Printed, Hybrid, Structural, & 3D Electronics

11-12 May 2021
Virtual Event Platform

Topics Covered

Printed | Hybrid | Structural | 3D Electronics

Confirmed speakers:

COMING SOON

Airbus Operations GmBH
ARM
Parsons
META (Metamaterial)
ACCIONA
XTPL
E2ip Technologies
CondAlign AS
SUNEW
The Coca-Cola Company
Panasonic Electronic Materials
Signify
Hewlett Packard
Applied Materials
Alpha Assembly
ACI Materials
SAFI-Tech
Smooth & Sharp Corporation
The Boeing Company
Fraunhofer FEP
DuPont  Teijin Films
NovaCentrix
ENJET Inc
IDS Inc
Danish Technological Institute
CPI
U.S. Army Combat Capabilities Development Command
COATEMA Coating Machinery GmbH
KIMOTO
Agfa
American Semiconductor
Prismade Labs GmbH
VTT
C3Nano
Procter & Gamble
Wuerth
IDENTIVE
Ntrium
CEA
Nanogate
Kundisch GmbH & Co. KG
VSParticle
Phillips 66
Texas Instruments
Sheldahl Flexible Technologies
Brewer Science
Brilliant Matters
PolyIC
Nano OPS
National Research Council Canada (NRCC)
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