Flexible Hybrid Electronics: Low-Temperature Die or IC Attach Towards PET Compatibility (1)
Wed 03 Feb
|Virtual Event Platform
Flexible hybrid electronics will enable integration of ultrathin ICs on flexible substrates. To enable a transition from expensive PI to inexpensive PET, low-temperature or higher novel die or IC attach is needed. Promising innovation space to watch.
Time & Location
03 Feb 2021, 19:10 – 23:10 CET
Virtual Event Platform
Information
Flexible hybrid electronics will enable integration of ultrathin ICs on flexible substrates. To enable a transition from expensive PI to inexpensive PET, low-temperature or higher novel die or IC attach is needed. This is an essential enabling technology. It is important that the roadmap here supports complex ICs with high I/O pins and ever narrower pitch and spacings. This is an innovation space to closely watch. It encompases novel low-T solders, self-aligned conductive adhesives, and beyond
Tickets
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€595.00
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€500.00
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