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Explore Exhibitor Profiles

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Notion Systems
Flexoo
Voltera
Akoneer
Danish Technological Institute
Hamamatsu Photonics
Nano OPS
Sefar
Tracxon
Ames Goldsmith
COATEMA Coating Machinery GmbH
Creative Materials
Henkel
INKATRONIC
KIMOTO
MacDermid Alpha
NanoPrintek
QNA
SIJ Technology
Smooth & Sharp Corporation
SÜSS MicroTec SE
VTT
DoMicro
3E Smart Solutions
Arkema
CPI
Conductive Technologies
DELO
Eastman Kodak Company
Epishine
Fraunhofer IAP
Fujifilm
InnovationLab GmbH
Kulicke-and-Soffa
NRCC
NanoXplore
Normandy Coating
Oxford Instruments
Polar Light
RH Solutions
ROARTIS
Scrona
Syenta
VFP Ink
AFELIM
Celanese MicroMax
META (Metamaterial)
VueReal
BeLink Solutions
DuPont  Teijin Films
IDS Inc
Neotech AMT GmbH
SmartKem
XTPL
Binder ITZ
CondAlign AS
East West Manufacturing
Heraeus Printed Electronics
INO-Žiri
LinkZill
Metafas
PEL
Quad Industries
SPG Prints
Sun Chemical Corp
TNO at Holst Centre
Warsaw University
Heraeus
ACI Materials
BotFactory
Ceradrop
Contag AG
E2ip Technologies
Eastprint
Exxelia
Fraunhofer IFAM
Fujikura Kasei
Joanneum Research
MAASS
NSM Norbert Schläfli AG
Nazdar
Nuovo Film
PROVATIC
PrintUp Institute
RISE
Saphlux
Seristampa
Teca-Print
Witte Tech
PVF GmbH
Coherent
Nagase ChemteX
Panasonic Electronic Materials
Brewer Science
Electroninks Ltd
ImageXpert
Panacol-Elosol GmbH
Tapecon
ADVPES
C3Nano
Copprium
FUJI CORPORATION
Hummink
Intellivation LLC
Linxens
Molex
Pragmatic
Quantica
Smart Consortium
SunRay Scientific
Tesa SE
Copprint
3D-Micromac
Agfa
Brilliant Matters
Chimet S.p.A
Coveme Spa
ELANTAS Europe
Encres DUBUIT
FlackTek
Fraunhofer IKTS
Global Inkjet Systems
Konica Minolta
METALOR Technologies SA
Nano Dimension
Niebling GmbH
OrelTech GmbH
PST Sensors
Printed Energy Pty Ltd
RK Siebdruck
Saralon
Space Foundry
Toray Engineering
Xenon

Past Event Talks On-Demand

For Annual Individual & Group Access

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OCT 2024

Digital-Therapeutics-2024

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SEP 2024

Hearing-Technology-2024

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AUG 2024

Chronic-Disease-Care-2024

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JUL 2024

Healthcare-in-Home-2024

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JUN 2024

Smart-Patches-2024

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MAY 2024

Wearable-Adaptive-Tech-2024

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APR 2024

Spring_Innovations_Festival

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APR 2024

Al-in-Healthcare-2024

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APR 2024

OLEDs-Innovations-Manufacturing-Markets

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MAR 2024

Brain-Computer-Interfaces-2024

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MAR 2024

SustainableElectronics

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FEB 2024

MicroLED_StartUps

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14 May 2024

Pilot Factory for roll-to-roll processing of next-generation smart wearable patches | VTT

Wearable sensor patches offer novel opportunities for many healthcare and wellness applications. For optimal comfort and reliability, they should be flexible, soft, conformable, or even stretchable. Printed electronics and hybrid electronics enable the use of almost any substrate and packaging materials, making it the perfect technology for next-generation wearables. Author: Antti Kemppainen , VTT, Antti.Kemppainen@vtt.fi Pilot Factory The production of printed and hybrid electronics requires several manufacturing processes and tools which might not be available by commercial manufacturing partners. VTT’s Printocent Pilot Factory bridges the gap towards full upscaled manufacturing by extremely versatile infra, including for example following capabilities: Roll-to-roll printed electronics lines with: Interchangeable printing methods, high curing capacity and automated layer-to-layer registration. Printing and coating processes are available for thin films (<100 nm) up to thick films (tens of micrometers). Highly experienced team and facilities for ink tailoring, process development and quality control. Component assembly in a roll-to-roll format using: High throughput pick and place line for low-temperature soldering or adhesive bonding. Flip-chip high-precision and bare-die assembly line Extensive converting and post-processing capabilities including: A Versatile lamination and cutting converting line equipped with a cutting laser, robot arms, soldering and ultrasonic welding...

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10 April 2024

Paste Noise Absorber Technology for High Frequency Devices (110-170 GHz) and Packages

UJIWARA REI | Panasonic Electronic Materials Business Division | fujiwara.rei@jp.panasonic.com High-frequency devices, such as those used in beyond 5G and 6G technologies, require precise and reliable signal transmission for optimal performance. High-frequency signals are more susceptible to noise interference, which can degrade the quality and integrity of the transmitted data. Noise mitigation is crucial to ensure that the intended signal is accurately received and interpreted.
Traditionally, noise-absorbing materials have been used as an effective method of making noise. Noise absorbing materials are generally sheet or sponge type. However, these types are difficult to apply beyond5G/6G devices which become smaller and more complicated. We are speaking in Boston on 12-13 June 2024 at The Future of Electronics RESHAPED USA
Register now and come to hear our talk To solve this problem, we propose a noise-absorbing paste. Dispensable material can be easily installed in narrow spaces, suppressing noise inside electronic devices used in beyond 5G/6G, and contributing to improved quality and performance. Features: Dispensable Good conformability High frequencies over 100GHz Figure 1 Paste Noise Absorber Table 1 Properties Figure 2 Absorption vs frequency
Case 1: For solving cavity resonance. Figure 3 MMIC on antenna module. The radiation noise of MMIC resonating in the cavity affects the antenna characteristics.  (Figure.3) Noise absorbing paste can be installed on small sp...

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4 April 2024

Flexible Microelectronic Devices produced with Sputtered Coatings and Laser Patterning

Authors: Mike Simmons, Matthew Kleyn, Joseph Vlach, Liz Josephson; Intellivation LLC ljosephson@intellivation.com | Intellivation The demand for high-performance devices with enhanced functionalities continues to grow. Materials, such as graphene and MoS2, exhibit unique electrical and mechanical properties making them ideal for flexible electronic applications. To meet the rising demand and requirements for flexible 2D microelectronics devices manufactured using Roll to Roll technology, we use innovative manufacturing techniques including vacuum coatings in combination with laser technology. Laser patterning of sputtered coatings provides the ability to achieve high-volume production with precision, functionality and efficiency for a wide range of flexible applications. Sputter deposition is a widely used technique for depositing thin films onto substrates. For flexible 2D microelectronics, sputtered coatings serve as the foundation for building functional devices. Sputtering involves bombarding a target material with ions to eject atoms or molecules, which then deposit onto a substrate to form a thin film. This process allows for precise control over the thickness and composition of the deposited film, making it a preferred method for creating uniform and reproducible coatings. Sputtered layers were deposited using Intellivation’ s R2R Lab system. Sputtering provides an excellent method for depositing coatings uniformly over large areas, while laser patterning can create...

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27 March 2024

TechBlick's hugely popular Innovations Festival is back!

On 25 April, we will hold our  FREE-TO-ATTEND  online Innovations Festival, focusing on aspects of additive, sustainable, flexible, hybrid, wearable, and 3D electronics.   Attendee places will be limited and assigned on a first-come, first-served basis. At our last Winter Festival, we had 700 unique actual attendees, so book now to secure your place. As always, this festival will take place on the unique TechBlick platform. You can use your avatar to meet the speakers, visit the exhibition, and network with fellow participants.  Agenda Track 1 1:00pm | Hangzhou LinkZill Technology | Innovating with TFT technology in both optoelectronic and biological ways 1:15pm | Smartkem | Organic Thin-Film Transistor Technology – from Lab to Fab 1:30pm | DoMicro | Inkjet Printed Interconnects on Bare Dies for Hybrid Electronics* 2:00pm | Fraunhofer IAP | Polymeric solid electrolytes* 2.00PM | Break/Exhibition 2:50pm | VTT | R2R Manufacturing of Flexible Electronics with Integrated Pick-and-Place* 3:05pm | Linxens | Scalable, customizable, multimodal electrode platform for biosensors and sensors 3:20pm | TNO | Advancing Medical Technology: Printed Electronics and Hybrid Integration Pave the Way for Next-Generation Medical Devices. 3:35pm | 3E Smart Solutions | Driving Reliability and Scalability in E-Textiles and Wearables via Embroidery Technology 3:50pm | Metafas | Going from Screen Printed Human Machine Interfaces to 3D Multi-Layer Electronics* 4:05 PM | Break/Exhibition 4:55pm |...

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11 April 2024

Celanese Micromax™ Presents: "Electronic Inks & Pastes Seminar"

Free seminar An Introduction to Printed Electronics & Thick Film Technology May 22nd & 23rd, 2024 With Dinner on Wednesday, May 22nd Join us to hear leading industry experts provide a comprehensive overview of Printed Electronics/Thick Film materials and processing during this TWO DAYS / TWO TRACKS IN PERSON seminar. The seminar is designed for professionals and engineers who are new to Printed Electronics & Thick Film Technology or would like to learn more about its art and science. The program also comprises talks from external speakers as well as a tour of our European Technology Center (ETC) for Engineering Polymers. In addition, we will display and discuss Printed Electronics/Thick Film applications. The event runs from 8:30 am to approximately 5 pm each day. Lunch, coffee and light snacks will be provided during the seminar. Please refer to the attached preliminary agenda Seminar Location Celanese Performance Solutions Switzerland Sàrl Route du Nant-d’Avril 146 1217 Meyrin, Switzerland

Click HERE to register for the Seminar

Recommended Hotel Mercure Geneva Airport (10 min walk to the Seminar location) 3B Rue de la Bergère, 1217 Meyrin, Geneva A contingent number of rooms are pre-reserved to ensure availability. Please book prior 15th April 2024 by sending an email to: mercure-geneva-airport@accor.com and refer to: “Celanese Group as of May 2024” Additional Hotels (not pre-reserved) Hotel NH Geneva Airport, Av. De Mategnin 21, 1217 Meyrin, Geneva Hotel NH Genev...