoc Fellow
Laser-induced forward transfer: Improved versatility for printed electronics applications
Over the last decades, printed electronics has gained importance as a cost-effective alternative to ...
Celanese Micromax Microcircuit and Component Materials
Hee Hyun Lee
Micromax™ Senior R&D Scientist
Designing Ink-Jet and Nozzle Dispensable conductive/dielectric Inks for electronic applications
Additive printing technology has evolved to realize functional electric pattern on various type of s...
Centre de Transfert de Technologies Ceramiques
Elodie Pereira
R&D Project Manager
Digital printing for ceramic based electronics
While the uses of ceramics in electronic devices are multiple, the manufacturing processes are also ...
Cicor Group
Karl-Heinz Fritz
VP Technology & Development
Embedded components in plastic parts including the subsequent connection using aerosol jet printing.
Domicro
Aart-Jan Hoeven
Business Development Manager.
Inkjet Printing For Applications With Small Feature Sizes
The technology for integrating dies is an important enabler for the realization of thin applications...
Dracula Technologies
Florence Archet
R&D Manager
Inkjet Printed Flexible and Free Design OPV Modules for Indoor Application
Inkjet printing is a unique coating and printing technique. Fully digital, it allows to print design...
ETSMTL
Sylvain G Cloutier
Professor and Chair
Inkjet-Printed Materials and Flexible Hybrid Electronic (FHE) Devices
This TechBlick presentation will discuss new inkjet-printable optoelectronic materials and their int...
Electroninks
Melbs LeMieux
Co-Founder & President
Metal Complex inks for semiconductor packaging applications
Elephantech
Masaaki Sugimoto
Co Founder/SVP
Inkjet-Printed PCBs, a paradigm shift to a needs-driven approach to decarbonization
Elephantech, a printed electronics firm using inkjet technology founded in 2014, began producing fle...
Essemtec AG
Irving Rodriguez
Novel automatic repair of populated PCBs in a cost-effective and adaptive way
Repair of soldered components is a constant necessity in the electronics industry. Product performa...
Exaddon
Wabe Koelmans
CTO
Microscale Metal 3d Printing
FTMC
Karolis Ratautas
Researcher
Selective Surface Activation Induced by Laser (SSAIL) – technology of electric circuit formation on various 3D dielectric surfaces
Electric circuit traces formation on 3D-shaped dielectrics is one of the highest challenges in 3D Me...
FUJI CORPORATION
Ryojiro Tominaga
Development Center Engineering Department
Section manager
Digital manufacturing of 3D electronics with low temperature SMT
Additive manufacturing driven by digital 3D data is effective approach to make unique shape electric...
Fraunhofer ENAS
Prof. Ralf Zichner
Manager Printed Functionalities
Robot-guided inkjet printing for the production of printed electronics on arbitrary 3D components
The industrial demand for individualized (quantity 1) functionalization of components and devices is...
Fraunhofer IAP
Manuel Gensler
Chemist
High Resolution EHDJET Printing of PEDOT:PSS for Display Applications
PEDOT:PSS is a versatile organic semiconductor used in a variety of organic-electronic applications ...
Fraunhofer IKTS
Prashantkumar Pandey
Researcher | PhD Scholar
Additively printed hybrid ceramic components for microsystem applications
Ceramics are one of the more difficult materials to fabricate into complex morphologies and are chal...
Grenoble INP-Pagora
Davide Beneventi
LGP2, CNRS Research Director
Rapid prototyping of 3D electronics using direct ink writing and 6-axis robots
Over the last decade the integration of printed electronic boards and conductive paths on the surfac...
HighLine Technology
Maximilian Pospischil
CTO
(TBC) Multi-head ultra-fine dispensing of high-viscosity pastes for PV and other applications
Humboldt-Universität zu Berlin -
Felix Hermerschmidt
Postdoctoral Researcher
Combinatorically Inkjet-Printed Metal Halide Perovskite Optoelectronic Devices
Beyond the use in home and office-based printers, inkjet printing has become a popular structuring a...
Hummink
Frederic Raynal
VP of Business Development
Breaking the sub-micron printing wall
IMTEK - University of Freiburg
Zhe Shu
Group Leader
StarJet technology - Direct molten metal printing for printed, flexible, and 3D electronics applications
ImageXpert
Kyle Pucci
Sales Engineering Manager
(TBC) Machine vision to automate industrial production of micron-sized electronics with inkjet printing
J.A.M.E.S GmbH
Alexandre Schaefer
Business Development Manager
Accelerating the development of AME
Additively manufactured electronics (AME) is a very important but currently a small part of additive...
Lithoz
Dr.-Ing Serkan Nohut
(TBC) 3D ceramics for 3D printed electronic applications
NASA
Beth Paquette
Aerospace Engineer
Additive Manufacturing of Electronics for Space Applications”
NRCC
Chantal Paquet
Senior Research Officer
(TBC) Direct printing of functional 3D objects using vat
Nanyang Technological University
Guo Liang
Ph.D. | Researcher
Digital manufacturing for mass customization of printed electronics using aerosol jet printing technology
Printed electronics is a rapidly growing field, and new technologies and materials are constantly be...
Neotech AMT
Martin Hedges
Managing Director
Real and Emerging Applications of 3D Printed Electronics
North Carolina State University
Jingyan Dong
Professor
Direct EHD Printing of VIA Interconnects towards Multi-Layer Flexible and Stretchable Electronics
Direct printing of flexible and stretchable conductors provides a low-cost mask-less approach for th...
Notion Systems
Kai Keller
VP Business Development Europe
Replacing subtractive with additive processes in electronics production - making an impact with inkjet.
Ntrium
Seyoung Jeong
CEO/Ph.D
Introduction to Mass-producible Component Level EMI Shielding Technology
Electromagnetic interference is one of the most critical problems that must be thoroughly solved to...
Quantica
Ben Hartkopp
Co-Founder
Breaking Barriers in 3D Printing: Jetting Functional, High-Viscosity Materials
SAULE Technologies
German Soto
Materials science specialist
Update on the technology progress of printed perovskite PV
Metal halide perovskites in the last decade emerged as a new class of materials for highly efficient...
Seoul National University
Yongtaek Hong
Professor
Maskless patterning of electrodes for 3D deformable and stretchable electronics applications
Recently in-mold or 3D deformable electronics and stretchable electronics areas have gained a lot of...
TCL Corporate Research
Longjia Wu
Materials Development Expert/ Lead R&D Manager
The Development of IJP-QLED Display towards its Commercialization
Quantum dots light emitting diodes(QLEDs), have been widely recognized as the most promising next-ge...
Trinity College Dublin
Valeria Nicolosi
Professor
2D materials and MXenes for digital printed electronics
University Paris Cité
Vincent Noel
Professor & Director of the Printup Institute (CEO)
Perspectives and Pitfalls of Inkjet-Printed Electronics: A Chemist's Point of View
Printed electronics is experiencing considerable growth due to the ability of inkjet printing method...
University of Michigan
Tae H. Cho
Research Assistant
Integrating Area-Selective Atomic Layer Deposition with Electrohydrodynamic Jet Printing to Enable Additivve Nanomanufacturing
University of Montreal
Christos Boutopoulos
Professor
Drop-on-demand laser-assisted bioprinting of cells and hydrogels
University of Texas
Michael Cullinan
Assistant Professor
(TBC) Selective micro-scale sintering for next generation semiconductor bumps
XTPL S.A.
Łukasz Kosior
Business Development Manager
High resolution printing of functional materials for advanced high density 3D interconnections.
XTPL is a supplier of micron-scale, additive fabrication technology and conductive materials to solv...