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Evolution of flexible active matric backplanes to integrate all side circuits and driving ICs?

Here, Meike Baumgarten explains how InnovationLab GmbH is evolving the architecture of flexible active matrix backplanes with printed electronics and thinned ICs as part of 2-Horisons project to eliminate all rigid parts.


In a conventional set up, the non-pixel-level circuits as well as driver IC sit off-site, linked with the flexible backplane via some connector. In this project, iL has already demonstrated that it can print many of the circuit functions (e.g., multiplexers, decoders) already onto the flexible backplane sheet. This is an important advancement of the technology.


The next step of the evolution will be to print also full circuits and fan-outs and place thinned silicon IC/dies onto the flexible active matrix backplane sheet, thus integrating all the electronics into the backplane sheet itself. This is essential for creating very flexible displays and will be an important development in the field.


To support this project, and also to generally support flexible hybrid electronics, iL is also developing techniques to solder ICs and SMDs directly onto the substrate with printed metallization.


Here, Cu inks are S2S printed to, for example, form NFC on substrates such as PEN, FR4, and PET. Given the non-bulk conductivity of inks, a high dry thickness of 30um is required for printed Cu metallization, which can result in spreading and thus shorting between the pins of ICs. Meike Baumgarten explains various approaches to overcome this challenge


To learn more join the Printed Electronics community in Eindhoven, the Netherlands, on 12-13 OCT 2022. For more information please visit


https://www.techblick.com/electronicsreshaped






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