Fraunhofer IZM (Berlin 2024)
Guided Tour
Berlin 2024
Packaging technology and the integration of multifunctional electronics into systems
Fraunhofer IZM
Fraunhofer IZM is a 45 minute drive from Estrel Congress Center, transportation will be provided. Places will be allocated on a first come, first served basis.
As part of the Fraunhofer-Gesellschaft, Fraunhofer IZM specializes in applied and industrial contract research. Fraunhofer IZM’s focus is on packaging technology and the integration of multifunctional electronics into systems. Fraunhofer IZM was founded in 1993 and is today one of the global leaders in microelectronics and microsystems packaging. The focus lies mainly on material, process and substrate development, characterization and simulation, advanced system engineering, assembly and interconnection technologies and environmental engineering. Fraunhofer IZM is employing about 438 employees and graduate students with its main branch in Berlin. Together with its partner institute at the TU Berlin it is running a ~1000m2 clean room of with full thin film and packaging capabilities from 4” to 12” wafers.
The guided tour at Fraunhofer IZM is organized by three working groups. “System on Flex" advances flexible hybrid electronics, stretchable electronics and electronic textiles by developing scalable manufacturing processes and transforming novel concepts into production-ready solutions. The “Technologies for Bioelectronics” group designs, fabricates, and tests active neural interfaces and flexible, biocompatible implants for neural stimulation and recording, exploring new methods for stimulation and wireless power transfer. The “Sensor Development and Integration” group develops micromechanical sensors for various applications, offering complete services from concept to testing, using semiconductor effects for high sensitivity and linearity.
Participants will be guided through our labs for flexible and stretchable electronics assembly and characterization. In our clean room tour we will demonstrate the variety of assembly technologies on small and large panel size substrates such as flip chip bonding and various technologies such as finest line patterning of flexible, stretchable and rigid substrates. The Substrate Integration Lab focuses on the integration of microelectronics into flexible and stretchable substrates. This includes several processes such as lamination, laser patterning, mechanical drilling and milling, thermoforming, and various types of inspection and qualification tools. On the other hand, the Lab of Technologies for Bioelectronics focuses on the fabrication of flexible electrodes for neural stimulation and recording, protection of active implantable devices using soft materials, and wireless ultrasound energy transfer and communication for deep implants. The Mechanical Testing Lab enables the customization of standardized test methods for specific applications and is used to characterize the electrical and mechanical properties of devices as well as their lifetime. Furthermore, in combination with our Textile Lab, we will provide an overview of our in-house developed AI-based non-invasive system for monitoring cardiovascular insufficiency by integrating bioimpedance spectroscopy and other sensor technologies into smart textiles.