MicroLED & AR/VR Connect: Full Program
- khashayar Ghaffarzadeh
- Sep 18
- 8 min read
The show will take place next week on 24 & 25 Sept 2025 at the High Tech Campus, Eindhoven, Netherlands. Explore the program here
The exhibition spots are all sold out and the registrations have long exceeded the 2024 levels. We hope you will join us and we look forward to seeing you all there.
In this article, we introduce the talks that are to be given onsite at the show.
Google – Bernard Kress discusses the evolution of light engine technologies for smart eyewear, highlighting design tradeoffs and innovations needed to enable all-day wearable AR glasses.
Avegant – Edward Tang contrasts LCoS and MicroLED display engines for AR glasses, examining their respective strengths and tradeoffs as the industry moves toward mainstream adoption.
VueReal – Reza Chaji outlines the manufacturing benchmarks microLEDs must achieve—from yield and cost to scalability—to enable transition from niche deployments to broad consumer and industrial adoption.
ITEC – Joep Stokkermans introduces XG-Alpha, a flexible lab tool for microLED development that combines laser-based droplet dispensing and die transfer with in-line metrology, dynamic gap control, and optical inspection—aiming for high-yield, cost-effective assembly and paving the way toward next-gen industrial platforms.
Aledia – Xavier Hugon presents nanoLED arrays grown on silicon, where GaN nanorods form photonic-crystal structures with intrinsic directive emission and tunable RGB capability, enabling >6000 ppi ultra-compact microdisplays with high brightness and power efficiency for AR glasses.
Jade Bird Display – Wei Sin Tan details progress toward monolithic microLED panels, combining stacked InGaN blue/green and phosphide red emitters with wafer bonding and microlens optimization, pushing toward native full-color AR microdisplays.
Mojo Vision – Nikhil Balram introduces a wafer-scale microLED platform uniting 300 mm silicon, GaN-on-Si emitters, quantum dots, and micro-lens arrays—scaling across applications and poised to drive the next wave of AI-enabled microLED products.
ASML – Henri van Helleputte highlights how TWINSCAN lithography systems enable both advanced and mainstream semiconductor nodes, offering flexibility in wafer handling, size, and thickness. By addressing diverse application needs, ASML demonstrates how its platforms unlock new opportunities and drive growth across the rapidly evolving semiconductor market.
Coherent Corp – Ralph Aschenbach presents a breakthrough in industrial microLED laser mass transfer. The new turnkey system integrates high-speed donor/receiver handling, diagnostics, and software to boost throughput, precision, and yield in microLED assembly. By addressing small-pixel handling and wafer inhomogeneities, the solution advances mass transfer from pilot lines toward scalable industrial microLED display manufacturing.
Holst Centre – Akchheta Karki presents laser-assisted die-to-wafer assembly for microLEDs and photonics. A proprietary release stack enables rapid, selective transfer of microcomponents with submicron precision and >99.9% yield, demonstrated on 10,000+ microLEDs. The approach supports adaptive pitch, die-on-demand release, and transfer of thin InP photonic components with <0.5 µm accuracy, offering scalability for advanced display and integrated photonic applications.
Advanced View Technology Inc – Jaekyun Kim presents electrofluidic assembly of nano-LEDs for AR/VR displays. The method enables ultrahigh-density, high-accuracy placement of InGaN blue nano-LEDs on silicon, addressing key limitations of OLEDoS and LEDoS technologies. This approach advances scalable integration for next-generation AR/VR display systems.
Smartkem – Simon Ogier presents high-yield electrical connections to micro-LEDs via chip-first OTFT backplane process. By reversing the conventional flow—placing micro-LEDs first and forming via-patterned polymer planarization layers—ohmic contacts are achieved through sputtered metallization. This approach eliminates eutectic bonding challenges, delivering high light-on yields. Combined with low-temperature OTFT backplanes (<150 °C), the process enables scalable, reliable micro-LED display manufacturing.
CREAL – Tomas Sluka presents vision care at the core of AR. Using ultra-fast sequential light field displays with ferroelectric LCOS modulators and holographic optical element combiners, CREAL delivers AR glasses with natural depth cues, prescription correction, high transparency, and motion clarity—ensuring uncompromised vision alongside immersive AR functionality.
Vizon Tech – Nikhil Sharma presents what it will take to make AR glasses a mass-adopted reality. Drawing on pilots across birdbaths, prisms, waveguides, and MicroOLED/MicroLED displays, the talk highlights the trade-offs between wide FOV, brightness, efficiency, and manufacturability. Prisms with RGB MicroOLEDs emerge as the most practical near-term path to cost-effective, full-color AR. Beyond optics, the discussion covers intuitive interactions—hand/eye tracking, AI voice, neural interfaces—and the role of open-source hardware/software in enabling XR glasses to replace today’s 2D devices.
Lusovu – Ivo Vieira presents a transparent display concept for next-generation AR. The talk addresses key requirements such as high brightness, optical transparency, and compact form factors, while discussing integration challenges and performance metrics critical for scalable, cost-effective production within the microLED ecosystem.
Aegis Rider – Simon Hecker presents Component to Cockpit: High-Performance AR Helmets for Riders & Racers. Aegis Rider develops motorcycle helmets with integrated AR head-up displays, combining sensor fusion, computer vision, and connectivity to deliver real-time navigation, hazard warnings, and rider assistance. The system focuses on safety, ergonomics, and high-performance visualization, bringing AR directly into the cockpit for motorsport and road applications.
QNA Technology – Artur Podhorodecki presents heavy metal–free blue-emitting quantum dots (PureBlue.dots) for UV microLED color conversion and emissive display applications. These UV-curable inks enable efficient conversion to high-quality 455 nm emission, eliminating blue light leakage and improving red/green QD absorption. Recent results from electroluminescent devices using PureBlue.dots highlight their potential for scalable, environmentally sustainable microLED displays.
Raysolve Optoelectronics – Eddie Chong presents a 0.18 cc single-chip full-color microLED light engine enabled by quantum-dot photolithography (QDPR). The 0.13-inch display delivers 320×240 resolution (effective 640×480), peak brightness of 500,000 nits, and >100% DCI-P3 color gamut, all at low power. This wafer-level approach overcomes GaN growth and integration limits, offering scalable, compact light engines with MIPI/QSPI interfaces tailored for AR/XR systems.
Panasonic Production Engineering – Hidehiro Yoshida introduces a high-resolution inkjet system for QD color converters on microLEDs, featuring a redesigned printhead for high-viscosity inks, active circulation to suppress aggregation, and multi-restrictor architecture to stabilize flow. With drive-per-nozzle waveform control, the process achieves 0.8 pL droplets (±1.8%) and 1 µm placement accuracy, enabling fabrication of uniform color-converter microLED panels.
Hummink – Julien Vitiello presents High Precision Capillary Printing (HPCaP) for microLED manufacturing and repair. Using capillary forces and mechanical resonance, HPCaP deposits inks with micron to sub-micron resolution, enabling non-destructive repair of high-resolution defects. The method combines precision, versatility, and ease of integration to address critical bottlenecks in scalable microLED production.
AddOptics – Lucas Klamer introduces Direct Finished Lens Casting Technology for AR glasses, enabling thin, lightweight prescription lenses with integrated waveguide displays. The process supports complex freeform surfaces, eliminates edging and polishing, and allows embedding of electronic components—paving the way for fully integrated, prescription-corrected AR eyewear.
Westlake University / Mold Nano – Min Qiu presents breakthroughs in SiC nanophotonics, including a 4H-SiC metalens with superior thermal stability for high-power laser processing, inverse-designed achromatic high-NA metalenses, and an ultra-thin SiC AR waveguide. The latter achieves single-layer full-color display with wide FoV while suppressing rainbow artifacts, advancing compact, high-performance AR optics.
Lynx Mixed Reality – Stan Larroque reviews display and optical technologies for mixed reality, emphasizing the trade-offs between optical see-through and digital passthrough. The talk highlights how practicality and cost constraints shape design choices for scalable, compelling immersive devices.
KGOnTech – Karl Guttag analyzes the tradeoffs in optical architectures for AR displays, comparing MicroLED, Micro-OLED, LCOS, DLP, and laser beam scanning. The talk highlights the pros and cons of leading display–optics combinations, offering a critical perspective on performance, efficiency, and system integration challenges.
Bühler Leybold Optics – Daniel de Sá Pereira presents advanced optical coating and trimming technologies—from TiO₂ sputtering to long-throw evaporation and ion beam trimming—that enable low-loss waveguides, beam splitters, and gratings for high-performance AR optics.
SCIL Nanoimprint Solutions – Marc Verschuuren demonstrates direct nanoimprinting of optical elements in high-index materials, optimizing light coupling and extraction for compact, high-efficiency microLED AR smart glasses.
Nanoscribe – Joerg Smolenski highlights additively manufactured 3D micro-optics and microlens arrays using highly transparent resins, with scalable transition to NIL, accelerating AR/VR optical component development from prototype to mass production.
Hongshi Intelligent Technology – Yi Liu presents the Hybrid Stack Structure (HSS) platform for monolithic full-color microLED microdisplays, combining dual wafer bonding with QD conversion to achieve higher efficiency, smaller pixels, and simplified processing.
Polar Light Technologies – Chih-Wei Hsu demonstrates pyramidal GaN/InGaN microLEDs delivering native RGB emission without phosphors or QDs, enabling ultra-compact, energy-efficient microdisplays with narrow emission profiles for AR glasses and wearables.
Unipress (Institute of High Pressure Physics) – Henryk Turski introduces Dualtronics, a double-sided epitaxial approach on GaN substrates, integrating LEDs and HEMTs on opposite polarities of the same wafer—unlocking multifunctional III-nitride device architectures.
Fraunhofer IZM – Morten Brink discusses advances in bumping and bonding solutions for high-resolution LED and microLED assembly. He demonstrates AuSn for high-temp stability, indium for sensitive materials, and nanoporous gold for compensating high topographies at pixel pitches below 15 µm.
Adeia – Seung Kang outlines a semiconductor system co-optimization strategy for AR microLEDs, combining monolithic GaN RGB diode growth on 300 mm Si wafers with advanced wafer-to-wafer/die-to-wafer bonding. This 3D integration approach reduces cost and improves scalability for smart glasses.
Delo – Sven Hujo highlights functional polymer adhesives for electrical and mechanical interconnection of mini- and microLEDs. Fine-pitch test boards reveal optimization pathways for die-shear strength and connection resistance, supporting next-gen lightweight assemblies in EVs and AR wearables.
AIST – Xue-Lun Wang demonstrates fabrication of high-efficiency submicron GaN micro-LEDs using neutral beam etching, which suppresses sidewall nonradiative recombination common in ICP-etched devices. This ultralow-damage method enabled 3.5 µm² blue µLEDs and was extended to diameters down to 200 nm, advancing scalable approaches for AR microdisplays.
Instrument Systems GmbH – Tobias Steinel presents advanced optical metrology strategies for microLED displays and wafers. By applying DUT-specific, real-time calibration of imaging light measurement devices (ILMDs), the approach addresses µLEDs’ narrow spectral bandwidths and variability, achieving traceable, high-accuracy chromaticity and luminance measurements that surpass conventional calibration methods
Semilab – Adam Virovecz introduces a high-throughput photoluminescence inspection system for GaN/InGaN microLED wafers. With 0.5 µm spatial resolution, <2 nm wavelength accuracy, and full-wafer device mapping, the system enables precise yield management by measuring intensity and spectral peak of every microLED—supporting scalable, cost-effective manufacturing of next-generation displays.
Chong Wei Gong Zuo Shi – Zhenye Okimoto examines AR market trends with Japanese companies driving AI–AR glasses. While free-form optics with microOLED dominate today, the shift to microLED + waveguide integration is emerging despite efficiency and reproducibility challenges.
TrendForce – Eric Chiou reviews microLED opportunities across large displays, wearables, automotive, and silicon-based products. Focus areas include chip size reduction, diverse mass transfer solutions, display–sensor integration, transparent displays, and new bonding and
Panel Discussion - We will host a panel of investors active in display and deep tech investment. The investor panel will feature
Haylo | Claire Valoti
Lam Research | Bedwyr Humphreys
PhotonVentures | Pieter Klinkert
Display Training Center – Radu Reit presents a first-principles cost analysis of microLED consumer displays, dissecting material, equipment, and process contributions for high-volume production. The masterclass highlights yield, technology choices, and pricing realities compared with incumbent LCD and OLED technologies.
TrendForce – Eric Chiou provides an overview of VR/AR head-mounted displays, covering optics and display engines from OLEDoS, LEDoS, LCoS, and LCD to waveguides. The session examines trade-offs in brightness, efficiency, size, and cost as AI and optics shape the next generation of near-eye devices.
Labbet Advice – Alexander Mityashin analyzes the competitive landscape of AR displays, comparing microLED, LCOS, and laser beam scanning. With each technology facing unique technical and commercial challenges, the session explores whether one approach will dominate or multiple solutions will coexist in smart glasses.
R&D to ROI Consulting – Zahir Alpaslan discusses the full microLED value chain, from fabrication to system integration and content optimization. The masterclass emphasizes how technical constraints, human visual factors, and business considerations converge to shape user experience and profitability in next-gen display systems.
imec – Matthew C. Traub examines patterning technologies for AR waveguides, showing how semiconductor nanofabrication methods can be adapted to achieve the complex features and material requirements needed for efficient, compact AR display optics.
III-V Consulting – Stephan Lutgen outlines microLED display architectures for AR glasses, comparing monochrome and monolithic RGB approaches. By addressing challenges in red emitters, light extraction, and CMOS integration, the session highlights pathways to ultra-fine-pitch, full-color AR microdisplays.
Profactor – Michael Mühlberger introduces nanoimprinting and nanoimprint lithography, covering fundamentals, challenges, and use cases. Special focus is given to optical applications such as microlenses and AR components.
Beneq – Tatiana Ivanova and John Rönn detail how atomic layer deposition (ALD) underpins scalable microLED and AR display manufacturing. Topics include ALD for device fabrication, high-index contrast coatings, and encapsulation solutions critical to waveguide optics and display reliability.
What to expect at the MicroLED Connect & AR/VR Connect event in Eindhoven on 24-25 September 2025?
To learn more about MicroLED and AR/VR displays,
please join the show in Eindhoven on 24 and 25 Sept 2025.
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