top of page

High-Resolution 3D-Printed Conductive Features In Single Micron Scale

Speaker: Filip Granek | Company: XTPL | Date: 11-12 May 2021 | Full Presentation

We introduce the ultra-precise deposition (UPD) technology for rapid prototyping of microelectronic devices. UPD allows maskless deposition of high-viscosity metallic and non-metallic inks with the printed feature size as small as 1 μm. XTPL technology answers some of the key challenges in the fabrication of high-density microelectronics, including the ability to print on complex 3D substrates and obtain structures with arbitrary shapes, including lines, dots, crosses, and meshes.

Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs)

portfolio of expert led masterclass year-round platform

And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor.

To learn more visit

To see feedback about previous event see


Subscribe for updates

Thank you!

bottom of page