Fraunhofer IZM
Guided Tour
Berlin 2025
Conformal & Stretchable Electronics and E-Textiles
As part of the Fraunhofer-Gesellschaft, Fraunhofer IZM specializes in applied and industrial contract research. Fraunhofer IZM’s focus is on packaging technology and the integration of multifunctional electronics into systems. Fraunhofer IZM was founded in 1993 and is today one of the global leaders in microelectronics and microsystems packaging. The focus lies mainly on material, process and substrate development, characterization and simulation, advanced system engineering, assembly and interconnection technologies and environmental engineering. Fraunhofer IZM is employing about 438 employees and graduate students with its main branch in Berlin. Together with its partner institute at the TU Berlin it is running a ~1000m2 clean room of with full thin film and packaging capabilities from 4” to 12” wafers.
The guided tour at Fraunhofer IZM is organised by the “System on Flex” working group, which advances flexible hybrid electronics, stretchable electronics, and electronic textiles by developing scalable manufacturing processes and transforming novel concepts into production-ready solutions.
Participants will be guided through our labs for flexible and stretchable electronics assembly and characterization. The Substrate Integration Lab focuses on the integration of microelectronics into flexible and stretchable substrates. This includes several processes such as lamination, laser patterning, mechanical drilling and milling, thermoforming, and various types of inspection and qualification tools. The Mechanical Testing Lab enables the customization of standardized test methods for specific applications and is used to characterize the electrical and mechanical properties of devices as well as their lifetime. Furthermore, in combination with our Textile Lab, we will provide an overview of our in-house developed AI-based non-invasive system for monitoring cardiovascular insufficiency by integrating bioimpedance spectroscopy and other sensor technologies into smart textiles.