Printed, Hybrid, InMold, and 3D Electronics

9-10 March 2022
Virtual Event Platform

Description coming soon

Topics Covered

Printed | Flexible | Additive | Hybrid | 3D | Structural | R2R | InMold | Textiles | Stretchable | Conformal | Wearable | Package Level Electronics | Conductive, Dielectric and Adhesives Inks | LIFT | Inkjet | Advanced Screen Print | Electrohydrodynamic | Aerosol | Nanoimprint | HMI | Smart Skin Patches | Perovskite and Organic Photovoltaics| Flexible Substrates and Barriers | Printed Sensors and Actuators | Printed Displays | Low Temperature Attachment | Heat- and Photo-sintering |

Confirmed speakers:

COMING SOON

META/Facebook
Toppan
Simoldes
Electronink
PV NanoCell
Swarovski
ELANTAS Europe GmbH
Henkel AG & Co. KGaA
Sunway Communications
Arkema-Piezotech
Schreiner MediPharm
Sheldahl Flexible Technologies
Sefar
ISC Konstanz
Novasentis
STABILO International
BeLink Solutions
Clayens
Jet Metal Technologies
IO Tech 3D Printing
Flex
Elephantech
Motherson Innovations
Nagase ChemteX
Asahi Kasei
Celoplás
Merck
Sateco XT
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Here is how the LIVE 'In-Person Virtual' networking & exhibition works.
Watch the Demo Below