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Agenda

11-12 June 2025

Boston, USA

or pickup your copy at the registration desk

Agenda (TBC)

Speakers from some of the world's leading companies will present on their requirements and research, with many new announcements.  You will learn about the needs and case studies from key end-user companies.  You will also hear about the latest innovations from companies involved in the fields of  Additive, Sustainable, Flexible, Hybrid,  Wearable, Textile, Structural, R2R, and 3D.

Confirmed Talks (agenda to be announced shortly) - Work in progress

Day 1 | 11 June

Keynote Presentations - Room A
TechBlick
Khasha Ghaffarzadeh

TechBlick

Khasha Ghaffarzadeh

Welcome & Introduction

9:05 AM

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Forvia
Damien Bouisset

Forvia

Damien Bouisset

Smart surfaces in automotive interiors*

9:30 AM

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European Space Agency
Rita Palumbo

European Space Agency

Rita Palumbo

Unlocking the Future of Space Electronics with Advanced Manufacturing

9:50 AM

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Advanced Manufacturing of Electronics (AME) promises to be a disruptive technology for the space industry. With the aim of supporting low volume component needs, European Sovereignty, Sustainability and the move to green technologies (ESA Green Agenda), AME provides useful advantages for space: agile manufacturing with reduced procurement time, faster spacecraft development times, miniaturization, innovative complex designs, cost and weight reduction, and reduced environmental impact in the manufacturing processes. AME also offers the prospect of a European supply chain for electronics and components, contributing to strengthen the European industrial competitiveness. In this talk, the most promising AME techniques, innovative concepts and examples of applications will be described, as well as ESA internal AME roadmap

NextFlex
Scott Miller

NextFlex

Scott Miller

Innovations and ecosystem for hybrid flexible electronics: A US perspective*

10:10 AM

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Exhibition Networking Event

10.30AM

Track 1 - Room A
Flexoo
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Flexoo

Mass customization & mass production of Smart Sensors

11:30 AM

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Jean Charles

Jean Charles

Mass customization & mass production of Smart Sensors

11:30 AM

Beckermus Technologies
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Beckermus Technologies

Challenges of interconnections between chips and flex substrates

11:50 AM

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Aviv Ronen

Aviv Ronen

Challenges of interconnections between chips and flex substrates

11:50 AM

Avery Dennison Smartrac
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Avery Dennison Smartrac

Green Printing in the Digital Landscape - from fab to mass production

12:10 PM

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Tiina Vuorinen

Tiina Vuorinen

Green Printing in the Digital Landscape - from fab to mass production

12:10 PM

SPGPrints
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SPGPrints

The 3 C’s of de-risking industrialized Printed Electronics production

12:30 PM

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Jurgen Westerhoff

Jurgen Westerhoff

In this talk we will take you through the journey of scaling up Printed Electronics production along the 3 C’s of de-risking industrialized production: Cost, Capacity and Certainty. Using real-life customer cases we will dive into the technical and application-design decisions you need to make to ensure steady and predictable production. We will share some of our experiences with finding the right balance between pattern design, inks, substrate and choosing the correct production method. Once the functionality of the application is proven, there are several scenarios to scale up to full production. We will explain how to choose the best scenario for your business while minimizing risk.

The 3 C’s of de-risking industrialized Printed Electronics production

12:30 PM

TU Eindhoven
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TU Eindhoven

The road ahead for integrated photonics

12:50 PM

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Martijn Heck

Martijn Heck

Integrated photonics is growing in terms of technology maturity and circuit complexity. Although traditionally used in communication, democratizing the technology through open foundries has opened up the technology for many more applications. In this webinar, I will discuss the main trends and opportunities.

The road ahead for integrated photonics

12:50 PM

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Lunch & Exhibition Break

1:10 PM

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Lunch & Exhibition Break

1:10 PM

Motherson Innovations
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Motherson Innovations

From Heating to Transparent Sensing to Lighting Elements in Smart Surfaces

2:50 PM

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Thomas Nugraha

Thomas Nugraha

From Heating to Transparent Sensing to Lighting Elements in Smart Surfaces

2:50 PM

Würth Elektronik Group
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Würth Elektronik Group

State of the art of the industrial stretchable PCB and its potential for future development

3:10 PM

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Stefan Bendig

Stefan Bendig

In this lecture a short overview of the state of the art of the industrial stretchable PCB will be given.Starting with the basics of the stretchable printed circuit board, through its material properties to the basic design rules and possible applications. The conclusion is formed by further development possibilities that are currently being investigated in research projects.

State of the art of the industrial stretchable PCB and its potential for future development

3:10 PM

Metafas
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Metafas

InMold Electronics: Technical and Business Transition from Membrane Switches to 3D InMold Electronics*

3:30 PM

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Luc van Neer

Luc van Neer

InMold Electronics: Technical and Business Transition from Membrane Switches to 3D InMold Electronics*

3:30 PM

KIMOTO
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KIMOTO

Adhesive carrier and protection films for advanced manufacturing

3:50 PM

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Christoph Bosshard

Christoph Bosshard

Advanced production processes require protection of sensitive surfaces and materials, while other processes require the fixation of parts or stretchable substrates for efficient processing. The challenge is to find the best possible combination of base film and adhesive for a given material combination and environmental condition. After processing, the film must be released without adhesive residue to prevent unnecessary process steps. In cooperation with our customers, we developed a wide range of different solutions with variable adhesive strength, that when combined with specific base films, allows to extend the application and temperature range. Our presentation will focus on typical examples as well as on some special use cases, that are currently under development for areas such as: Printed electronics, sensors, batteries, displays and micro LED’s.

Adhesive carrier and protection films for advanced manufacturing

3:50 PM

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Exhibition & Refreshment Break

4:10 PM

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Exhibition & Refreshment Break

4:10 PM

Track 2 - Room B
Momentive | BSC Computer
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Momentive | BSC Computer

Sustainable Motion based on Silicone

11:30 AM

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Jan Geboers | Andreas Schneider

Jan Geboers | Andreas Schneider

Highly efficient, biocompatible linear actuators can be produced from silicones. Structures like artificial muscles that contract when an electrical voltage is applied and relax again just as quickly. In this presentation, the authors will discuss how bring this Dielectric Elastomer Actuator (DEA) technology is being brought to market maturity and can replace small motor-gear units with highly energy-efficient and maintenance-free DEA solutions.The DEAs are stacks of thousands of individual silicone layers with conductive coatings. The motion dynamics depend heavily on the silicone base material used and the dimensions of the stacks. Specific solutions are specified for a maximum force of up to 20N and a compression of up to 8% of their length at rest. The DEA’s electronic control unit generates and regulates the required high voltage of approx. 800 V, protects against overvoltage and takes care of charge, trickle charge and discharge management. The electronics are designed so that they can be used with standard supply voltages in battery operation and are extremely energy-efficient. This makes DEA technology easy to integrate into end products: The module and its interfaces fulfill the approval requirements in the voltage range used.In this presentation, we will provide background information on all the components for the use of DEA technology in real products. Sustainable motion through dielectric elastomer drives is becoming a reality, and the first end products will be launched on the market in the course of 2024.

Sustainable Motion based on Silicone

11:30 AM

X-Trodes
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X-Trodes

Soft electrode array for skin electro-physiology: New opportunities in sleep studies and rehabilitation

11:50 AM

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Yael Hanein

Yael Hanein

Soft electrode array for skin electro-physiology: New opportunities in sleep studies and rehabilitation

11:50 AM

Creative Materials
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Creative Materials

Advances in Materials for Additively Manufactured Electronics Skin Patches

12:10 PM

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Brian Violette

Brian Violette

Electronic skin patches have emerged as promising platforms for various biomedical applications, including healthcare monitoring, prosthetics, wound care, stimulation, rehabilitation, medicine delivery, and human-machine interfaces. Advances in flexible and strechable supporting films and compatible functional materials have enabled conformal integration of sensors onto the skin, facilitating real-time monitoring of vital signs, pressure profiles, motion, and environmental parameters.Careful selection of all materials of construction as well as the geometries of the patch are critical to ensure the maximum durability of the end device while maintaining user comfort. This includes consideration of the thicknesses and moduli for mechanical matching of substrates, functional, and decorative material features. The chemical compatibility of these materials, and design considerations with regards to the interfaces to conventional electronic devices are also important to be properly engineered for mechanical matching. A multivariable design of experiments is necessary to optimize the final device bill of materials and design for reliability, performance, and comfort.

Advances in Materials for Additively Manufactured Electronics Skin Patches

12:10 PM

MacDermid Alpha Electronic Solutions
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MacDermid Alpha Electronic Solutions

TBC

12:30 PM

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TBC

TBC

TBC

12:30 PM

Printed Electronics Ltd
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Printed Electronics Ltd

TBC

12:50 PM

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Neil Chilton

Neil Chilton

TBC

12:50 PM

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Lunch & Exhibition Break

1:10 PM

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Lunch & Exhibition Break

1:10 PM

DECATHLON
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DECATHLON

How Plastronic LDS process can reduce CO² emissions for Electronics devices

2:50 PM

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Christophe Dupuis

Christophe Dupuis

DECATHLON is committed to reducing its CO² impact by 20% by 2026. In order to meet this ambition, we started by actions like to reuse recycled materials or to reduce the weight of our components, but these levers will not be sufficient to achieve our target. We have no other choice but to explore disruptive solutions that break with standard technologies in order to respond to the climate challenge.This presentation aims to present the study of a concrete application of LDS technology on a headlamp product.
We will present first the Environmental evaluation of the LDS process to focus then on the Carbon footprint improvement compared to conventional technologie, without forgetting finally the technical and economic evaluation of LDS technology applied to the case study.

How Plastronic LDS process can reduce CO² emissions for Electronics devices

2:50 PM

Horizon Microtechnologies
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Horizon Microtechnologies

Hybrid Microfabrication by 3D printing and subsequent Coating for Electronics and Radio-Frequency Applications

3:10 PM

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Andreas Frölich

Andreas Frölich

Additive manufacturing technologies with precision and resolution on the micrometer scale (micro AM) today are realistically being looked at as viable production technologies, and are no longer the expensive and slow processes of a decade ago. If properly used, the design freedom of micro AM allows of higher miniaturization, functional integration, better performance, or reduced size, weight and power consumption of parts and components. However, most micro AM technologies work with photopolymers which lack certain functionalities. Combining micro AM-derived parts with coating technologies for non-polymer materials that are able to conformally coat 3D substrates is an efficient approach to overcome the lack of functionalities of bare polymer parts. It brings together the benefits of photopolymer based 3D printing such as precision, repeatability and relatively simple processing with the functionalities which the respective coatings can achieve. This talk will present a process portfolio for depositing thin (<10 µm), conformal, electrically conductive, protective and metallic films on three-dimensional polymer substrates made by micro-AM processes to enhance the functionality of the polymer microstructures and their application in radio-frequency devices and electronics.

Hybrid Microfabrication by 3D printing and subsequent Coating for Electronics and Radio-Frequency Applications

3:10 PM

LPKF Laser & Electronics
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LPKF Laser & Electronics

Semi Additive Glass-Based Advanced packaging for HPC and Chiplet Application*

3:30 PM

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Richard Noack

Richard Noack

The semiconductor industry faces significant challenges in integrating glass as a material for advanced packaging, a critical step in enhancing high-performance computing (HPC) for artificial intelligence (AI) applications. Traditional packaging materials and methods are reaching their limits in terms of thermal management, signal integrity, and miniaturization. Glass, with its superior electrical insulation, thermal stability, and mechanical strength, presents a promising alternative. However, its brittle nature and the difficulties associated with precise microfabrication pose substantial barriers. Overcoming these obstacles is crucial for realizing the full potential of glass in semiconductor packaging, which can lead to significant advancements in AI performance and efficiency.Innovative technologies are essential for enabling the use of glass in semiconductor packaging. One such groundbreaking approach is the Laser-Induced Deep Etching (LIDE) technology, which allows for precise, high-quality microfabrication of glass substrates. This technology not only addresses the material's brittleness but also facilitates the integration of glass into existing semiconductor processes. By leveraging LIDE, the industry can achieve the desired advancements in HPC for AI, paving the way for more efficient and powerful AI systems.

Semi Additive Glass-Based Advanced packaging for HPC and Chiplet Application*

3:30 PM

Exxelia Micropen
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Exxelia Micropen

Functionalization of Medical Devices Using Additive Dispense Technology

3:50 PM

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RJ Greco

RJ Greco

Medical device designs are constantly evolving as the trend to make passive devices functional is taking over the market space. Using additive dispense technology, one can print conductive traces, sensors,and markers on a variety of different medical device products.The direct printing system, Micropen, is a CAD/CAM driven capillary dispensing tool akin to an ultra-precise micro-dispense gun. If a material is flowable and can be loaded into a syringe, the Micropen can print it onto virtually any surface. It’s a non-contact, additive printing technique that dispenses the precise amount of material needed. This makes it beneficial when using novel, expensive or rare inks. The efficient use of materials and the ease of changing them provides product designers with increased prototype control as well as reducing time-to-market. Direct printing is an ideal way to form many different patterns on 2D substrates giving them superior electrical characteristics. However, the capabilities of the Micropen don’t stop at 2D substrates. Printers have been designed with 5-axis of movement. This allows many different medical device form factors to be printed such as thin, flexible,irregular, and highly three-dimensional shapes.This talk will provide an overview of the Micropen additive dispense integration with a variety of products in the medical device arena.

Functionalization of Medical Devices Using Additive Dispense Technology

3:50 PM

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Exhibition & Refreshment Break

4:10 PM

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Exhibition & Refreshment Break

4:10 PM

Track 3 - Room C
Fuji Corporation
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Fuji Corporation

11:30 AM

New era of additive manufactured electronics with the integration of SMT process and machine.

More

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Ryojiro Tominaga

Additive manufactured electronics is efficient approach for the view point of capability of shape and speed, environmental friendly process. Since the process and material differ from common PCB manufacturing method, the important thing is that the part mounting technology will also be transformed and integrated accordingly. In the presentation, we’ll show the worldview of future electrical device manufacturing driven by additive manufactured electronics with the integration of SMT process and machine.

New era of additive manufactured electronics with the integration of SMT process and machine.

11:30 AM

Elephantec
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Elephantec

11:50 AM

Printed Electronics as sustainable solutions

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Sugimoto Masaaki

Elephantech is a company that develops manufacturing processes for Flex PCBs utilizing metal inkjet printing technology. We plan to introduce new technology that pushes the boundaries of circuit manufacturing using inkjet printing.

Printed Electronics as sustainable solutions

11:50 AM

Nano OPS
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Nano OPS

12:10 PM

Fully Additive Manufacturing of Electronics at the Nano and Microscale for Making Active Components and Integrated Circuits

More

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Ahemd Busnaina

We introduce a new sustainable and scalable technique to additively manufacture nano and microelectronics. The technique eliminates etching, vacuum deposition and other chemically intensive processing by utilizing direct assembly of nanoscale particles or other nanomaterials at room temperature and atmospheric pressure onto a substrate. The presented technology enables the printing of single crystal conductors and semiconductors [1]. The technology enables the additive manufacturing of passive and active components at the nano and microscale using a purely additive (directed assembly enabled) process utilizing inorganic semiconductors, metals, and dielectrics nanoparticles. The process demonstrates the manufacturing of transistors with an on/off ratio greater than 10 6 . This new technology enables the fabrication of nanoelectronics and electronic compenents while reducing the cost by 10-100 times and can print 1000 faster and 1000 smaller (down to 25nm) structures than ink-jet based printing. Printed applications such as transistors, diodes, display [2], MEMs [3] and all carbon electronics [4], and sensors at the micro and nanoscale using inorganic and organic materials will be presented. Nano OPS introduced the world’s first Nanoscale fully-automated printing system (NanoOPS) prototype with built-in alignment and registration. This is the only demonstrated solution for high-throughput printing of interconnects and circuit components at a scale equal to or less than 2 microns on rigid or flexible substrates. This new Fab-in-a-Box is designed to print electronics and products with minimum features down to 600 nm and is expected to democratize the electronics industry by eliminating the current high-cost entry barrier.

Fully Additive Manufacturing of Electronics at the Nano and Microscale for Making Active Components and Integrated Circuits

12:10 PM

Notion Systems
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Notion Systems

12:30 PM

Advancing Additive Processes into Electronics Mass Production - Breaking Boundaries One at a Time

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Kai Keller

Additive technologies, and in particular digital printing processes are a very powerful tool in the hands of electronic designers and solution providers. The main area of adoption for additive technologies, however, still is in prototyping and low volume manufacturing. Nevertheless, additive technologies unfold their real potential only when implemented in mass production process chains. Qualified additive processes in electronics mass production provide means to improve quality of end products and to implement new features &amp; solutions with zero time to market. In this presentation I will focus on how the inkjet solder mask process increases flexibility while maintaining stability in PCB mass production. I will also speak about limitations of the current inkjet process and provide an outlook on how they can be overcome by new EHD printing technologies.

Advancing Additive Processes into Electronics Mass Production - Breaking Boundaries One at a Time

12:30 PM

Henkel | Teca-Print
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Henkel | Teca-Print

12:50 PM

Advancing Pad Printable Solutions with Henkel Materials

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Thibaut Soulestin | Dominik Aeschbach

Henkel is an industry-leading supplier of printed electronics materials and services. The broad LOCTITE portfolio includes conductive inks and coatings and resistive and dielectric inks. Wireless communication has evolved rapidly over the past few decades and antennas play a fundamental role in wireless communication systems. 5G pad-printable antennas are especially unique to the mobile communication industry and Henkel has developed a range of pad-printable inks that enable direct printing on 3D-shaped surfaces. Pad printing of functional inks can be viewed as an alternative technology to more traditional Laser-Direct-Structuring (LDS), offering an additive manufacturing process that is more environmentally friendly. Henkel has started a technical collaboration with Teca-Print to accelerate our customers' projects. Teca-Print is a Swiss-based world-leading machine and consumables supplier for pad printing. In this presentation, we will discuss pad-printing process parameters and focus on the properties of the LOCTITE portfolio that make these inks unique.

Advancing Pad Printable Solutions with Henkel Materials

12:50 PM

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1:10 PM

Lunch & Exhibition Break

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Lunch & Exhibition Break

1:10 PM

 Holst Centre  |  imec
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Holst Centre | imec

2:50 PM

The environmental impact of traditional electronics vs printed electronics.

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Stephan Harkema | Maarten Cauwe

The environmental impact of traditional electronics vs printed electronics.

2:50 PM

Pragmatic Semiconductor
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Pragmatic Semiconductor

3:10 PM

Bringing flexible intelligence to Medicine 3.0

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Vincent Barlier

Healthcare is undergoing a quiet revolution, shifting from traditional models that respond to symptoms, to proactive, personalised care that prevents issues before they arise. Technology is key to this paradigm shift. Next-generation devices – such as wearable sensors and point-of-care diagnostic tools – promise patients a convenient and interconnected digital health experience. But their widespread adoption depends on their ability to achieve the necessary performance at low cost. In this presentation, Vincent Barlier introduces FlexICs – ultra-thin, flexible semiconductors – and the pivotal role they will play in this healthcare revolution, delivering performance at an appropriate price point, while maximising ease of use and patient comfort.

Bringing flexible intelligence to Medicine 3.0

3:10 PM

Essemtec
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Essemtec

3:30 PM

Enhancing circular economy by facilitating the repair of electronic components

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Irving Rodriguez

A circular economy and sustainable electronics are a must in the modern industry, not only for environmental reasons but also for commercial ones. Facilitating electronic repair helps to prolong the life span of products, enhance their performance and to correct production mistakes. Dispensing and placing a fine pitch component manually is very time consuming and could cause collateral damage to the already populated devices. A novel automatic repair method and tools with no human interaction were developed. This method uses the advantages of medium jetting, pick-and-place and quality control in one instrument, making it extremely accurate, reliable, and cost-effective. This method can be applied to replace components on PCBs and for BGAs reballing. The use of different alloys including low-temperature soldering (LTS) is feasible. The results show that this technique significantly improves the throughput and yield of the repaired devices.

Enhancing circular economy by facilitating the repair of electronic components

3:30 PM

Jiva Materials Ltd
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Jiva Materials Ltd

3:50 PM

Fully recyclable PCB substrate

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Jonathan Swanston

Fully recyclable PCB substrate

3:50 PM

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4:10 PM

Exhibition & Refreshment Break

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Exhibition & Refreshment Break

4:10 PM

Day 2 | 12 June

  TRACK 1 - Room A
Binghamton University
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Binghamton University

9:20 AM

Fabrication of Multi-Sensor Vital Sign Patches for Ambulatory Care*

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Mark D. Poliks

Mark D. Poliks

Fabrication of Multi-Sensor Vital Sign Patches for Ambulatory Care*

9:20 AM

TBC
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TBC

9:40 AM

TBC

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TBC

9:40 AM

Ceradrop
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Ceradrop

10:00 AM

TBC

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TBC

TBC

TBC

10:00 AM

Voltera
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Voltera

10:20 AM

Multi-layer Printed Battery for Versatile Integration in Wearables, Medical Applications, Smart Packaging, Smart Sensors & more

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Jesus Zozaya

Jesus Zozaya

Multi-layer Printed Battery for Versatile Integration in Wearables, Medical Applications, Smart Packaging, Smart Sensors & more

10:20 AM

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10:40 AM

Exhibition & Refreshment Break

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Exhibition & Refreshment Break

10:40 AM

Texavie
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Texavie

11:30 AM

Empowering Personalized Therapy and Wellness Anywhere with Texavie’s MarsWear Smart Apparels

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 Amir Servati

Amir Servati

Texavie’s MarsWear smart apparel represents a groundbreaking leap in personalized therapy and wellness solutions. Utilizing flexible smart textile with advanced yarn sensor technologies, MarsWear delivers comfortable apparel and wearables that, coupled with machine learning algorithms, AI and data analytics, provide real-time monitoring and personalized feedback with unparalleled accuracy and fidelity. The wealth of data gathered and analyzed by ML algorithms not only enhances the accessibility and effectiveness of therapy and wellness programs but also revolutionizes these fields by providing users and clinicians with objective tools and parameters for superior assessment and program planning, ultimately leading to better outcomes. Furthermore, the versatility of integrating different sensing modalities and designs into various apparel form factors extends Texavie's platform technology beyond health and wellness, encompassing applications in gaming, professional training, and AR/VR control. Additionally, Texavie’s patented solar fabric further enhances the utility of MarsWear, serving as a crucial addition and alternative in the expanding market of green energy harvesting and the solar revolution. Join us as we delve into how Texavie's MarsWear smart apparel is reshaping the landscape of personalized therapy and wellness, ensuring accessibility anytime, anywhere.

Empowering Personalized Therapy and Wellness Anywhere with Texavie’s MarsWear Smart Apparels

11:30 AM

Danish Technological Institute
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Danish Technological Institute

11:50 AM

DTI Printed Electronics: On body eTextile sensors for physiological and neurological monitoring

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Zachary J. Davis

Zachary J. Davis

The demand for flexible, stretchable and sustainable electronic solutions is growing rapidly due to the growth in eHealth, automotive, smart buildings and other similar application areas. At the core is printed electronics, which uses printing technologies such as screen, flexographic and inkjet printing, together with functional materials and inks to fabricate electronics directly onto plastic foils, paper or textiles. To de-risk European industry to adept these novel materials and technologies, Danish Technological Institute (DTI), has established a One-Stop-Shop, which facilitates European industry with consultancy, development and pilot production. DTI can take novel ideas and perform proof of concept projects, develop these into full prototypes and in many cases, upscale prototypes to a pilot scale. Furthermore, DTI can provide support throughout the entire value chain, from materials to final products. In this presentation, you will witness DTI's work on novel material formulations, particularly focusing on bio-based and sustainable printable materials, including 2D material inks. DTI will also showcase various fully functional eTextile demonstrators and prototypes they have developed, including a fully functioning wearable EMG sleeves using bio-based materials, heated wearables and an EEG headband.

DTI Printed Electronics: On body eTextile sensors for physiological and neurological monitoring

11:50 AM

Datwyler
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Datwyler

12:10 PM

Smart Elastomer based Sensors and Actuators