CondAlign | Room temperature bonding in printed & flexible electronics – solutions addressing cost &

Morten Lindberget | VP Business Development and Sales

CondAlign develops and produces adhesive anisotropic conductive films, based on their unique technology. These adhesive ACFs combine unique properties making them very well suited for room temperature bonding in the printed, flexible and hybrid electronics area. They do not require any post processing, and are ideal for efficiently bonding to temperature sensitive substrates, for instance in a pick and place process. This enables designs and applications beyond today’s traditional limits, taking care of the function and performance in a sustainable and cost efficient