Introducing the Program - Smart surfaces and sensors

Why Should You Join TechBlick's The Future of Electronics RESHAPED?

The Future of Electronics RESHAPED conference and exhibition (22 & 23 OCT 2025, Berlin) is set to be the most important event of the year focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics. 

This year the program features a world-class agenda with over 100 superb invited talks from around the world, 12 industry- or expert-led masterclasses, 4 tours, and over 90 onsite exhibitors. 

In this article, we discuss and highlight various innovative talks at the event around the theme of smart surfaces and sensors. In future articles, we will cover further technologies including smart surfaces, sustainable electronics, printed medical electronics, novel materials and beyond.

Explore the full agenda now and join the global industry in Berlin on 22 & 23 OCT 2025. Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable. 

🚨Register before 12 September to save 200 Euros on top of early bird discounts. This is a one-time offer. The coupon can be obtained here🚨

Agenda and Registration

Toyota – Michael Rowe presents technology opportunities beyond automotive, showcasing cross-industry applications of actuator, sensor, and material innovations. Highlights include shape memory alloy (SMA) wire actuators delivering lightweight, translational motion with integrated feedback; near-IR reflective pigments enabling hidden data transfer for autonomous systems; and metamaterial-based vibration dampening for electronic housings.

Auburn University – Pradeep Lall explores additively printed in-mold electronics (IME) circuits and sensors as a lightweight alternative to traditional wire harnesses in vehicles. Using direct-write and gravure offset printing on thermoformed substrates such as PETG, PC, and HIPS, Auburn demonstrates multilayer circuits with mounted components and electrodermal sensors. Applications include driver monitoring, ADAS integration, and signal processing, with results showing performance parity with conventional rigid circuits.

Trusscore – Chad Smithson presents electrochromic wall panels for on-demand color change. Using multilayer printed films integrated onto rigid PVC, the panels shift color via a reversible redox reaction under <3 V bias, ensuring low power draw and safety. The talk covers scaling from lab to production, challenges in ink selection, device architecture, and compatibility of print sequences.

🚨Register before 12 September to save 200 Euros on top of early bird discounts. This is a one-time offer. The coupon can be obtained here🚨

Agenda and Registration

Antolin – Stephan Horn discusses dynamic automotive interiors using electronic ink. In collaboration with E Ink, Antolin integrates Prism™ technology into interior trim, enabling surfaces that change color and patterns on demand or in response to alerts. The technology consumes energy only during transitions, enhancing efficiency and driving range. Automotive prototypes demonstrate validated performance under real-use conditions.

ruhlamat– Michael Bruns explores embedded wire technologies for 3D-formed electronics and smart surfaces. Techniques such as in-mold wire embedding, additive manufacturing, and thermoforming-compatible conductive traces enable robust interconnections in curved geometries. Applications include automotive and consumer products, where 3D wiring enhances ergonomics, user interfaces, and sensor integration, pointing toward multifunctional smart skins and hybrid printed–wire electronics.

Valeo – Martial Berry presents introducing printed and in-mold electronics into automotive products. The talk outlines Valeo’s structured approach to integrating new technologies under strict performance and quality demands, covering development timelines, resources, and specifications needed to bring printed and IME solutions into next-generation vehicles.

Explore the Full Agenda and Register before 12 September 2025 for the best rates

Agenda and Registration

CurveSYS Sensors – Denis Guezelocak presents smart conformal pressure-sensitive sensors for security fields. Flexible sensor arrays with multi-zone architectures enable real-time impact detection and differentiation between low-force events and high-energy strikes or ballistic impacts. Coupled with data fusion and intelligent signal processing, the technology enhances situational awareness and response capabilities in security and defense applications.

iGii – Michelle Ntola discusses 3D carbon nanomaterials (Gii™) for sensing and diagnostics. With high surface area, porosity, and biocompatibility, these nanocarbon frameworks enhance electrochemical signal transduction, multiplexed detection, and low non-specific adsorption. Roll-to-roll, low-temperature processes enable cost-effective point-of-care devices, with applications extending to catalysis, energy storage, and heating.

Armor Smart Films – Fabien Resweber showcases functionalized surfaces using advanced coatings and electroactive polymers. Leveraging P(VDF-TrFE) piezoelectric materials, Armor enables scalable production of next-generation sensors, haptic interfaces, heating films, and medical devices. The focus is on flexible, efficient, and seamlessly integrated functional surfaces for industrial and healthcare applications.

NGK Europe GmbH – Daniel Harden presents ultra-thin, semi-solid-state Li-ion batteries with ceramic electrodes for wearables and IoT. The design minimizes liquid electrolyte and eliminates binders, enhancing safety, thermal stability, and fast charging while enabling reliable integration with energy-harvesting systems for long-life autonomous devices.

🚨Register before 12 September to save 200 Euros on top of early bird discounts. This is a one-time offer. The coupon can be obtained here🚨

Agenda and Registration