Electronics Packaging Symposium

4-5 November 2021
Virtual Event Platform

This is a virtual symposium with live presentations. Binghamton University State University of New York

Topics Covered

This event will be available as on-demand talks only. This was originally organized by the Integrated Electronics Engineering Center (IEEC) of Binghamton University. Topics covered include Future of Semiconductor Technology | Heterogeneous Integration | AI Hardware | Supercomputers | Quantum Computing | On-Package Integration | Panel Level Packaging | Chiplets and Die Block Assembly | 5G Architectures and Packaging| Materials for Neuromorphic Computing | Photonic Packaging | Printed Microwave Packaging | Future of Semiconductors | High Density Fan-Out Packages | Chiplets and SiP | Liquid Metal | 3D Printed Electronics | Printed Electronics | Energy Storage E-Textiles | Interconnects and Die Attach Technologies | Scaling in interconnects | E-Textiles | Wearable Sensors

Confirmed speakers:

COMING SOON

Corning Incorporated
GE Research
US Army Research Laboratory
Auburn
Łukasiewicz - ITR
Rochester Institute of Technology
Lockheed Martin
Griffis AF Base
Intel
SUNY Polytechnic Institute
Fraunhofer IZM
Georgia Institute of Technology
Raytheon Missiles and Defense Systems
HP Labs
GE Research
IBM
University at Buffalo
Binghamton University
ASE
Prismark Partners
NSWC Crane Division
NSWC Crane Division
Tampere University of Technology
ASE
Defense Advanced Research Projects Agency (DARPA)
NC State University
Binghamton University
Fraunhofer IZM
IBM Research
NC State University
IBM
Binghamton University
University of Minnesota
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