As part of the Fraunhofer-Gesellschaft, Fraunhofer IZM specializes in applied and industrial contract research. Fraunhofer IZM’s focus is on packaging technology and the integration of multifunctional electronics into systems. Fraunhofer IZM was founded in 1993 and is today one of the global leaders in microelectronics and microsystems packaging. The focus lies mainly on material, process and substrate development, characterization and simulation, advanced system engineering, assembly and interconnection technologies and environmental engineering. Fraunhofer IZM is employing about 438 employees and graduate students with its main branch in Berlin. Together with its partner institute at the TU Berlin it is running a ~1000m2 clean room of with full thin film and packaging capabilities from 4” to 12” wafers.

Fraunhofer IZM and specifically the department “System Integration and Interconnection Technologies” with the group “System on Flex” is specialized in the integration of electronics in and on flexible and stretchable substrates – including textiles. The focus will be on optimized integration technologies for garments. Fraunhofer IZM has a unique prototyping infrastructure for electronic textiles and has been developing successfully technologies for the reliable integration of electronics into textiles.

Participants will be guided through our textile labs (textile technologies and textile specific interconnection technologies), our substrate line and our mechanical testing lab.

This tour is limited to 30 people, and places will be allocated on a first come, first served basis.  Fraunhofer IZM is a 45 minute drive from Estrel Congress Center, transportation will be provided.

www.izm.fraunhofer.de/