To watch this presentation in full, please purchase TechBlick Annual Pass at https://www.techblick.com/registration  and login to TechBlick platform https://app.swapcard.com/event/techblick Engineering Functionality: Sensors Sensors are at the heart of modern technology - integrated into devices we use every day to enhance healthcare, fitness, safety, and comfort. From monitoring vital signs to enabling smart industrial systems, sensors are transforming the way we interact with the world. Depending on the application, sensors come in many forms, each with its own materials, requirements, and performance considerations. Below are a few examples of sensors that are key to next-generation sensor innovation. Biosensors & Electrochemical Sensors:  Measure biological and chemical reactions by generating signals proportional to analyte concentration. PTC Heaters:  Regulate temperature through self-limiting properties that enhance safety and efficiency. Temperature Sensors:  Monitor and maintain optimal conditions using precise electrical signals. We are Exhibiting in California, USA. Visit our booth at the TechBlick event on 10-11 June 2026 . Contact us for your special discount coupon to attend These sensors find use across  wearable ,  diagnostic , and  industrial  applications, each with distinct design and material needs: Wearables Flexible and stretchable materials Stretchable inks Adhesive layers (for housing-to-patch or multilayer adhesion) Conductive skin contact layers Dia...

Printed electronics often involve touch applications on flexible transparent films, which creates a demand for transparent conductive materials. Integration of ICs enables the control of capacitive touch functionality, combined with serial communication protocols such as I2C or USB. This allows for much smaller and more efficient connections than traditional solutions using bulky cables. DoMicro is capable of making Flexible Hybrid Electronic touch applications with screen-printed transparent PEDOT electrodes, inkjet printed silver circuitry and Anisotropic Conductive Adhesive ( ACA) bonded components. This paper focusses on the integration processes of printed transparent conductive polymer polyethylene dioxythiophene (PEDOT:PSS).   Human machine interfaces and control displays should be easy to understand for the operator. Highlighting essential information depending on mode or status of the equipment creates a focussed and minimal atmosphere without distraction. Visual appearance and coloured feedback of touch icons by RGB controlled backlight LED’s is featured by transparent capacitive touch technology in Flexible Hybrid Electronics (FHE) circuitry. A FHE-Touch foil integrated with a FPCA-LED assembly enables a fully flat, flexible interface system that can be integrated in curve products and surfaces. Touch icon buttons can be completely hidden or made invisible when backlight is switched off. Figure 1 - User interface by Metafas Application demonstrator Figure 1 shows a...

Authors: Anaghim Nasri, R&D Engineer Quentin Maerklen, Process Engineer   Water-based graphene inks are emerging as a groundbreaking solution for next-generation heating technology. By leveraging graphene’s exceptional thermal and electrical conductivity, these inks enable thin, flexible heating elements that deliver high heat output with minimal power. Importantly, sustainability is becoming a key market driver, with growing demand for water-based, responsibly sourced graphene inks as eco-friendly alternatives to metal-based conductive materials.   This article explores how water-based graphene inks provide efficient and uniform heating, their environmental advantages over conventional carbon-based inks, and the role of Blackleaf in driving this innovation forward. As the demand grows for eco-friendly heating (from automotive seats to building systems), water-based graphene inks offer a powerful combination of performance, sustainability, and scalability.   Introduction: Blackleaf Inks for Next-Generation Heating One of the pioneers bringing this technology to market is Blackleaf, a French graphene manufacturer and ink developer. Blackleaf has positioned itself as a leading producer of graphene and formulated inks in Europe, with a capacity of over 120 tons per year of graphene products by 2027, all produced in-house in France. Blackleaf’ s product portfolio includes ready-to-use graphene conductive inks for a variety of uses. Notably, the company has focused on graphene-bas...

Conference & Exhibition: 10 & 11 June 2026 | Masterclasses: 9 June 2026 Computer History Museum, Mountain View, California, USA Co-located with the Nextflex Innovation Day Exhibition spaces 75% sold already! Super early bird rate expiring 19 DEC 2025 The next Future of Electronics RESHAPED USA show will  move from the East Coast to the West Coast , taking place at the iconic Computer History Museum in Mountain View, California! Let's RESHAPE the Future of Electronics together, one layer at a time , on 10 & 11 June 2026 in Mountain View, making it Additive, Printed, Sustainable, Flexible, Hybrid, Stretchable, Wearable, Textile, Structural, 3D... Global Agenda Discover key breakthroughs RESHAPING the future of electronics. Discover more here The TechBlick team is currently curating the agenda. To get a sense of the calibre of our events, please explore all our previous events here . All these past events across all locations, technology topics and years are  also available to you with your annual pass. Super early bird attendee rates end on 19 DEC 2025. Secure your spot now Incredible Tradeshow

Experience the innovations that will RESHAPE electronics

Explore
75+ exhibitors will be joining us onsite, creating a vibrant tradeshow floor that reflects the state-of-the-art across the entire global value chain for additive, printed, hybrid, sustainable, wearable and 3D electronics.  The exhibition floor is already 75% full . Please secure your space now. Learn more and dow...

Electronics encapsulation refers to the process of enclosing and protecting electronic components, circuits, or chips in a durable material or “package.” The encapsulating material (sometimes called a molding compound or potting compound) serves as a barrier against environmental factors like moisture, dust, and harsh chemicals, and shields the device from mechanical stress and vibration. Over the decades, encapsulation approaches have evolved significantly. Historically, hermetic encapsulation (a method of sealing sensitive electronic components inside airtight metal or ceramic enclosures) was common, as it completely blocked moisture and gases. This was especially important in aerospace or military-grade devices [1].  Since the 1970s, the industry has shifted toward polymer-based plastic encapsulation due to its low cost, ease of processing, and high throughput. Today, encapsulating components usually involves applying polymer resins (epoxies, silicones, polyurethanes, etc.) using automated dispensing, molding, or conformal coating systems.  Common types of encapsulation Potting electronics Schematic of an encapsulated PCB assembly, adapted from © Hu C., et al ., CC BY 4.0 In the context of electronics and semiconductors, potting and encapsulation are often used interchangeably. Potting is an encapsulation process where an entire electronic assembly or a larger section of a circuit is placed into a mold (often referred to as a “pot”) and then filled with a potting material ...

10 Feb 2026 | London | Free event Technology is reshaping every aspect of our lives, and the loan ecosystem is no exception. Advances in emerging technologies within the loan market such as Generative AI, Legal Tech, and Distributed Ledger Technology (DLT) are driving a wave of innovation, automating previously manual tasks, streamlining documentation, and enhancing transparency across transactions. But the critical question remains: how do we adapt, adopt, and utilise these solutions?  LMA Edge is a brand new event dedicated to showcasing new technologies in the lending sector. It prioritises interaction, offering high-impact networking opportunities through exhibition, tech demos, case study and collaboration stage talks, and curated 1:1 meetings. Tomi Popoola, CEO of Slash Finances and Lord Holmes, Member of the UK House of Lords are the confirmed keynote speakers. Tomi will share insights on From Innovation to Operating Model: How AI, Cloud and Automation Are Transforming Corporate Lending for Real-World Impact, exploring how emerging technologies are reshaping lending models and driving tangible outcomes across the market. Lord Holmes will examine the role of emerging technology in the UK, reflect on current trends and the future outlook, and consider the evolving intersection between technology and the loan markets. Why it matters:  Accelerate digital execution, reduce operational cost and risk, and align on standards that improve interoperability across the loan lifecy...

Author: Jesus Zozaya, CEO, Voltera, sales@voltera.io

It was our pleasure to present a masterclass at TechBlick Berlin on advancements in printed electronics prototyping. As a follow-up, we’d like to share an example of a multilayer flexible circuit we printed on PET. To watch this presentation in full, please purchase TechBlick Annual Pass at https://www.techblick.com/registration  and login to TechBlick platform https://app.swapcard.com/event/techblick
MATERIALS USED Voltera Conductor 3 silver ink ACI Materials FS0142 Semi-Sintering Conductive Ink ACI Materials SI3104 Stretchable Printed Insulator Voltera T4 solder paste Voltera solder wire Siraya Tech Tenacious Flexible Resin SUBSTRATES USED Normandy Coating polyethylene terephthalate (PET)  FR1 board TOOLS AND ACCESSORIES V-One PCB printer NOVA materials dispensing system Voltera disposable nozzle   Nordson EFD 7018395 dispensing tip   Nordson EFD 7018424 dispensing tip   Nordson general purpose dispense tips  NE555DR timer LEDs Project Overview Purpose The goal of this project was to prototype a flexible multilayer LED wheel roulette circuit that was traditionally considered rigid and validate the redesign of the circuit. Design This project involves a multilayer flexible PCB for the LED roulette circuit and a traditional control board that powers it. We adapted the design of an LED roulette circuit, originally developed for a 3” × 4” FR4 board by ITIZ, Voltera’s authorized reseller in Korea. This new version is pri...

As electronics demand greater miniaturization, multifunctionality, and integration, the materials enabling these advancements require significant consideration. Brewer Science is pioneering a new frontier in additive electronics by developing advanced functional materials, including printable low-loss dielectrics, encapsulants, and optical layers, that empower high-performance sensor systems and advanced packaging solutions. These innovations not only enhance device capabilities but also strengthen the domestic electronics supply chain, positioning the U.S. as a leader in next-generation electronics manufacturing.   The Challenge: Evolving Demands in Electronics Manufacturing Microelectronics manufacturing has long relied on proven techniques like photolithography and PCB fabrication, technologies that have enabled decades of innovation and remain essential to many high-performance applications. However, as the industry pushes toward greater miniaturization, multifunctionality, and integration, new manufacturing paradigms are emerging to meet these evolving demands. Additive manufacturing offers unique advantages in design flexibility, rapid prototyping, and integration of complex 3D structures. Yet, while structural additive manufacturing has matured, the development of functional materials, such as printable dielectrics, conductive materials, and encapsulants, remains a critical frontier. Brewer Science is helping bridge this gap by introducing advanced materials that compl...