This is an excellent chat by Eric Virey (Yole showing how LED dies are expect to shrink in size, going from mini-LED region (e.g., 125x255mm) to ultrasmall microLED region (5x5um?). This driver is essentially because it increases PPI and drives down cost as well as transfer time/cost since more LEDs are produced per wafer. To sustain this trend, many other technologies need to evolve from more efficient small-sized red LEDs to microbumps to better tiling and metallization techniques and transfer technologies.
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