In-Mold Electronics (IME): Reliability, Design Rules, and Harsh-Environment Performance

In-Mold Electronics (IME) represents an innovative approach that significantly enhances the integration of design and functionality by merging printed decorations and electronic circuitry with structural components through advanced techniques such as thermoforming and molding. A major contributor to the overall weight of mobility electronics in both ground and airborne vehicles is the extensive use of wire harnesses. These harnesses are crucial for transmitting signals from an array of sensors, cameras, and touch surfaces to central processing units, including the engine control unit (ECU) and powertrain control units (PCUs). In typical vehicles, these wire harnesses can span 2-3 kilometers, adding considerable weight and complexity. However, by adopting lightweighting strategies for the automotive platform,manufacturers can realize substantial weight savings. One of the most effective methods involves eliminating traditional wire harnesses and integrating wiring directly into structural plastics or body panels. This transformative approach fosters the development of "smart plastics" that not only supportstructural integrity but also enable essential electronic functions. Moreover, manufacturers can achieve additional cost efficiencies by using additive manufacturing techniques to integrate sensors and circuits directly into the plastics. The shift to IME techniques substantially reduces reliance on conventional printed circuit board (PCB) manufacturing and assembly practices, as well as on traditional snap-lock connectors for wire-harness interconnections. This integration has the potential to significantly reduce the overall size and weight of electronic systems in vehicles. The transition to IME processes can yield impressive results, with potential reductions in size and weight of up to 70 percent. This reduction translates into increased operational efficiency, providing electric vehicles with extended mileage per charge and enhancing fuel efficiency in internal combustion engine vehicles. In addition to these
performance gains, adopting IME technology reduces manufacturing tooling requirements by up to 80 percent, simplifying production setup. The streamlined bill of materials and decreased part count also facilitate easier logistics support, making the overall manufacturing process more efficient and cost-effective. This presentation aims to demonstrate the various process recipes and practical applications of additive in-mold techniques. Additionally, it will delve into the interactions between these innovative processes and their impact on product performance, showcasing the future of automotive electronics integration.


BIOGRAPHY
Pradeep Lall
MacFarlane Distinguished Professor, Alumni Professor and Director, Auburn University

Bio: Pradeep Lall is the MacFarlane Endowed Distinguished Professor and Alumni Professor with the Department of Mechanical Engineering. He is Director of Auburn University’s Electronics Packaging Research Institute and Director of the Alabama Node of NextFlex. He holds Joint Courtesy Appointments in the Department of Electrical and Computer Engineering. He is a member of the technical council, governing council and academic co-lead of the automotive and asset monitoring TWGs of NextFlex Manufacturing Institute. He is the author and co-author of over 1,000 journal and conference papers, 2 books, and 15 book chapters in the field of electronics. Dr. Lall is a fellow of the ASME, a fellow of the IEEE, a Fellow of NextFlex Manufacturing Institute, and a Fellow of the Alabama Academy of Science. He is a recipient of SEMI’s FLEXI R&D Achievements Award for landmark contributions to Additive
Printed Electronics, ASME Avram Bar-Cohen Memorial Medal, IEEE Biedenbach Outstanding
Engineering Educator Award, IEEE Sustained Outstanding Technical Contributions Award, NSF Alex Schwarzkopf Award, Alabama Academy of Science Wright A, Gardner Award, IEEE Exceptional Technical Achievement Award, ASME-EPPD Applied Mechanics Award, Three-Motorola Outstanding Innovation Awards, Five-Motorola Engineering Awards, and over Fifty Best-Paper Awards.