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Printed, Hybrid, InMold, and 3D Electronics

9-10 March 2022
1pm - 9pm

CET:

Virtual Event
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Confirmed speakers include:

The times below is Central European Times (CET).
On the platform the times will automatically be changed to your time zone

STABILO International
Motherson Innovations
Nagase ChemteX
Schreiner MediPharm
Sheldahl Flexible Technologies
IO Tech 3D Printing
Swarovski
Merck
ISC Konstanz
META/Facebook
Celoplás
Sateco XT
Asahi Kasei
Clayens
Jet Metal Technologies
Flex
Henkel AG & Co. KGaA
Arkema-Piezotech
Toppan
Sunway Communications
Simoldes
Elephantech
Sefar
BeLink Solutions
ELANTAS Europe
PV NanoCell
Electronink
Novasentis

Printed | Flexible | Additive | Hybrid | 3D | Structural | R2R | InMold | Textiles | Stretchable | Conformal | Wearable | Package Level Electronics | Conductive, Dielectric and Adhesives Inks | LIFT | Inkjet | Advanced Screen Print | Electrohydrodynamic | Aerosol | Nanoimprint | HMI | Smart Skin Patches | Perovskite and Organic Photovoltaics| Flexible Substrates and Barriers | Printed Sensors and Actuators | Printed Displays | Low Temperature Attachment | Heat- and Photo-sintering |

Full Agenda

The times below is Central European Times (CET).
On the platform the times will automatically be changed to your time zone

Track 1
Track 2
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