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Electronics Packaging Symposium

4-5 November 2021
Virtual Event
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Confirmed speakers
ASE
Prismark Partners
NSWC Crane Division
University at Buffalo
ASE
Intel
SUNY Polytechnic Institute
University of Minnesota
Corning Incorporated
NC State University
Binghamton University
Łukasiewicz - ITR
GE Research
US Army Research Laboratory
Binghamton University
IBM Research
Auburn
Binghamton University
Lockheed Martin
GE Research
Fraunhofer IZM
Raytheon Missiles and Defense Systems
IBM
Fraunhofer IZM
Defense Advanced Research Projects Agency (DARPA)
IBM
Georgia Institute of Technology
Griffis AF Base
NC State University
Rochester Institute of Technology
HP Labs
NSWC Crane Division
Tampere University of Technology

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This is a virtual symposium with live presentations. Binghamton University  State University of New York

This event will be available as on-demand talks only. This was originally organized by the Integrated Electronics Engineering Center (IEEC) of Binghamton University. Topics covered include Future of Semiconductor Technology | Heterogeneous Integration | AI Hardware | Supercomputers | Quantum Computing | On-Package Integration | Panel Level Packaging | Chiplets and Die Block Assembly | 5G Architectures and Packaging| Materials for Neuromorphic Computing | Photonic Packaging | Printed Microwave Packaging | Future of Semiconductors | High Density Fan-Out Packages | Chiplets and SiP | Liquid Metal | 3D Printed Electronics | Printed Electronics | Energy Storage E-Textiles | Interconnects and Die Attach Technologies | Scaling in interconnects | E-Textiles | Wearable Sensors

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