Advancements in Printed Electronics Prototyping: Direct Ink Write Technology for Printed Multi-Layer Flexible Electronics

The evolution of printed electronics has been significantly influenced by additive manufacturing techniques, such as direct ink write (DIW) technology. This masterclass examines the application of DIW in the development of flexible printed circuits, emphasizing its capacity for rapid design iteration using materials that are scalable to screen printed manufacturing processes.

The masterclass will also highlight how DIW technology compares to other technologies, such as inkjet. Special attention will be given to the use of materials, such as silver-, gold-, copper-, and carbon-based inks, their adhesion with various substrates including PET, TPU, and polyimide, and will also cover sheer thinning and nozzle compatibility. Attendees will leave with a deeper understanding of the interdependencies between ink and substrate characteristics, enabling informed decision-making in the selection of materials and a dispensing system for printing functional, flexible hybrid electronics.

This presentation is particularly relevant for academics, researchers, materials scientists, and engineers involved in the design and prototyping of next-generation electronic devices.