Why Should You Join TechBlick's The Future of Electronics RESHAPED? The Future of Electronics RESHAPED conference and exhibition (22 & 23 OCT 2025, Berlin) is set to be the most important event of the year focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics.  This year the program features a world-class agenda with over over 100 superb invited talks from around the world, 12 industry- or expert-led masterclasses, 4 tours, and over 90 onsite exhibitors.  In this article, we discuss and highlight various innovative talks at the event around the theme of Material, Ink and Paste Innovations . In future articles, we will cover further technologies including smart surfaces, sustainable electronics, printed medical electronics, novel materials and beyond. Explore the  full agenda now and join the global industry in Berlin on 22 & 23 OCT 2025. Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable.  Explore the Full Agenda and   Register  before 12 September 2025 for the best rates Heraeus Electronics – Ryan Banfield  presents bridging additive and subtractive technologies through solderable polymer thick films . The talk highlights advances in polymer thick-film conductors that overcome long-standing barriers of poor solderability and thermal stability. This breakthrough enables flexible, low-cost circuits while reducing reliance on environmentally intensive subtract...

The flagship Future of Electronics RESHAPED conference and exhibition (22 & 23 OCT 2025, Berlin) is set to be the most important event of the year focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics.  This year the program features a world-class agenda with over over 100 superb invited talks from around the world, 12 industry- or expert-led masterclasses, 4 tours, and over 90 onsite exhibitors.  In this article, we discuss and highlight various innovative talks at the event around the theme of Additive, Hybrid and 3D Electronics. In future articles, we will cover further technologies including smart surfaces, sustainable electronics, printed medical electronics, novel materials and beyond. Explore the  full agenda now and join the global industry in Berlin on 22 & 23 OCT 2025. Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable.  Register before 12 Sept 2025 for the best rates Lockheed Martin (USA)– Paul Gaylo  explores the transition of flexible hybrid electronics (FHE) from lab to field applications . Case studies on copper printing and flexible RF circuits illustrate how FHE can deliver SWaP-C advantages in defense systems while meeting reliability demands. The talk emphasizes concurrent engineering and early integration of design with advanced manufacturing to overcome barriers to FHE adoption. Fuji Corporation (Japan) – Ryojiro Tominaga  demonstrates ad...

A decimal counter is a digital circuit that cycles through zero to nine using logic components. It is essential in clocks and timers. Making a decimal counter using seven-segment displays offers great opportunities for students to learn sequential logic, clock signals, and circuit integration. Materials used Voltera V-One PCB printer Voltera disposable nozzles Linear voltage regulator Switching voltage regulator NE555DR timer Variable resistor  Seven-segment displays   We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend Purpose The goal of this project was to demonstrate PCB development through key concepts:  Linear and switching regulators Variable resistors Seven-segment displays Prototyping techniques Conductive trace printing Component placement Solder reflow Project overview Design The original PCB layouts were provided by ITIZ , Voltera’s authorized reseller in Korea. We modified the design to create an integrated circuit system, which was comprised of three interconnected PCBs: Voltage regulator board Pulse generator board Decimal counter board ITIZ design of the boards Desired outcome When connected to a 7V–12V DC source, the system should function as follows:  The voltage regulator board converts the input to a steady 5V output. The pulse generator board uses this 5V supply to create adjustable pulse signals. The decimal counter board drives two seven-segment displ...

Authors: Julien Vitiello, Elisa Duquet, Louis Caillard, Achille Guitton, Marc Pascual, Maroua Ben Haddada, Frederic Raynal, Amin M’barki Corresponding author: julien.vitiello@hummink.com Hummink S.A.S, 5 rue Charlot, 75003 Paris, France Keywords: Display repair, additive manufacturing, High Precision Capillary Printing (HPCaP), capillary forces, Atomic Force Microscopy (AFM) Abstract In the field of display repair, particularly for OLED and microLED technologies, there is a growing need for precise and scalable solutions to restore high-resolution defects without compromising performance. While several repair methods exist, they often fall short in resolution, versatility, or ease of integration. High Precision Capillary Printing (HPCaP) overcomes these limitations by leveraging capillary forces and mechanical resonance to deposit inks with micron and sub-micron precision, enabling accurate, reliable, and non-destructive repair of critical display components. 1. Introduction According to MarketsandMarkets the global display market size is expected to reach around USD 174 billion in 2029 growing at a CAGR of 5.1% from 2024 to 2029. The increased demand for displays in various industries especially the IT and healthcare industries, and the increased demand of interactive displays such as wearable devices, AR/VR products in addition to the adoption of flexible displays are the major factors driving this market growth. We are Exhibiting! Visit our booth at the MicroLED Connect...

Author: Andrew Gabor, BrightSpot Automation LLC, gabor@brightspotautomation.com Perovskite PV technology faces severe challenges in scaling to the GW deployment level in terms of panel stability, conversion efficiency, and manufacturing yields. To help solve these challenges, BrightSpot Automation serves the entire Perovskite PV value chain with a suite of metrology tools implemented from R&D to product development to manufacturing to field testing. Our systems help identify defects, improve quality, reduce investment risk, and extend the performance of PV technology throughout its lifecycle. BrightSpot supplies customized Photoluminescence (PL) and Electroluminescence (EL) imaging tools which assess device spatial uniformity and resolve defects such as pinholes between the Perovskite film and carrier transport layers. Such pinholes may cause shunts that reduce fill factor and increase sensitivity to reverse bias damage. BrightSpot also supplies UV Fluorescence (UVF) tools which reveal the effects of moisture ingress due to incomplete sealing. The table above shows which of these tools are applicable at different stages during manufacturing, accelerated testing, and field exposure. EL involves injecting current into the device with a power supply such that the device glows like a large LED in the near infrared (NIR), and then imaging the emission with an NIR sensitive camera. Any dark areas represent problems, and the overall strength of the emission is correlated to d...

In the fast-paced world of advanced manufacturing, precision, speed, and reliability are non-negotiable. Enter the Intlvac Icarus Indium Solder Bump Deposition System—a game-changing solution designed to meet the rigorous demands of high-volume production. With over 30 years of expertise in system manufacturing and coating services, Intlvac has engineered a system that delivers exceptional performance, minimal maintenance, and rapid turnaround times. A solder bump is a small, raised deposit of indium solder that is typically applied to the surface of a microelectronic device. Solder bumps are commonly used in semiconductor packaging and flip-chip bonding processes, microprocessors, integrated circuits, and other electronic components. They provide an efficient and reliable method for connecting chips to substrates, allowing for high-performance and compact devices. We are Exhibiting! Visit our booth at the MicroLED Connect & AR/VR Connect in Eindhoven on 24-25 September 2025   Why Indium Bumps? Indium bumps are essential for advanced applications due to their unique properties. They enable higher packing density and increased device speeds, making them ideal for flip-chip bonding in pixel readout applications. Additionally, indium offers strong mechanical properties and superconductivity at temperatures below 3.4K, ensuring reliable performance in demanding environments. Its role as an under-bump diffusion barrier further enhances device performance by preventing material int...

#PrintedElectronics #MedicalTechnology #FlexibleElectronics Author: Antti KEMPPAINEN | Email: antti.kemppainen@vtt.fi
Bringing medical technology from innovation to patient care is slow and costly due to the complexity of the needed technologies and regulations. VTT’s pilot environment for medical devices, based on printed and flexible electronics and photonics technologies, accelerates the market entry of patient-friendly innovations. We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend The medical device pilot enables the production of small and middle-size prototype series for pre-clinical studies using advanced flexible electronics, photonics, microelectronic, and microfluidic components and integration manufacturing technologies. These technologies facilitate the development of comfortable-to-wear, skin-like wearable sensors combined with wireless communication and data processing functionalities. Key application areas for the pilot line include preventive monitoring of cardiovascular diseases, metabolic syndromes, early cancer detection and recurrence, as well as rapid diagnostics. Our Key Infrastructure:
State-of-the-art ISO7 cleanroom Flatbed automatic screen printer with 500 mm x 500mm and Flatbed Computer-to-Screen (CtS) screen exposure system, UV and IR belt oven Automatic component assembly line for large area flexible PCBs High-capacity 3D X-ray Microscopy,...

Introducing the program for MicroLED Connect 2025 and AR/VR Connect 202 5 (Conference and Exhibition, 24 &25 Sept 2025, High Tech Campus, Eindhoven, Netherlands)

This event is shaping up to be the definitive global forum for microLED and AR/VR display professionals, offering an exceptional program, vibrant exhibition, and unmatched networking opportunities. In this preview, we’ll spotlight several speakers, showcase selected conference themes, and give you a glimpse of what awaits in Berlin. For the complete agenda and event details, click here.
Mass Transfer – From Wafer to Display In many icroLED manufacturing platforms, at least one major transfer process is required—often two. Typically, devices move from the epiwafer to an intermediate interposer substrate and later from the interposer to the final display. Executing this step with precision, speed, and cost efficiency remains one of the industry’s most persistent challenges. At MicroLED Connect 2025 , leading innovators will unveil new solutions:
Coherent  will present a fully integrated laser-based mass transfer system designed to handle donor wafers and receiver panels—whether they’re backplanes or temporary carriers. Offering exceptional throughput, yield, and flexibility, the system can manage even the tiniest microLED dies.
Holst Centre  will introduce a proprietary release stack enabling rapid, selective microcomponent release with adaptive pitch using a cost-effective laser source. Recent results sh...