InMold Electronics: Materials, Substrates, Processes, and Applications

In-Mold Electronics (IME) is a technology for structurally integrating electronic functionality into 3D-shaped parts. It combines printed electronics with molding/forming, enabling mass production of 3D-shaped parts with embedded electronics.

The value proposition is compelling: the technology enables novel and elegant designs, reduces weight and saves space, and decrease part and assembly numbers.

The technology is no longer young. Its successful realization usually used to resemble a black art, but is now transitioning towards a standard accessible platform. Indeed, the industry is maturing in terms of materials, process experience, design know-how, and product experience.

Once it becomes a platform, IME can become the method of choice when it makes sense to integrate relatively simple electronics and lighting with 3D-shaped structural parts. To consider this scenario consider the PCB industry which is an accessible technology that underpins the electronic industry.

Once this occurs, numerous products can be designed and manufactured using IME in diverse sectors including automotive, white goods, consumer electronics, and others.

In this session, we hear from end users in various sectors (consumer and automotive), material suppliers, process and technology developers, rigid component manufacturers, and so on. This session brings together all the key players.

5 additional speakers will be announced in Jan 2021.