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Full Program: The Future of Electronics RESHAPED Berlin

22 & 24 October 2025 | ECC, Berlin | Conference & Exhibition

This is the must-attend event of the year, focusing on additive, printed, 3D sustainable, wearable, flexible, hybrid, soft, stretchable, textile, structural and R2R electronics.   


This year the event will feature: ✅ 100+ speakers  ✅ 90+ exhibitors showcasing all the key innovations ✅ 12 expert- and industry-led masterclasses  ✅ 3 guided tours ✅ Networking with 600+ global participants  ✅ Annual access to all TechBlick online events, on-demand version of all onsite events, as well as an on-demand library featuring over 1500 talks and  masterclasses.

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Explore The Agenda

See the most up-to-date conference agenda here

22 October | Conference Day 1 Track 1

  • 09:00 | TechBlick | Welcome & Introduction

  • 09:10 | Toyota | Technology Opportunities That Go Beyond Automotive

  • 09:30 | Fuji Corporation | Additively manufactured multi-layer and stacked circuits with embedded electronics components

  • 09:50 | Lockheed Martin | Flexible Hybrid Electronics in the Wild: How Copper Printing and Flexible RF Circuits Made it Out of the Lab and Into the Field

  • 10:10 | NanoPrintek | Inkless Multimaterial Printing Directly from Raw Materials - Breaking the Barriers in Cost, Time, Pollution, and Supply Chain  

Networking Break

  • 11:15 | University of Rome Tor Vergata | Scalable and Ambient-Air Processing of Printed Perovskite PV Modules

  • 11:35 | CubicPV | Enabling Durable Perovskite Tandems with Scalable Architecture and Manufacturing Methods

  • 11:55 | Solaires Entreprises Inc | From Lab to Fab: Navigating the Challenges and Lessons Learned in Scaling Perovskite PV Modules

  • 12:15 | Institut Photovoltaïque d'Île-de-France (IPVF) | From Lab to Fab: Navigating the Challenges and Lessons Learned in Scaling Perovskite PV Modules

Lunch & Exhibition Break

  • 14:05 | SATO Global | How digital twins support Industry 4.0 and what comes next in RFID

  • 14:25 | Wiliot | Scaling Ambient IoT: Wiliot’s Battery-Free Bluetooth Revolution with Printed Sensing and Reel-to-Reel Manufacturing Technology

  • 14:45 | Sunray Scientific Inc | Ultraviolet Light-Cured Anisotropic Conductive Epoxy for Low Cost, High Throughput Electronic Assemblies

  • 15:05 | University of Glasgow | Sustainable Wireless Battery-Free and Chip-Free Sensors and IDs

Exhibition & Refreshment Break

  • 16:10 | Essemtec | Jetting and SMT mounting technologies for additive and printed electronics on flexible and stretchable substrates

  • 16:30 | VTT | Flexible hybrid multi-layer complex systems: Prototyping and Process Development

  • 16:50 | Fraunhofer ENAS | Ultra-thin Parylene-based Printed Circuit Boards for the next generation of flexible electronics

  • 17:10 | TracXon | Expanding the boundaries of printed electronics for volume manufacturing of PCB-replacements

Drinks Reception

Track 2

  • 09:10 | Oxford PV | The world's first commercial tandem perovskite-silicon module

  • 09:30 | Hangzhou Microquanta Semiconductor | Bridging the Gap: The Commercial Readiness of Perovskite PV

  • 09:50 | Swift Solar | Unlocking the Potential of Perovskite-Silicon Tandem PV: Insights into the Journey from Lab to Fab

  • 10:10 | Solar and Renewable Industry Leader | The Future of European and U.S. Solar Manufacturing: Niche Only or Mass Production?

Exhibition & Refreshment Break

  • 11:15 | Würth Elektronik GmbH & Co. KG | Towards Sustainable PCBs: Design, Process Efficiency and Material Innovation for a Greener Lifecycle

  • 11:35 | Signify Research | Printed Electronics, an opportunity for lighting?

  • 11:55 | Dresden Integrated Center for Applied Physics and Photonic Materials - TU Dresden | Leaftronics: novel devices based on leaf skeletons

  • 12:15 | Holst Centre | Recyclability of In-Mold Electronics

 Lunch & Exhibition Break

  • 14:05 | Q5D | 5 axis laser-assisted selective metallization of large 3D parts

  • 14:25 | XTPL | Additive Manufacturing for Next-Generation Microelectronics

  • 14:45 | AMAREA Technology | Ceramic-Based Printed Electronics Enabled by Multi-Material Additive Manufacturing

  • 15:05 | Lithoz | Additive Manufacturing of Dielectric Ceramics and Ceramic–Metal Components Using Lithography-Based Ceramic Manufacturing

Exhibition & Refreshment Break

  • 16:10 | Henkel | High Performance Inks for Cost Efficient Manufacturing of Printed Electronics

  • 16:30 | CondAlign | Novel conductive films – from launch to volume production

  • 16:50 | University of Coimbra | Scalable, High-Resolution Microchip-Integrated Liquid Metal Circuits: Enabling the Next Generation of 3R Electronics

  • 17:10 | The University of Manchester | Graphene and 2D materials printed electronics

Drinks Reception

Track 3

  • 11:15 | CurveSYS Sensors | Smart Sensors for Security Fields

  • 11:35 | Heraeus Electronics | Bridging the Gap Between Additive and Subtractive Technologies: the Solderable Polymer Revolution

  • 11:55 | Blackleaf | Graphene-based Electric Heating: how graphene films are reinventing surface heating in the industry

  • 12:15 | ELANTAS Europe GmbH | Printed Electronics in the fast lane: Paste technologies driving tomorrow’s mobility

 Lunch & Exhibition Break

  • 14:05 | iGii | Revolutionising sensing and diagnostics with 3D carbon nanomaterials

  • 14:25 | NGK Europe GmbH |  [TBC]

  • 14:45 | Armor Smart Films | Armor Smart Films: Empowering Scalable Innovation in Functional Surfaces

  • 15:05 | RISE | Screen printed stretchable electronics including liquid metals  

Exhibition & Refreshment Break

  • 16:30 | TNO partner in Solliance | Pioneering Perovskite Scalability: Advancing Roll-to-Roll Slot Die Coating for Stable and Efficient Flexible Solar Cells

  • 16:50 | Heliatek | Certified, flexible and lightweight PV modules on a commercial scale

  • 17:10 | OET Energy Technologies | Scaling Printed Photovoltaics: From 3rd Gen PV Innovation to Giga Fab Industrialization  

Drinks Reception

Track 4

  • 11:15 | National Research Council Canada | 3D electronics with volumetric additive manufacturing

  • 11:35 | Notion Systems | New products for development and scale-up of functional inkjet processes to industrial production

  • 11:55 | ImageXpert | Selecting the Right Inkjet Printhead for Advanced Electronics Applications

  • 12:15 | Printed Electronics Limited | Drop-on-Demand Printing of Highly Viscous Inks  

 Lunch & Exhibition Break

  • 14:05 | Sofab Inks | Novel materials for next-generation perovskite solar panel production processes

  • 14:25 | Karlsruhe Institute of Technology | New Materials for Metallization and Interconnection of Perovskite Reduced Silver Consumption

  • 14:45 | Nano-C, Inc. | Innovative Interface Materials for Perovskite Photovoltaics

  • 15:05 | DELO Industrial Adhesives | Pioneering the Future: DELO's Advanced Adhesives Enhance Perovskite Solar Cell Protection

Exhibition & Refreshment Break

23 October | Conference Day 2 Track 1

  • 09:10 | Valeo | Introducing new technologies into automotive products: Valeo’s path with Printed and In-Mold Electronics

  • 09:30 | Auburn University | Additively Printed In-Mold Electronics Circuits and Sensors for Automotive

  • 09:50 | GE Aerospace | Additive Electronics for Harsh Environment Applications in Aerospace

  • 10:10 | NextFlex | Commercialization of Additively Manufactured Electronics

Exhibition & Refreshment Break

  • 11:15 | Fraunhofer ISE | Sustainable Fabrication of Perovskite Modules: Strategies for scalable devices with low material criticality

  • 11:35 | SparkNano | On a Roll: Spatial ALD Advances Scalable Perovskite Solar Manufacturing

  • 11:55 | AeroSolar | Aerosol treatment of perovskite solar cells for improved efficiency, stability and manufacturing yield

Lunch & Exhibition Break

  • 13:15 | HighLine Technologies | Scalable Solutions, from Microextrusion to Coating

  • 13:35 | Ceradrop - MGI Digital Technology | [Title TBC]

  • 13:55 | Sonojet | SAW-Based Aerosol Printing for the Future of Electronics

  • 14:15 | Enjet | Redefining Functional Printing: Innovations in EHD Inkjet Multi-Nozzle Technology

Exhibition & Refreshment Break

  •  15:05 | X-Fab | Micro-Transfer Printing: Integrate ultra-thin ASICs to enable sophisticated Applications

  • 15:25 | Mesoline | Microchannel particle deposition for MEMS & Sensors Applications

  • 15:45 | Prio Optics GmbH | Precision Through Additive Manufacturing: Inkjet-Printed Optical Coatings

Track 2

  •  09:10 | Caelux Corporation | Meeting Future Energy Needs With High Density Solar

  • 09:30 | Helmholtz-Zentrum Berlin | [Title TBC]

  • 09:50 | Perovskia Solar | Charged by Light – Designed for Life

  • 10:10 | CEA | Challenges for upscaling Perovskite/Silicon tandem solar cells

Exhibition & Refreshment Break

  • 11:15 | Fraunhofer EMFT | Endless electronics by R2R processing

  • 11:35 | Eastman Kodak | Flexo for High-Resolution Roll-to-Roll Manufacturing

  • 11:55 | LightnTec | [Title TBC].

Lunch & Exhibition Break

  • 13:15 | Fraunhofer ILT | Optimizing Local Conductivity in Printed Electronics: A Laser-Controlled Approach

  • 13:35 | Hamamatsu | Leveraging Laser Processing for Sustainable Printed Electronics – Laser Sintering, Encapsulation & Soldering

  • 14:05 | Akoneer | Making of multilayer glass HDI PCB

  • 14:15 | DR Utilight Corp | Laser Pattern Transfer Printing for High-Viscosity Pastes

Exhibition & Refreshment Break

  • 15:05 | Smartkem | OTFT circuit developments enabling low-voltage flexible processors

  • 15:25 | Canatu | ADAS camera heaters, advancing autonomous driving in any weather

  • 15:45 | INKTIO | From Ink to Impact: Digital Manufacturing of Flexible Photocatalytic Electronics

Track 3

  • 11:15 | Hummink | HPCaP (High Precision Capillary Printing): A Technology for Next-Generation Manufacturing

  • 11:35 | Suss MicroTec | Pushing the Limits of Inkjet Printing: A Flexible Platform for Micro- and Multi-Material Deposition

  • 11:55 | Myrias Optics + UMass Amherst | Printed Metaoptics for AR/VR and Photonics

Lunch & Exhibition Break

  • 13:15 | INO d.o.o. | From R&D to high volume production and importance of modular equipment

  • 13:35 | Conductive Technologies | Engineering Functionality: Material Strategies for Modern Sensors

  • 14:15 | Panasonic | Multifunctional Shock Absorb Film Material, Toughtelon  

Exhibition & Refreshment Break

  • 15:05 | SOLRA-PV | The Industrialization of Perovskite-Based Indoor Photovoltaics

  • 15:25 | P3C Technology and Solutions Pvt Ltd | Scaling Perovskite Solar Module Technology in India: Field Deployment and Commercialization Roadmap

Track 4  

  • 11:15 | Antolin | Automotive interiors dynamic decoration with electronic ink

  • 11:35 | Trusscore | Changing your wall colour on demand using electrochromics

  • 11:55 | ruhlamat GmbH | Embedded wires for 3D formed electronics and smart surfaces  

Lunch & Exhibition Break

  • 13:15 | SOLRA-PV | The Industrialization of Perovskite-Based Indoor Photovoltaics

  • 13:35 | SALD B.V. | A Paradigm Shift in Roll-to-Roll Spatial Atomic Layer Deposition for Perovskite Solar Cell Manufacture

  • 14:15 | Panacol-Elosol GmbH | Advanced Bonding Technologies for Flexible Substrates and Electronic Devices

  • 14:35 | Intellivation LLC | R2R Laser Processing of Multi-Layer Vacuum deposited coatings on flexible substrates for 2D Functional Devices

Masterclasses and Tours  

Explore our masterclass and tour program here.

Masterclasses | Track 1 (21 OCT 2025)

  • 09:00 | Nagase ChemteX | Selecting Conductive Inks: A Property-Driven Approach for Printed Electronics Applications

  • 10:00 | Heraeus Electronics | Printable Thick Film Heaters: Essentials for Design, Material Selection, and Printing

  • 11:00 | Fraunhofer IFAM | Screen Printing Technology For Printed Electronics Manufacturing

  • 12:00 | 3E Smart Solutions / ZSK | Driving Reliability and Scalability in E-Textiles and Wearables via Embroidery Technologies | Chip Interconnections for Flexible Printed Electronics.

Masterclasses | Track 2 (21 OCT 2025)

  • 09:00 | Hahn-Schickard | Multi-material Additive Manufacturing of 3D Electronics

  • 10:00 | Voltera | Advancements in Printed Electronics Prototyping: Direct Ink Write Technology for Printed Multi-Layer Flexible Electronics

  • 11:00 | Silicon Austria Labs GmbH | Life Cycle Assessment of Printed Electronics: Challenges, Insights and Opportunities

  • 12:00 | CEA | Advancing PCB Technology Through Additive Manufacturing: Process, Sustainability, and Reliability

Masterclasses | Track 3 (21 OCT 2025)

  • 09:00 | imec | Stable and efficient architectures for perovskite solar modules and tandems

  • 10:00 | Swansea University | Printing Perovskite Solar Modules using S2S and R2R processes

  • 11:00 | Coatema | Slot Die Coating: Principles and Practice Towards Mass Production

  • 12:00 | Fraunhofer IAP | Towards Non-Toxic and Sustainable Materials in Perovskite Photovoltaics  

Tours to:  Fraunhofer IAP, Fraunhofer IZM, Helmholz Zentrum Berlin/PVcomB  

Exhibition Explore the exhibition floor here

Gold Exhibitors

  • Dimension Division

  • Heraeus Electronics

  • Henkel

  • Nagase ChemteX

  • Notion Systems

Silver and Standard Exhibitors

  • ACI Materials

  • Akoneer

  • Ames Goldsmith

  • Armor Smart Films

  • Blackleaf

  • Ceradrop - MGI Digital Technology

  • Coatema

  • CondAlign

  • Conductive Technologies

  • Creative Materials Inc.

  • Delo

  • Eastman Kodak Company

  • ELANTAS Europe GmbH

  • Ercon

  • Fuji Corporation

  • Hamamatsu

  • HighLine Technology

  • Holst Centre

  • Hummink

  • ImageXpert

  • INO, d.o.o., Žiri

  • Integrated Graphene (iGii)

  • Intellivation LLC

  • Kimoto

  • Linxens

  • Nano-C

  • NanoPrintek

  • NGK Europe GmbH

  • NovaCentrix

  • OET Energy Technologies & Coatema

  • Panacol

  • Panasonic Electronic Materials

  • Policrom

  • Printed Electronics Limited

  • Smartkem

  • SparkNano

  • SPGPrints

  • Sun Chemical

  • SunRay Scientific

  • SUSS

  • The University Of Manchester

  • TracXon

  • Voltera

  • VTT

  • XTPL

  • ABeetle Corporation

  • Agfa

  • Ail Arian

  • Alpha Precision Systems (APS)

  • Arkema

  • Beespenser

  • BrightSpot Automation LLC

  • Brilliant Matters

  • CEA

  • Chimet S.p.A

  • Coveme Spa

  • DoMicro BV

  • droptical GmbH

  • FOM Technologies

  • Fraunhofer IAP

  • Fraunhofer IFAM

  • Grafisk Maskinfabrik A/S

  • GraphEnergyTech

  • IPVF

  • Joanneum Research

  • JP Kummer Semiconductor Technology GmbH

  • National Research Council Canada

  • Noctiluca

  • Normandy Coating

  • nsm Norbert Schläfli AG

  • PINA CREATION

  • Polytec GmbH

  • PrintUp Institute

  • PROFACTOR GmbH

  • PROTEX INTERNATIONAL

  • RK Siebdrucktechnik

  • RISE

  • ruhlamat

  • Silicon Austria Labs GmbH

  • Sofab Inks Inc.

  • Solaveni

  • Technic, Inc.

  • THIEME

  • Toray Research Center, Inc.

  • VFP Ink Technologies

 
 
 

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